CN220189616U - 电子部件模块、子模块 - Google Patents

电子部件模块、子模块 Download PDF

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CN220189616U
CN220189616U CN202190000795.XU CN202190000795U CN220189616U CN 220189616 U CN220189616 U CN 220189616U CN 202190000795 U CN202190000795 U CN 202190000795U CN 220189616 U CN220189616 U CN 220189616U
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electronic component
module
substrate
sub
conductor
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高仓毅
大坪喜人
野村忠志
中越英雄
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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Abstract

本实用新型的一方式是一种电子部件模块(1),具备:基板(2);电子部件(11~14),其安装于基板(2);以及子模块(30),其安装于基板(2),子模块(30)包括:作为布线基板的再布线层(48);电子部件(14),其配置于再布线层(48)的两个主面中的一个主面;电子部件(13),其配置于再布线层(48)的两个主面中的另一个主面;以及作为密封构件的密封树脂(33),其覆盖再布线层(48)和电子部件(13、14)。通过这样的结构,能够高密度地安装模块内的部件。

Description

电子部件模块、子模块
技术领域
本实用新型涉及安装有多个电子部件的电子部件模块、子模块。
背景技术
移动电话、智能手机等移动终端、各种通信设备使用安装有多个电子部件的电子部件模块。这样的电子部件模块要求(1)小型化、(2)电磁屏蔽性、(3)散热性、耐电压性等性能。
关于小型化,多个以SAW滤波器为代表的电子部件搭载于基板。因此,占有部件搭载面的较多面积,对模块整体的尺寸带来影响。
另外,关于电磁屏蔽性,针对使在多个频带动作的部件同时运转的情况下产生的电波干涉、来自电感部件的磁场的影响,通常使用在四周配置金属片(电波遮壁)这种构造来实施噪声对策。在设置这样的电磁屏蔽的情况下,预计存在对模块整体的尺寸造成影响、遮壁效果受到限定、制造工艺变复杂化等课题。
另外,关于散热性、耐电压性,近年来谋求模块的高输出化,IC(集成电路)、SAW滤波器、体声波(BAW)滤波器等电子部件的散热性、耐电压性成为重要的课题。在现有的模块构造中,为了改善散热性、耐电压性,需要增大电子部件的平面尺寸。例如,为了确保IC(集成电路)的耐电压性,需要增大IC的表面尺寸。若这样,则模块内的部件的高密度安装变困难。
下述的专利文献1公开一种部件内置模块,其二维安装有多个电子部件,并具有比模块基板面积小的子模块。
专利文献1:日本特许第4424449号公报
实用新型内容
本实用新型的目的在于提供能够高密度地安装模块内的部件的电子部件模块。
另外,本实用新型的目的在于提供能够安装于电子部件模块内的子模块的制造方法。
本实用新型的一方式是一种电子部件模块,具备:基板;电子部件,其安装于上述基板;以及子模块,其安装于上述基板,上述子模块包括:布线基板;第1电子部件,其配置于上述布线基板的两个主面中的一个主面;第2电子部件,其配置于上述布线基板的两个主面中的另一个主面;以及第1密封构件,其覆盖上述布线基板、上述第1电子部件和上述第2电子部件。
本实用新型的其他方式所涉及的子模块的制造方法包括如下步骤:准备具有相向的第1面和第2面的第1电子部件;在上述第1电子部件的第2面侧设置布线基板,在上述第1电子部件的侧面侧设置布线导体;将具有相向的第1面和第2面的第2电子部件层叠于上述第1电子部件的第2面侧,并将上述布线基板、上述布线导体和上述第2电子部件的端子电连接;以及通过密封构件被覆上述第1电子部件、上述第2电子部件、上述布线基板和上述布线导体。
