KR20220157959A - 기판 및 기판에 커플링된 고밀도 인터커넥트 집적 디바이스를 포함하는 패키지 - Google Patents

기판 및 기판에 커플링된 고밀도 인터커넥트 집적 디바이스를 포함하는 패키지 Download PDF

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Publication number
KR20220157959A
KR20220157959A KR1020227032071A KR20227032071A KR20220157959A KR 20220157959 A KR20220157959 A KR 20220157959A KR 1020227032071 A KR1020227032071 A KR 1020227032071A KR 20227032071 A KR20227032071 A KR 20227032071A KR 20220157959 A KR20220157959 A KR 20220157959A
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South Korea
Prior art keywords
integrated device
substrate
interconnect
interconnects
coupled
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KR1020227032071A
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English (en)
Korean (ko)
Inventor
라이언 레인
리-성 웡
찰스 데이비드 페인터
에릭 데이비드 포론다
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퀄컴 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H01L25/0655—
    • H01L23/5381—
    • H01L23/5384—
    • H01L23/5386—
    • H01L25/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Combinations Of Printed Boards (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020227032071A 2020-03-23 2021-03-18 기판 및 기판에 커플링된 고밀도 인터커넥트 집적 디바이스를 포함하는 패키지 Pending KR20220157959A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202062993544P 2020-03-23 2020-03-23
US62/993,544 2020-03-23
US17/017,361 US11605594B2 (en) 2020-03-23 2020-09-10 Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate
US17/017,361 2020-09-10
PCT/US2021/023035 WO2021194857A1 (en) 2020-03-23 2021-03-18 Package comprising a substrate and a high-density interconnect integrated device coupled to the substrate

Publications (1)

Publication Number Publication Date
KR20220157959A true KR20220157959A (ko) 2022-11-29

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KR1020227032071A Pending KR20220157959A (ko) 2020-03-23 2021-03-18 기판 및 기판에 커플링된 고밀도 인터커넥트 집적 디바이스를 포함하는 패키지

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Country Link
US (1) US11605594B2 (enExample)
EP (1) EP4128347A1 (enExample)
JP (2) JP7791095B2 (enExample)
KR (1) KR20220157959A (enExample)
CN (1) CN115298819B (enExample)
BR (1) BR112022018379A2 (enExample)
PH (1) PH12022551934A1 (enExample)
WO (1) WO2021194857A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI738525B (zh) * 2020-09-24 2021-09-01 矽品精密工業股份有限公司 電子封裝件及其製法
US11658123B2 (en) * 2020-09-25 2023-05-23 Advanced Micro Devices, Inc. Hybrid bridged fanout chiplet connectivity

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JPH0438080U (enExample) * 1990-07-30 1992-03-31
JPH05110024A (ja) * 1991-10-18 1993-04-30 Sharp Corp 半導体装置及びその製造方法
JPH1051147A (ja) * 1996-07-29 1998-02-20 Oki Electric Ind Co Ltd 分岐配線部品および配線構造
WO2006011320A1 (ja) * 2004-07-30 2006-02-02 Murata Manufacturing Co., Ltd. 複合型電子部品及びその製造方法
US7969009B2 (en) * 2008-06-30 2011-06-28 Qualcomm Incorporated Through silicon via bridge interconnect
US9059179B2 (en) 2011-12-28 2015-06-16 Broadcom Corporation Semiconductor package with a bridge interposer
US9831170B2 (en) * 2011-12-30 2017-11-28 Deca Technologies, Inc. Fully molded miniaturized semiconductor module
US9250403B2 (en) * 2013-04-26 2016-02-02 Oracle International Corporation Hybrid-integrated photonic chip package with an interposer
US9230936B2 (en) * 2014-03-04 2016-01-05 Qualcomm Incorporated Integrated device comprising high density interconnects and redistribution layers
US9666559B2 (en) 2014-09-05 2017-05-30 Invensas Corporation Multichip modules and methods of fabrication
US9368450B1 (en) * 2015-08-21 2016-06-14 Qualcomm Incorporated Integrated device package comprising bridge in litho-etchable layer
US20170092594A1 (en) * 2015-09-25 2017-03-30 Qualcomm Incorporated Low profile package with passive device
US9761533B2 (en) 2015-10-16 2017-09-12 Xilinx, Inc. Interposer-less stack die interconnect
US9799616B2 (en) 2016-03-08 2017-10-24 Dyi-chung Hu Package substrate with double sided fine line RDL
WO2017164810A1 (en) 2016-03-21 2017-09-28 Agency For Science, Technology And Research Semiconductor package and method of forming the same
WO2017171738A1 (en) * 2016-03-30 2017-10-05 Intel Corporation Hybrid microelectronic substrates
US10510721B2 (en) 2017-08-11 2019-12-17 Advanced Micro Devices, Inc. Molded chip combination
DE112017008327T5 (de) 2017-12-29 2020-10-08 Intel Corporation Mikroelektronische anordnungen
US10580738B2 (en) 2018-03-20 2020-03-03 International Business Machines Corporation Direct bonded heterogeneous integration packaging structures
US11869842B2 (en) * 2019-07-24 2024-01-09 Intel Corporation Scalable high speed high bandwidth IO signaling package architecture and method of making
US11289453B2 (en) * 2020-02-27 2022-03-29 Qualcomm Incorporated Package comprising a substrate and a high-density interconnect structure coupled to the substrate

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Publication number Publication date
US20210296246A1 (en) 2021-09-23
US11605594B2 (en) 2023-03-14
EP4128347A1 (en) 2023-02-08
JP2025166172A (ja) 2025-11-05
TW202141711A (zh) 2021-11-01
CN115298819A (zh) 2022-11-04
JP7791095B2 (ja) 2025-12-23
JP2023519145A (ja) 2023-05-10
PH12022551934A1 (en) 2023-11-29
CN115298819B (zh) 2025-08-22
BR112022018379A2 (pt) 2022-11-08
WO2021194857A1 (en) 2021-09-30

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