JP5753857B2 - 表面センサ - Google Patents
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- JP5753857B2 JP5753857B2 JP2012546431A JP2012546431A JP5753857B2 JP 5753857 B2 JP5753857 B2 JP 5753857B2 JP 2012546431 A JP2012546431 A JP 2012546431A JP 2012546431 A JP2012546431 A JP 2012546431A JP 5753857 B2 JP5753857 B2 JP 5753857B2
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1312—Sensors therefor direct reading, e.g. contactless acquisition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Description
前記対象物と機械的に接触するように適合された接触面と、
選択された厚さを有する第1の誘電体層と、
所定のサイズおよび位置を有する複数の導電性の第1の電極1を含む第2の層であって、センサ素子が誘電体材料によって分離されている第2の層と、
複数の導電部を含む第3の層であって、各導電部が第1の電極に直流的に結合された第1の端部、および所定の位置を有する第3の層の反対側にある第2の端部を有し、導電部が誘電体材料によって分離されている第3の層と、
信号処理ユニットへの直流接続用導電部の前記第2の端部の前記所定の位置にある導電性接続手段とを備える。
平坦なガラス表面に液体のポリイミドを堆積し、このポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって前記第1の層の上に第2の層を堆積して第1の層の上に第1の電極を構成し、また液体ポリイミド層を堆積し、それによって第1の電極間に絶縁体を設け、ポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって第3の層を堆積し、液体ポリイミド層を堆積し、それによって第1の電極間に絶縁体を設け、ポリイミド材料を硬化させ、ユニットを硬化させた後にユニットをガラスプレートから取り外し、それによって積層可撓膜または積層可撓箔を生成するステップとを含む方法によって生成される。
2 埋込導電部、第2の電極
3 埋込導電部、第3の電極
4 埋込導電部、第1の導電路、導体リード
5 導体リード
6 導体リード
7 処理ユニットインターフェース部
8 基板、誘電体材料、ビルドアップ基板
9 接触面
10 指
11 スワイプ方向
12 センサ電極、センサアレイ
13 処理ユニット
14 追加内部層
15 外部入出力接続部
16 追加内部層、パターニング可能な誘電体層
17 導電路
18 埋込構成要素
19 印刷可能電子回路
20 スパークギャップ
21 指紋センサ
22 硬化可能ポリマー樹脂
23 第2の誘電体材料、第2の誘電体ユニット
24 可撓リボンケーブル
25 可撓リボンケーブル
26 プリント回路基板または可撓プリント回路
27 外部入出力接続部
28 プリント回路基板または可撓プリント回路
29 ボタン
30 外部電気インターフェース部
31 結合点
32 マイクロコントローラ
33 電気構成要素
34 積層補強材プレート
39 第1の誘電体層
40 可撓ユニット
41 ボンディングインターフェース部
42 ハンダ面
43 接点
44 電気導体
45 マイクロチップ
46 アンテナ
47 スマートカード
Claims (16)
- 有機体組織の対象物の表面によって構造および特質を評価するセンサユニットであって、特に指紋センサであり、
前記対象物と機械的に接触するように適合された接触面と、
選択された厚さを有する第1の誘電体層(39)と、
前記第1の層によって覆われた第2の誘電体層(40)であって、
前記第1の層と同じ層側に所定のサイズおよび位置を有する複数の導電性の第1および第2の電極(1、2)、ならびに
前記第1および第2の電極(1、2)の一方に直流結合された第1の端部、ならびに前記層(40)の反対側に所定の位置を有する第2の端部をそれぞれが有する、前記層内の誘電体材料によって分離された複数の導電部4、5
をさらに含む第2の誘電体層と、
前記導電部の前記第2の端部の前記所定の位置で前記導電部に接続された、信号処理ユニット(13)に直流接続するための導電接続手段(31)であって、前記電極の位置から横方向に分離された位置に配置される導電接続手段(31)とを備え、
前記処理ユニット(13)が、前記第1および第2の電極の電圧または電流を検出するように適合され、
前記層の材料が可撓性材料であり、
前記第2の電極の少なくとも1つが、評価されるべき表面の構造物よりも大きい寸法を有するセンサユニット。 - 前記誘電体材料がポリイミドである、請求項1に記載のセンサユニット。
- 少なくとも2つのサブ層によって構成された追加層をさらに備え、少なくとも一方が、第2の導体端部の位置を処理ユニットへの接続点の必要とされる位置に適合させる導電部のパターンを有する、請求項1に記載のセンサユニット。
- 前記接触面が、例えば炭素ベース材料である保護コーティングを備える、請求項1に記載のセンサユニット。
- 前記接触面に対して反対側が、例えば樹脂材料である硬化材料でコーティングされる、請求項1に記載のセンサユニット。
- 前記硬化材料がまた搭載処理ユニットを覆う、請求項5に記載のセンサユニット。
- 前記追加層が、前記電極から前記センサユニットの反対側まで延びる導電部を含む、請求項3に記載のセンサユニット。
- 前記第2の電極が前記反対側に、前記処理ユニットに結合するための接続点を備える、請求項7に記載のセンサユニット。
- 少なくとも1つの第2の電極の上の前記第1の層の厚さが低減される、請求項7に記載のセンサユニット。
- 前記第1の層が、前記電極のうちの少なくとも1つの上に開口を備え、前記電極と前記対象物の間の直流接触を提供する、請求項1に記載のセンサユニット。
- 前記導電接続手段が可撓性のプリント回路基板またはプリント回路の上の導体に接続され、前記導体が、前記導電接続手段と、前記導電接続手段から横方向に分離された位置に配置された信号処理ユニット上の対応するインターフェース部との間の接続部を提供する、請求項1に記載のセンサユニット。
- 前記処理ユニットが、前記導電接続手段に対して前記可撓性のプリント回路基板またはプリント回路の同じ側に配置される、請求項11に記載のセンサユニット。
- 前記処理ユニットが、前記導電接続手段に対して前記可撓性のプリント回路基板またはプリント回路の反対側に配置される、請求項11に記載のセンサユニット。
- 前記可撓性のプリント回路基板またはプリント回路が、複数の構成要素、および外部機器との結合インターフェース部を備える、請求項11に記載のセンサユニット。
- 請求項1に記載のセンサユニットを製作する方法であって、
平坦なガラス表面に液体のポリイミドを堆積し、前記ポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって前記第1の層の上に第2の層を堆積して前記第1の層の上に第1の電極を構成し、液体ポリイミド層を堆積し、前記第1の電極間に絶縁体を設け、前記ポリイミド材料を硬化させるステップと、
導電材料のパターンを付けることによって第3の層を堆積して、前記第2の層内の導電材料の前記パターンに一方の端部が電気的に接続された複数の導電部を構成し、液体ポリイミド層を堆積し、前記第1の電極間に絶縁体を設け、前記ポリイミド材料を硬化させるステップと、
前記ガラス面と前記第1の層との間の以前の接触面で前記接触面を検査するために、前記層を前記ガラス面から除去するステップとを含む、方法。 - 接続手段を設けるために前記導電部の第2の端部上に導電材料を適用するステップを含む、請求項15に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29063009P | 2009-12-29 | 2009-12-29 | |
US61/290,630 | 2009-12-29 | ||
NO20093601A NO20093601A1 (no) | 2009-12-29 | 2009-12-29 | Overflatesensor |
NO20093601 | 2009-12-29 | ||
PCT/EP2010/070787 WO2011080262A1 (en) | 2009-12-29 | 2010-12-28 | Surface sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013516012A JP2013516012A (ja) | 2013-05-09 |
JP5753857B2 true JP5753857B2 (ja) | 2015-07-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012546431A Active JP5753857B2 (ja) | 2009-12-29 | 2010-12-28 | 表面センサ |
