WO2015196340A1 - 一种芯片散热结构和终端设备 - Google Patents

一种芯片散热结构和终端设备 Download PDF

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Publication number
WO2015196340A1
WO2015196340A1 PCT/CN2014/080532 CN2014080532W WO2015196340A1 WO 2015196340 A1 WO2015196340 A1 WO 2015196340A1 CN 2014080532 W CN2014080532 W CN 2014080532W WO 2015196340 A1 WO2015196340 A1 WO 2015196340A1
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WO
WIPO (PCT)
Prior art keywords
chip
card holder
heat dissipation
pcb
dissipation structure
Prior art date
Application number
PCT/CN2014/080532
Other languages
English (en)
French (fr)
Inventor
郭俊生
况明强
孙略
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP14878386.3A priority Critical patent/EP2988581B1/en
Priority to PCT/CN2014/080532 priority patent/WO2015196340A1/zh
Priority to JP2016528316A priority patent/JP2016524820A/ja
Priority to CN201480001759.XA priority patent/CN104488077A/zh
Priority to US14/815,160 priority patent/US20150373827A1/en
Publication of WO2015196340A1 publication Critical patent/WO2015196340A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate

Definitions

  • the invention relates to a chip heat dissipation structure and a terminal device having the chip heat dissipation structure. Background technique
  • SIM card for the existing vehicle terminal is fixed to the circuit board by the card holder. Since the specific environment of the vehicle is likely to generate high temperature and heat generated by the CPU of the circuit board, the heat may easily cause deformation or damage of the SIM card.
  • Embodiments of the present invention provide a chip heat dissipation structure for reducing heat received by a chip.
  • the invention also provides a terminal device having the heat dissipation structure of the chip.
  • the first aspect is a chip heat dissipation structure, the chip heat dissipation structure is disposed on a printed circuit board (PCB), and the chip heat dissipation structure includes a chip card holder and at least one isolation slot;
  • PCB printed circuit board
  • the at least one isolation slot is disposed on the PCB and is located around the chip card holder.
  • the area where the chip card holder is located and other areas of the PCB Connected through the connection area is disposed on the PCB and is located around the chip card holder.
  • the at least one isolation trench is a strip structure, and the isolation trench is along the chip from a side of the connection region The circumference of the deck is set.
  • the isolation slot is partitioned into at least two through slots, and the at least two through slots surround the chip card holder Settings.
  • a terminal device which includes any one of the first to third possible implementation modes
  • the chip heat dissipation structure wherein the other portions of the circuit board are isolated, and heat at other positions on the circuit board is reduced to be transmitted to the chip card holder through the circuit board, thereby reducing the chip card holder. Heat, to avoid deformation or damage of the chip in the chip card holder.
  • FIG. 1 is a schematic plan view showing a heat dissipation structure of a chip according to an embodiment of the present invention.
  • FIG. 2 is a schematic plan view of a heat dissipation structure of a chip according to another embodiment of the present invention.
  • FIG. 3 is a structural block diagram of a terminal device according to an embodiment of the present invention.
  • FIG. 4 is a structural block diagram of a terminal device according to another embodiment of the present invention. detailed description
  • the invention provides a chip heat dissipation structure, which can reduce the heat of the external environment of the chip and prevent the chip from being deformed due to excessive temperature.
  • FIG. 1 is a schematic plan view of a heat dissipation structure of a chip according to an embodiment of the present invention.
  • the chip heat dissipation structure provided by the embodiment of the present invention is disposed on a Printed Circuit Board (PCB) of the terminal device.
  • the chip heat dissipation structure includes a chip card holder 20 and at least one isolation slot 30, and the chip card holder 20 is integrally formed on the PCB 10.
  • the at least one isolation slot 30 is disposed on the PCB 10 and located around the chip card holder 20, and the at least one isolation slot 30 extends through the PCB 10 at the periphery of the chip card holder 20 to make the chip card holder 20 With PCB10 The other areas are isolated, thereby enabling the chip in the chip card holder 20 to block heat dissipation.
  • the chip heat dissipation structure can be applied to a mobile terminal such as an in-vehicle terminal, a mobile phone, or a tablet computer.
  • the chip may be a SIM card or a memory card.
  • the chip card holder 20 is used to carry the chip, and the electrical connection terminals connected to the chip in the chip card holder 20 are directly mounted on the printed circuit board 10.
