JP2024537996A5 - - Google Patents
Info
- Publication number
- JP2024537996A5 JP2024537996A5 JP2024519876A JP2024519876A JP2024537996A5 JP 2024537996 A5 JP2024537996 A5 JP 2024537996A5 JP 2024519876 A JP2024519876 A JP 2024519876A JP 2024519876 A JP2024519876 A JP 2024519876A JP 2024537996 A5 JP2024537996 A5 JP 2024537996A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- interconnects
- traces
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/451,302 US12362269B2 (en) | 2021-10-18 | 2021-10-18 | Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods |
| US17/451,302 | 2021-10-18 | ||
| PCT/US2022/076910 WO2023069820A1 (en) | 2021-10-18 | 2022-09-23 | Integrated circuit (ic) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ets) layer, and related fabrication methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024537996A JP2024537996A (ja) | 2024-10-18 |
| JP2024537996A5 true JP2024537996A5 (enExample) | 2025-09-02 |
Family
ID=83978905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024519876A Pending JP2024537996A (ja) | 2021-10-18 | 2022-09-23 | ダイ側埋め込みトレース基板（ｅｔｓ）層内の埋め込み金属トレースに結合された補助金属層を採用する集積回路（ｉｃ）パッケージ、及び関連する製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12362269B2 (enExample) |
| EP (1) | EP4420164A1 (enExample) |
| JP (1) | JP2024537996A (enExample) |
| KR (1) | KR20240074788A (enExample) |
| CN (1) | CN118056277A (enExample) |
| TW (1) | TW202322330A (enExample) |
| WO (1) | WO2023069820A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12100645B2 (en) | 2021-09-23 | 2024-09-24 | Qualcomm Incorporated | Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101514539B1 (ko) | 2013-08-29 | 2015-04-22 | 삼성전기주식회사 | 전자부품 내장기판 |
| US8772951B1 (en) | 2013-08-29 | 2014-07-08 | Qualcomm Incorporated | Ultra fine pitch and spacing interconnects for substrate |
| US10748843B2 (en) | 2016-11-18 | 2020-08-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor substrate including embedded component and method of manufacturing the same |
| US10096542B2 (en) | 2017-02-22 | 2018-10-09 | Advanced Semiconductor Engineering, Inc. | Substrate, semiconductor package structure and manufacturing process |
| US20180350630A1 (en) | 2017-06-01 | 2018-12-06 | Qualcomm Incorporated | Symmetric embedded trace substrate |
| US10354969B2 (en) * | 2017-07-31 | 2019-07-16 | Advanced Semiconductor Engineering, Inc. | Substrate structure, semiconductor package including the same, and method for manufacturing the same |
| US11004779B2 (en) * | 2018-02-09 | 2021-05-11 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and a method of manufacturing the same |
| US10418316B1 (en) * | 2018-04-04 | 2019-09-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device |
| US10622292B2 (en) | 2018-07-06 | 2020-04-14 | Qualcomm Incorporated | High density interconnects in an embedded trace substrate (ETS) comprising a core layer |
| US10804195B2 (en) * | 2018-08-08 | 2020-10-13 | Qualcomm Incorporated | High density embedded interconnects in substrate |
| US12142567B2 (en) * | 2019-04-17 | 2024-11-12 | Intel Corporation | Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density |
| JP7430990B2 (ja) | 2019-06-26 | 2024-02-14 | 新光電気工業株式会社 | 配線基板の製造方法 |
| US11742301B2 (en) | 2019-08-19 | 2023-08-29 | Advanced Micro Devices, Inc. | Fan-out package with reinforcing rivets |
| MY208458A (en) * | 2019-09-26 | 2025-05-09 | Intel Corp | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages |
| EP4161222A4 (en) * | 2020-05-26 | 2024-07-10 | LG Innotek Co., Ltd. | PACKAGING SUBSTRATE |
| US12354935B2 (en) | 2020-08-25 | 2025-07-08 | Qualcomm Incorporated | Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods |
| US12100645B2 (en) | 2021-09-23 | 2024-09-24 | Qualcomm Incorporated | Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods |
| US11791320B2 (en) | 2021-11-22 | 2023-10-17 | Qualcomm Incorporated | Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods |
| US20230215849A1 (en) | 2022-01-05 | 2023-07-06 | Qualcomm Incorporated | PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPACITOR(S) (DTC(s)), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS |
| US20250062235A1 (en) | 2023-08-16 | 2025-02-20 | Qualcomm Incorporated | Package substrate with metallization layer(s) that includes an additional metal pad layer to facilitate reduced via size for reduced bump pitch, and related integrated circuit (ic) packages and fabrication methods |
-
2021
- 2021-10-18 US US17/451,302 patent/US12362269B2/en active Active
-
2022
- 2022-09-20 TW TW111135447A patent/TW202322330A/zh unknown
- 2022-09-23 CN CN202280067307.6A patent/CN118056277A/zh active Pending
- 2022-09-23 JP JP2024519876A patent/JP2024537996A/ja active Pending
- 2022-09-23 KR KR1020247012117A patent/KR20240074788A/ko active Pending
- 2022-09-23 WO PCT/US2022/076910 patent/WO2023069820A1/en not_active Ceased
- 2022-09-23 EP EP22793496.5A patent/EP4420164A1/en active Pending
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