JP5593317B2 - 表面センサ - Google Patents
表面センサ Download PDFInfo
- Publication number
- JP5593317B2 JP5593317B2 JP2011524413A JP2011524413A JP5593317B2 JP 5593317 B2 JP5593317 B2 JP 5593317B2 JP 2011524413 A JP2011524413 A JP 2011524413A JP 2011524413 A JP2011524413 A JP 2011524413A JP 5593317 B2 JP5593317 B2 JP 5593317B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- substrate
- fingerprint sensor
- conductor
- fingerprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/4813—Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Artificial Intelligence (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Biology (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Description
Claims (19)
- 表面構造を測定するための指紋センサであって、前記指紋センサは、
前記表面構造の大きさよりも小さいかそれに相当する大きさを有する表面に結合するための選択された位置にある選択された数のセンサ素子と、
前記表面構造におけるインピーダンスの測定結果を提供するために、前記センサ素子に結合された問い合わせ電極を含む処理装置であって、前記処理装置は、前記センサ素子と前記問い合わせ電極との間に貫通する第1の導線を含む基板の片側に取り付けられ、前記センサ素子は前記基板の反対側に配置され、前記基板は半導体材料から作製され、前記第1の導線は、絶縁体によって囲まれた選択された大きさの貫通する基板部分によって構成され、前記第1の導線は前記基板と同一の材料から作製され、前記基板は少なくとも1つの第2の導線も含み、前記少なくとも1つの第2の導線は、誘電体によって前記基板から絶縁されている前記基板の部分によって構成されている、処理装置と、
前記少なくとも1つの第2の導線を介して指表面および前記処理装置に結合された外部電極であって、前記外部電極は前記表面構造よりも大きい、外部電極と、
を含む、指紋センサ。 - 前記少なくとも1つの第2の導線は前記基板を介する方向の断面を含み、前記断面は前記表面構造よりも大きい、請求項1に記載の指紋センサ。
- 前記処理装置は、前記外部電極と前記センサ素子との間のインピーダンスを測定する、請求項2に記載の指紋センサ。
- 前記センサ素子は、前記基板の限定された領域に集められており、前記少なくとも1つの第2の導線は、前記限定された領域の少なくとも2つの側の平面に配置され、前記少なくとも1つの第2の導線は、前記センサ素子を有する限定された領域を部分的に取り囲む、請求項3に記載の指紋センサ。
- 前記少なくとも1つの第2の導線は接地結合されている、請求項2に記載の指紋センサ。
- 前記センサ素子が配置されている基板の側を覆い、かつ前記センサ素子の全体にわたり減少した厚さを有する領域上に開口部を有する誘電層と、
センサパッドを構成する少なくとも前記開口部に配置された導電層と、
を含む、請求項1に記載の指紋センサ。 - 前記センサパッドの寸法は、周囲の誘電体絶縁を有する第1の導線の断面寸法と同一である、請求項6に記載の指紋センサ。
- 炭素系材料から作製された外側保護層であって、前記外側保護層は前記センサ素子を覆いかつセンサ表面を保護する、外側保護層を含む、請求項1に記載の指紋センサ。
- 前記センサ素子は、基板表面の所定の領域内に配置されており、前記センサ素子が駆動電極によって囲まれており、前記駆動電極が、前記駆動電極と接地との間に変動電圧を印加し、かつ前記センサ素子と前記駆動電極との間のインピーダンスを測定するために前記処理装置に結合されている、請求項1に記載の指紋センサ。
- 前記駆動電極は、前記基板内の少なくとも1つの第2の導線を介して前記処理装置に結合され、かつ前記基板から電気的に絶縁されており、前記絶縁は、2つの貫通する平行な誘電領域によって構成された絶縁構造であり、前記絶縁構造は、二重の絶縁領域を提供するために、選択された間隔で各平行な誘電領域の間に延びる貫通する誘電領域を有する、請求項9に記載の指紋センサ。
- 前記センサ素子は、前記指表面の一部における表面構造を測定するための線形のセンサアレイを構成し、前記線形のセンサアレイは、少なくとも1つのセンサ素子の線を含む、請求項9に記載の指紋センサ。
- 前記線形のセンサアレイは、複数のセンサ素子の平行な線を含む、請求項11に記載の指紋センサ。
- 前記センサ素子の平行な線は、センサ素子のスタガー線を提供するために、互いに関連した選択された距離だけ移動される、請求項12に記載の指紋センサ。
- 前記センサ上での前記指表面の移動を測定するための、互いからの選択された距離で配置された少なくとも2つの移動センサ素子を含む、請求項11に記載の指紋センサ。
- 前記少なくとも2つの移動センサ素子のうちの少なくとも1つは、前記線形のセンサアレイにおけるセンサ素子によって構成されている、請求項14に記載の指紋センサ。
- 少なくとも1つの接地電極を含む、請求項10に記載の指紋センサ。
- 前記基板は、前記基板の外側にある外部電極へ結合され、かつ前記表面構造よりも大きい、少なくとも1つの第2の導体を含む、請求項1に記載の指紋センサ。
- 前記半導体材料はシリコンを含む、請求項1に記載の指紋センサ。
- 前記絶縁体は、前記基板から前記第1の導線を分離する誘電体を含む、請求項1に記載の指紋センサ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20083766A NO20083766L (no) | 2008-09-01 | 2008-09-01 | Overflatesensor |
NO20083766 | 2008-09-01 | ||
PCT/EP2009/061260 WO2010023323A1 (en) | 2008-09-01 | 2009-09-01 | Surface sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012501484A JP2012501484A (ja) | 2012-01-19 |
JP5593317B2 true JP5593317B2 (ja) | 2014-09-24 |
Family
ID=41284176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011524413A Expired - Fee Related JP5593317B2 (ja) | 2008-09-01 | 2009-09-01 | 表面センサ |
Country Status (7)
Country | Link |
---|---|
US (1) | US8487624B2 (ja) |
