JP2019510368A5 - - Google Patents

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Publication number
JP2019510368A5
JP2019510368A5 JP2018540419A JP2018540419A JP2019510368A5 JP 2019510368 A5 JP2019510368 A5 JP 2019510368A5 JP 2018540419 A JP2018540419 A JP 2018540419A JP 2018540419 A JP2018540419 A JP 2018540419A JP 2019510368 A5 JP2019510368 A5 JP 2019510368A5
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JP
Japan
Prior art keywords
integrated
michipa
kkeji
layer
die
Prior art date
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Granted
Application number
JP2018540419A
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English (en)
Japanese (ja)
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JP6956095B2 (ja
JP2019510368A (ja
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Publication date
Priority claimed from US15/040,881 external-priority patent/US9633950B1/en
Application filed filed Critical
Publication of JP2019510368A publication Critical patent/JP2019510368A/ja
Publication of JP2019510368A5 publication Critical patent/JP2019510368A5/ja
Application granted granted Critical
Publication of JP6956095B2 publication Critical patent/JP6956095B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018540419A 2016-02-10 2017-02-07 集積回路（ｉｃ）パッケージ間にフレキシブルコネクタを備える集積デバイス Active JP6956095B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/040,881 2016-02-10
US15/040,881 US9633950B1 (en) 2016-02-10 2016-02-10 Integrated device comprising flexible connector between integrated circuit (IC) packages
PCT/US2017/016864 WO2017139285A1 (en) 2016-02-10 2017-02-07 Integrated device comprising flexible connector between integrated circuit (ic) packages

Publications (3)

Publication Number Publication Date
JP2019510368A JP2019510368A (ja) 2019-04-11
JP2019510368A5 true JP2019510368A5 (enExample) 2020-02-27
JP6956095B2 JP6956095B2 (ja) 2021-10-27

Family

ID=58057302

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018540419A Active JP6956095B2 (ja) 2016-02-10 2017-02-07 集積回路（ｉｃ）パッケージ間にフレキシブルコネクタを備える集積デバイス

Country Status (9)

Country Link
US (1) US9633950B1 (enExample)
EP (1) EP3414776B1 (enExample)
JP (1) JP6956095B2 (enExample)
KR (1) KR20180111840A (enExample)
CN (1) CN108604585B (enExample)
AU (1) AU2017217375A1 (enExample)
BR (1) BR112018016132B1 (enExample)
TW (1) TWI601217B (enExample)
WO (1) WO2017139285A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11581261B2 (en) * 2018-06-12 2023-02-14 Novatek Microelectronics Corp. Chip on film package
US11342268B2 (en) * 2020-01-29 2022-05-24 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US12074077B2 (en) * 2020-11-19 2024-08-27 Apple Inc. Flexible package architecture concept in fanout

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
WO2000065888A1 (fr) 1999-04-22 2000-11-02 Rohm Co., Ltd. Carte de circuit imprime, bloc batterie et procede de fabrication de carte de circuit imprime
FR2793352B1 (fr) 1999-05-07 2006-09-22 Sagem Composant electrique a nappe souple de conducteurs de raccordement
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
AU2003279215A1 (en) 2002-10-11 2004-05-04 Tessera, Inc. Components, methods and assemblies for multi-chip packages
US6862191B1 (en) * 2003-08-19 2005-03-01 Cardiac Pacemakers, Inc. Volumetrically efficient electronic circuit module
US20060033217A1 (en) * 2004-08-10 2006-02-16 Brian Taggart Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same
KR100659826B1 (ko) 2005-12-20 2006-12-19 삼성에스디아이 주식회사 배터리 팩의 회로 기판
DE102006004321A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
JP2008034433A (ja) * 2006-07-26 2008-02-14 Cmk Corp リジッドフレックスプリント配線板の製造方法及びリジッドフレックスプリント配線板
WO2008036726A2 (en) 2006-09-19 2008-03-27 Ibiden Co., Ltd. Optical interconnect device and method for manufacturing the same
US8031475B2 (en) * 2007-07-12 2011-10-04 Stats Chippac, Ltd. Integrated circuit package system with flexible substrate and mounded package
TWI365524B (en) * 2007-10-04 2012-06-01 Unimicron Technology Corp Stackable semiconductor device and fabrication method thereof
JP4975584B2 (ja) * 2007-10-26 2012-07-11 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法。
KR20090078124A (ko) * 2008-01-14 2009-07-17 한국광기술원 연성 광전배선을 이용한 시스템 패키지 및 그의 신호 처리방법
FI122216B (fi) * 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex moduuli
US20110194240A1 (en) * 2010-02-05 2011-08-11 Broadcom Corporation Waveguide assembly and applications thereof
KR101078743B1 (ko) 2010-04-14 2011-11-02 주식회사 하이닉스반도체 스택 패키지
US9190380B2 (en) * 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
JP2014192476A (ja) 2013-03-28 2014-10-06 Fujitsu Ltd プリント基板の半田実装方法及び半田実装構造
KR102135415B1 (ko) 2013-06-28 2020-07-17 엘지이노텍 주식회사 회로기판 및 상기 회로기판을 포함하는 조명장치
WO2015166588A1 (ja) * 2014-05-02 2015-11-05 株式会社メイコー 部品内蔵リジッドフレックス基板

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