JP2024523238A5 - - Google Patents
Info
- Publication number
- JP2024523238A5 JP2024523238A5 JP2023575919A JP2023575919A JP2024523238A5 JP 2024523238 A5 JP2024523238 A5 JP 2024523238A5 JP 2023575919 A JP2023575919 A JP 2023575919A JP 2023575919 A JP2023575919 A JP 2023575919A JP 2024523238 A5 JP2024523238 A5 JP 2024523238A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated device
- die
- bridge
- substrate
- coupled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/357,811 | 2021-06-24 | ||
| US17/357,811 US11830819B2 (en) | 2021-06-24 | 2021-06-24 | Package comprising integrated devices and bridge coupling top sides of integrated devices |
| PCT/US2022/030533 WO2022271376A1 (en) | 2021-06-24 | 2022-05-23 | Package comprising integrated devices and bridge coupling top sides of integrated devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024523238A JP2024523238A (ja) | 2024-06-28 |
| JP2024523238A5 true JP2024523238A5 (enExample) | 2025-05-20 |
Family
ID=82492622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575919A Pending JP2024523238A (ja) | 2021-06-24 | 2022-05-23 | 集積デバイスおよび集積デバイスの上面を結合するブリッジを含むパッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11830819B2 (enExample) |
| EP (1) | EP4360131A1 (enExample) |
| JP (1) | JP2024523238A (enExample) |
| KR (1) | KR20240025525A (enExample) |
| CN (1) | CN117413358A (enExample) |
| BR (1) | BR112023025604A2 (enExample) |
| TW (1) | TW202303899A (enExample) |
| WO (1) | WO2022271376A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11830819B2 (en) | 2021-06-24 | 2023-11-28 | Qualcomm Incorporated | Package comprising integrated devices and bridge coupling top sides of integrated devices |
| US12463156B2 (en) * | 2021-11-10 | 2025-11-04 | Intel Corporation | Packaging architectures for sub-terahertz radio frequency devices |
| US12599007B2 (en) * | 2021-12-23 | 2026-04-07 | Intel Corporation | Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias |
| TWI835546B (zh) * | 2023-02-03 | 2024-03-11 | 福懋科技股份有限公司 | 半導體封裝 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7838337B2 (en) | 2008-12-01 | 2010-11-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming an interposer package with through silicon vias |
| US20140131854A1 (en) | 2012-11-13 | 2014-05-15 | Lsi Corporation | Multi-chip module connection by way of bridging blocks |
| US10192810B2 (en) * | 2013-06-28 | 2019-01-29 | Intel Corporation | Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
| US10797022B2 (en) * | 2017-10-06 | 2020-10-06 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| US10991635B2 (en) | 2019-07-20 | 2021-04-27 | International Business Machines Corporation | Multiple chip bridge connector |
| US11133263B2 (en) | 2019-09-17 | 2021-09-28 | Intel Corporation | High-density interconnects for integrated circuit packages |
| US11600526B2 (en) | 2020-01-22 | 2023-03-07 | iCometrue Company Ltd. | Chip package based on through-silicon-via connector and silicon interconnection bridge |
| US11315902B2 (en) * | 2020-02-12 | 2022-04-26 | International Business Machines Corporation | High bandwidth multichip module |
| US12159840B2 (en) * | 2020-06-23 | 2024-12-03 | Intel Corporation | Scalable and interoperable PHYLESS die-to-die IO solution |
| US11450612B2 (en) * | 2020-07-09 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor devices and methods of manufacturing the same |
| US11830819B2 (en) | 2021-06-24 | 2023-11-28 | Qualcomm Incorporated | Package comprising integrated devices and bridge coupling top sides of integrated devices |
-
2021
- 2021-06-24 US US17/357,811 patent/US11830819B2/en active Active
-
2022
- 2022-05-23 WO PCT/US2022/030533 patent/WO2022271376A1/en not_active Ceased
- 2022-05-23 CN CN202280038808.1A patent/CN117413358A/zh active Pending
- 2022-05-23 EP EP22741028.9A patent/EP4360131A1/en active Pending
- 2022-05-23 BR BR112023025604A patent/BR112023025604A2/pt unknown
- 2022-05-23 JP JP2023575919A patent/JP2024523238A/ja active Pending
- 2022-05-23 TW TW111119074A patent/TW202303899A/zh unknown
- 2022-05-23 KR KR1020237043786A patent/KR20240025525A/ko active Pending
-
2023
- 2023-10-23 US US18/492,402 patent/US12400966B2/en active Active
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