根据本实用新型,能够高密度地安装模块内的部件。
附图说明
图1的(A)是表示二维安装有多个电子部件的电子部件模块1的内部结构的剖视图。图1的(B)~(E)是表示本实用新型的实施方式1所涉及的电子部件模块的制造方法的一个例子的剖视图。
图2的(A)~(C)是表示本实用新型的实施方式2所涉及的子模块30的结构的一个例子的剖视图。图2的(D)是表示再布线层的接地层的俯视图。
图3的(A)~(B)是表示本实用新型的实施方式3所涉及的子模块30的结构的一个例子的剖视图,图3的(C)是表示侧面布线的侧视图。
图4的(A)~(C)是表示本实用新型的实施方式4所涉及的子模块30的结构的一个例子的剖视图。
图5的(A)~(H)是表示本实用新型的实施方式5所涉及的子模块30的结构的一个例子的图,图5的(A)~(B)是电子部件80、90的凸块配置图,图5的(C)是导体框架36的俯视图,图5的(D)是凸块和导体框架36的配置图,图5的(E)是沿着X1-X1线的剖视图,图5的(F)是沿着X2-X2线的剖视图,图5的(G)是表示在导体框架36上设置了宽度宽的接地平面的变形例的俯视图,图5的(H)是凸块和导体框架36的配置图。
图6的(A)(C)(D)是表示本实用新型的实施方式6所涉及的子模块30的结构的一个例子的剖视图,图6的(B)是表示引出布线的侧视图。
图7是表示本实用新型的实施方式7所涉及的电子部件模块的内部结构的一个例子的剖视图。
具体实施方式
本实用新型的一方式是一种电子部件模块,具备:基板;电子部件,其安装于上述基板;以及子模块,其安装于上述基板,上述子模块包括:布线基板;第1电子部件,其配置于上述布线基板的两个主面中的一个主面;第2电子部件,其配置于上述布线基板的两个主面中的另一个主面;以及第1密封构件,其覆盖上述布线基板、上述第1电子部件和上述第2电子部件。
根据该结构,通过具备在布线基板的两面侧层叠有第1电子部件和第2电子部件的子模块,模块内的部件安装密度变高。
也可以是,在本实用新型中,在上述子模块的上述第1密封构件的表面设置有第1屏蔽膜。
根据该结构,能够抑制处于电子部件模块的内部且位于子模块的外部的电子部件与位于子模块的内部的第1电子部件和第2电子部件之间的电磁波的干涉。
也可以是,在本实用新型中,在上述子模块内的上述第1电子部件与上述第2电子部件之间,在与上述布线基板的主面平行的方向上设置有接地导体。
根据该结构,能够抑制位于子模块的内部的第1电子部件与第2电子部件之间的电磁波的干涉。
也可以是,在本实用新型中,具备覆盖上述子模块和上述第1电子部件和上述第2电子部件的第2密封构件,在上述第2密封构件的表面设置有第2屏蔽膜。
根据该结构,能够抑制从电子部件模块的外部到来的电磁波的干涉。
也可以是,在本实用新型中,上述第1电子部件和上述第2电子部件中一者与上述第2屏蔽膜直接接触,上述第1电子部件和上述第2电子部件中另一者与配置于上述基板的导体直接接触。
根据该结构,屏蔽膜和导体通常能够由金属材料形成,因此,具有良好的热传导性。因此,通过子模块内的电子部件与屏蔽膜和导体直接接触,改善散热性。
也可以是,在本实用新型中,上述第1电子部件和上述第2电子部件中一者具有与上述第2屏蔽膜直接接触的接触面和不与上述第2屏蔽膜直接接触的非接触面,上述接触面的表面粗糙度大于上述非接触面的表面粗糙度。
根据该结构,与屏蔽膜直接接触的接触面例如通过磨削加工而变粗糙,通常接触面的表面粗糙度比非接触面的表面粗糙度大。由此锚固效应增强,屏蔽膜的紧贴强度提高。
本实用新型的另一其他方式所涉及的子模块的制造方法包括如下步骤:准备具有相向的第1面和第2面的第1电子部件;在上述第1电子部件的第2面侧设置布线基板,在上述第1电子部件的侧面侧设置布线导体;将具有相向的第1面和第2面的第2电子部件层叠于上述第1电子部件的第2面侧,并将上述布线基板、上述布线导体和上述第2电子部件的端子电连接;以及通过密封构件被覆上述第1电子部件、上述第2电子部件、上述布线基板和上述布线导体。
根据该结构,通过层叠有第1电子部件和第2电子部件,部件安装密度变高。
(实施方式1)
