JP2025513694A5 - - Google Patents
Info
- Publication number
- JP2025513694A5 JP2025513694A5 JP2024553824A JP2024553824A JP2025513694A5 JP 2025513694 A5 JP2025513694 A5 JP 2025513694A5 JP 2024553824 A JP2024553824 A JP 2024553824A JP 2024553824 A JP2024553824 A JP 2024553824A JP 2025513694 A5 JP2025513694 A5 JP 2025513694A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- rdl
- interconnection portion
- metallized layer
- interposer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/657,760 | 2022-04-04 | ||
| US17/657,760 US20230317677A1 (en) | 2022-04-04 | 2022-04-04 | Three-dimensional (3d) integrated circuit (ic) (3dic) package employing a redistribution layer (rdl) interposer facilitating semiconductor die stacking, and related fabrication methods |
| PCT/US2023/015820 WO2023196114A1 (en) | 2022-04-04 | 2023-03-21 | Three-dimensional (3d) integrated circuit (ic) (3dic) package employing a redistribution layer (rdl) interposer facilitating semiconductor die stacking, and related fabrication methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2025513694A JP2025513694A (ja) | 2025-04-30 |
| JP2025513694A5 true JP2025513694A5 (enExample) | 2026-03-04 |
Family
ID=85936856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024553824A Pending JP2025513694A (ja) | 2022-04-04 | 2023-03-21 | 半導体ダイ積層化を容易にする再配線層（ｒｄｌ）インターポーザを用いる３次元（３ｄ）集積回路（ｉｃ）（３ｄｉｃ）パッケージ、及び関連する製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20230317677A1 (enExample) |
| EP (1) | EP4505520A1 (enExample) |
| JP (1) | JP2025513694A (enExample) |
| KR (1) | KR20240166502A (enExample) |
| CN (1) | CN118872052A (enExample) |
| TW (1) | TW202343703A (enExample) |
| WO (1) | WO2023196114A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230369234A1 (en) * | 2022-05-11 | 2023-11-16 | Qualcomm Incorporated | Package comprising a substrate and an interconnection die configured for high density interconnection |
| KR20240118983A (ko) * | 2023-01-27 | 2024-08-06 | 삼성전자주식회사 | 3d 집적 회로(3dic) 구조체 및 그 제조 방법 |
| US20240282729A1 (en) * | 2023-02-20 | 2024-08-22 | Qualcomm Incorporated | Package dies including vertical interconnects for signal and power distribution in a three-dimensional (3d) integrated circuit (ic) package |
| CN118366954A (zh) * | 2024-06-17 | 2024-07-19 | 中科亿海微电子科技（苏州）有限公司 | 一种bga封装形式的fpga管脚互换的方法及兼容芯片 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11189599B2 (en) * | 2019-05-30 | 2021-11-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | System formed through package-in-package formation |
| US11742301B2 (en) * | 2019-08-19 | 2023-08-29 | Advanced Micro Devices, Inc. | Fan-out package with reinforcing rivets |
| US11456291B2 (en) * | 2020-06-24 | 2022-09-27 | Qualcomm Incorporated | Integrated circuit (IC) packages employing split, double-sided metallization structures to facilitate a semiconductor die (“die”) module employing stacked dice, and related fabrication methods |
| KR102879453B1 (ko) * | 2021-05-11 | 2025-10-31 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
| US20230307341A1 (en) * | 2022-01-25 | 2023-09-28 | Intel Corporation | Packaging architecture with edge ring anchoring |
-
2022
- 2022-04-04 US US17/657,760 patent/US20230317677A1/en active Pending
-
2023
- 2023-03-20 TW TW112110210A patent/TW202343703A/zh unknown
- 2023-03-21 KR KR1020247032069A patent/KR20240166502A/ko active Pending
- 2023-03-21 EP EP23715676.5A patent/EP4505520A1/en active Pending
- 2023-03-21 JP JP2024553824A patent/JP2025513694A/ja active Pending
- 2023-03-21 CN CN202380026426.1A patent/CN118872052A/zh active Pending
- 2023-03-21 WO PCT/US2023/015820 patent/WO2023196114A1/en not_active Ceased
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