JP2019528583A5 - - Google Patents

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JP2019528583A5
JP2019528583A5 JP2018564258A JP2018564258A JP2019528583A5 JP 2019528583 A5 JP2019528583 A5 JP 2019528583A5 JP 2018564258 A JP2018564258 A JP 2018564258A JP 2018564258 A JP2018564258 A JP 2018564258A JP 2019528583 A5 JP2019528583 A5 JP 2019528583A5
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fingerprint sensor
sensor
substrate
sensor substrate
layer
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JP7050698B2 (ja
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JP2018564258A 2016-06-16 2017-06-05 指紋センサーデバイスおよびその方法 Active JP7050698B2 (ja)

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Application Number Priority Date Filing Date Title
US201662351228P 2016-06-16 2016-06-16
US62/351,228 2016-06-16
US15/430,389 US11003884B2 (en) 2016-06-16 2017-02-10 Fingerprint sensor device and methods thereof
US15/430,389 2017-02-10
PCT/US2017/035981 WO2017218228A1 (en) 2016-06-16 2017-06-05 Fingerprint sensor device and methods thereof

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JP2019528583A JP2019528583A (ja) 2019-10-10
JP2019528583A5 true JP2019528583A5 (enExample) 2020-06-25
JP7050698B2 JP7050698B2 (ja) 2022-04-08

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US (1) US11003884B2 (enExample)
EP (1) EP3472751A1 (enExample)
JP (1) JP7050698B2 (enExample)
KR (1) KR102459255B1 (enExample)
CN (1) CN109313702B (enExample)
AR (1) AR108765A1 (enExample)
CA (1) CA3024317A1 (enExample)
TW (1) TWI752962B (enExample)
WO (1) WO2017218228A1 (enExample)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140355387A1 (en) 2013-06-03 2014-12-04 Qualcomm Incorporated Ultrasonic receiver with coated piezoelectric layer
US10036734B2 (en) 2013-06-03 2018-07-31 Snaptrack, Inc. Ultrasonic sensor with bonded piezoelectric layer
TWI831924B (zh) * 2014-04-25 2024-02-11 日商半導體能源研究所股份有限公司 顯示裝置及電子裝置
CN105789065B (zh) 2016-04-08 2019-02-12 Oppo广东移动通信有限公司 一种芯片封装结构、终端设备及方法
KR20180013321A (ko) * 2016-07-29 2018-02-07 삼성전자주식회사 디스플레이 장치 및 그 제어방법
US10346663B2 (en) * 2016-09-05 2019-07-09 Nanchang O-Film Bio-Identification Technology Co., Ltd Fingerprint sensor and fingerprint identification module comprising the same
US10387706B2 (en) * 2016-09-05 2019-08-20 Nanchang O-Film Bio-Identification Technology Co., Ltd. Ultrasonic transducer of ultrasonic fingerprint sensor and manufacturing method thereof
CN108346587A (zh) * 2017-01-25 2018-07-31 新加坡有限公司 芯片封装器件及封装方法
TWI644601B (zh) * 2017-03-03 2018-12-11 致伸科技股份有限公司 指紋辨識模組的治具及指紋辨識模組的製造方法
CN107292226A (zh) * 2017-04-24 2017-10-24 麦克思商务咨询(深圳)有限公司 指纹识别装置及电子装置
US10489627B2 (en) * 2017-04-28 2019-11-26 The Board Of Trustees Of The Leland Stanford Junior University Acoustic biometric touch scanner
US10846501B2 (en) 2017-04-28 2020-11-24 The Board Of Trustees Of The Leland Stanford Junior University Acoustic biometric touch scanner
US10404306B2 (en) * 2017-05-30 2019-09-03 International Business Machines Corporation Paint on micro chip touch screens