  • the SIM card is disposed in a terminal device such as a vehicle, and the heat generated by the internal environment of the terminal and the heat generated by the CPU of the circuit board easily cause deformation or damage of the SIM card.
  • At least one isolation trench 30 is disposed around the card holder 20 to be isolated from other portions of the PCB 10, so that heat generated by components such as CPUs on the circuit board is prevented from being transmitted to the chip card holder 20 through the circuit board, and the chip is reduced.
  • the heat of the card holder 20 prevents the chip card in the chip card holder 20 from being deformed or damaged.
  • the PCB 10 carries a connection area 15 between the area of the chip card holder 20 and the other areas of the PCB 10 for setting the routing of the chip card holder 20 and the PCB 10.
  • the area carrying the chip card holder 20 is the carrying area 16.
  • the other area of the PCB 10 is the main board area 17.
  • the connection area 15 connects the load area 16 and the main board area 17, so as to connect the layout of the signal lines of the chip card holder 20 and the PCB 10.
  • the isolation trench 30 is a strip-shaped structure, and the isolation trench 30 extends through the PCB 10 and is disposed along the edge of the chip card holder 20 from the side of the connection region 15 .
  • the isolation trench 30 separates the load-bearing area 16 from the main board area 17, thereby reducing the transfer of heat generated by components on the printed circuit board 10 to the load-bearing area 16.
  • the isolation trench 30 is partitioned into at least two through slots 32, and the at least two through slots 32 are disposed around the chip card holder 20, specifically, At least two through slots 32 extend through the PCB 10.
  • the through slots 32 are plural and spaced apart.
  • the plurality of through slots 32 are arranged to form a breakpoint strip shape around the chip card holder 20 from the side of the connection region, and the number of the through slots 32 is set according to the design requirements of the chip card holder 20.
  • the plurality of spaced-apart slots 32 form a breakpoint strip to isolate the chip card holder 20 to meet the connection requirements of the circuit board dielectric layer.
  • the signal lines on the PCB 10 can pass through each of the two through slots 32. The partial pass between can guarantee the signal quality and ensure the anti-vibration and deformation requirements of the board.
  • the present invention further provides a terminal device 100, which includes the printed circuit board (PCB) 10 and the chip heat dissipation structure provided by the embodiment of the present invention shown in FIG. Carrying a chip and dissipating heat to the chip, the chip card holder 20 and the PCB 10 passing through The wire is electrically connected, and the wire is disposed in the connection region 15 .
  • PCB printed circuit board
  • the PCB 10 is further provided with other electronic components such as a central processing unit (not shown) and a power processor (not shown).
  • the power processor implements an electrical connection between a chip within the chip card holder 20 and the central processor, and the central processor operates the terminal device 100. Since the periphery of the chip card holder 20 is provided with an isolation slot, heat generated by the electronic components on the PCB 10 such as the central processing unit is isolated by the isolation slot, and heat of components such as a CPU on the circuit board is reduced to be transmitted through the circuit board to the circuit board.
  • the chip card holder 20 reduces the probability of damage to the chip in the chip card holder 20 and the electrical connection terminal connected to the chip, thereby improving the stability of the terminal device 100. See Figure 4.
  • the present invention further provides a terminal device 200 including the printed circuit board (PCB) 10 and the chip heat dissipation structure provided by another embodiment of the invention shown in FIG. 2, the chip heat dissipation structure for carrying the chip and the pair
  • the chip is thermally dissipated, and the chip card holder 20 and the PCB 10 are electrically connected by a trace, and the trace is disposed in the connection area.
  • the plurality of spaced-apart slots 32 of the chip heat dissipation structure form a breakpoint strip to isolate the chip card holder 20 to meet the connection requirement of the circuit board dielectric layer, and the signal line on the PCB 10 can pass every two The passage between the through slots 32 ensures the signal quality and thus the stability of the terminal device 100.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Abstract

本发明提供一种芯片散热结构，所述芯片散热结构设置在印制电路板 (PCB)上，所述芯片散热结构包括芯片卡座及至少一个隔离槽；所述芯片卡座与所述PCB一体成型；所述至少一个隔离槽设置于所述PCB上并位于所述芯片卡座周围，所述至少一个隔离槽用于隔离所述芯片卡座所在区域与所述PCB上其他区域。本发明还提供一种终端设备。