EP (1) | EP2332095B1 (ja) |
JP (1) | JP5593317B2 (ja) |
KR (1) | KR101620373B1 (ja) |
CN (1) | CN102138147B (ja) |
NO (1) | NO20083766L (ja) |
WO (1) | WO2010023323A1 (ja) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8447077B2 (en) * | 2006-09-11 | 2013-05-21 | Validity Sensors, Inc. | Method and apparatus for fingerprint motion tracking using an in-line array |
US8131026B2 (en) | 2004-04-16 | 2012-03-06 | Validity Sensors, Inc. | Method and apparatus for fingerprint image reconstruction |
WO2006041780A1 (en) | 2004-10-04 | 2006-04-20 | Validity Sensors, Inc. | Fingerprint sensing assemblies comprising a substrate |
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
US9342194B2 (en) | 2012-02-06 | 2016-05-17 | Qualcomm Incorporated | Biometric scanner having a protective conductive array |
NO20131423A1 (no) | 2013-02-22 | 2014-08-25 | Idex Asa | Integrert fingeravtrykksensor |
NO340311B1 (no) * | 2013-02-22 | 2017-03-27 | Idex Asa | Integrert fingeravtrykksensor |
CN103309540B (zh) * | 2013-06-25 | 2016-02-03 | 元亮科技有限公司 | 一种类金刚石镀膜电容触摸屏及其制备方法 |
NO336318B1 (no) | 2013-07-12 | 2015-08-03 | Idex Asa | Overflatesensor |
CN106575351B (zh) | 2014-02-21 | 2019-12-13 | 傲迪司威生物识别公司 | 采用重叠的网格线和用于从网格线延伸感测表面的导电探头的传感器 |
US9342727B2 (en) | 2014-03-04 | 2016-05-17 | Apple Inc. | Field shaping channels in a substrate above a biometric sensing device |
CN104102902B (zh) * | 2014-07-04 | 2017-07-04 | 京东方科技集团股份有限公司 | 一种半导体指纹识别传感器及其制造方法 |
WO2016118683A1 (en) * | 2015-01-23 | 2016-07-28 | Corning Incorporated | Coated substrate for use in sensors |
USD776664S1 (en) * | 2015-05-20 | 2017-01-17 | Chaya Coleena Hendrick | Smart card |
US9842243B2 (en) * | 2015-06-08 | 2017-12-12 | Fingerprint Cards Ab | Fingerprint sensing device with heterogeneous coating structure comprising a mold |
CN108040494B (zh) | 2015-06-23 | 2022-01-21 | 傲迪司威生物识别公司 | 双面指纹传感器 |
CN105938545A (zh) * | 2016-04-13 | 2016-09-14 | 深圳芯邦科技股份有限公司 | 一种指纹识别模组 |
SE1650769A1 (sv) * | 2016-06-01 | 2017-10-24 | Fingerprint Cards Ab | Fingerprint sensing device and method for manufacturing a fingerprint sensing device |
US11003884B2 (en) * | 2016-06-16 | 2021-05-11 | Qualcomm Incorporated | Fingerprint sensor device and methods thereof |
US9946915B1 (en) * | 2016-10-14 | 2018-04-17 | Next Biometrics Group Asa | Fingerprint sensors with ESD protection |
CN110023746B (zh) * | 2016-12-02 | 2022-11-18 | 索尼半导体解决方案公司 | 半导体装置和电位测量装置 |
WO2019058259A1 (en) | 2017-09-19 | 2019-03-28 | Idex Asa | DUAL-SIDED SENSOR MODULE SUITABLE FOR INTEGRATION IN ELECTRONIC DEVICES |
WO2020188313A2 (en) * | 2018-07-10 | 2020-09-24 | Next Biometrics Group Asa | Thermally conductive and protective coating for electronic device |
US11519801B1 (en) * | 2021-06-04 | 2022-12-06 | Synaptics Incorporated | Sensor device for transcapacitive sensing with shielding |
US11816919B2 (en) * | 2021-06-04 | 2023-11-14 | Synaptics Incorporated | Sensor device for transcapacitive sensing with shielding |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4310390C2 (de) * | 1993-03-30 | 1995-03-16 | Topping Best Ltd | Ultraschallabbildungsvorrichtung zur Erfassung und/oder Identifikation von Oberflächenstrukturen und oberflächennahen Strukturen |