图1的(A)是表示二维安装有多个电子部件的电子部件模块1的内部结构的剖视图。图1的(B)~(E)是表示本实用新型的实施方式1所涉及的电子部件模块的制造方法的一个例子的剖视图。
在图1的(A)中,在基板2上二维搭载有多个电子部件11~14。各电子部件11~14通过焊球、回流焊、导电性粘合剂等而与基板2的导体图案电连接并且机械连接。作为一个例子,电子部件11是线圈、电容器、电阻等无源电子部件,电子部件12~14是SAW滤波器、集成电路等平面型的电子部件。此处,例示电子部件11的高度比电子部件12~14大的情况。
通过密封树脂3的填充来被覆各电子部件11~14,通过密封树脂3的形状决定电子部件模块1的外形。在密封树脂3的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射,设置有导体膜4来作为遮挡电磁波的屏蔽膜。该导体膜4与基板2的接地线连接。区域A1(虚线)表示包含应该保护免受电磁波的干涉影响的部件等的区域。
接着,图1的(B)中,电子部件13、14作为子模块30而构成。电子部件13、14分别具有相向的第1面(例如,图1中下表面)和第2面(例如,图1中上表面)。电子部件13在与基板表面垂直的方向上层叠于电子部件14的第2面侧。
在电子部件14与电子部件13之间,作为部件间的布线基板而设置有再布线层48。也可以是,再布线层48由导体层/绝缘层构成,导体层包含将电子部件14、电子部件13、布线导体43电连接的连接电极和导体线,绝缘层包含使导体层间连接的层间导通孔。例如,再布线层48也可以是层叠了多层的导体层/绝缘层而成的基板。在电子部件14的侧面侧设置有柱状的布线导体43。在电子部件14的第1面侧设置有与基板2的导体线连接的连接电极(未图示)。连接电极经由布线导体43、再布线层48等而与电子部件13的端子例如电源端子、接地端子、信号端子等电连接。
电子部件13、14、再布线层48、布线导体43等通过密封树脂33的填充而被覆,根据密封树脂33的形状来决定子模块30的外形。在密封树脂33的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射而设置有导体膜34,来作为遮挡电磁波的屏蔽膜。
接着,在图1的(C)中,在预先搭载了电子部件11、12的基板2上搭载上述的子模块30。此时,位于下侧的电子部件14与基板2的导体线电连接,并且位于上侧的电子部件13也能够经由再布线层48、布线导体43等而与基板2的导体线电连接。子模块30的导体膜34也与基板2的接地线连接。接着,通过密封树脂3的填充来被覆电子部件11、12和子模块30。基板2由多层基板例如LTCC等多层陶瓷基板、多层树脂基板等构成。在本实施方式中,在基板2上形成凹部,由此实现电子部件的低矮化。作为代替,基板2也可以平坦。
接着,在图1的(D)中,通过例如磨削加工而除去密封树脂3的上侧部分,也除去子在模块30的顶面设置的导体膜34。设置于子模块30的侧面的导体膜34保持原样残留,仅上侧边缘暴露。由此,通过密封树脂3的形状来决定电子部件模块1的外形。
接着,在图1的(E)中,在密封树脂3的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射,设置有导体膜4,来作为遮挡电磁波的屏蔽膜。导体膜4与残留的导体膜34导通,与基板2的接地线连接。由于导体膜4的存在,能够抑制从电子部件模块1的外部到来的电磁波的干涉。
通过以上述方式采用层叠了电子部件13、14而成的子模块30,与图1的(A)的结构相比,电子部件模块1内的部件安装密度变高,实现设置面积的小型化。另外,能够在电子部件11、12与电子部件13、14之间设置作为屏蔽膜发挥功能的导体膜34,能够抑制两者间的电磁波的干涉。
另外,在区域A2(虚线)中,电子部件13与导体膜4直接接触。由此,从电子部件13放出的热的一部分直接传递于导体膜4,散热性改善。特别是与导体膜4直接接触的接触面例如通过磨削加工而变粗糙,因此,通常接触面的表面粗糙度比不与导体膜4直接接触的非接触面例如部件的侧面的表面粗糙度大。由此,锚固效应增强,导体膜的紧贴强度提高。关于表面粗糙度的测定方法,例如能够利用激光扫描表面而测定凹凸形状,例如,激光方式能够使用VK-X120(Keyence制),不是激光的光学式能够使用VR-3000(Keyence制)。