Description

一种芯片散热结构和终端 i殳备
技术领域
本发明涉及一种芯片散热结构和具有所述芯片散热结构的终端设备。 背景技术
随着通讯技术的迅速发展，移动互联网被广泛应用， 比如车载定位终端系 统、 车载视讯等应用无线通讯技术实现起功能， 这些功能需要搭载 SIM卡来 实现信号传输等功能。现有的车载终端用 SIM卡是通过卡座固定到电路板上， 由于车载的特定环境容易产生高温以及电路板的 CPU等散发的热量， 这些热 量容易导致 SIM卡产生变形或损坏。 发明内容
本发明实施例提供一种芯片散热结构， 用于降低芯片所受的热量。
本发明还提供一种具有所述芯片散热结构的终端设备。
第一方面，一种芯片散热结构，所述芯片散热结构设置在印制电路板（ PCB ) 上， 所述芯片散热结构包括芯片卡座及至少一个隔离槽；
所述芯片卡座与所述 PCB—体成型；
所述至少一个隔离槽设置于所述 PCB上并位于所述芯片卡座周围， 所述 在第一方面的第一种可能的实现方式中， 所述芯片卡座所在区域与所述 PCB其它区域之间通过连接区域连接。
结合第一方面的第一种可能的实现方式，在第二种可能的实现方式中， 所 述至少一个隔离槽为条形结构，所述隔离槽从所述连接区域一侧沿着所述芯片 卡座周缘设置。
结合第一方面的第一种可能的实现方式，在第三种可能的实现方式中， 所 述隔离槽被隔断为至少两个通槽，所述至少两个通槽围绕所述芯片卡座周围设 置。
第二方面，提供一种终端设备， 其包括第一种至第三种可能实现方式中任 一种所述的芯片散热结构， 所述电路板上其它部分隔离，减少电路板上的其它位置的热量通过所述电路板 传递到所述芯片卡座上， 进而减小所述芯片卡座的热量，避免所述芯片卡座内 的芯片发生形变或损坏。 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要 使用的附图作简单地介绍，显而易见地， 下面描述中的附图仅仅是本发明的一 些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还 可以根据这些附图获得其他的附图。
图 1是本发明实施例提供的芯片散热结构的平面示意图。
图 2是本发明另一实施例提供的芯片散热结构的平面示意图。
图 3是本发明实施例提供的终端设备结构框图。
图 4是本发明另一实施例提供的终端设备结构框图。 具体实施方式
本发明提供一种芯片散热结构， 能够降低芯片所受外界环境的热量，避免 芯片因温度过高导致芯片变形。
为了使本技术领域的人员更好地理解本发明方案，下面将结合本发明实施 例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描述， 显然， 所 描述的实施例仅仅是本发明一部分的实施例， 而不是全部的实施例。基于本发 明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所 有其他实施例， 都应当属于本发明保护的范围。
图 1为本发明实施例提供的芯片散热结构的平面示意图。如图 1所示， 本 发明实施例提供了的芯片散热结构设置于终端设备的印制电路板 10 ( Printed Circuit Board, PCB )上。 所述芯片散热结构包括芯片卡座 20及至少一个隔离 槽 30， 所述芯片卡座 20—体成型于所述 PCB10上。 所述至少一个隔离槽 30 设置于所述 PCB10上并位于所述芯片卡座 20周围， 所述至少一个隔离槽 30 贯穿所述芯片卡座 20周缘的 PCB10， 使所述芯片卡座 20所在区域与 PCB10 其它区域隔离， 进而实现芯片卡座 20内的芯片隔断散热。
本实施例中， 所述芯片散热结构可以应用在车载终端、手机或平板电脑等 等移动终端中。 所述芯片可以是 SIM卡， 也可以是存储卡。 所述芯片卡座 20 用于承载所述芯片， 并且所述芯片卡座 20内的与芯片连接的电连接端子直接 装设于所述印制电路板 10上。 具体的， 对于所述 SIM卡而言， 设置在车载等 终端设备中， 由于终端内部环境容易产生高温以及电路板的 CPU等散发的热 量容易导致 SIM卡产生变形或损坏， 所以通过在所述芯片卡座 20周围设置至 少一个隔离槽 30与所述 PCB10上其它部分隔离， 避免电路板上的 CPU等元 件产生的热量通过所述电路板传递到所述芯片卡座 20上， 减小所述芯片卡座 20的热量， 避免所述芯片卡座 20内的芯片卡发生形变或损坏。
进一步的， 所述 PCB10承载所述芯片卡座 20区域与所述 PCB10其它区 域之间设有连接区域 15， 用于设置芯片卡座 20与所述 PCB10的走线。 具体 的， 承载所述芯片卡座 20区域为承载区 16。 所述 PCB10的其他区域为主板 区 17。 所述连接区域 15连接所述承载区 16与所述主板区 17， 以便连接芯片 卡座 20与 PCB10的信号线的布局。
进一步的， 所述隔离槽 30为一个条形结构， 所述隔离通槽 30贯穿所述 PCB10并由所述连接区域 15 —侧沿着所述芯片卡座 20边缘设置。 所述隔离 槽 30将所述承载区 16与所述主板区 17分离，进而减少印制电路板 10上元件 产生的热量传递到所述承载区 16。
请参阅图 2， 本发明另一实施例中， 所述隔离槽 30被隔断为至少两个通 槽 32， 所述至少两个通槽 32围绕所述芯片卡座 20周围设置， 具体的， 所述 至少两个通槽 32贯穿所述 PCB10。 本实施例中， 所述通槽 32为多个且间隔 设置。 所述多个通槽 32由所述连接区域一侧开始排列形成围绕所述芯片卡座 20的断点式带状， 所述通槽 32数量根据芯片卡座 20设计需求设定。 所述数 个间隔设置的通槽 32形成的断点式带状进行隔离所述芯片卡座 20， 满足电路 板介质层的连接需求，所述 PCB10上的信号线可以通过每两个通槽 32之间的 部分通过， 可以保证信号质量， 更可以保证电路板的抗振、 形变需求。
请参阅图 3， 本发明还提供一种终端设备 100， 其包括所述印制电路板 ( PCB ) 10及图 1 所示的本发明实施例提供的芯片散热结构， 所述芯片散热 结构用于承载芯片及对芯片进行散热，所述芯片卡座 20与所述 PCB10通过走 线电性连接， 所述走线设置于所述连接区域 15。
在本发明另一实施例中， PCB10上还装设有中央处理器（图未示）、 电源 处理器（图未示）等其它电子元件。 所述电源处理器实现芯片卡座 20内的芯 片与所述中央处理器的电连接， 所述中央处理器运行所述终端设备 100。 由于 所述芯片卡座 20周缘设有隔离槽，所述中央处理器等 PCB 10上的电子元件产 生热量被所述隔离槽隔离， 减少电路板上的 CPU等元件热量通过所述电路板 传递到所述芯片卡座 20上，减小对于芯片卡座 20内的芯片及与芯片连接的电 连接端子损坏的机率， 进而提高了终端设备 100的稳定性。 请参阅图 4。 本发 明还提供一种终端设备 200， 其包括所述印制电路板 ( PCB ) 10及图 2所示的 发明另一实施例提供的芯片散热结构，所述芯片散热结构用于承载芯片及对芯 片进行散热， 所述芯片卡座 20与所述 PCB10通过走线电性连接， 所述走线设 置于所述连接区域。 所述芯片散热结构的数个间隔设置的通槽 32形成的断点 式带状进行隔离所述芯片卡座 20，满足电路板介质层的连接需求，所述 PCB10 上的信号线可以通过每两个通槽 32之间的部分通过， 可以保证信号质量， 进 而保证了终端设备 100的稳定性。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技 术人员来说， 在不脱离本发明原理的前提下， 还可以做出若干改进和润饰， 这 些改进和润饰也视为本发明的保护范围。

