JP2024533131A5 - - Google Patents
Info
- Publication number
- JP2024533131A5 JP2024533131A5 JP2024513794A JP2024513794A JP2024533131A5 JP 2024533131 A5 JP2024533131 A5 JP 2024533131A5 JP 2024513794 A JP2024513794 A JP 2024513794A JP 2024513794 A JP2024513794 A JP 2024513794A JP 2024533131 A5 JP2024533131 A5 JP 2024533131A5
- Authority
- JP
- Japan
- Prior art keywords
- interconnectors
- dielectric layer
- layer
- spacing
- package according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/479,691 | 2021-09-20 | ||
| US17/479,691 US12125742B2 (en) | 2021-09-20 | 2021-09-20 | Package comprising a substrate with high density interconnects |
| PCT/US2022/039610 WO2023043548A1 (en) | 2021-09-20 | 2022-08-05 | Package comprising a substrate with high density interconnects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024533131A JP2024533131A (ja) | 2024-09-12 |
| JP2024533131A5 true JP2024533131A5 (enExample) | 2025-07-22 |
Family
ID=83149368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024513794A Pending JP2024533131A (ja) | 2021-09-20 | 2022-08-05 | 高密度相互接続子を有する基板を備えるパッケージ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12125742B2 (enExample) |
| EP (1) | EP4406015A1 (enExample) |
| JP (1) | JP2024533131A (enExample) |
| KR (1) | KR20240057411A (enExample) |
| CN (1) | CN117981078A (enExample) |
| TW (1) | TW202329366A (enExample) |
| WO (1) | WO2023043548A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12581937B2 (en) * | 2023-07-03 | 2026-03-17 | Rf360 Singapore Pte. Ltd. | Integrated device comprising metallization interconnects |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI645527B (zh) | 2018-03-06 | 2018-12-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| US11075260B2 (en) * | 2018-10-31 | 2021-07-27 | Qualcomm Incorporated | Substrate comprising recessed interconnects and a surface mounted passive component |
| KR102600154B1 (ko) | 2019-06-12 | 2023-11-07 | 삼성전자주식회사 | 반도체 패키지 |
-
2021
- 2021-09-20 US US17/479,691 patent/US12125742B2/en active Active
-
2022
- 2022-08-05 JP JP2024513794A patent/JP2024533131A/ja active Pending
- 2022-08-05 WO PCT/US2022/039610 patent/WO2023043548A1/en not_active Ceased
- 2022-08-05 CN CN202280061486.2A patent/CN117981078A/zh active Pending
- 2022-08-05 EP EP22761799.0A patent/EP4406015A1/en active Pending
- 2022-08-05 TW TW111129520A patent/TW202329366A/zh unknown
- 2022-08-05 KR KR1020247008307A patent/KR20240057411A/ko active Pending
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