Country Status (7)
Country | Link |
---|---|
US (4) | US9122901B2 (ja) |
EP (2) | EP2975554A3 (ja) |
JP (1) | JP5753857B2 (ja) |
CN (1) | CN102782700A (ja) |
NO (1) | NO20093601A1 (ja) |
TW (1) | TWI511052B (ja) |
WO (1) | WO2011080262A1 (ja) |
Families Citing this family (113)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007147137A2 (en) | 2006-06-15 | 2007-12-21 | Sitime Corporation | Stacked die package for mems resonator system |
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
BR122021016044B1 (pt) | 2010-05-08 | 2022-07-19 | Bruin Biometrics, Llc | Aparelho para detecção de umidade subepidérmica (sem) |
US10043052B2 (en) * | 2011-10-27 | 2018-08-07 | Synaptics Incorporated | Electronic device packages and methods |
US9695036B1 (en) * | 2012-02-02 | 2017-07-04 | Sitime Corporation | Temperature insensitive resonant elements and oscillators and methods of designing and manufacturing same |
US9740343B2 (en) | 2012-04-13 | 2017-08-22 | Apple Inc. | Capacitive sensing array modulation |
GB201208680D0 (en) | 2012-05-17 | 2012-06-27 | Origold As | Method of manufacturing an electronic card |
US9581628B2 (en) * | 2012-05-04 | 2017-02-28 | Apple Inc. | Electronic device including device ground coupled finger coupling electrode and array shielding electrode and related methods |
US9030440B2 (en) | 2012-05-18 | 2015-05-12 | Apple Inc. | Capacitive sensor packaging |
TWI491059B (zh) * | 2012-10-04 | 2015-07-01 | Upi Semiconductor Corp | 接近感測器及其電路佈局方法 |
US9651513B2 (en) | 2012-10-14 | 2017-05-16 | Synaptics Incorporated | Fingerprint sensor and button combinations and methods of making same |
NO20131423A1 (no) | 2013-02-22 | 2014-08-25 | Idex Asa | Integrert fingeravtrykksensor |
USD758372S1 (en) * | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
US9883822B2 (en) | 2013-06-05 | 2018-02-06 | Apple Inc. | Biometric sensor chip having distributed sensor and control circuitry |
NL2012891B1 (en) | 2013-06-05 | 2016-06-21 | Apple Inc | Biometric sensor chip having distributed sensor and control circuitry. |
SG11201509901VA (en) | 2013-06-06 | 2016-01-28 | Tricord Holdings L L C | Modular physiologic monitoring systems, kits, and methods |
NO336318B1 (no) | 2013-07-12 | 2015-08-03 | Idex Asa | Overflatesensor |
US9984270B2 (en) | 2013-08-05 | 2018-05-29 | Apple Inc. | Fingerprint sensor in an electronic device |
KR20150018350A (ko) * | 2013-08-08 | 2015-02-23 | 삼성전자주식회사 | 지문인식장치와 그 제조방법 및 전자기기 |
WO2015026288A1 (en) * | 2013-08-23 | 2015-02-26 | Fingerprint Cards Ab | Connection pads for a fingerprint sensing device |
US10296773B2 (en) | 2013-09-09 | 2019-05-21 | Apple Inc. | Capacitive sensing array having electrical isolation |
US9460332B1 (en) | 2013-09-09 | 2016-10-04 | Apple Inc. | Capacitive fingerprint sensor including an electrostatic lens |
US9697409B2 (en) | 2013-09-10 | 2017-07-04 | Apple Inc. | Biometric sensor stack structure |
KR101869624B1 (ko) | 2013-11-22 | 2018-06-21 | 선전 구딕스 테크놀로지 컴퍼니, 리미티드 | 안전한 인체 지문 센서 |
US10924472B2 (en) | 2013-11-27 | 2021-02-16 | Shenzhen GOODIX Technology Co., Ltd. | Wearable communication devices for secured transaction and communication |
US10128907B2 (en) * | 2014-01-09 | 2018-11-13 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensor module-based device-to-device communication |
CN103793691A (zh) * | 2014-01-28 | 2014-05-14 | 深圳市汇顶科技股份有限公司 | 指纹识别装置及具有其的移动终端 |
TWI493187B (zh) * | 2014-02-17 | 2015-07-21 | Morevalued Technology Co Let | 藉由信號外延結構形成之具有平坦接觸面之生物感測器及其製造方法 |
CN106575351B (zh) * | 2014-02-21 | 2019-12-13 | 傲迪司威生物识别公司 | 采用重叠的网格线和用于从网格线延伸感测表面的导电探头的传感器 |
US10223572B2 (en) * | 2014-03-12 | 2019-03-05 | Idex Asa | Fingerprint detecting apparatus and driving method thereof |
WO2015143011A1 (en) | 2014-03-19 | 2015-09-24 | Bidirectional Display Inc. | Image sensor panel and method for capturing graphical information using same |
US9122349B1 (en) | 2014-03-19 | 2015-09-01 | Bidirectional Display Inc. | Image sensor panel and method for capturing graphical information using same |
US9489559B2 (en) * | 2014-05-28 | 2016-11-08 | Fingerprint Cards Ab | Electronic device with fingerprint sensing system and conducting housing |