EP3634230A4 (en) * 2017-06-02 2021-01-20 Next Biometrics Group ASA FINGERPRINT SENSOR WITH LIVE CHARACTER DETECTION
CN109416558B (zh) * 2017-06-14 2022-09-09 华为技术有限公司 一种显示模组及移动终端
US20180373913A1 (en) * 2017-06-26 2018-12-27 Qualcomm Incorporated Ultrasonic fingerprint sensor for under-display applications
TWI614695B (zh) * 2017-07-03 2018-02-11 敦泰電子有限公司 具指紋辨識之高屏佔比顯示裝置
US10461124B2 (en) * 2017-08-07 2019-10-29 Invensense, Inc. Ultrasonic sensing device
JP2019066319A (ja) * 2017-09-29 2019-04-25 株式会社ジャパンディスプレイ 検出装置及び電子機器
CN107656656B (zh) * 2017-10-24 2021-05-18 业成科技（成都）有限公司 声波式触控装置及其触控判断方法
KR102524554B1 (ko) * 2017-12-28 2023-04-20 엘지디스플레이 주식회사 지문 인식이 가능한 표시 장치
KR102540010B1 (ko) * 2017-12-29 2023-06-02 엘지디스플레이 주식회사 지문 인식이 가능한 표시 장치
KR102395435B1 (ko) * 2018-01-22 2022-05-09 엘지이노텍 주식회사 지문 인식 장치 및 이를 포함하는 전자 디바이스
US11474077B2 (en) 2018-02-02 2022-10-18 Cornell University Acoustic sensing systems, devices and methods
US11031358B2 (en) 2018-03-01 2021-06-08 Marvell Asia Pte, Ltd. Overhang model for reducing passivation stress and method for producing the same
CN108423632A (zh) * 2018-05-04 2018-08-21 李扬渊 一种能够实现超声波传感的电子设备及其制造方法
CN108502841A (zh) * 2018-05-04 2018-09-07 李扬渊 一种能够实现超声波传感的电子设备及其制造方法
US20190354238A1 (en) * 2018-05-21 2019-11-21 UltraSense Systems, Inc. Ultrasonic touch detection and decision
CN108955736B (zh) 2018-05-30 2020-03-06 京东方科技集团股份有限公司 一种超声波传感器及其制作方法、显示装置
CN108924277A (zh) * 2018-05-31 2018-11-30 业成科技（成都）有限公司 面板结构
CN108830214A (zh) * 2018-06-14 2018-11-16 业成科技（成都）有限公司 指纹辨识装置及其制造方法
KR102471819B1 (ko) 2018-06-21 2022-11-29 삼성전자 주식회사 압전 소자를 이용하여, 압력 감지 및 초음파 신호를 송수신하는 센서 모듈을 포함하는 전자 장치
CN118256865A (zh) * 2018-07-10 2024-06-28 耐科思特生物识别集团股份公司 电子设备及其制造方法
CN109240550B (zh) * 2018-08-10 2022-04-15 业泓科技(成都)有限公司 触控显示模组以及应用该触控显示模组的电子装置
CN109144319B (zh) * 2018-08-22 2022-04-08 京东方科技集团股份有限公司 传感结构、显示设备及传感结构的驱动方法
KR102495667B1 (ko) * 2018-08-23 2023-02-03 삼성전자주식회사 디스플레이의 아래에 배치된 센서를 포함하는 전자 장치
US11126814B2 (en) * 2018-10-17 2021-09-21 Qualcomm Incorporated Ultrasonic fingerprint sensor with flexible substrate
KR102708149B1 (ko) * 2018-11-08 2024-09-24 엘지이노텍 주식회사 터치 센싱 장치
KR102646718B1 (ko) * 2018-11-16 2024-03-14 삼성디스플레이 주식회사 전자장치
CN111222386B (zh) * 2018-11-27 2023-11-10 上海耕岩智能科技有限公司 指纹采集方法及装置
KR102630772B1 (ko) * 2018-11-30 2024-01-30 엘지디스플레이 주식회사 초음파 센서 및 디스플레이 장치
CN109597081A (zh) * 2018-11-30 2019-04-09 李扬渊 一种传感器装置
CN111403591B (zh) * 2018-12-14 2023-04-07 茂丞(郑州)超声科技有限公司 晶圆级超声波芯片组件及其制造方法
US10833292B2 (en) * 2018-12-20 2020-11-10 Wuhan China Star Optoelectronics Technology Co., Ltd. Organic light-emitting diode display panel
CN111403431B (zh) * 2019-01-02 2023-09-05 京东方科技集团股份有限公司 柔性体及控制其发生形变的方法
CN109522885B (zh) * 2019-01-08 2024-06-14 深圳市台技光电有限公司 适用于超声波指纹识别功能的钢化玻璃保护膜及制备方法
KR102629414B1 (ko) * 2019-01-17 2024-01-26 삼성전자주식회사 드래그 입력에 기반하여 지문을 인식하기 위한 전자 장치 및 방법
US10929636B2 (en) * 2019-01-18 2021-02-23 Qualcomm Incorporated Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer
CN109817679B (zh) * 2019-01-31 2020-10-16 武汉华星光电半导体显示技术有限公司 Oled显示屏模组
