JP2024505487A5 - - Google Patents
Info
- Publication number
- JP2024505487A5 JP2024505487A5 JP2023544579A JP2023544579A JP2024505487A5 JP 2024505487 A5 JP2024505487 A5 JP 2024505487A5 JP 2023544579 A JP2023544579 A JP 2023544579A JP 2023544579 A JP2023544579 A JP 2023544579A JP 2024505487 A5 JP2024505487 A5 JP 2024505487A5
- Authority
- JP
- Japan
- Prior art keywords
- interconnections
- substrate
- pad
- interconnects
- coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/164,729 | 2021-02-01 | ||
| US17/164,729 US11682607B2 (en) | 2021-02-01 | 2021-02-01 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate |
| PCT/US2021/064920 WO2022164560A1 (en) | 2021-02-01 | 2021-12-22 | Package having a substrate comprising surface interconnects aligned with a surface of the substrate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2024505487A JP2024505487A (ja) | 2024-02-06 |
| JP2024505487A5 true JP2024505487A5 (enExample) | 2024-12-03 |
| JP7824965B2 JP7824965B2 (ja) | 2026-03-05 |
Family
ID=80050968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023544579A Active JP7824965B2 (ja) | 2021-02-01 | 2021-12-22 | 基板の表面と整合された表面相互接続を備える基板を有するパッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11682607B2 (enExample) |
| EP (1) | EP4285407A1 (enExample) |
| JP (1) | JP7824965B2 (enExample) |
| KR (1) | KR20230137329A (enExample) |
| CN (1) | CN116745902A (enExample) |
| BR (1) | BR112023014695A2 (enExample) |
| TW (1) | TWI911361B (enExample) |
| WO (1) | WO2022164560A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7728756B2 (ja) | 2019-10-29 | 2025-08-25 | エイエムエス－オスラム インターナショナル ゲーエムベーハー | オプトエレクトロニクス装置 |
| WO2021110332A1 (en) * | 2019-12-06 | 2021-06-10 | Osram Opto Semiconductors Gmbh | Window or surface of a vehicle comprising at least one optoelectronic component |
| DE112020005977T5 (de) | 2019-12-06 | 2022-09-22 | Osram Opto Semiconductors Gmbh | Vorrichtung umfassend einen träger mit optoelektronischen elementen und verfahren zur herstellung der vorrichtung |
| CN114786943A (zh) | 2019-12-06 | 2022-07-22 | 奥斯兰姆奥普托半导体股份有限两合公司 | 光电装置 |
| US12040317B2 (en) | 2019-12-06 | 2024-07-16 | Osram Opto Semiconductors Gmbh | Optoelectronic device |
| CN114787996A (zh) | 2019-12-06 | 2022-07-22 | 奥斯兰姆奥普托半导体股份有限两合公司 | 光电装置 |
| US11682607B2 (en) * | 2021-02-01 | 2023-06-20 | Qualcomm Incorporated | Package having a substrate comprising surface interconnects aligned with a surface of the substrate |
| US12549154B2 (en) | 2021-09-24 | 2026-02-10 | Rf360 Singapore Pte. Ltd. | Package comprising an acoustic device and a cap substrate comprising an inductor |
| US12341488B2 (en) * | 2022-09-20 | 2025-06-24 | Qualcomm Incorporated | Package comprising an acoustic device and a polymer cap layer |
| US20240136293A1 (en) * | 2022-10-25 | 2024-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method of forming the same |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8021976B2 (en) * | 2002-10-15 | 2011-09-20 | Megica Corporation | Method of wire bonding over active area of a semiconductor circuit |
| US7099293B2 (en) * | 2002-05-01 | 2006-08-29 | Stmicroelectronics, Inc. | Buffer-less de-skewing for symbol combination in a CDMA demodulator |
| JP3800215B2 (ja) | 2003-09-29 | 2006-07-26 | 株式会社トッパンＮｅｃサーキットソリューションズ | 印刷配線板、半導体装置、及びそれらの製造方法 |
| JP4769022B2 (ja) | 2005-06-07 | 2011-09-07 | 京セラＳｌｃテクノロジー株式会社 | 配線基板およびその製造方法 |
| US7569422B2 (en) * | 2006-08-11 | 2009-08-04 | Megica Corporation | Chip package and method for fabricating the same |
