JP4967164B2 - 多層プリント配線板及びそれを用いた電子機器 - Google Patents
多層プリント配線板及びそれを用いた電子機器 Download PDFInfo
- Publication number
- JP4967164B2 JP4967164B2 JP2008070542A JP2008070542A JP4967164B2 JP 4967164 B2 JP4967164 B2 JP 4967164B2 JP 2008070542 A JP2008070542 A JP 2008070542A JP 2008070542 A JP2008070542 A JP 2008070542A JP 4967164 B2 JP4967164 B2 JP 4967164B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- power supply
- multilayer printed
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/0949—Pad close to a hole, not surrounding the hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
2 グランド配線層
3 電源配線層
4 電源コネクタ
5〜8 集積回路
9a〜9l デカップリングコンデンサ
41,51,161 電源スルーホール
42,52,162 グランドスルーホール
53,163 電源配線
54,164 グランド配線
Claims (3)
- 電源配線層とグランド配線層とが平行に配置され、集積回路と、この集積回路の周辺に配置されてこの集積回路のノイズを吸収すべく前記電源配線層と前記グランド配線層との間に接続されたデカップリングコンデンサとを実装してなる多層プリント配線板であって、
前記電源配線層が、前記デカップリングコンデンサの前記電源配線層への接続のためのスルーホールを包含し、少くとも一部のスルーホール間を結ぶ直線により形成される多角形とされていることを特徴とする多層プリント配線板。 - 前記集積回路のノイズを吸収するためのデカップリングコンデンサを、前記電源配線層と前記グランド配線層との間のノイズを吸収するためのデカップリングコンデンサと兼用したことを特徴とする請求項1記載の多層プリント配線板。
- 請求項1または2記載の前記多層プリント配線板を含むことを特徴とする電子機器。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008070542A JP4967164B2 (ja) | 2008-03-19 | 2008-03-19 | 多層プリント配線板及びそれを用いた電子機器 |
US12/405,813 US8125794B2 (en) | 2008-03-19 | 2009-03-17 | Multilayer printed wiring board and electronic device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008070542A JP4967164B2 (ja) | 2008-03-19 | 2008-03-19 | 多層プリント配線板及びそれを用いた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009224735A JP2009224735A (ja) | 2009-10-01 |
JP4967164B2 true JP4967164B2 (ja) | 2012-07-04 |
Family
ID=41088704
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008070542A Active JP4967164B2 (ja) | 2008-03-19 | 2008-03-19 | 多層プリント配線板及びそれを用いた電子機器 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8125794B2 (ja) |
JP (1) | JP4967164B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010183042A (ja) * | 2009-02-09 | 2010-08-19 | Sony Corp | 配線基板 |
JP2012238724A (ja) * | 2011-05-12 | 2012-12-06 | Sharp Corp | プリント配線基板 |
US9099477B2 (en) * | 2012-05-10 | 2015-08-04 | Panasonic Intellectual Property Management Co., Ltd. | Three-dimensional integrated circuit having stabilization structure for power supply voltage, and method for manufacturing same |
FR3077925B1 (fr) * | 2018-02-14 | 2021-06-18 | Commissariat Energie Atomique | Circuit integre tridimensionnel face a face de structure simplifiee |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5800575A (en) * | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
JP2988421B2 (ja) * | 1997-03-24 | 1999-12-13 | 日本電気株式会社 | Emi抑制多層プリント基板 |
JP4190040B2 (ja) * | 1997-08-04 | 2008-12-03 | 富士ゼロックス株式会社 | 回路基板装置及び電子機器 |
US6483714B1 (en) * | 1999-02-24 | 2002-11-19 | Kyocera Corporation | Multilayered wiring board |
JP3348709B2 (ja) * | 1999-11-24 | 2002-11-20 | 日本電気株式会社 | プリント回路基板設計支援装置及び制御プログラム記録媒体 |
JP2001274558A (ja) * | 2000-03-23 | 2001-10-05 | Hitachi Ltd | プリント配線基板 |
JP2001308222A (ja) * | 2000-04-21 | 2001-11-02 | Hitachi Ltd | 実装基板 |
-
2008
- 2008-03-19 JP JP2008070542A patent/JP4967164B2/ja active Active
-
2009
- 2009-03-17 US US12/405,813 patent/US8125794B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009224735A (ja) | 2009-10-01 |
US20090237902A1 (en) | 2009-09-24 |
US8125794B2 (en) | 2012-02-28 |
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