TWI567886B (zh) * | 2014-05-28 | 2017-01-21 | 南茂科技股份有限公司 | 晶片封裝結構以及晶片封裝結構的製作方法 |
CN107040621A (zh) * | 2014-06-16 | 2017-08-11 | 深圳市汇顶科技股份有限公司 | 一种移动终端 |
CN104051366B (zh) * | 2014-07-01 | 2017-06-20 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构和封装方法 |
WO2016007444A1 (en) | 2014-07-07 | 2016-01-14 | Goodix Technology Inc. | Integration of touch screen and fingerprint sensor assembly |
US9558390B2 (en) * | 2014-07-25 | 2017-01-31 | Qualcomm Incorporated | High-resolution electric field sensor in cover glass |
TWM493712U (zh) * | 2014-08-01 | 2015-01-11 | Superc Touch Corp | 具有遮罩功能的感應電極之生物辨識裝置 |
TWI640767B (zh) * | 2014-08-13 | 2018-11-11 | 佳能企業股份有限公司 | 電子傳輸模組及電子裝置 |
KR102356453B1 (ko) | 2014-08-29 | 2022-01-27 | 삼성전자주식회사 | 지문 인식 센서 및 이를 포함하는 지문 인식 시스템 |
US9779280B2 (en) | 2014-12-24 | 2017-10-03 | Idex Asa | Fingerprint sensor employing an integrated noise rejection structure |
EP3242593A4 (en) * | 2015-01-08 | 2018-11-07 | Medasense Biometrics Ltd. | An electrode array for physiological monitoring and device including or utilizing same |
CN104657707B (zh) | 2015-01-30 | 2018-03-20 | 业成光电(深圳)有限公司 | 指纹识别装置及其制作方法 |
KR102280155B1 (ko) * | 2015-02-04 | 2021-07-22 | 엘지디스플레이 주식회사 | 센서 스크린 및 그를 구비한 표시장치 |
KR102339546B1 (ko) * | 2015-02-06 | 2021-12-16 | 엘지디스플레이 주식회사 | 센서 스크린 및 그를 구비한 표시장치 |
KR102097179B1 (ko) * | 2015-04-07 | 2020-04-03 | 앰코테크놀로지코리아(주) | 지문센서 패키지 및 그 제조 방법 |
CN106056033B (zh) * | 2015-04-14 | 2019-07-05 | 李美燕 | 复合基板感测装置及其制造方法 |
AU2016250527B2 (en) | 2015-04-24 | 2021-01-14 | Bruin Biometrics Llc | Apparatus and methods for determining damaged tissue using sub-epidermal moisture measurements |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
KR101942141B1 (ko) | 2015-05-12 | 2019-01-24 | 앰코테크놀로지코리아(주) | 지문센서 패키지 |
USD776664S1 (en) * | 2015-05-20 | 2017-01-17 | Chaya Coleena Hendrick | Smart card |
TWI553563B (zh) * | 2015-05-25 | 2016-10-11 | 義隆電子股份有限公司 | 指紋辨識裝置 |
KR101670894B1 (ko) | 2015-05-27 | 2016-10-31 | (주)파트론 | 반도체 패키지의 제조 방법 |
CN105447442B (zh) * | 2015-06-10 | 2017-08-04 | 比亚迪股份有限公司 | 调整指纹检测芯片激励电压的方法和装置 |
TWI537837B (zh) * | 2015-06-11 | 2016-06-11 | 南茂科技股份有限公司 | 指紋辨識晶片封裝結構及其製作方法 |
CN108040494B (zh) | 2015-06-23 | 2022-01-21 | 傲迪司威生物识别公司 | 双面指纹传感器 |
CN106356348A (zh) * | 2015-07-24 | 2017-01-25 | 晨星半导体股份有限公司 | 电容式传感器结构、具电容式传感器的电路板结构以及电容式传感器的封装结构 |
US9704012B2 (en) * | 2015-09-10 | 2017-07-11 | Cypress Semiconductor Corporation | Fingerprint sensor pattern |
US10338753B2 (en) | 2015-11-03 | 2019-07-02 | Microsoft Technology Licensing, Llc | Flexible multi-layer sensing surface |
US10955977B2 (en) | 2015-11-03 | 2021-03-23 | Microsoft Technology Licensing, Llc | Extender object for multi-modal sensing |
US10649572B2 (en) | 2015-11-03 | 2020-05-12 | Microsoft Technology Licensing, Llc | Multi-modal sensing surface |
US9740908B2 (en) * | 2015-11-09 | 2017-08-22 | Contek Life Science Co., Ltd. | Capacitive fingerprint sensor and package method thereof |
US9898645B2 (en) | 2015-11-17 | 2018-02-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fingerprint sensor device and method |
TWI597670B (zh) * | 2016-01-06 | 2017-09-01 | 晨星半導體股份有限公司 | 指紋辨識電極結構 |
US9792516B2 (en) * | 2016-01-26 | 2017-10-17 | Next Biometrics Group Asa | Flexible card with fingerprint sensor |
KR102592972B1 (ko) * | 2016-02-12 | 2023-10-24 | 삼성전자주식회사 | 센싱 모듈 기판 및 이를 포함하는 센싱 모듈 |
US9914066B2 (en) | 2016-03-07 | 2018-03-13 | Microsoft Technology Licensing, Llc | Electromagnetically coupled building blocks |
US9773153B1 (en) * | 2016-03-24 | 2017-09-26 | Fingerprint Cards Ab | Fingerprint sensor module |
SE539668C2 (en) * | 2016-06-01 | 2017-10-24 | Fingerprint Cards Ab | Fingerprint sensing device and method for manufacturing a fingerprint sensing device |
US10426672B2 (en) * | 2016-08-26 | 2019-10-01 | Vener8 Technologies | Moisture detection and notification system |
CN107844732A (zh) * | 2016-09-18 | 2018-03-27 | 敦泰电子有限公司 | 一种指纹感测器、指纹感测模组和电子设备 |
US10274449B2 (en) * | 2016-10-17 | 2019-04-30 | Robert Bosch Gmbh | Capacitive moisture sensor system for a surveillance camera |
