JP2024516532A5 - - Google Patents
Info
- Publication number
- JP2024516532A5 JP2024516532A5 JP2023560896A JP2023560896A JP2024516532A5 JP 2024516532 A5 JP2024516532 A5 JP 2024516532A5 JP 2023560896 A JP2023560896 A JP 2023560896A JP 2023560896 A JP2023560896 A JP 2023560896A JP 2024516532 A5 JP2024516532 A5 JP 2024516532A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- contacts
- interconnections
- bridge
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/245,903 | 2021-04-30 | ||
| US17/245,903 US11594491B2 (en) | 2021-04-30 | 2021-04-30 | Multi-die interconnect |
| PCT/US2022/071738 WO2022232746A1 (en) | 2021-04-30 | 2022-04-15 | Multi-die interconnect |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024516532A JP2024516532A (ja) | 2024-04-16 |
| JP2024516532A5 true JP2024516532A5 (enExample) | 2025-04-01 |
Family
ID=81585651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023560896A Pending JP2024516532A (ja) | 2021-04-30 | 2022-04-15 | マルチダイ相互接続 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11594491B2 (enExample) |
| EP (1) | EP4331009A1 (enExample) |
| JP (1) | JP2024516532A (enExample) |
| KR (1) | KR20240005699A (enExample) |
| CN (1) | CN116998000A (enExample) |
| BR (1) | BR112023021850A2 (enExample) |
| WO (1) | WO2022232746A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230011746A (ko) * | 2021-07-14 | 2023-01-25 | 삼성전자주식회사 | 반도체 패키지 |
| US11848272B2 (en) * | 2021-08-16 | 2023-12-19 | International Business Machines Corporation | Interconnection between chips by bridge chip |
| US11784130B2 (en) * | 2021-08-27 | 2023-10-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and formation method of package with underfill |
| US12355001B2 (en) * | 2021-11-17 | 2025-07-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor package structure and method for forming the same |
| WO2025239219A1 (ja) * | 2024-05-16 | 2025-11-20 | 株式会社村田製作所 | モジュール |
| WO2026033954A1 (ja) * | 2024-08-07 | 2026-02-12 | 株式会社村田製作所 | 配線基板 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10192810B2 (en) | 2013-06-28 | 2019-01-29 | Intel Corporation | Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
| US9443824B1 (en) | 2015-03-30 | 2016-09-13 | Qualcomm Incorporated | Cavity bridge connection for die split architecture |
| CN116110887A (zh) | 2015-12-11 | 2023-05-12 | 英特尔公司 | 具有利用嵌入微电子衬底中的微电子桥连接的多个微电子器件的微电子结构 |
| US10497674B2 (en) | 2016-01-27 | 2019-12-03 | Amkor Technology, Inc. | Semiconductor package and fabricating method thereof |
| US10276403B2 (en) | 2016-06-15 | 2019-04-30 | Avago Technologies International Sales Pe. Limited | High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer |
| EP3479398B1 (en) | 2016-07-01 | 2025-02-19 | Intel Corporation | Molded embedded bridge for enhanced emib applications |
| US20200098692A1 (en) * | 2018-09-26 | 2020-03-26 | Intel Corporation | Microelectronic assemblies having non-rectilinear arrangements |
| US11404379B2 (en) * | 2020-11-17 | 2022-08-02 | International Business Machines Corporation | Structure and method for bridge chip assembly with capillary underfill |
-
2021
- 2021-04-30 US US17/245,903 patent/US11594491B2/en active Active
-
2022
- 2022-04-15 BR BR112023021850A patent/BR112023021850A2/pt unknown
- 2022-04-15 WO PCT/US2022/071738 patent/WO2022232746A1/en not_active Ceased
- 2022-04-15 CN CN202280022426.XA patent/CN116998000A/zh active Pending
- 2022-04-15 JP JP2023560896A patent/JP2024516532A/ja active Pending
- 2022-04-15 EP EP22722093.6A patent/EP4331009A1/en active Pending
- 2022-04-15 KR KR1020237036578A patent/KR20240005699A/ko active Pending
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