KR102548486B1 (ko) 2019-02-13 2023-06-28 삼성전자주식회사 디스플레이 및 이를 포함하는 전자 장치
US10891458B2 (en) * 2019-02-28 2021-01-12 Qualcomm Incorporated Module architecture for large area ultrasonic fingerprint sensor
US11079518B1 (en) * 2019-02-28 2021-08-03 Facebook Technologies, Llc Transparent tunable optical elements with structurally-modified electroactive polymer
KR20200109437A (ko) 2019-03-12 2020-09-23 삼성디스플레이 주식회사 전자 패널 및 이를 포함하는 전자 장치
US10943150B2 (en) 2019-04-12 2021-03-09 Datalogic Ip Tech S.R.L. Smart trigger
WO2021093384A1 (zh) * 2019-11-12 2021-05-20 神盾股份有限公司 指纹识别装置及其指纹识别方法
CN112906442B (zh) * 2019-12-04 2024-04-30 茂丞(郑州)超声科技有限公司 晶圆级超声波装置及其制造方法
JP7367932B2 (ja) * 2020-01-23 2023-10-24 大日本印刷株式会社 センサモジュール
KR102892296B1 (ko) 2020-02-04 2025-11-26 삼성전자주식회사 지문 인식 겸용 터치 센서 및 이를 포함하는 디스플레이 장치
US11228846B2 (en) 2020-02-14 2022-01-18 Apple Inc. Sensor assembly for electronic device
CN111682045B (zh) * 2020-06-23 2022-06-21 京东方科技集团股份有限公司 超声波指纹识别传感器及其制作方法、显示模组
KR20210158459A (ko) * 2020-06-23 2021-12-31 삼성디스플레이 주식회사 표시 장치
US11393239B2 (en) * 2020-07-01 2022-07-19 Qualcomm Incorporated Multiple-frequency ultrasonic sensor system
WO2022011606A1 (zh) * 2020-07-15 2022-01-20 深圳市汇顶科技股份有限公司 超声换能器与电子设备
KR102848872B1 (ko) * 2020-07-27 2025-08-22 삼성디스플레이 주식회사 표시 패널
KR102860672B1 (ko) 2020-07-30 2025-09-17 삼성디스플레이 주식회사 전자장치
CN111914776B (zh) * 2020-08-07 2023-12-22 业泓科技(成都)有限公司 显示装置
DE102020121855A1 (de) * 2020-08-20 2022-02-24 Infineon Technologies Ag Hochfrequenz-Vorrichtungen und zugehörige Herstellungsverfahren
US11823968B2 (en) * 2020-08-27 2023-11-21 Nxp Usa, Inc. Semiconductor device package having stress isolation and method therefor
CN112183396B (zh) * 2020-09-30 2024-03-08 京东方科技集团股份有限公司 显示组件和显示装置
US12205857B2 (en) * 2020-10-07 2025-01-21 Murata Manufacturing Co., Ltd. Electronic component with metallic cap
CN112216732B (zh) * 2020-10-13 2024-04-23 京东方科技集团股份有限公司 一种显示面板及显示装置
CN115273156B (zh) * 2021-04-29 2025-07-08 上海思立微电子科技有限公司 超声波指纹识别装置以及超声波指纹识别芯片
US12066338B2 (en) * 2021-05-11 2024-08-20 UltraSense Systems, Inc. Force-measuring device assembly for a portable electronic apparatus, a portable electronic apparatus, and a method of modifying a span of a sense region in a force-measuring device assembly
US11519801B1 (en) * 2021-06-04 2022-12-06 Synaptics Incorporated Sensor device for transcapacitive sensing with shielding
US11816919B2 (en) 2021-06-04 2023-11-14 Synaptics Incorporated Sensor device for transcapacitive sensing with shielding
US11798307B2 (en) 2021-08-30 2023-10-24 Qualcomm Incorporated Under-display ultrasonic fingerprint sensors for foldable displays
US20240353440A1 (en) * 2021-09-14 2024-10-24 Apple Inc. Sensor assembly
CN114758367A (zh) * 2022-04-29 2022-07-15 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
WO2024010507A1 (en) * 2022-07-05 2024-01-11 Fingerprint Cards Anacatum Ip Ab Biometric imaging device and method for manufacturing the biometric imaging device
