NO20083766L - Overflatesensor - Google Patents

Overflatesensor

Info

Publication number
NO20083766L
NO20083766L NO20083766A NO20083766A NO20083766L NO 20083766 L NO20083766 L NO 20083766L NO 20083766 A NO20083766 A NO 20083766A NO 20083766 A NO20083766 A NO 20083766A NO 20083766 L NO20083766 L NO 20083766L
Authority
NO
Norway
Prior art keywords
substrate
sensor elements
aforementioned
sensor
size
Prior art date
Application number
NO20083766A
Other languages
English (en)
Inventor
Ralph W Bernstein
Nicolai W Christie
Geir Ivar Bredholt
Anders Natas
Oyvind Slogedal
Original Assignee
Idex Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa filed Critical Idex Asa
Priority to NO20083766A priority Critical patent/NO20083766L/no
Priority to KR1020117006526A priority patent/KR101620373B1/ko
Priority to EP09782445.2A priority patent/EP2332095B1/en
Priority to US13/060,759 priority patent/US8487624B2/en
Priority to PCT/EP2009/061260 priority patent/WO2010023323A1/en
Priority to JP2011524413A priority patent/JP5593317B2/ja
Priority to CN200980134246.5A priority patent/CN102138147B/zh
Publication of NO20083766L publication Critical patent/NO20083766L/no

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)

Abstract

Foreliggende oppfinnelse vedrører en sensor for måling av strukturer i en overflate, f.eks. en fingeravtrykksensor som omfatter et valgt antall sensorelementer ved valgte posisjoner for kobling til en fingeroverflate som har en størrelse mindre eller sammenlignbar med størrelsen til strukturene i fingeroverflaten, og en prosesseringsenhet som inkluderer undersøkelseselektroder koblet til ovennevnte sensorelementer for fremskaffelse av impedansmålinger ved ovennevnte fingeroverflate, der prosessenngsenheten er montert på en side av et substrat og der sensorelementene er plassert på den andre siden av ovennevnte substrat, der substratet inkluderer gjennomgående første ledere mellom ovennevnte sensorelementer og ovennevnte undersøkelseselektroder. Substratet er fremstilt fra et halvledermateriale slik som silisium og ovennevnte første ledere utgjøres av gjennomgående substratseksjoner av en valgt størrelse omgitt av en dielektrisk isolasjon som skiller dem fra substratet.1
NO20083766A 2008-09-01 2008-09-01 Overflatesensor NO20083766L (no)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NO20083766A NO20083766L (no) 2008-09-01 2008-09-01 Overflatesensor
KR1020117006526A KR101620373B1 (ko) 2008-09-01 2009-09-01 표면 센서
EP09782445.2A EP2332095B1 (en) 2008-09-01 2009-09-01 Surface sensor
US13/060,759 US8487624B2 (en) 2008-09-01 2009-09-01 Surface sensor
PCT/EP2009/061260 WO2010023323A1 (en) 2008-09-01 2009-09-01 Surface sensor
JP2011524413A JP5593317B2 (ja) 2008-09-01 2009-09-01 表面センサ
CN200980134246.5A CN102138147B (zh) 2008-09-01 2009-09-01 表面传感器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO20083766A NO20083766L (no) 2008-09-01 2008-09-01 Overflatesensor

Publications (1)

Publication Number Publication Date
NO20083766L true NO20083766L (no) 2010-03-02

Family

ID=41284176

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20083766A NO20083766L (no) 2008-09-01 2008-09-01 Overflatesensor

Country Status (7)