US6016355A (en) | 1995-12-15 | 2000-01-18 | Veridicom, Inc. | Capacitive fingerprint acquisition sensor |
US5963679A (en) * | 1996-01-26 | 1999-10-05 | Harris Corporation | Electric field fingerprint sensor apparatus and related methods |
FR2749955B1 (fr) * | 1996-06-14 | 1998-09-11 | Thomson Csf | Systeme de lecture d'empreintes digitales |
NO304766B1 (no) * | 1997-06-16 | 1999-02-08 | Sintef | Fingeravtrykksensor |
JP3400347B2 (ja) * | 1998-05-18 | 2003-04-28 | 日本電信電話株式会社 | 表面形状認識用センサおよびその製造方法 |
US6628812B1 (en) * | 1999-05-11 | 2003-09-30 | Authentec, Inc. | Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods |
US6683971B1 (en) * | 1999-05-11 | 2004-01-27 | Authentec, Inc. | Fingerprint sensor with leadframe bent pin conductive path and associated methods |
US6512381B2 (en) * | 1999-12-30 | 2003-01-28 | Stmicroelectronics, Inc. | Enhanced fingerprint detection |
NO316482B1 (no) * | 2000-06-09 | 2004-01-26 | Idex Asa | Navigasjonsverktöy for kobling til en skjerminnretning |
US7184581B2 (en) * | 2000-06-09 | 2007-02-27 | Idex Asa | System for real time finger surface pattern measurement |
NO315017B1 (no) | 2000-06-09 | 2003-06-23 | Idex Asa | Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate |
NO20003006L (no) * | 2000-06-09 | 2001-12-10 | Idex Asa | Mus |
US6515488B1 (en) | 2001-05-07 | 2003-02-04 | Stmicroelectronics, Inc. | Fingerprint detector with scratch resistant surface and embedded ESD protection grid |
JP2003058872A (ja) | 2001-08-21 | 2003-02-28 | Sony Corp | 指紋検出装置、その製造方法及び成膜装置 |
US6693441B2 (en) | 2001-11-30 | 2004-02-17 | Stmicroelectronics, Inc. | Capacitive fingerprint sensor with protective coating containing a conductive suspension |
NO316776B1 (no) * | 2001-12-07 | 2004-05-03 | Idex Asa | Pakkelosning for fingeravtrykksensor |
EP2560199B1 (en) * | 2002-04-05 | 2016-08-03 | STMicroelectronics S.r.l. | Process for manufacturing a through insulated interconnection in a body of semiconductor material |
NO20025803D0 (no) * | 2002-12-03 | 2002-12-03 | Idex Asa | Levende finger |
SE526366C3 (sv) | 2003-03-21 | 2005-10-26 | Silex Microsystems Ab | Elektriska anslutningar i substrat |
EP2005467B1 (en) * | 2006-02-01 | 2018-07-11 | Silex Microsystems AB | Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections |
-
2008
- 2008-09-01 NO NO20083766A patent/NO20083766L/no not_active Application Discontinuation
-
2009
- 2009-09-01 JP JP2011524413A patent/JP5593317B2/ja not_active Expired - Fee Related
- 2009-09-01 CN CN200980134246.5A patent/CN102138147B/zh active Active
- 2009-09-01 KR KR1020117006526A patent/KR101620373B1/ko active IP Right Grant
- 2009-09-01 US US13/060,759 patent/US8487624B2/en active Active
- 2009-09-01 EP EP09782445.2A patent/EP2332095B1/en active Active
- 2009-09-01 WO PCT/EP2009/061260 patent/WO2010023323A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2332095A1 (en) | 2011-06-15 |
WO2010023323A1 (en) | 2010-03-04 |
EP2332095B1 (en) | 2015-06-10 |
JP2012501484A (ja) | 2012-01-19 |
CN102138147B (zh) | 2015-04-15 |
CN102138147A (zh) | 2011-07-27 |
US8487624B2 (en) | 2013-07-16 |
US20110182488A1 (en) | 2011-07-28 |
KR20110063643A (ko) | 2011-06-13 |
KR101620373B1 (ko) | 2016-05-23 |
NO20083766L (no) | 2010-03-02 |
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