US10102412B2 (en) | 2016-11-17 | 2018-10-16 | Fingerprint Cards Ab | Fingerprint sensing with different capacitive configurations |
US9922231B1 (en) * | 2016-11-17 | 2018-03-20 | Fingerprint Cards Ab | Fingerprint sensing with voltage pattern configurations |
CN110023746B (zh) * | 2016-12-02 | 2022-11-18 | 索尼半导体解决方案公司 | 半导体装置和电位测量装置 |
US11023702B2 (en) | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
US11610429B2 (en) | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
US10395164B2 (en) * | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
AU2018217185B2 (en) | 2017-02-03 | 2020-10-15 | Bbi Medical Innovations, Llc | Measurement of tissue viability |
WO2018144946A1 (en) | 2017-02-03 | 2018-08-09 | Bruin Biometrics, Llc | Measurement of susceptibility to diabetic foot ulcers |
CN109890273B (zh) | 2017-02-03 | 2022-10-11 | 布鲁恩生物有限责任公司 | 水肿的测量 |
KR101989457B1 (ko) * | 2017-02-28 | 2019-06-14 | 동우 화인켐 주식회사 | 고성능 터치 센서 및 그 제조방법 |
US10282651B2 (en) | 2017-03-23 | 2019-05-07 | Idex Asa | Sensor array system selectively configurable as a fingerprint sensor or data entry device |
US11250307B2 (en) | 2017-03-23 | 2022-02-15 | Idex Biometrics Asa | Secure, remote biometric enrollment |
TWI634527B (zh) * | 2017-05-23 | 2018-09-01 | 財團法人工業技術研究院 | 感測系統 |
FR3069081B1 (fr) | 2017-07-17 | 2021-08-20 | Safran Identity & Security | Carte electronique comprenant un capteur d'empreinte et procede de fabrication d'une telle carte |
TWI633480B (zh) * | 2017-08-07 | 2018-08-21 | 致伸科技股份有限公司 | 指紋辨識觸控屏 |
DE112018005258T5 (de) | 2017-09-19 | 2020-10-22 | Idex Biometrics Asa | Doppelseitiges Sensormodul, das zur Integration in elektronische Geräte geeignet ist |
TWI626599B (zh) * | 2017-09-26 | 2018-06-11 | 速博思股份有限公司 | 小曲率半徑指紋偵測器結構 |
WO2019099810A1 (en) | 2017-11-16 | 2019-05-23 | Bruin Biometrics, Llc | Strategic treatment of pressure ulcer using sub-epidermal moisture values |
WO2019116233A1 (en) | 2017-12-12 | 2019-06-20 | Idex Asa | Power source for biometric enrollment with status indicators |
GB2573267B (en) | 2018-03-12 | 2023-02-15 | Idex Biometrics Asa | Power management |
GB2584226B (en) | 2018-02-09 | 2022-06-22 | Bruin Biometrics Llc | Detection of tissue damage |
WO2019235989A1 (en) * | 2018-06-07 | 2019-12-12 | Fingerprint Cards Ab | Smartcard comprising a fingerprint sensor and method for manufacturing the smartcard |
DE102018118765A1 (de) * | 2018-08-02 | 2020-02-06 | Endress+Hauser SE+Co. KG | Hochfrequenzbaustein |
FI128364B (en) * | 2018-09-28 | 2020-04-15 | Forciot Oy | Sensor with connection to an extensible wiring harness |
KR20210070365A (ko) | 2018-10-11 | 2021-06-14 | 브루인 바이오메트릭스, 엘엘씨 | 일회용 요소를 가진 디바이스 |
CN110298333B (zh) * | 2019-07-05 | 2021-08-31 | 京东方科技集团股份有限公司 | 一种指纹识别单元及设备、指纹识别方法 |
US11347993B2 (en) | 2019-08-12 | 2022-05-31 | Federal Card Services, LLC | Dual interface metal cards and methods of manufacturing |
US11113593B2 (en) | 2019-08-15 | 2021-09-07 | Federal Card Services; LLC | Contactless metal cards with fingerprint sensor and display |
US20210049431A1 (en) | 2019-08-14 | 2021-02-18 | Federal Card Services, LLC | Metal-containing dual interface smartcards |
DE102019128464A1 (de) | 2019-10-22 | 2021-04-22 | Infineon Technologies Ag | Sensoreinrichtung, Verfahren zum Bilden einer Sensoreinrichtung, Chipkarte und Verfahren zum Bilden einer Chipkarte |
US11341385B2 (en) | 2019-11-16 | 2022-05-24 | Federal Card Services, LLC | RFID enabled metal transaction card with shaped opening and shaped slit |
US11187721B2 (en) * | 2020-02-03 | 2021-11-30 | Sunasic Technologies, Inc. | Contactor for testing electronic device |
FR3111215B1 (fr) * | 2020-06-04 | 2022-08-12 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
US11642075B2 (en) | 2021-02-03 | 2023-05-09 | Bruin Biometrics, Llc | Methods of treating deep and early-stage pressure induced tissue damage |
TWI778719B (zh) * | 2021-07-22 | 2022-09-21 | 王士華 | 指紋感測器及其製造方法 |
CN113642458B (zh) * | 2021-08-12 | 2023-07-07 | 业成科技(成都)有限公司 | 指纹识别感测器 |
TWI767835B (zh) * | 2021-09-07 | 2022-06-11 | 恆勁科技股份有限公司 | 智慧卡指紋辨識模組封裝結構及其製造方法 |
WO2023131609A1 (en) | 2022-01-04 | 2023-07-13 | Idex Biometrics Asa | Antenna extender |
