JP5753857B2 - 表面センサ - Google Patents
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- JP5753857B2 JP5753857B2 JP2012546431A JP2012546431A JP5753857B2 JP 5753857 B2 JP5753857 B2 JP 5753857B2 JP 2012546431 A JP2012546431 A JP 2012546431A JP 2012546431 A JP2012546431 A JP 2012546431A JP 5753857 B2 JP5753857 B2 JP 5753857B2
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1312—Sensors therefor direct reading, e.g. contactless acquisition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
Description
前記対象物と機械的に接触するように適合された接触面と、
選択された厚さを有する第1の誘電体層と、
所定のサイズおよび位置を有する複数の導電性の第1の電極1を含む第2の層であって、センサ素子が誘電体材料によって分離されている第2の層と、
複数の導電部を含む第3の層であって、各導電部が第1の電極に直流的に結合された第1の端部、および所定の位置を有する第3の層の反対側にある第2の端部を有し、導電部が誘電体材料によって分離されている第3の層と、
信号処理ユニットへの直流接続用導電部の前記第2の端部の前記所定の位置にある導電性接続手段とを備える。
平坦なガラス表面に液体のポリイミドを堆積し、このポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって前記第1の層の上に第2の層を堆積して第1の層の上に第1の電極を構成し、また液体ポリイミド層を堆積し、それによって第1の電極間に絶縁体を設け、ポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって第3の層を堆積し、液体ポリイミド層を堆積し、それによって第1の電極間に絶縁体を設け、ポリイミド材料を硬化させ、ユニットを硬化させた後にユニットをガラスプレートから取り外し、それによって積層可撓膜または積層可撓箔を生成するステップとを含む方法によって生成される。
2 埋込導電部、第2の電極
3 埋込導電部、第3の電極
4 埋込導電部、第1の導電路、導体リード
5 導体リード
6 導体リード
7 処理ユニットインターフェース部
8 基板、誘電体材料、ビルドアップ基板
9 接触面
10 指
11 スワイプ方向
12 センサ電極、センサアレイ
13 処理ユニット
14 追加内部層
15 外部入出力接続部
16 追加内部層、パターニング可能な誘電体層
17 導電路
18 埋込構成要素
19 印刷可能電子回路
20 スパークギャップ
21 指紋センサ
22 硬化可能ポリマー樹脂
23 第2の誘電体材料、第2の誘電体ユニット
24 可撓リボンケーブル
25 可撓リボンケーブル
26 プリント回路基板または可撓プリント回路
27 外部入出力接続部
28 プリント回路基板または可撓プリント回路
29 ボタン
30 外部電気インターフェース部
31 結合点
32 マイクロコントローラ
33 電気構成要素
34 積層補強材プレート
39 第1の誘電体層
40 可撓ユニット
41 ボンディングインターフェース部
42 ハンダ面
43 接点
44 電気導体
45 マイクロチップ
46 アンテナ
47 スマートカード
Claims (16)
- 有機体組織の対象物の表面によって構造および特質を評価するセンサユニットであって、特に指紋センサであり、
前記対象物と機械的に接触するように適合された接触面と、
選択された厚さを有する第1の誘電体層(39)と、
前記第1の層によって覆われた第2の誘電体層(40)であって、
前記第1の層と同じ層側に所定のサイズおよび位置を有する複数の導電性の第1および第2の電極(1、2)、ならびに
前記第1および第2の電極(1、2)の一方に直流結合された第1の端部、ならびに前記層(40)の反対側に所定の位置を有する第2の端部をそれぞれが有する、前記層内の誘電体材料によって分離された複数の導電部4、5
をさらに含む第2の誘電体層と、
前記導電部の前記第2の端部の前記所定の位置で前記導電部に接続された、信号処理ユニット(13)に直流接続するための導電接続手段(31)であって、前記電極の位置から横方向に分離された位置に配置される導電接続手段(31)とを備え、
前記処理ユニット(13)が、前記第1および第2の電極の電圧または電流を検出するように適合され、
前記層の材料が可撓性材料であり、
前記第2の電極の少なくとも1つが、評価されるべき表面の構造物よりも大きい寸法を有するセンサユニット。 - 前記誘電体材料がポリイミドである、請求項1に記載のセンサユニット。
- 少なくとも2つのサブ層によって構成された追加層をさらに備え、少なくとも一方が、第2の導体端部の位置を処理ユニットへの接続点の必要とされる位置に適合させる導電部のパターンを有する、請求項1に記載のセンサユニット。
- 前記接触面が、例えば炭素ベース材料である保護コーティングを備える、請求項1に記載のセンサユニット。
- 前記接触面に対して反対側が、例えば樹脂材料である硬化材料でコーティングされる、請求項1に記載のセンサユニット。
- 前記硬化材料がまた搭載処理ユニットを覆う、請求項5に記載のセンサユニット。