在区域A3(虚线)中,电子部件14也与基板2的导体线直接接触。由此,从电子部件14放出的热的一部分直接传递于基板2,散热性改善。
(实施方式2)
图2的(A)~(C)是表示本实用新型的实施方式2所涉及的子模块30的结构的一个例子的剖视图。图2的(D)是表示再布线层的接地层的俯视图。
在图2的(A)中,电子部件40预先搭载在载体基板41上。在电子部件40的第1面设置有端子42。在电子部件40的侧面侧设置有柱状的布线导体43。电子部件40和布线导体43通过密封树脂44的填充而受到被覆。
接着,在图2的(B)中,密封树脂44的上侧部分通过例如磨削加工而除去,从而电子部件40的第2面暴露。接着,在电子部件40的第2面形成有用于位于上侧的电子部件50的再布线层48。再布线层48包括电绝缘层45、导体层46和接地层47。导体层46与布线导体43电连接。接地层47在与再布线层48的主面平行的方向上设置。
如图2的(D)所示,接地层47遍及第2面的几乎整个面设置,以防止与布线导体43短路。另外,接地层47的外侧边缘暴露,能够与后述的导体膜34导通。此外,接地层47的角部为了防止切割加工时的毛刺而局部缺损。
接下来,返回图2的(B),准备在第1面具备连接端子52和密封树脂51的电子部件50。将该电子部件50搭载在形成于电子部件40的第2面的再布线层48之上,进行电连接和机械连接。接着,除去载体基板41,在端子42和布线导体43的下端分别设置有连接电极35。
接着,在图2的(C)中,在电子部件50四周填充密封树脂33,子模块整体例如成形为长方体状。接着,在密封树脂33和密封树脂44的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射而设置有导体膜34,来作为遮挡电磁波的屏蔽膜。导体膜34与再布线层48的接地层47导通。这样,得到在电子部件40上层叠有电子部件50的子模块30。由此,实现设置面积的小型化。
子模块30安装于图1所示那样的基板2。此时,导体膜34也与基板2的接地线连接。通过导体膜34的存在,能够抑制从子模块30的外部到来的电磁波的干涉。
(实施方式3)
图3的(A)~(B)是表示本实用新型的实施方式3所涉及的子模块30的结构的一个例子的剖视图,图3的(C)是表示侧面布线的侧视图。本实施方式所涉及的基本结构与实施方式2类似,但在取代柱状的布线导体43而在电子部件40的侧面设置有侧面布线43a这点上不同。
在图3的(A)中,与实施方式2相同,在电子部件40的第2面形成有包括电绝缘层45、导体层46和接地层47的再布线层48。如图3的(C)所示,导体层46与设置于电子部件40的侧面的侧面布线43a电连接。电子部件40和侧面布线43a的四周由密封树脂44填充。
接下来,将在第1面具备连接端子52和密封树脂51的电子部件50搭载在再布线层48上,进行电连接和机械连接。接着,在端子42和侧面布线43a的下端分别设置有连接电极35。
接着,在图3的(B)中,在电子部件50的四周填充有密封树脂33,子模块整体例如成形为长方体状。接着,在密封树脂33和密封树脂44的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射,设置有导体膜34,来作为遮挡电磁波的屏蔽膜。导体膜34与再布线层48的接地层47导通。这样得到在电子部件40上层叠有电子部件50的子模块30。由此,实现设置面积的小型化。
子模块30安装于图1所示那样的基板2。此时,导体膜34也与基板2的接地线连接。通过导体膜34的存在,能够抑制从子模块30的外部到来的电磁波的干涉。
(实施方式4)
图4的(A)~(C)是表示本实用新型的实施方式4所涉及的子模块30的结构的一个例子的剖视图。本实施方式所涉及的基本结构与实施方式2类似,但在位于上侧的电子部件60的第1面设置有再布线层68这点上不同。
在图4的(A)中,准备在第1面具备连接端子62和密封树脂61的电子部件60。接着,在电子部件60的第1面形成用于位于下侧的电子部件70的再布线层68。再布线层68包括电绝缘层65、导体层66和接地层67。与图2的(D)相同,接地层67遍及第1面的几乎整个面设置,以防止与后述的布线导体74短路。另外,接地层67的外侧边缘暴露,能够与后述的导体膜34导通。