EP4318415A1 (en) * | 2022-08-03 | 2024-02-07 | IDSpire Corporation Ltd. | Fingerprint recognition module |
Family Cites Families (141)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4353056A (en) | 1980-06-05 | 1982-10-05 | Siemens Corporation | Capacitive fingerprint sensor |
SE425704B (sv) | 1981-03-18 | 1982-10-25 | Loefberg Bo | Databerare |
JPH0652206B2 (ja) | 1986-03-28 | 1994-07-06 | 工業技術院長 | 静電容量型圧力分布測定装置 |
US5399898A (en) | 1992-07-17 | 1995-03-21 | Lsi Logic Corporation | Multi-chip semiconductor arrangements using flip chip dies |
US5108819A (en) | 1990-02-14 | 1992-04-28 | Eli Lilly And Company | Thin film electrical component |
DE4125270A1 (de) | 1991-07-31 | 1993-02-04 | Bayer Ag | Chinolin-2-yl-methoxybenzylhydroxyharnstoffe |
US5861875A (en) | 1992-07-13 | 1999-01-19 | Cirque Corporation | Methods and apparatus for data input |
US5559504A (en) * | 1993-01-08 | 1996-09-24 | Kabushiki Kaisha Toshiba | Surface shape sensor, identification device using this sensor, and protected system using this device |
US5371404A (en) | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
DE4310390C2 (de) | 1993-03-30 | 1995-03-16 | Topping Best Ltd | Ultraschallabbildungsvorrichtung zur Erfassung und/oder Identifikation von Oberflächenstrukturen und oberflächennahen Strukturen |
GB9308665D0 (en) | 1993-04-27 | 1993-06-09 | Ross William L | Sensor |
FR2716281B1 (fr) | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5509083A (en) | 1994-06-15 | 1996-04-16 | Nooral S. Abtahi | Method and apparatus for confirming the identity of an individual presenting an identification card |
CN1106627C (zh) | 1995-08-01 | 2003-04-23 | 奥地利塑料卡及证件系统股份有限公司 | 带有一个拥有一个构件的模块的和带有一个线圈的数据载体和用于制造这种数据载体的方法 |
FR2739977B1 (fr) | 1995-10-17 | 1998-01-23 | France Telecom | Capteur monolithique d'empreintes digitales |
US6016355A (en) | 1995-12-15 | 2000-01-18 | Veridicom, Inc. | Capacitive fingerprint acquisition sensor |
US5963679A (en) | 1996-01-26 | 1999-10-05 | Harris Corporation | Electric field fingerprint sensor apparatus and related methods |
US5956415A (en) | 1996-01-26 | 1999-09-21 | Harris Corporation | Enhanced security fingerprint sensor package and related methods |
FR2746201A1 (fr) | 1996-03-13 | 1997-09-19 | Seagate Technology | Carte de credit destinee a etre utilisee dans un systeme faisant appel a des empreintes digitales pour assurer la protection contre une manoeuvre frauduleuse, et procede d'utilisation de cette carte |
FR2749955B1 (fr) * | 1996-06-14 | 1998-09-11 | Thomson Csf | Systeme de lecture d'empreintes digitales |
JP3434415B2 (ja) | 1996-07-05 | 2003-08-11 | アルプス電気株式会社 | 座標入力装置 |
US6020749A (en) | 1996-11-12 | 2000-02-01 | Hewlett-Packard Company | Method and apparatus for performing testing of double-sided ball grid array devices |
DE19710144C2 (de) | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
US5953441A (en) | 1997-05-16 | 1999-09-14 | Harris Corporation | Fingerprint sensor having spoof reduction features and related methods |
US5920640A (en) | 1997-05-16 | 1999-07-06 | Harris Corporation | Fingerprint sensor and token reader and associated methods |
NO304766B1 (no) | 1997-06-16 | 1999-02-08 | Sintef | Fingeravtrykksensor |
JP2959532B2 (ja) | 1997-06-30 | 1999-10-06 | 日本電気株式会社 | 静電容量検出方式の指紋画像入力装置 |
US6071597A (en) | 1997-08-28 | 2000-06-06 | 3M Innovative Properties Company | Flexible circuits and carriers and process for manufacture |
US6483931B2 (en) | 1997-09-11 | 2002-11-19 | Stmicroelectronics, Inc. | Electrostatic discharge protection of a capacitve type fingerprint sensing array |
JP3102395B2 (ja) * | 1997-11-27 | 2000-10-23 | 日本電気株式会社 | 指紋検出装置 |
US7663607B2 (en) | 2004-05-06 | 2010-02-16 | Apple Inc. | Multipoint touchscreen |
DE19803020C2 (de) | 1998-01-27 | 1999-12-02 | Siemens Ag | Chipkartenmodul für biometrische Sensoren |
FR2774617B1 (fr) | 1998-02-06 | 2000-05-05 | St Microelectronics Sa | Procede et machine d'usinage d'une cavite dans une carte a puce electronique renfermant une antenne |
NO307065B1 (no) | 1998-02-26 | 2000-01-31 | Idex As | Fingeravtrykksensor |
EP0941696A1 (de) | 1998-03-03 | 1999-09-15 | Siemens Aktiengesellschaft | Fingertippsensor mit integriertem Tastschalter |