Country Link
US (1) US8487624B2 (no)
EP (1) EP2332095B1 (no)
JP (1) JP5593317B2 (no)
KR (1) KR101620373B1 (no)
CN (1) CN102138147B (no)
NO (1) NO20083766L (no)
WO (1) WO2010023323A1 (no)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8131026B2 (en) 2004-04-16 2012-03-06 Validity Sensors, Inc. Method and apparatus for fingerprint image reconstruction
US8447077B2 (en) * 2006-09-11 2013-05-21 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array
WO2006041780A1 (en) 2004-10-04 2006-04-20 Validity Sensors, Inc. Fingerprint sensing assemblies comprising a substrate
NO20093601A1 (no) * 2009-12-29 2011-06-30 Idex Asa Overflatesensor
US9342194B2 (en) 2012-02-06 2016-05-17 Qualcomm Incorporated Biometric scanner having a protective conductive array
NO340311B1 (no) 2013-02-22 2017-03-27 Idex Asa Integrert fingeravtrykksensor
NO20131423A1 (no) 2013-02-22 2014-08-25 Idex Asa Integrert fingeravtrykksensor
CN103309540B (zh) * 2013-06-25 2016-02-03 元亮科技有限公司 一种类金刚石镀膜电容触摸屏及其制备方法
NO336318B1 (no) 2013-07-12 2015-08-03 Idex Asa Overflatesensor
US10095906B2 (en) 2014-02-21 2018-10-09 Idex Asa Sensor employing overlapping grid lines and conductive probes for extending a sensing surface from the grid lines
US9342727B2 (en) 2014-03-04 2016-05-17 Apple Inc. Field shaping channels in a substrate above a biometric sensing device
CN104102902B (zh) * 2014-07-04 2017-07-04 京东方科技集团股份有限公司 一种半导体指纹识别传感器及其制造方法
WO2016118683A1 (en) * 2015-01-23 2016-07-28 Corning Incorporated Coated substrate for use in sensors
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
US9842243B2 (en) * 2015-06-08 2017-12-12 Fingerprint Cards Ab Fingerprint sensing device with heterogeneous coating structure comprising a mold
KR102626033B1 (ko) 2015-06-23 2024-01-18 이덱스 바이오메트릭스 아사 양면 지문 센서
CN105938545A (zh) * 2016-04-13 2016-09-14 深圳芯邦科技股份有限公司 一种指纹识别模组
SE539668C2 (en) * 2016-06-01 2017-10-24 Fingerprint Cards Ab Fingerprint sensing device and method for manufacturing a fingerprint sensing device
US11003884B2 (en) * 2016-06-16 2021-05-11 Qualcomm Incorporated Fingerprint sensor device and methods thereof
US9946915B1 (en) * 2016-10-14 2018-04-17 Next Biometrics Group Asa Fingerprint sensors with ESD protection
US10852292B2 (en) * 2016-12-02 2020-12-01 Sony Semiconductor Solutions Corporation Semiconductor apparatus and potential measuring apparatus
US10713461B2 (en) 2017-09-19 2020-07-14 IDEX Biometrtics ASA Double sided sensor module suitable for integration into electronic devices
WO2020188313A2 (en) * 2018-07-10 2020-09-24 Next Biometrics Group Asa Thermally conductive and protective coating for electronic device
US11816919B2 (en) * 2021-06-04 2023-11-14 Synaptics Incorporated Sensor device for transcapacitive sensing with shielding
US11519801B1 (en) * 2021-06-04 2022-12-06 Synaptics Incorporated Sensor device for transcapacitive sensing with shielding

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4310390C2 (de) * 1993-03-30 1995-03-16 Topping Best Ltd Ultraschallabbildungsvorrichtung zur Erfassung und/oder Identifikation von Oberflächenstrukturen und oberflächennahen Strukturen
US6016355A (en) 1995-12-15 2000-01-18 Veridicom, Inc. Capacitive fingerprint acquisition sensor
US5963679A (en) * 1996-01-26 1999-10-05 Harris Corporation Electric field fingerprint sensor apparatus and related methods
FR2749955B1 (fr) * 1996-06-14 1998-09-11 Thomson Csf Systeme de lecture d'empreintes digitales
NO304766B1 (no) * 1997-06-16 1999-02-08 Sintef Fingeravtrykksensor
JP3400347B2 (ja) * 1998-05-18 2003-04-28 日本電信電話株式会社 表面形状認識用センサおよびその製造方法
US6683971B1 (en) * 1999-05-11 2004-01-27 Authentec, Inc. Fingerprint sensor with leadframe bent pin conductive path and associated methods
US6628812B1 (en) * 1999-05-11 2003-09-30 Authentec, Inc. Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods
US6512381B2 (en) * 1999-12-30 2003-01-28 Stmicroelectronics, Inc. Enhanced fingerprint detection
NO316482B1 (no) * 2000-06-09 2004-01-26 Idex Asa Navigasjonsverktöy for kobling til en skjerminnretning
US7184581B2 (en) * 2000-06-09 2007-02-27 Idex Asa System for real time finger surface pattern measurement
NO20003006L (no) * 2000-06-09 2001-12-10 Idex Asa Mus
NO315017B1 (no) * 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
US6515488B1 (en) 2001-05-07 2003-02-04 Stmicroelectronics, Inc. Fingerprint detector with scratch resistant surface and embedded ESD protection grid
JP2003058872A (ja) 2001-08-21 2003-02-28 Sony Corp 指紋検出装置、その製造方法及び成膜装置
US6693441B2 (en) 2001-11-30 2004-02-17 Stmicroelectronics, Inc. Capacitive fingerprint sensor with protective coating containing a conductive suspension
NO316776B1 (no) 2001-12-07 2004-05-03 Idex Asa Pakkelosning for fingeravtrykksensor
EP2560199B1 (en) * 2002-04-05 2016-08-03 STMicroelectronics S.r.l. Process for manufacturing a through insulated interconnection in a body of semiconductor material
NO20025803D0 (no) * 2002-12-03 2002-12-03 Idex Asa Levende finger
SE526366C3 (sv) 2003-03-21 2005-10-26 Silex Microsystems Ab Elektriska anslutningar i substrat
SE1050461A1 (sv) 2006-02-01 2010-05-10 Silex Microsystems Ab Metoder för tillverkning av en startsubstratskiva för halvledartillverkning, med skivgenomgående anslutningar

Also Published As

Publication number Publication date
JP2012501484A (ja) 2012-01-19
KR101620373B1 (ko) 2016-05-23
JP5593317B2 (ja) 2014-09-24
US8487624B2 (en) 2013-07-16
KR20110063643A (ko) 2011-06-13
EP2332095A1 (en) 2011-06-15
CN102138147B (zh) 2015-04-15
EP2332095B1 (en) 2015-06-10
US20110182488A1 (en) 2011-07-28
WO2010023323A1 (en) 2010-03-04
CN102138147A (zh) 2011-07-27

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