Claims

权利要求
1. 一种芯片散热结构， 所述芯片散热结构设置在印制电路板（PCB )上， 其特征在于： 所述芯片散热结构包括芯片卡座及至少一个隔离槽； 所述芯片卡座与所述 PCB—体成型；
所述至少一个隔离槽设置于所述 PCB上并位于所述芯片卡座周围， 所
2. 如权利要求 1 所述结构， 其特征在于， 所述芯片卡座所在区域与所述 PCB其它区域之间通过连接区域连接。
3. 如权利要求 2所述结构， 其特征在于， 所述至少一个隔离槽为条形结 构， 所述隔离槽从所述连接区域一侧沿着所述芯片卡座周缘设置。
4. 如权利要求 2所述结构， 其特征在于， 所述隔离槽被隔断为至少两个 通槽， 所述至少两个通槽围绕所述芯片卡座周围设置。
5. 一种终端设备， 其特征在于， 所述终端设备包括如权利要求 1-4 中任 一项所述的芯片散热结构。
6. 如权利要求 5所述终端设备， 其特征在于， 所述芯片散热结构用于承 载芯片及对芯片进行散热， 所述芯片卡座与 PCB通过走线电性连接， 所述走 线设置于所述连接区域。
PCT/CN2014/080532 2014-06-23 2014-06-23 一种芯片散热结构和终端设备 WO2015196340A1 (zh)

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