US6026564A (en) | 1998-04-10 | 2000-02-22 | Ang Technologies Inc. | Method of making a high density multilayer wiring board |
DE19831565C1 (de) | 1998-07-14 | 1999-10-28 | Muehlbauer Ag | Verfahren zum Freilegen von Antennenanschlußflächen einer Chipkarte |
JP2002523789A (ja) | 1998-08-31 | 2002-07-30 | シーメンス アクチエンゲゼルシヤフト | 金属の微細構造の製造方法および指紋を検出するためのセンサー装置の製造における該方法の適用 |
DE19842835A1 (de) | 1998-09-18 | 2000-04-20 | Weidmueller Interface | Funktionsmodul |
US6346739B1 (en) | 1998-12-30 | 2002-02-12 | Stmicroelectronics, Inc. | Static charge dissipation pads for sensors |
JP2000262494A (ja) * | 1999-03-19 | 2000-09-26 | Toshiba Corp | 指形状照合用半導体装置 |
DE19921231A1 (de) | 1999-05-07 | 2000-11-09 | Giesecke & Devrient Gmbh | Fingerabdrucksensor für Chipkarte |
US6628812B1 (en) | 1999-05-11 | 2003-09-30 | Authentec, Inc. | Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods |
US6683971B1 (en) | 1999-05-11 | 2004-01-27 | Authentec, Inc. | Fingerprint sensor with leadframe bent pin conductive path and associated methods |
EP1059602B1 (en) | 1999-06-10 | 2006-12-13 | Nippon Telegraph and Telephone Corporation | Surface shape recognition apparatus |
US6423995B1 (en) | 1999-07-26 | 2002-07-23 | Stmicroelectronics, Inc. | Scratch protection for direct contact sensors |
US6459424B1 (en) | 1999-08-10 | 2002-10-01 | Hewlett-Packard Company | Touch-sensitive input screen having regional sensitivity and resolution properties |
DE19939347C1 (de) | 1999-08-19 | 2001-02-15 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
JP4253826B2 (ja) | 1999-09-07 | 2009-04-15 | カシオ計算機株式会社 | 画像読取装置 |
US7030860B1 (en) | 1999-10-08 | 2006-04-18 | Synaptics Incorporated | Flexible transparent touch sensing system for electronic devices |
KR200184982Y1 (ko) | 1999-11-08 | 2000-06-15 | 삼성전자주식회사 | 지문인식기능을 가지는 디스플레이장치 |
US6325285B1 (en) | 1999-11-12 | 2001-12-04 | At&T Corp. | Smart card with integrated fingerprint reader |
US6512381B2 (en) | 1999-12-30 | 2003-01-28 | Stmicroelectronics, Inc. | Enhanced fingerprint detection |
JP3713418B2 (ja) | 2000-05-30 | 2005-11-09 | 光正 小柳 | 3次元画像処理装置の製造方法 |
NO315016B1 (no) * | 2000-06-09 | 2003-06-23 | Idex Asa | Miniatyrisert sensor |
NO315017B1 (no) | 2000-06-09 | 2003-06-23 | Idex Asa | Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate |
US7184581B2 (en) | 2000-06-09 | 2007-02-27 | Idex Asa | System for real time finger surface pattern measurement |
NO20003006L (no) | 2000-06-09 | 2001-12-10 | Idex Asa | Mus |
NO316482B1 (no) | 2000-06-09 | 2004-01-26 | Idex Asa | Navigasjonsverktöy for kobling til en skjerminnretning |
GB2371264A (en) | 2001-01-18 | 2002-07-24 | Pioneer Oriental Engineering L | Smart card with embedded antenna |
JP4087125B2 (ja) | 2001-03-07 | 2008-05-21 | シャープ株式会社 | 凹凸パターン検出素子 |
US6525547B2 (en) | 2001-04-17 | 2003-02-25 | Sentronics Corporation | Capacitive two dimensional sensor |
US6515488B1 (en) | 2001-05-07 | 2003-02-04 | Stmicroelectronics, Inc. | Fingerprint detector with scratch resistant surface and embedded ESD protection grid |
JP4765226B2 (ja) * | 2001-08-20 | 2011-09-07 | ソニー株式会社 | 指紋検出装置及びその製造方法 |
JP2003058872A (ja) | 2001-08-21 | 2003-02-28 | Sony Corp | 指紋検出装置、その製造方法及び成膜装置 |
US8266451B2 (en) | 2001-08-31 | 2012-09-11 | Gemalto Sa | Voice activated smart card |
US6939735B2 (en) * | 2001-09-13 | 2005-09-06 | Tessera Inc. | Microelectronic assembly formation with releasable leads |
US6693441B2 (en) | 2001-11-30 | 2004-02-17 | Stmicroelectronics, Inc. | Capacitive fingerprint sensor with protective coating containing a conductive suspension |
NO316776B1 (no) | 2001-12-07 | 2004-05-03 | Idex Asa | Pakkelosning for fingeravtrykksensor |
EP1481358B1 (en) | 2001-12-07 | 2006-08-16 | Idex ASA | Sensor for measurement on wet and dry fingers |
US20050100938A1 (en) | 2002-03-14 | 2005-05-12 | Infineon Technologies Ag | Vertical impedance sensor arrangement and method for producing a vertical impedance sensor arrangement |
JP2003288573A (ja) | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | Icカード及びその製造方法 |