接着,在图4的(B)中,准备在第1面具备连接端子72和密封树脂71的电子部件70。接着,将电子部件70接合于再布线层68,进行电连接和机械连接。而且,准备柱状的布线导体74,与再布线层68的导体层66电连接。
接着,在图4的(C)中,在电子部件70的四周填充有密封树脂33,子模块整体例如成形为长方体状。接着,在密封树脂33和密封树脂61的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射,设置有导体膜34,来作为遮挡电磁波的屏蔽膜。导体膜34与再布线层68的接地层67导通。接着,在端子72和布线导体74的下端分别设置有连接电极35。这样得到在电子部件70上层叠有电子部件60的子模块30。由此,实现设置面积的小型化。
子模块30安装于图1所示那样的基板2。此时,导体膜34也与基板2的接地线连接。通过导体膜34的存在,能够抑制从子模块30的外部到来的电磁波的干涉。
(实施方式5)
图5的(A)~(H)是表示本实用新型的实施方式5所涉及的子模块30的结构的一个例子的图,图5的(A)~(B)是电子部件80、90的凸块配置图,图5的(C)是导体框架36的俯视图,图5的(D)是凸块和导体框架36的配置图,图5的(E)是沿着X1-X1线的剖视图,图5的(F)是沿着X2-X2线的剖视图,图5的(G)是表示在导体框架36设置了宽度宽的接地平面的变形例的俯视图,图5的(H)是凸块和导体框架36的配置图。本实施方式所涉及的基本结构与实施方式2类似,但在取代再布线层48而使用布线用的导体框架36这点上不同。
如图5的(A)所示,准备在第2面具备连接凸块81的电子部件80,另外,如图5的(B)所示,准备在第1面具备连接凸块91的电子部件90。作为一个例子,3个连接凸块81以正三角形状配置,3个连接凸块91以倒正三角形状配置。此外,连接凸块的数量和配置不限定于此。
接着,如图5的(C)所示,准备具有与连接凸块81、91的配置方式对应的6个导体36a~36f的导体框架36。
接着,如图5的(D)~(F)所示,在垂直方向上层叠电子部件80、90。此时,使导体框架36夹设于电子部件80、90之间。接着,在电子部件80的侧面侧配置6个柱状的布线导体38,在连接凸块81、91、导体36a~36f和布线导体38之间相互进行电连接和机械连接。即,导体36a、36d、36f分别将3个连接凸块81与3个布线导体38电连接,导体36b、36c、36e分别将3个连接凸块91与3个布线导体38电连接。其后,除导体36a~36f以外的外周框架通过切断而除去。
接着,在电子部件80、90的四周填充有密封树脂33,子模块整体例如成形为长方体状。接着,在密封树脂33的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射设置有导体膜34,来作为遮挡电磁波的屏蔽膜。如图5的(G)~(H)所示,在设置了将导体36a、36b合体而变宽幅的接地平面的情况下,导体36a与导体膜34导通。接着,在布线导体38的下端分别设置有连接电极39。这样,得到在电子部件80上层叠有电子部件90的子模块30。由此,实现设置面积的小型化。
子模块30安装于图1所示那样的基板2。此时,导体膜34也与基板2的接地线连接。通过导体膜34的存在,能够抑制从子模块30的外部到来的电磁波的干涉。
(实施方式6)
图6的(A)(C)(D)是表示本实用新型的实施方式6所涉及的子模块30的结构的一个例子的剖视图,图6的(B)是表示引出布线的侧视图。本实施方式所涉及的基本结构与实施方式2类似,但在取代布线导体43和再布线层48而使用FPC(柔性基板)100这点上不同。
图6的(A)中,准备包括具有电绝缘层105、导体层106、接地层107的多层布线层108和引出布线109的FPC100,追随位于下侧的电子部件110的形状而屈曲。引出布线109沿着电子部件110的侧面延伸,并在电子部件110的第1面向外部暴露。
接着,在图6的(B)中,例如,使用粘合剂使FPC100沿着电子部件110的形状装配。接着,准备在第1面具备连接端子122和密封树脂121的电子部件120。将该电子部件120搭载在多层布线层108之上,进行电连接和机械连接。接着,在电子部件110的端子112和引出布线109的下端分别设置有连接电极35。
