BR112023025604A2 - Pacote que compreende dispositivos integrados e lados de topo de acoplamento de ponte de dispositivos integrados - Google Patents
Pacote que compreende dispositivos integrados e lados de topo de acoplamento de ponte de dispositivos integradosInfo
- Publication number
- BR112023025604A2 BR112023025604A2 BR112023025604A BR112023025604A BR112023025604A2 BR 112023025604 A2 BR112023025604 A2 BR 112023025604A2 BR 112023025604 A BR112023025604 A BR 112023025604A BR 112023025604 A BR112023025604 A BR 112023025604A BR 112023025604 A2 BR112023025604 A2 BR 112023025604A2
- Authority
- BR
- Brazil
- Prior art keywords
- integrated devices
- integrated device
- bridge
- package
- top sides
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Combinations Of Printed Boards (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/357,811 US11830819B2 (en) | 2021-06-24 | 2021-06-24 | Package comprising integrated devices and bridge coupling top sides of integrated devices |
| PCT/US2022/030533 WO2022271376A1 (en) | 2021-06-24 | 2022-05-23 | Package comprising integrated devices and bridge coupling top sides of integrated devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112023025604A2 true BR112023025604A2 (pt) | 2024-02-20 |
Family
ID=82492622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112023025604A BR112023025604A2 (pt) | 2021-06-24 | 2022-05-23 | Pacote que compreende dispositivos integrados e lados de topo de acoplamento de ponte de dispositivos integrados |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US11830819B2 (enExample) |
| EP (1) | EP4360131A1 (enExample) |
| JP (1) | JP2024523238A (enExample) |
| KR (1) | KR20240025525A (enExample) |
| CN (1) | CN117413358A (enExample) |
| BR (1) | BR112023025604A2 (enExample) |
| TW (1) | TW202303899A (enExample) |
| WO (1) | WO2022271376A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11830819B2 (en) | 2021-06-24 | 2023-11-28 | Qualcomm Incorporated | Package comprising integrated devices and bridge coupling top sides of integrated devices |
| US12463156B2 (en) * | 2021-11-10 | 2025-11-04 | Intel Corporation | Packaging architectures for sub-terahertz radio frequency devices |
| US12599007B2 (en) * | 2021-12-23 | 2026-04-07 | Intel Corporation | Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias |
| TWI835546B (zh) * | 2023-02-03 | 2024-03-11 | 福懋科技股份有限公司 | 半導體封裝 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7838337B2 (en) | 2008-12-01 | 2010-11-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming an interposer package with through silicon vias |
| US20140131854A1 (en) | 2012-11-13 | 2014-05-15 | Lsi Corporation | Multi-chip module connection by way of bridging blocks |
| US10192810B2 (en) * | 2013-06-28 | 2019-01-29 | Intel Corporation | Underfill material flow control for reduced die-to-die spacing in semiconductor packages |
| US10797022B2 (en) * | 2017-10-06 | 2020-10-06 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| US10991635B2 (en) | 2019-07-20 | 2021-04-27 | International Business Machines Corporation | Multiple chip bridge connector |
| US11133263B2 (en) | 2019-09-17 | 2021-09-28 | Intel Corporation | High-density interconnects for integrated circuit packages |
| US11600526B2 (en) | 2020-01-22 | 2023-03-07 | iCometrue Company Ltd. | Chip package based on through-silicon-via connector and silicon interconnection bridge |
| US11315902B2 (en) * | 2020-02-12 | 2022-04-26 | International Business Machines Corporation | High bandwidth multichip module |
| US12159840B2 (en) * | 2020-06-23 | 2024-12-03 | Intel Corporation | Scalable and interoperable PHYLESS die-to-die IO solution |
| US11450612B2 (en) * | 2020-07-09 | 2022-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor devices and methods of manufacturing the same |
| US11830819B2 (en) | 2021-06-24 | 2023-11-28 | Qualcomm Incorporated | Package comprising integrated devices and bridge coupling top sides of integrated devices |
-
2021
- 2021-06-24 US US17/357,811 patent/US11830819B2/en active Active
-
2022
- 2022-05-23 WO PCT/US2022/030533 patent/WO2022271376A1/en not_active Ceased
- 2022-05-23 CN CN202280038808.1A patent/CN117413358A/zh active Pending
- 2022-05-23 EP EP22741028.9A patent/EP4360131A1/en active Pending
- 2022-05-23 BR BR112023025604A patent/BR112023025604A2/pt unknown
- 2022-05-23 JP JP2023575919A patent/JP2024523238A/ja active Pending
- 2022-05-23 TW TW111119074A patent/TW202303899A/zh unknown
- 2022-05-23 KR KR1020237043786A patent/KR20240025525A/ko active Pending
-
2023
- 2023-10-23 US US18/492,402 patent/US12400966B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202303899A (zh) | 2023-01-16 |
| WO2022271376A1 (en) | 2022-12-29 |
| US11830819B2 (en) | 2023-11-28 |
| JP2024523238A (ja) | 2024-06-28 |
| US20220415808A1 (en) | 2022-12-29 |
| EP4360131A1 (en) | 2024-05-01 |
| US12400966B2 (en) | 2025-08-26 |
| KR20240025525A (ko) | 2024-02-27 |
| CN117413358A (zh) | 2024-01-16 |
| US20240055356A1 (en) | 2024-02-15 |
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