JP2024540436A5 - - Google Patents
Info
- Publication number
- JP2024540436A5 JP2024540436A5 JP2024527687A JP2024527687A JP2024540436A5 JP 2024540436 A5 JP2024540436 A5 JP 2024540436A5 JP 2024527687 A JP2024527687 A JP 2024527687A JP 2024527687 A JP2024527687 A JP 2024527687A JP 2024540436 A5 JP2024540436 A5 JP 2024540436A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- channel
- interconnects
- integrated device
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/532,754 | 2021-11-22 | ||
| US17/532,754 US12243855B2 (en) | 2021-11-22 | 2021-11-22 | Package comprising channel interconnects located between solder interconnects |
| PCT/US2022/048192 WO2023091285A1 (en) | 2021-11-22 | 2022-10-28 | Package comprising channel interconnects located between solder interconnects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024540436A JP2024540436A (ja) | 2024-10-31 |
| JP2024540436A5 true JP2024540436A5 (enExample) | 2025-10-14 |
Family
ID=84487697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024527687A Pending JP2024540436A (ja) | 2021-11-22 | 2022-10-28 | はんだ相互接続部間に配置されたチャネル相互接続部を備えるパッケージ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12243855B2 (enExample) |
| EP (1) | EP4437587A1 (enExample) |
| JP (1) | JP2024540436A (enExample) |
| KR (1) | KR20240104099A (enExample) |
| CN (1) | CN118215998A (enExample) |
| TW (1) | TW202324621A (enExample) |
| WO (1) | WO2023091285A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117810101A (zh) * | 2023-12-28 | 2024-04-02 | 上海易卜半导体有限公司 | 半导体封装方法、半导体组件及电子设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7307293B2 (en) * | 2002-04-29 | 2007-12-11 | Silicon Pipe, Inc. | Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths |
| JP4520355B2 (ja) | 2005-04-19 | 2010-08-04 | パナソニック株式会社 | 半導体モジュール |
| JP5352146B2 (ja) * | 2008-07-23 | 2013-11-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US10289796B2 (en) * | 2016-12-06 | 2019-05-14 | Synopsys, Inc. | Automated place-and-route method for HBM-based IC devices |
-
2021
- 2021-11-22 US US17/532,754 patent/US12243855B2/en active Active
-
2022
- 2022-10-28 KR KR1020247013807A patent/KR20240104099A/ko active Pending
- 2022-10-28 TW TW111141117A patent/TW202324621A/zh unknown
- 2022-10-28 WO PCT/US2022/048192 patent/WO2023091285A1/en not_active Ceased
- 2022-10-28 EP EP22822236.0A patent/EP4437587A1/en active Pending
- 2022-10-28 CN CN202280074189.1A patent/CN118215998A/zh active Pending
- 2022-10-28 JP JP2024527687A patent/JP2024540436A/ja active Pending