WO2024010506A1 (en) * 2022-07-05 2024-01-11 Fingerprint Cards Anacatum Ip Ab Biometric imaging device and method for manufacturing the biometric imaging device
WO2024023591A1 (en) * 2022-07-26 2024-02-01 Centitvc - Centro De Nanotecnologia E Materiais Técnicos Funcionais E Inteligentes Natural stone panel with an integrated touch sensing system and manufacturing method thereof
KR20240021413A (ko) 2022-08-10 2024-02-19 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드
EP4589552A4 (en) * 2022-09-13 2025-10-22 Huike Singapore Holding Pte Ltd ULTRASONIC FINGERPRINT DEVICE AND ELECTRONIC DEVICE
CN119418374A (zh) * 2022-09-13 2025-02-11 汇科(新加坡)控股私人有限公司 超声指纹装置和电子设备
WO2024128767A1 (ko) * 2022-12-13 2024-06-20 삼성전자 주식회사 초음파 센서 모듈을 포함하는 전자 장치
CN116140175B (zh) * 2023-03-08 2025-06-06 中国科学院苏州纳米技术与纳米仿生研究所 压电微机械超声波换能器及超声探测系统
US12494080B2 (en) * 2023-04-04 2025-12-09 Qualcomm Incorporated Devices configured for near-field ultrasonic imaging
US20250024605A1 (en) * 2023-07-14 2025-01-16 Cellink Corporation Forming Welded and Soldered Connections to Flexible Interconnect Circuits
TWI888883B (zh) * 2023-08-02 2025-07-01 大陸商茂丞(鄭州)超聲科技有限公司 超聲波感測元件總成及超聲波感測元件
KR20250074970A (ko) * 2023-11-21 2025-05-28 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 기기

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58186981A (ja) 1982-04-26 1983-11-01 Toray Ind Inc 入出力変換素子
US5133037A (en) 1991-06-07 1992-07-21 Hoechst Celanese Corp Polymeric optical modulator and waveguiding media
TW241352B (en) 1994-03-30 1995-02-21 Whitaker Corp Reflective mode ultrasonic touch sensitive switch
JPH0854425A (ja) 1994-04-28 1996-02-27 Hoechst Celanese Corp 電気光学的センサーデバイス
DE19833928B4 (de) 1998-07-28 2005-05-25 Infineon Technologies Ag Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen
KR20010110247A (ko) 2001-11-05 2001-12-12 주식회사 이지메딕스 이방 전도성 접착 필름을 이용한 초음파 탐촉자 적층구조
ATE518231T1 (de) 2003-03-26 2011-08-15 Daikin Ind Ltd Verfahren zur bildung eines ferroelektrischen dünnfilms
US20040263483A1 (en) 2003-06-24 2004-12-30 Aufderheide Brian E Sensing device
US7616786B2 (en) 2003-09-24 2009-11-10 Authentec, Inc. Finger biometric sensor with sensor electronics distributed over thin film and monocrystalline substrates and related methods
US7223243B2 (en) 2003-11-14 2007-05-29 General Electric Co. Thin film ultrasonic transmitter/receiver
KR100561851B1 (ko) 2003-11-18 2006-03-16 삼성전자주식회사 지문 인식 센서 및 그 제조 방법
US7392706B2 (en) 2003-11-27 2008-07-01 Kyocera Corporation Pressure sensor device
US20060002956A1 (en) 2004-04-05 2006-01-05 Surber Mark W Minicells as vaccines
WO2006042144A2 (en) * 2004-10-07 2006-04-20 Ultra-Scan Corporation Ultrasonic fingerprint scanning utilizing a plane wave
US8247802B2 (en) 2005-04-28 2012-08-21 Semiconductor Energy Laboratory Co., Ltd. Memory element and semiconductor device
CN1876760A (zh) 2005-06-08 2006-12-13 富士胶片株式会社 非线性光学材料用组合物、光学部件、非线性光学材料及其制造方法
US20070008952A1 (en) 2005-07-07 2007-01-11 Vodtel Communications Inc. Internet telephone network system
JP4682927B2 (ja) 2005-08-03 2011-05-11 セイコーエプソン株式会社 静電型超音波トランスデューサ、超音波スピーカ、音声信号再生方法、超音波トランスデューサの電極の製造方法、超音波トランスデューサの製造方法、超指向性音響システム、および表示装置