EP1351288B1 (en) | 2002-04-05 | 2015-10-28 | STMicroelectronics Srl | Process for manufacturing an insulated interconnection through a body of semiconductor material and corresponding semiconductor device |
DE10221214A1 (de) | 2002-05-13 | 2003-11-27 | Orga Kartensysteme Gmbh | Chipmodul |
US7076089B2 (en) * | 2002-05-17 | 2006-07-11 | Authentec, Inc. | Fingerprint sensor having enhanced ESD protection and associated methods |
EP1516175B1 (de) | 2002-06-24 | 2006-11-02 | Siemens Aktiengesellschaft | Biosensor-array und verfahren zum betreiben eines biosensor-arrays |
US7543156B2 (en) | 2002-06-25 | 2009-06-02 | Resilent, Llc | Transaction authentication card |
JP3971674B2 (ja) | 2002-07-10 | 2007-09-05 | 富士通株式会社 | 接触型センサ内蔵半導体装置及びその製造方法 |
CZ2005209A3 (cs) | 2002-09-10 | 2005-12-14 | Ivi Smart Technologies, Inc. | Bezpečné biometrické ověření identity |
DE10248394A1 (de) | 2002-10-17 | 2004-05-13 | Giesecke & Devrient Gmbh | Tragbarer elektronischer Datenträger |
NO20025803D0 (no) | 2002-12-03 | 2002-12-03 | Idex Asa | Levende finger |
DE10257111B4 (de) | 2002-12-05 | 2005-12-22 | Mühlbauer Ag | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
FI20030102A0 (fi) | 2003-01-22 | 2003-01-22 | Nokia Corp | Henkilön varmennusjärjestely |
FI115109B (fi) * | 2003-01-22 | 2005-02-28 | Nokia Corp | Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin |
SE526366C3 (sv) | 2003-03-21 | 2005-10-26 | Silex Microsystems Ab | Elektriska anslutningar i substrat |
JP3775601B2 (ja) | 2003-04-17 | 2006-05-17 | セイコーエプソン株式会社 | 静電容量検出装置及びその駆動方法、指紋センサ並びにバイオメトリクス認証装置 |
KR20030043840A (ko) | 2003-04-25 | 2003-06-02 | (주)실리콘이미지웍스 | 지문인식센서를 구비한 휴대 통신단말기 |
JP3858864B2 (ja) | 2003-08-29 | 2006-12-20 | セイコーエプソン株式会社 | 静電容量検出装置 |
US7028893B2 (en) | 2003-12-17 | 2006-04-18 | Motorola, Inc. | Fingerprint based smartcard |
KR100564915B1 (ko) | 2004-02-10 | 2006-03-30 | 한국과학기술원 | 정전용량방식 지문센서 및 이를 이용한 지문 센싱방법 |
US7751601B2 (en) * | 2004-10-04 | 2010-07-06 | Validity Sensors, Inc. | Fingerprint sensing assemblies and methods of making |
EP1766547B1 (en) * | 2004-06-18 | 2008-11-19 | Fingerprint Cards AB | Fingerprint sensor element |
JP4443334B2 (ja) | 2004-07-16 | 2010-03-31 | Towa株式会社 | 半導体素子の樹脂封止成形方法 |
WO2006071798A1 (en) | 2004-12-23 | 2006-07-06 | Touchsensor Technologies, Llc | Track position sensor and method |
JP2006184104A (ja) | 2004-12-27 | 2006-07-13 | Alps Electric Co Ltd | 容量センサ |
JP4731191B2 (ja) * | 2005-03-28 | 2011-07-20 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
CN100374991C (zh) | 2005-03-31 | 2008-03-12 | 联想(北京)有限公司 | 一种便携式键盘及其指纹特征信息提取方法 |
DE102005020092A1 (de) | 2005-04-29 | 2006-11-16 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines tragbaren Datenträgers |
JP2007010338A (ja) | 2005-06-28 | 2007-01-18 | Alps Electric Co Ltd | 面圧分布センサ |
CN1889103A (zh) | 2005-06-29 | 2007-01-03 | 上海雷硕医疗器械有限公司 | 一种电子病历保密智能卡 |
EP1913528B1 (en) | 2005-07-01 | 2013-06-05 | Fabrizio Borracci | Universal smart card |
JP2007018168A (ja) | 2005-07-06 | 2007-01-25 | Murata Mach Ltd | 生体認証装置及び画像処理装置 |
RU2008110177A (ru) * | 2005-08-18 | 2009-09-27 | АйВиАй СМАРТ ТЕКНОЛОДЖИЗ, ИНК. (US) | Система и способ биометрической аутентификации |
EP1775674A1 (en) | 2005-10-11 | 2007-04-18 | Aimgene Technology Co., Ltd. | Press-trigger fingerprint sensor module |
US7868874B2 (en) | 2005-11-15 | 2011-01-11 | Synaptics Incorporated | Methods and systems for detecting a position-based attribute of an object using digital codes |
ATE511703T1 (de) | 2006-02-01 | 2011-06-15 | Silex Microsystems Ab | Herstellungsverfahren für durchkontakte |
CN101410877B (zh) | 2006-03-27 | 2012-05-23 | 法布里兹奥·博拉希 | 一种制作安全个人卡及其工作程序的方法 |
CA2659388A1 (en) * | 2006-08-01 | 2008-02-07 | Micro-D Ltd. | Method of making smart cards, smart cards made according to the method, and an lcd particularly for use in such smart cards |
KR101270379B1 (ko) | 2006-10-18 | 2013-06-05 | 삼성전자주식회사 | 잠금 장치를 구비한 휴대용 단말기의 기능실행 방법 |
JP2008134836A (ja) | 2006-11-28 | 2008-06-12 | Wacom Co Ltd | タッチパネル装置 |
US20080185193A1 (en) | 2007-01-30 | 2008-08-07 | Jao-Ching Lin | Touch pad structure |
DE102007016779B4 (de) | 2007-04-04 | 2015-03-19 | Bundesdruckerei Gmbh | Verfahren zur Herstellung von Kavitäten in Sicherheitsdokumenten, insbesondere Chipkarten |
