JP2024526596A5 - - Google Patents
Info
- Publication number
- JP2024526596A5 JP2024526596A5 JP2023579789A JP2023579789A JP2024526596A5 JP 2024526596 A5 JP2024526596 A5 JP 2024526596A5 JP 2023579789 A JP2023579789 A JP 2023579789A JP 2023579789 A JP2023579789 A JP 2023579789A JP 2024526596 A5 JP2024526596 A5 JP 2024526596A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- electrical component
- block
- substrate
- encapsulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/383,241 US11985804B2 (en) | 2021-07-22 | 2021-07-22 | Package comprising a block device with a shield and method of fabricating the same |
| US17/383,241 | 2021-07-22 | ||
| PCT/US2022/033023 WO2023003650A1 (en) | 2021-07-22 | 2022-06-10 | Package comprising a block device with a shield |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024526596A JP2024526596A (ja) | 2024-07-19 |
| JP2024526596A5 true JP2024526596A5 (enExample) | 2025-06-05 |
Family
ID=82403492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023579789A Pending JP2024526596A (ja) | 2021-07-22 | 2022-06-10 | シールドを有するブロックデバイスを含むパッケージ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11985804B2 (enExample) |
| EP (1) | EP4374426A1 (enExample) |
| JP (1) | JP2024526596A (enExample) |
| KR (1) | KR20240035464A (enExample) |
| CN (1) | CN117642856A (enExample) |
| TW (1) | TW202308094A (enExample) |
| WO (1) | WO2023003650A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN220189616U (zh) * | 2020-10-16 | 2023-12-15 | 株式会社村田制作所 | 电子部件模块、子模块 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205428912U (zh) * | 2013-02-25 | 2016-08-03 | 株式会社村田制作所 | 模块以及模块元器件 |
| US10163871B2 (en) | 2015-10-02 | 2018-12-25 | Qualcomm Incorporated | Integrated device comprising embedded package on package (PoP) device |
| WO2018101381A1 (ja) * | 2016-12-02 | 2018-06-07 | 株式会社村田製作所 | 高周波モジュール |
| CN110036469B (zh) * | 2016-12-02 | 2023-05-12 | 株式会社村田制作所 | 高频模块 |
| KR101983188B1 (ko) * | 2016-12-22 | 2019-05-28 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 |
| JP6753514B2 (ja) * | 2017-03-08 | 2020-09-09 | 株式会社村田製作所 | 高周波モジュール |
| KR101982056B1 (ko) * | 2017-10-31 | 2019-05-24 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 모듈 |
| KR101982061B1 (ko) * | 2017-12-19 | 2019-05-24 | 삼성전기주식회사 | 반도체 패키지 |
| KR102008344B1 (ko) * | 2018-01-02 | 2019-08-07 | 삼성전자주식회사 | 반도체 패키지 |
| KR102026132B1 (ko) | 2018-03-05 | 2019-09-27 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 모듈 |
| US10937741B2 (en) * | 2018-11-16 | 2021-03-02 | STATS ChipPAC Pte. Ltd. | Molded laser package with electromagnetic interference shield and method of making |
| KR102553021B1 (ko) * | 2018-12-18 | 2023-07-07 | 삼성전자주식회사 | 전자장치 하우징 및 이를 구비하는 전자 시스템 |
| US12293980B2 (en) * | 2019-09-20 | 2025-05-06 | Qualcomm Incorporated | Package comprising discrete antenna device |
| US11495873B2 (en) * | 2020-03-05 | 2022-11-08 | Qualcomm Incorporated | Device comprising multi-directional antennas in substrates coupled through flexible interconnects |
-
2021
- 2021-07-22 US US17/383,241 patent/US11985804B2/en active Active
-
2022
- 2022-06-10 KR KR1020247001301A patent/KR20240035464A/ko active Pending
- 2022-06-10 CN CN202280048900.6A patent/CN117642856A/zh active Pending
- 2022-06-10 WO PCT/US2022/033023 patent/WO2023003650A1/en not_active Ceased
- 2022-06-10 TW TW111121645A patent/TW202308094A/zh unknown
- 2022-06-10 EP EP22738168.8A patent/EP4374426A1/en active Pending
- 2022-06-10 JP JP2023579789A patent/JP2024526596A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9642259B2 (en) | Embedded bridge structure in a substrate | |
| CN101449375B (zh) | 用于集成电路封装中的无导线连接的设备、系统和方法 | |
| KR101657622B1 (ko) | 전자기 간섭 인클로저를 갖는 무선 주파수 멀티-칩 집적 회로 패키지 및 패키지를 제조하기 위한 방법 | |
| US9368566B2 (en) | Package on package (PoP) integrated device comprising a capacitor in a substrate | |
| JP2018535541A5 (enExample) | ||
| US7477197B2 (en) | Package level integration of antenna and RF front-end module | |
| JP2016536787A5 (enExample) | ||
| JP2024508408A5 (enExample) | ||
| EP3039716A1 (en) | Ultra fine pitch and spacing interconnects for substrate | |
| JP2024523238A5 (enExample) | ||
| JP2024505487A5 (enExample) | ||
| US20130320547A1 (en) | Enabling package-on-package (pop) pad surface finishes on bumpless build-up layer (bbul) package | |
| JP2018511165A5 (enExample) | ||
| US9355898B2 (en) | Package on package (PoP) integrated device comprising a plurality of solder resist layers | |
| JP2019102536A (ja) | 多層回路基板 | |
| JP2024521546A5 (enExample) | ||
| US11432405B2 (en) | Methods for attaching large components in a package substrate for advanced power delivery | |
| JP2024526596A5 (enExample) | ||
| US20160183379A1 (en) | Substrate comprising an embedded capacitor | |
| US20180323137A1 (en) | Integrated circuit (ic) package and package substrate comprising stacked vias | |
| CN103811444A (zh) | 电子装置、系统级封装模块及系统级封装模块的制造方法 | |
| JP2019510368A5 (enExample) | ||
| JP2024533131A5 (enExample) | ||
| JP2024540436A5 (enExample) | ||
| CN221979165U (zh) | 一种有效改善emc的pcba结构 |