| JP5101169B2 (ja) | 2007-05-30 | 2012-12-19 | 新光電気工業株式会社 | 配線基板とその製造方法 |
| US8193555B2 (en) * | 2009-02-11 | 2012-06-05 | Megica Corporation | Image and light sensor chip packages |
| US8837872B2 (en) * | 2010-12-30 | 2014-09-16 | Qualcomm Incorporated | Waveguide structures for signal and/or power transmission in a semiconductor device |
| US9177899B2 (en) | 2012-07-31 | 2015-11-03 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
| US9461008B2 (en) * | 2012-08-16 | 2016-10-04 | Qualcomm Incorporated | Solder on trace technology for interconnect attachment |
| US9508637B2 (en) * | 2014-01-06 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Protrusion bump pads for bond-on-trace processing |
| US10971476B2 (en) * | 2014-02-18 | 2021-04-06 | Qualcomm Incorporated | Bottom package with metal post interconnections |
| US9679841B2 (en) | 2014-05-13 | 2017-06-13 | Qualcomm Incorporated | Substrate and method of forming the same |
| US9343369B2 (en) * | 2014-05-19 | 2016-05-17 | Qualcomm Incorporated | Three dimensional (3D) integrated circuits (ICs) (3DICs) and related systems |
| US10157823B2 (en) | 2014-10-31 | 2018-12-18 | Qualcomm Incorporated | High density fan out package structure |
| US9425174B1 (en) | 2014-11-18 | 2016-08-23 | Altera Corporation | Integrated circuit package with solderless interconnection structure |
| US11139224B2 (en) * | 2019-12-05 | 2021-10-05 | Qualcomm Incorporated | Package comprising a substrate having a via wall configured as a shield |
| US20210175178A1 (en) * | 2019-12-05 | 2021-06-10 | Qualcomm Incorporated | Package comprising a double-sided redistribution portion |
| US12040317B2 (en) * | 2019-12-06 | 2024-07-16 | Osram Opto Semiconductors Gmbh | Optoelectronic device |
| US20210210452A1 (en) * | 2020-01-02 | 2021-07-08 | Qualcomm Incorporated | Integrated passive device (ipd) coupled to front side of integrated device |
| US11444019B2 (en) * | 2020-04-06 | 2022-09-13 | Qualcomm Incorporated | Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package |
| US11502049B2 (en) * | 2020-05-06 | 2022-11-15 | Qualcomm Incorporated | Package comprising multi-level vertically stacked redistribution portions |
| US11682607B2 (en) * | 2021-02-01 | 2023-06-20 | Qualcomm Incorporated | Package having a substrate comprising surface interconnects aligned with a surface of the substrate |
| US11823983B2 (en) * | 2021-03-23 | 2023-11-21 | Qualcomm Incorporated | Package with a substrate comprising pad-on-pad interconnects |
| US12469811B2 (en) * | 2021-03-26 | 2025-11-11 | Qualcomm Incorporated | Package comprising wire bonds coupled to integrated devices |
| US11791276B2 (en) * | 2021-04-08 | 2023-10-17 | Qualcomm Incorporated | Package comprising passive component between substrates for improved power distribution network (PDN) performance |
-
2021
- 2021-02-01 US US17/164,729 patent/US11682607B2/en active Active
- 2021-12-22 KR KR1020237025272A patent/KR20230137329A/ko active Pending
- 2021-12-22 BR BR112023014695A patent/BR112023014695A2/pt unknown
- 2021-12-22 EP EP21848393.1A patent/EP4285407A1/en active Pending
- 2021-12-22 WO PCT/US2021/064920 patent/WO2022164560A1/en not_active Ceased
- 2021-12-22 CN CN202180091685.3A patent/CN116745902A/zh active Pending
- 2021-12-22 TW TW110148145A patent/TWI911361B/zh active
- 2021-12-22 JP JP2023544579A patent/JP7824965B2/ja active Active
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