CN118056277A - 采用耦合到管芯侧嵌入式迹线基板（ets）层中的嵌入式金属迹线的补充金属层的集成电路（ic）封装以及相关的制造方法 - Google Patents

采用耦合到管芯侧嵌入式迹线基板（ets）层中的嵌入式金属迹线的补充金属层的集成电路（ic）封装以及相关的制造方法 Download PDF

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Publication number
CN118056277A
CN118056277A CN202280067307.6A CN202280067307A CN118056277A CN 118056277 A CN118056277 A CN 118056277A CN 202280067307 A CN202280067307 A CN 202280067307A CN 118056277 A CN118056277 A CN 118056277A
Authority
CN
China
Prior art keywords
metal
layer
die
package
interconnects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280067307.6A
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English (en)
Chinese (zh)
Inventor
M·Y·金
K·康
J·R·V·鲍特
C-L·黄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN118056277A publication Critical patent/CN118056277A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
CN202280067307.6A 2021-10-18 2022-09-23 采用耦合到管芯侧嵌入式迹线基板（ets）层中的嵌入式金属迹线的补充金属层的集成电路（ic）封装以及相关的制造方法 Pending CN118056277A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/451,302 US12362269B2 (en) 2021-10-18 2021-10-18 Integrated circuit (IC) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ETS) layer, and related fabrication methods
US17/451,302 2021-10-18
PCT/US2022/076910 WO2023069820A1 (en) 2021-10-18 2022-09-23 Integrated circuit (ic) packages employing supplemental metal layer coupled to embedded metal traces in a die-side embedded trace substrate (ets) layer, and related fabrication methods

Publications (1)

Publication Number Publication Date
CN118056277A true CN118056277A (zh) 2024-05-17

Family

ID=83978905

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280067307.6A Pending CN118056277A (zh) 2021-10-18 2022-09-23 采用耦合到管芯侧嵌入式迹线基板（ets）层中的嵌入式金属迹线的补充金属层的集成电路（ic）封装以及相关的制造方法

Country Status (7)

Country Link
US (1) US12362269B2 (enExample)
EP (1) EP4420164A1 (enExample)
JP (1) JP2024537996A (enExample)
KR (1) KR20240074788A (enExample)
CN (1) CN118056277A (enExample)
TW (1) TW202322330A (enExample)
WO (1) WO2023069820A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12100645B2 (en) 2021-09-23 2024-09-24 Qualcomm Incorporated Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101514539B1 (ko) 2013-08-29 2015-04-22 삼성전기주식회사 전자부품 내장기판
US8772951B1 (en) 2013-08-29 2014-07-08 Qualcomm Incorporated Ultra fine pitch and spacing interconnects for substrate
US10748843B2 (en) 2016-11-18 2020-08-18 Advanced Semiconductor Engineering, Inc. Semiconductor substrate including embedded component and method of manufacturing the same
US10096542B2 (en) 2017-02-22 2018-10-09 Advanced Semiconductor Engineering, Inc. Substrate, semiconductor package structure and manufacturing process
US20180350630A1 (en) 2017-06-01 2018-12-06 Qualcomm Incorporated Symmetric embedded trace substrate
US10354969B2 (en) * 2017-07-31 2019-07-16 Advanced Semiconductor Engineering, Inc. Substrate structure, semiconductor package including the same, and method for manufacturing the same
US11004779B2 (en) * 2018-02-09 2021-05-11 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US10418316B1 (en) * 2018-04-04 2019-09-17 Advanced Semiconductor Engineering, Inc. Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device
US10622292B2 (en) 2018-07-06 2020-04-14 Qualcomm Incorporated High density interconnects in an embedded trace substrate (ETS) comprising a core layer
US10804195B2 (en) * 2018-08-08 2020-10-13 Qualcomm Incorporated High density embedded interconnects in substrate
US12142567B2 (en) * 2019-04-17 2024-11-12 Intel Corporation Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density
JP7430990B2 (ja) 2019-06-26 2024-02-14 新光電気工業株式会社 配線基板の製造方法
US11742301B2 (en) 2019-08-19 2023-08-29 Advanced Micro Devices, Inc. Fan-out package with reinforcing rivets
MY208458A (en) * 2019-09-26 2025-05-09 Intel Corp Organic mold interconnects in shielded interconnects frames for integrated-circuit packages
EP4161222A4 (en) * 2020-05-26 2024-07-10 LG Innotek Co., Ltd. PACKAGING SUBSTRATE
US12354935B2 (en) 2020-08-25 2025-07-08 Qualcomm Incorporated Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods
US12100645B2 (en) 2021-09-23 2024-09-24 Qualcomm Incorporated Integrated circuit (IC) package employing added metal for embedded metal traces in ETS-based substrate for reduced signal path impedance, and related fabrication methods
US11791320B2 (en) 2021-11-22 2023-10-17 Qualcomm Incorporated Integrated circuit (IC) packages employing a package substrate with a double side embedded trace substrate (ETS), and related fabrication methods
US20230215849A1 (en) 2022-01-05 2023-07-06 Qualcomm Incorporated PACKAGE SUBSTRATES WITH EMBEDDED DIE-SIDE, FACE-UP DEEP TRENCH CAPACITOR(S) (DTC(s)), AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS
US20250062235A1 (en) 2023-08-16 2025-02-20 Qualcomm Incorporated Package substrate with metallization layer(s) that includes an additional metal pad layer to facilitate reduced via size for reduced bump pitch, and related integrated circuit (ic) packages and fabrication methods

Also Published As

Publication number Publication date
WO2023069820A1 (en) 2023-04-27
TW202322330A (zh) 2023-06-01
JP2024537996A (ja) 2024-10-18
EP4420164A1 (en) 2024-08-28
US12362269B2 (en) 2025-07-15
KR20240074788A (ko) 2024-05-28
US20230118028A1 (en) 2023-04-20

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