接着,在图6的(D)中,在电子部件120的四周填充有密封树脂33,子模块整体例如成形为长方体状。接着,在密封树脂33、电子部件110和FPC100的外表面即顶面和4个侧面,通过例如使用了金属材料的溅射而设置有导体膜34,来作为遮挡电磁波的屏蔽膜。导体膜34与多层布线层108的接地层107导通。这样得到在电子部件110上层叠有电子部件120的子模块30。由此,实现设置面积的小型化。
子模块30安装于图1所示那样的基板2。此时,导体膜34也与基板2的接地线连接。因导体膜34的存在,能够抑制从子模块30的外部到来的电磁波的干涉。
(实施方式7)
图7是表示本实用新型的实施方式7所涉及的电子部件模块的内部结构的一个例子的剖视图。本实施方式所涉及的基本结构与实施方式1类似,但在基板200的两面二维搭载有多个电子部件所谓的两面安装这点上不同。
基板200例如由多层印刷基板构成,在电绝缘层201的两面设置有分别形成有导体线210、220的布线层202、203。
在下侧的布线层202电接合且机械接合有包括电子部件11、12和电子部件13、14的子模块30。在上侧的布线层203电接合且机械接合有包括电子部件11、12和电子部件13、14的子模块30。导体膜4和导体膜34与基板202的接地线连接。因导体膜4的存在,能够抑制从电子部件模块1的外部到来的电磁波的干涉。另外,通过导体膜34的存在,能够抑制电子部件11、12与电子部件13、14之间的电磁波的干涉。
在以上的各实施方式中,例示出在子模块的内部在垂直方向上层叠了两个电子部件的情况,但也能够使用相同的方法在垂直方向上层叠3个以上的电子部件。此外,也能够使用相同的方法在大型的电子部件上二维配置两个以上的电子部件。
本实用新型参照附图并且与优选的实施方式建立关联充分进行记载,但对于本领域的技术人员来说各种变形、修正是显而易见的。这样的变形、修正只要不脱离基于添附的权利要求书的本实用新型的范围,则应该理解为包含于其中。
产业上的可利用性
本实用新型在能够高密度地安装模块内的部件这点上在产业上极其有用。
附图标记说明
1...电子部件模块;2...基板;3、33、44...密封树脂;4、34...导体膜;11~14、40、50、60、70、80、90、110、120...电子部件;30...子模块;35...连接电极;36...导体框架;36a~36f...导体;38、43、74...布线导体;43a...侧面布线;45、65、105...电绝缘层;46、66、106...导体层;47、67、107...接地层;48、68...再布线层;81、91...连接凸块;100...FPC(柔性基板);108...多层布线层;109...引出布线。

Claims (6)

1.一种电子部件模块,具备:
基板;
电子部件,其安装于所述基板;以及
子模块,其安装于所述基板,
所述电子部件模块的特征在于,
所述子模块包括:
布线基板;
第1电子部件,其配置于所述布线基板的两个主面中的一个主面;
第2电子部件,其配置于所述布线基板的两个主面中的另一个主面;以及
第1密封构件,其覆盖所述布线基板、所述第1电子部件和所述第2电子部件。
2.根据权利要求1所述的电子部件模块,其特征在于,
在所述子模块的所述第1密封构件的表面设置有第1屏蔽膜。
3.根据权利要求2所述的电子部件模块,其特征在于,
在所述子模块内的所述第1电子部件与所述第2电子部件之间,在与所述布线基板的主面平行的方向上设置有接地导体。
4.根据权利要求1~3中任一项所述的电子部件模块,其特征在于,
具备覆盖所述子模块、所述第1电子部件和所述第2电子部件的第2密封构件,
在所述第2密封构件的表面设置有第2屏蔽膜。
5.根据权利要求4所述的电子部件模块,其特征在于,
所述第1电子部件和所述第2电子部件中一者与所述第2屏蔽膜直接接触,所述第1电子部件和所述第2电子部件中另一者与配置于所述基板的导体直接接触。
6.根据权利要求5所述的电子部件模块,其特征在于,
所述第1电子部件和所述第2电子部件中一者具有与所述第2屏蔽膜直接接触的接触面和不与所述第2屏蔽膜直接接触的非接触面,所述接触面的表面粗糙度大于所述非接触面的表面粗糙度。
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