JP2023519145A5 - - Google Patents
Info
- Publication number
- JP2023519145A5 JP2023519145A5 JP2022552624A JP2022552624A JP2023519145A5 JP 2023519145 A5 JP2023519145 A5 JP 2023519145A5 JP 2022552624 A JP2022552624 A JP 2022552624A JP 2022552624 A JP2022552624 A JP 2022552624A JP 2023519145 A5 JP2023519145 A5 JP 2023519145A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated device
- substrate
- interconnect
- interconnection
- electrical path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025135162A JP2025166172A (ja) | 2020-03-23 | 2025-08-14 | 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062993544P | 2020-03-23 | 2020-03-23 | |
| US62/993,544 | 2020-03-23 | ||
| US17/017,361 US11605594B2 (en) | 2020-03-23 | 2020-09-10 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate |
| US17/017,361 | 2020-09-10 | ||
| PCT/US2021/023035 WO2021194857A1 (en) | 2020-03-23 | 2021-03-18 | Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025135162A Division JP2025166172A (ja) | 2020-03-23 | 2025-08-14 | 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023519145A JP2023519145A (ja) | 2023-05-10 |
| JP2023519145A5 true JP2023519145A5 (enExample) | 2024-03-04 |
| JP7791095B2 JP7791095B2 (ja) | 2025-12-23 |
Family
ID=77748271
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022552624A Active JP7791095B2 (ja) | 2020-03-23 | 2021-03-18 | 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ |
| JP2025135162A Pending JP2025166172A (ja) | 2020-03-23 | 2025-08-14 | 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025135162A Pending JP2025166172A (ja) | 2020-03-23 | 2025-08-14 | 基板と基板に結合された高密度相互接続集積デバイスとを含むパッケージ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11605594B2 (enExample) |
| EP (1) | EP4128347A1 (enExample) |
| JP (2) | JP7791095B2 (enExample) |
| KR (1) | KR20220157959A (enExample) |
| CN (1) | CN115298819B (enExample) |
| BR (1) | BR112022018379A2 (enExample) |
| PH (1) | PH12022551934A1 (enExample) |
| WO (1) | WO2021194857A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI738525B (zh) * | 2020-09-24 | 2021-09-01 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| US11658123B2 (en) * | 2020-09-25 | 2023-05-23 | Advanced Micro Devices, Inc. | Hybrid bridged fanout chiplet connectivity |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0438080U (enExample) * | 1990-07-30 | 1992-03-31 | ||
| JPH05110024A (ja) * | 1991-10-18 | 1993-04-30 | Sharp Corp | 半導体装置及びその製造方法 |
| JPH1051147A (ja) * | 1996-07-29 | 1998-02-20 | Oki Electric Ind Co Ltd | 分岐配線部品および配線構造 |
| WO2006011320A1 (ja) * | 2004-07-30 | 2006-02-02 | Murata Manufacturing Co., Ltd. | 複合型電子部品及びその製造方法 |
| US7969009B2 (en) * | 2008-06-30 | 2011-06-28 | Qualcomm Incorporated | Through silicon via bridge interconnect |
| US9059179B2 (en) | 2011-12-28 | 2015-06-16 | Broadcom Corporation | Semiconductor package with a bridge interposer |
| US9831170B2 (en) * | 2011-12-30 | 2017-11-28 | Deca Technologies, Inc. | Fully molded miniaturized semiconductor module |
| US9250403B2 (en) * | 2013-04-26 | 2016-02-02 | Oracle International Corporation | Hybrid-integrated photonic chip package with an interposer |
| US9230936B2 (en) * | 2014-03-04 | 2016-01-05 | Qualcomm Incorporated | Integrated device comprising high density interconnects and redistribution layers |
| US9666559B2 (en) | 2014-09-05 | 2017-05-30 | Invensas Corporation | Multichip modules and methods of fabrication |
| US9368450B1 (en) * | 2015-08-21 | 2016-06-14 | Qualcomm Incorporated | Integrated device package comprising bridge in litho-etchable layer |
| US20170092594A1 (en) * | 2015-09-25 | 2017-03-30 | Qualcomm Incorporated | Low profile package with passive device |
| US9761533B2 (en) | 2015-10-16 | 2017-09-12 | Xilinx, Inc. | Interposer-less stack die interconnect |
| US9799616B2 (en) | 2016-03-08 | 2017-10-24 | Dyi-chung Hu | Package substrate with double sided fine line RDL |
| WO2017164810A1 (en) | 2016-03-21 | 2017-09-28 | Agency For Science, Technology And Research | Semiconductor package and method of forming the same |
| WO2017171738A1 (en) * | 2016-03-30 | 2017-10-05 | Intel Corporation | Hybrid microelectronic substrates |
| US10510721B2 (en) | 2017-08-11 | 2019-12-17 | Advanced Micro Devices, Inc. | Molded chip combination |
| DE112017008327T5 (de) | 2017-12-29 | 2020-10-08 | Intel Corporation | Mikroelektronische anordnungen |
| US10580738B2 (en) | 2018-03-20 | 2020-03-03 | International Business Machines Corporation | Direct bonded heterogeneous integration packaging structures |
| US11869842B2 (en) * | 2019-07-24 | 2024-01-09 | Intel Corporation | Scalable high speed high bandwidth IO signaling package architecture and method of making |
| US11289453B2 (en) * | 2020-02-27 | 2022-03-29 | Qualcomm Incorporated | Package comprising a substrate and a high-density interconnect structure coupled to the substrate |
-
2020
- 2020-09-10 US US17/017,361 patent/US11605594B2/en active Active
-
2021
- 2021-03-18 JP JP2022552624A patent/JP7791095B2/ja active Active
- 2021-03-18 PH PH1/2022/551934A patent/PH12022551934A1/en unknown
- 2021-03-18 WO PCT/US2021/023035 patent/WO2021194857A1/en not_active Ceased
- 2021-03-18 BR BR112022018379A patent/BR112022018379A2/pt unknown
- 2021-03-18 CN CN202180021997.7A patent/CN115298819B/zh active Active
- 2021-03-18 EP EP21718699.8A patent/EP4128347A1/en active Pending
- 2021-03-18 KR KR1020227032071A patent/KR20220157959A/ko active Pending
-
2025
- 2025-08-14 JP JP2025135162A patent/JP2025166172A/ja active Pending
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