TWI911361B - 具有包括與基板的表面對準的表面互連的基板的封裝 - Google Patents

具有包括與基板的表面對準的表面互連的基板的封裝

Info

Publication number
TWI911361B
TWI911361B TW110148145A TW110148145A TWI911361B TW I911361 B TWI911361 B TW I911361B TW 110148145 A TW110148145 A TW 110148145A TW 110148145 A TW110148145 A TW 110148145A TW I911361 B TWI911361 B TW I911361B
Authority
TW
Taiwan
Prior art keywords
interconnects
substrate
interconnect
pad
coupled
Prior art date
Application number
TW110148145A
Other languages
English (en)
Chinese (zh)
Other versions
TW202232694A (zh
Inventor
弘博 魏
馬克思 徐
安尼奇 佩托
Original Assignee
美商高通公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商高通公司 filed Critical 美商高通公司
Publication of TW202232694A publication Critical patent/TW202232694A/zh
Application granted granted Critical
Publication of TWI911361B publication Critical patent/TWI911361B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/021—Manufacture or treatment of interconnections within wafers or substrates
    • H10W20/023—Manufacture or treatment of interconnections within wafers or substrates the interconnections being through-semiconductor vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/435—Cross-sectional shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/6565—Shapes or dispositions of interconnections recessed into the surface of the package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/237—Multiple bump connectors having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW110148145A 2021-02-01 2021-12-22 具有包括與基板的表面對準的表面互連的基板的封裝 TWI911361B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/164,729 2021-02-01
US17/164,729 US11682607B2 (en) 2021-02-01 2021-02-01 Package having a substrate comprising surface interconnects aligned with a surface of the substrate

Publications (2)

Publication Number Publication Date
TW202232694A TW202232694A (zh) 2022-08-16
TWI911361B true TWI911361B (zh) 2026-01-11

Family

ID=80050968

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110148145A TWI911361B (zh) 2021-02-01 2021-12-22 具有包括與基板的表面對準的表面互連的基板的封裝

Country Status (8)

Country Link
US (1) US11682607B2 (enExample)
EP (1) EP4285407A1 (enExample)
JP (1) JP7824965B2 (enExample)
KR (1) KR20230137329A (enExample)
CN (1) CN116745902A (enExample)
BR (1) BR112023014695A2 (enExample)
TW (1) TWI911361B (enExample)
WO (1) WO2022164560A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7728756B2 (ja) 2019-10-29 2025-08-25 エイエムエス－オスラム インターナショナル ゲーエムベーハー オプトエレクトロニクス装置
WO2021110332A1 (en) * 2019-12-06 2021-06-10 Osram Opto Semiconductors Gmbh Window or surface of a vehicle comprising at least one optoelectronic component
DE112020005977T5 (de) 2019-12-06 2022-09-22 Osram Opto Semiconductors Gmbh Vorrichtung umfassend einen träger mit optoelektronischen elementen und verfahren zur herstellung der vorrichtung
CN114786943A (zh) 2019-12-06 2022-07-22 奥斯兰姆奥普托半导体股份有限两合公司 光电装置
US12040317B2 (en) 2019-12-06 2024-07-16 Osram Opto Semiconductors Gmbh Optoelectronic device
CN114787996A (zh) 2019-12-06 2022-07-22 奥斯兰姆奥普托半导体股份有限两合公司 光电装置
US11682607B2 (en) * 2021-02-01 2023-06-20 Qualcomm Incorporated Package having a substrate comprising surface interconnects aligned with a surface of the substrate
US12549154B2 (en) 2021-09-24 2026-02-10 Rf360 Singapore Pte. Ltd. Package comprising an acoustic device and a cap substrate comprising an inductor
US12341488B2 (en) * 2022-09-20 2025-06-24 Qualcomm Incorporated Package comprising an acoustic device and a polymer cap layer
US20240136293A1 (en) * 2022-10-25 2024-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of forming the same

Citations (1)

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US20150194379A1 (en) * 2014-01-06 2015-07-09 Taiwan Semiconductor Manufacturing Company, Ltd. Protrusion Bump Pads for Bond-on-Trace Processing

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US8021976B2 (en) * 2002-10-15 2011-09-20 Megica Corporation Method of wire bonding over active area of a semiconductor circuit
US7099293B2 (en) * 2002-05-01 2006-08-29 Stmicroelectronics, Inc. Buffer-less de-skewing for symbol combination in a CDMA demodulator
JP3800215B2 (ja) 2003-09-29 2006-07-26 株式会社トッパンＮｅｃサーキットソリューションズ 印刷配線板、半導体装置、及びそれらの製造方法
JP4769022B2 (ja) 2005-06-07 2011-09-07 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法
US7569422B2 (en) * 2006-08-11 2009-08-04 Megica Corporation Chip package and method for fabricating the same
JP5101169B2 (ja) 2007-05-30 2012-12-19 新光電気工業株式会社 配線基板とその製造方法
US8193555B2 (en) * 2009-02-11 2012-06-05 Megica Corporation Image and light sensor chip packages
US8837872B2 (en) * 2010-12-30 2014-09-16 Qualcomm Incorporated Waveguide structures for signal and/or power transmission in a semiconductor device
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US9461008B2 (en) * 2012-08-16 2016-10-04 Qualcomm Incorporated Solder on trace technology for interconnect attachment
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US11139224B2 (en) * 2019-12-05 2021-10-05 Qualcomm Incorporated Package comprising a substrate having a via wall configured as a shield
US20210175178A1 (en) * 2019-12-05 2021-06-10 Qualcomm Incorporated Package comprising a double-sided redistribution portion
US12040317B2 (en) * 2019-12-06 2024-07-16 Osram Opto Semiconductors Gmbh Optoelectronic device
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Also Published As

Publication number Publication date
TW202232694A (zh) 2022-08-16
BR112023014695A2 (pt) 2023-12-12
CN116745902A (zh) 2023-09-12
US11682607B2 (en) 2023-06-20
JP2024505487A (ja) 2024-02-06
KR20230137329A (ko) 2023-10-04
JP7824965B2 (ja) 2026-03-05
US20220246496A1 (en) 2022-08-04
EP4285407A1 (en) 2023-12-06
WO2022164560A1 (en) 2022-08-04

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