US8183745B2 (en) 2006-05-08 2012-05-22 The Penn State Research Foundation High frequency ultrasound transducers
US8139827B2 (en) * 2006-05-25 2012-03-20 Ultra-Scan Corporation Biometrical object reader having an ultrasonic wave manipulation device
US8098915B2 (en) 2006-05-25 2012-01-17 Ultra-Scan Corporation Longitudinal pulse wave array
WO2008015917A1 (en) 2006-08-02 2008-02-07 Konica Minolta Medical & Graphic, Inc. Ultrasonic probe, and ultrasonic probe manufacturing method
US8069549B2 (en) 2007-03-22 2011-12-06 Seiko Epson Corporation Method for sealing a quartz crystal device
US7994638B2 (en) * 2007-05-11 2011-08-09 Panasonic Corporation Semiconductor chip and semiconductor device
CN101315823A (zh) 2007-06-01 2008-12-03 聚鼎科技股份有限公司 过电流保护元件的制作方法
KR100914026B1 (ko) 2007-06-12 2009-08-28 한국세라믹기술원 압전 박막형 지문 센서 제조방법
CN101919079B (zh) 2007-07-03 2014-01-01 皇家飞利浦电子股份有限公司 用于存在性检测的薄膜检测器
WO2009029417A1 (en) 2007-08-13 2009-03-05 Ultra-Scan Corporation Method of making a piezoelectric device
KR100934957B1 (ko) 2008-02-22 2010-01-06 한국과학기술연구원 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법
IL189892A (en) 2008-03-03 2012-10-31 Supco Internat Ltd Electric or communication socket having a slot for receiving an electrical card and a card therefor
KR101493840B1 (ko) 2008-03-14 2015-02-17 삼성디스플레이 주식회사 액정 표시 장치, 표시 시스템, 및 액정 표시 장치를 이용한물체 형상의 인식 방법
US20090236732A1 (en) * 2008-03-19 2009-09-24 Powertech Technology Inc. Thermally-enhanced multi-hole semiconductor package
EP2327006A4 (en) 2008-08-01 2012-12-26 3M Innovative Properties Co METHODS OF MANUFACTURING COMPOSITE ELECTRODES
NO20083766L (no) * 2008-09-01 2010-03-02 Idex Asa Overflatesensor
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
HK1130618A2 (zh) * 2008-10-30 2010-05-14 耀光联有限公司 一种金融交易卡
WO2010138277A1 (en) 2009-05-29 2010-12-02 Xlumena, Inc. Apparatus and method for deploying stent across adjacent tissue layers
US20110021515A1 (en) 2009-07-24 2011-01-27 Takeda Pharmaceutical Company Limited Dihyrofuropyrmindine compounds
CN101691202B (zh) 2009-08-11 2012-01-04 西安交通大学 一种具有微结构的聚偏氟乙烯压电薄膜的制备方法
CN102596044A (zh) 2009-09-29 2012-07-18 卧龙岗大学 成像方法和系统
DE102010005403A1 (de) 2010-01-22 2011-07-28 Epcos Ag, 81669 Verfahren zur Herstellung eines piezoelektrischen Vielschichtbauelements und piezoelektrisches Vielschichtbauelement
US8201739B2 (en) * 2010-03-08 2012-06-19 Ultra-Scan Corporation Biometric sensor with delay layer
US20110279662A1 (en) * 2010-05-11 2011-11-17 Schneider John K Reflex Longitudinal Imaging Using Through Sensor Insonification
US8711128B2 (en) 2010-11-05 2014-04-29 Synaptics Incorporated Method and apparatus for sensing an input object relative to a sensing region of an ultrasound sensor device
US8539837B2 (en) 2010-12-10 2013-09-24 Palo Alto Research Center Incorporated Ultrasonic imaging using thin film transistor backplane
US9259961B2 (en) 2010-12-10 2016-02-16 Palo Alto Research Center Incorporated Large-area ultrasound contact imaging