US8860683B2 (en) | 2007-04-05 | 2014-10-14 | Cypress Semiconductor Corporation | Integrated button activation sensing and proximity sensing |
EP2158607A1 (en) | 2007-06-19 | 2010-03-03 | SiliconFile Technologies Inc. | Pixel array preventing the cross talk between unit pixels and image sensor using the pixel |
TWI341020B (en) * | 2007-08-10 | 2011-04-21 | Egis Technology Inc | Fingerprint sensing chip having a flexible circuit board serving as a signal transmission structure and method of manufacturing the same |
EP2073154A1 (en) | 2007-12-20 | 2009-06-24 | Gemalto SA | Biometric micro-module |
US20090199004A1 (en) | 2008-01-31 | 2009-08-06 | Mark Stanley Krawczewicz | System and method for self-authenticating token |
TW200935320A (en) * | 2008-02-01 | 2009-08-16 | Acer Inc | Method of switching operation modes of fingerprint sensor, electronic apparatus using the method and fingerprint sensor thereof |
JP2009199318A (ja) | 2008-02-21 | 2009-09-03 | Alps Electric Co Ltd | 入力装置 |
US8116540B2 (en) | 2008-04-04 | 2012-02-14 | Validity Sensors, Inc. | Apparatus and method for reducing noise in fingerprint sensing circuits |
CN101383704A (zh) | 2008-04-23 | 2009-03-11 | 鲁东大学 | 基于指纹识别技术的密码模块 |
WO2009140968A1 (en) * | 2008-05-22 | 2009-11-26 | Cardlab Aps | A fingerprint reader and a method of operating it |
TW200949714A (en) * | 2008-05-22 | 2009-12-01 | Moredna Technology Co Ltd | Wireless finger-print reading apparatus by pressing actuation |
US20100117224A1 (en) * | 2008-08-29 | 2010-05-13 | Vertical Circuits, Inc. | Sensor |
NO20083766L (no) * | 2008-09-01 | 2010-03-02 | Idex Asa | Overflatesensor |
TW201036124A (en) * | 2009-03-20 | 2010-10-01 | Advanced Semiconductor Eng | Package structure and manufacturing method thereof |
HK1138478A2 (en) * | 2009-06-18 | 2010-08-20 | Shining Union Ltd | A password input device |
US9400911B2 (en) | 2009-10-30 | 2016-07-26 | Synaptics Incorporated | Fingerprint sensor and integratable electronic display |
US9274553B2 (en) | 2009-10-30 | 2016-03-01 | Synaptics Incorporated | Fingerprint sensor and integratable electronic display |
US9336428B2 (en) | 2009-10-30 | 2016-05-10 | Synaptics Incorporated | Integrated fingerprint sensor and display |
SI2341471T1 (sl) | 2009-12-28 | 2013-06-28 | Nagraid S.A. | Postopek za izdelavo elektronskih kartic |
NO20093601A1 (no) | 2009-12-29 | 2011-06-30 | Idex Asa | Overflatesensor |
EP2397972B1 (en) | 2010-06-08 | 2015-01-07 | Vodafone Holding GmbH | Smart card with microphone |
JP5700511B2 (ja) | 2010-10-07 | 2015-04-15 | 埼玉日本電気株式会社 | 携帯端末、認証方法、及びプログラム |
US20120090757A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Fabrication of touch, handwriting and fingerprint sensor |
JP2012227328A (ja) | 2011-04-19 | 2012-11-15 | Sony Corp | 半導体装置、半導体装置の製造方法、固体撮像装置及び電子機器 |
US9153490B2 (en) | 2011-07-19 | 2015-10-06 | Sony Corporation | Solid-state imaging device, manufacturing method of solid-state imaging device, manufacturing method of semiconductor device, semiconductor device, and electronic device |
US9152838B2 (en) | 2012-03-29 | 2015-10-06 | Synaptics Incorporated | Fingerprint sensor packagings and methods |
US9030440B2 (en) | 2012-05-18 | 2015-05-12 | Apple Inc. | Capacitive sensor packaging |
NO20131423A1 (no) | 2013-02-22 | 2014-08-25 | Idex Asa | Integrert fingeravtrykksensor |
NO340311B1 (no) | 2013-02-22 | 2017-03-27 | Idex Asa | Integrert fingeravtrykksensor |
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US9122901B2 (en) | 2015-09-01 |
EP2975554A3 (en) | 2016-03-23 |
US20160104024A1 (en) | 2016-04-14 |
US20190251322A1 (en) | 2019-08-15 |
US20150136860A1 (en) | 2015-05-21 |
EP2519913A1 (en) | 2012-11-07 |
TWI511052B (zh) | 2015-12-01 |
TW201140467A (en) | 2011-11-16 |
US10762322B2 (en) | 2020-09-01 |
EP2975554A2 (en) | 2016-01-20 |
NO20093601A1 (no) | 2011-06-30 |
WO2011080262A1 (en) | 2011-07-07 |
JP2013516012A (ja) | 2013-05-09 |
US20130194071A1 (en) | 2013-08-01 |
US9396379B2 (en) | 2016-07-19 |
CN102782700A (zh) | 2012-11-14 |
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