- 前記追加層が、前記電極から前記センサユニットの反対側まで延びる導電部を含む、請求項3に記載のセンサユニット。
- 前記第2の電極が前記反対側に、前記処理ユニットに結合するための接続点を備える、請求項7に記載のセンサユニット。
- 少なくとも1つの第2の電極の上の前記第1の層の厚さが低減される、請求項7に記載のセンサユニット。
- 前記第1の層が、前記電極のうちの少なくとも1つの上に開口を備え、前記電極と前記対象物の間の直流接触を提供する、請求項1に記載のセンサユニット。
- 前記導電接続手段が可撓性のプリント回路基板またはプリント回路の上の導体に接続され、前記導体が、前記導電接続手段と、前記導電接続手段から横方向に分離された位置に配置された信号処理ユニット上の対応するインターフェース部との間の接続部を提供する、請求項1に記載のセンサユニット。
- 前記処理ユニットが、前記導電接続手段に対して前記可撓性のプリント回路基板またはプリント回路の同じ側に配置される、請求項11に記載のセンサユニット。
- 前記処理ユニットが、前記導電接続手段に対して前記可撓性のプリント回路基板またはプリント回路の反対側に配置される、請求項11に記載のセンサユニット。
- 前記可撓性のプリント回路基板またはプリント回路が、複数の構成要素、および外部機器との結合インターフェース部を備える、請求項11に記載のセンサユニット。
- 請求項1に記載のセンサユニットを製作する方法であって、
平坦なガラス表面に液体のポリイミドを堆積し、前記ポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって前記第1の層の上に第2の層を堆積して前記第1の層の上に第1の電極を構成し、液体ポリイミド層を堆積し、前記第1の電極間に絶縁体を設け、前記ポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって第3の層を堆積して、前記第2の層内の導電材料の前記パターンに一方の端部が電気的に接続された複数の導電部を構成し、液体ポリイミド層を堆積し、前記第1の電極間に絶縁体を設け、前記ポリイミド材料を硬化させるステップと、
前記ガラス面と前記第1の層との間の以前の接触面で前記接触面を検査するために、前記層を前記ガラス面から除去するステップとを含む、方法。 - 接続手段を設けるために前記導電部の第2の端部上に導電材料を適用するステップを含む、請求項15に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29063009P | 2009-12-29 | 2009-12-29 | |
US61/290,630 | 2009-12-29 | ||
NO20093601A NO20093601A1 (no) | 2009-12-29 | 2009-12-29 | Overflatesensor |
NO20093601 | 2009-12-29 | ||
PCT/EP2010/070787 WO2011080262A1 (en) | 2009-12-29 | 2010-12-28 | Surface sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013516012A JP2013516012A (ja) | 2013-05-09 |
JP5753857B2 true JP5753857B2 (ja) | 2015-07-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012546431A Active JP5753857B2 (ja) | 2009-12-29 | 2010-12-28 | 表面センサ |
Country Status (7)
Country | Link |
---|---|
US (4) | US9122901B2 (ja) |
EP (2) | EP2975554A3 (ja) |
JP (1) | JP5753857B2 (ja) |
CN (1) | CN102782700A (ja) |
NO (1) | NO20093601A1 (ja) |
TW (1) | TWI511052B (ja) |
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TWI511052B (zh) | 2015-12-01 |
EP2519913A1 (en) | 2012-11-07 |
JP2013516012A (ja) | 2013-05-09 |
US20160104024A1 (en) | 2016-04-14 |
US10762322B2 (en) | 2020-09-01 |
TW201140467A (en) | 2011-11-16 |
EP2975554A3 (en) | 2016-03-23 |
WO2011080262A1 (en) | 2011-07-07 |
CN102782700A (zh) | 2012-11-14 |
US9396379B2 (en) | 2016-07-19 |
US20150136860A1 (en) | 2015-05-21 |
EP2975554A2 (en) | 2016-01-20 |
US20130194071A1 (en) | 2013-08-01 |
US9122901B2 (en) | 2015-09-01 |
US20190251322A1 (en) | 2019-08-15 |
NO20093601A1 (no) | 2011-06-30 |
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