FR2977319B1 (fr) * 2011-07-01 2014-03-14 Commissariat Energie Atomique Dispositif de mesure de pression a sensiblite optimisee
US8724832B2 (en) 2011-08-30 2014-05-13 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
DE102012200125A1 (de) * 2012-01-05 2013-07-11 Robert Bosch Gmbh Sensorstruktur und Drehratensensor
UA116771C2 (uk) 2012-02-02 2018-05-10 Квелкомм Інкорпорейтед Ультразвуковий сенсор торкання з дисплейним монітором
US20140035935A1 (en) 2012-08-03 2014-02-06 Qualcomm Mems Technologies, Inc. Passives via bar
US8890853B2 (en) 2013-01-11 2014-11-18 Sharp Laboratories Of America, Inc. In-pixel ultrasonic touch sensor for display applications
JP6098197B2 (ja) * 2013-02-05 2017-03-22 セイコーエプソン株式会社 光学フィルターデバイス、光学モジュール、及び電子機器
US20140359757A1 (en) 2013-06-03 2014-12-04 Qualcomm Incorporated User authentication biometrics in mobile devices
US10036734B2 (en) * 2013-06-03 2018-07-31 Snaptrack, Inc. Ultrasonic sensor with bonded piezoelectric layer
US9606606B2 (en) * 2013-06-03 2017-03-28 Qualcomm Incorporated Multifunctional pixel and display
US9323393B2 (en) 2013-06-03 2016-04-26 Qualcomm Incorporated Display with peripherally configured ultrasonic biometric sensor
US9262003B2 (en) 2013-11-04 2016-02-16 Qualcomm Incorporated Piezoelectric force sensing array
US20140355387A1 (en) 2013-06-03 2014-12-04 Qualcomm Incorporated Ultrasonic receiver with coated piezoelectric layer
WO2015105320A1 (en) 2014-01-07 2015-07-16 Samsung Electronics Co., Ltd. Sensor device and electronic device having the same
US9817108B2 (en) * 2014-01-13 2017-11-14 Qualcomm Incorporated Ultrasonic imaging with acoustic resonant cavity
US9945818B2 (en) 2014-02-23 2018-04-17 Qualcomm Incorporated Ultrasonic authenticating button
US10042488B2 (en) 2014-04-04 2018-08-07 Synaptics Incorporated Through silicon vias for backside connection
US9558390B2 (en) 2014-07-25 2017-01-31 Qualcomm Incorporated High-resolution electric field sensor in cover glass
EP2983108A3 (en) * 2014-08-05 2016-07-13 LG Innotek Co., Ltd. Fingerprint sensor and touch device including the same
WO2016061410A1 (en) * 2014-10-15 2016-04-21 Qualcomm Incorporated Three-port piezoelectric ultrasonic transducer
US9995821B2 (en) * 2014-10-15 2018-06-12 Qualcomm Incorporated Active beam-forming technique for piezoelectric ultrasonic transducer array
US10147870B2 (en) 2014-11-12 2018-12-04 The Trustees Of Dartmouth College Porous piezoelectric material with dense surface, and associated methods and devices
US20160171276A1 (en) 2014-12-11 2016-06-16 Elan Microelectronics Corporation Fingerprint Sensor Having ESD Protection Structure
TWI594341B (zh) 2015-01-19 2017-08-01 神盾股份有限公司 指紋辨識裝置封裝及其製造方法
CN104766830B (zh) * 2015-04-02 2018-07-06 南昌欧菲生物识别技术有限公司 一种指纹传感器封装结构、封装方法及电子设备
CN205281521U (zh) * 2015-12-17 2016-06-01 南昌欧菲生物识别技术有限公司 指纹识别模组和终端设备
CN105631402B (zh) * 2015-12-18 2019-02-19 业成科技（成都）有限公司 指纹识别装置及方法
US9875388B2 (en) * 2016-02-26 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method

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