AR108765A1 - Dispositivo de sensor de huellas digitales y métodos del mismo - Google Patents
Dispositivo de sensor de huellas digitales y métodos del mismoInfo
- Publication number
- AR108765A1 AR108765A1 ARP170101537A ARP170101537A AR108765A1 AR 108765 A1 AR108765 A1 AR 108765A1 AR P170101537 A ARP170101537 A AR P170101537A AR P170101537 A ARP170101537 A AR P170101537A AR 108765 A1 AR108765 A1 AR 108765A1
- Authority
- AR
- Argentina
- Prior art keywords
- sensor device
- sensor
- sensor substrate
- same methods
- transceiver
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Theoretical Computer Science (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662351228P | 2016-06-16 | 2016-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR108765A1 true AR108765A1 (es) | 2018-09-26 |
Family
ID=60659611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ARP170101537A AR108765A1 (es) | 2016-06-16 | 2017-06-05 | Dispositivo de sensor de huellas digitales y métodos del mismo |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11003884B2 (enExample) |
| EP (1) | EP3472751A1 (enExample) |
| JP (1) | JP7050698B2 (enExample) |
| KR (1) | KR102459255B1 (enExample) |
| CN (1) | CN109313702B (enExample) |
| AR (1) | AR108765A1 (enExample) |
| CA (1) | CA3024317A1 (enExample) |
| TW (1) | TWI752962B (enExample) |
| WO (1) | WO2017218228A1 (enExample) |
Families Citing this family (90)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140355387A1 (en) | 2013-06-03 | 2014-12-04 | Qualcomm Incorporated | Ultrasonic receiver with coated piezoelectric layer |
| US10036734B2 (en) | 2013-06-03 | 2018-07-31 | Snaptrack, Inc. | Ultrasonic sensor with bonded piezoelectric layer |
| TWI832717B (zh) * | 2014-04-25 | 2024-02-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置及電子裝置 |
| CN105789065B (zh) | 2016-04-08 | 2019-02-12 | Oppo广东移动通信有限公司 | 一种芯片封装结构、终端设备及方法 |
| KR20180013321A (ko) * | 2016-07-29 | 2018-02-07 | 삼성전자주식회사 | 디스플레이 장치 및 그 제어방법 |
| US10346663B2 (en) * | 2016-09-05 | 2019-07-09 | Nanchang O-Film Bio-Identification Technology Co., Ltd | Fingerprint sensor and fingerprint identification module comprising the same |
| US10387706B2 (en) * | 2016-09-05 | 2019-08-20 | Nanchang O-Film Bio-Identification Technology Co., Ltd. | Ultrasonic transducer of ultrasonic fingerprint sensor and manufacturing method thereof |
| CN108346587A (zh) * | 2017-01-25 | 2018-07-31 | 新加坡有限公司 | 芯片封装器件及封装方法 |
| TWI644601B (zh) * | 2017-03-03 | 2018-12-11 | 致伸科技股份有限公司 | 指紋辨識模組的治具及指紋辨識模組的製造方法 |
| CN107292226A (zh) * | 2017-04-24 | 2017-10-24 | 麦克思商务咨询(深圳)有限公司 | 指纹识别装置及电子装置 |
| US10489627B2 (en) * | 2017-04-28 | 2019-11-26 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic biometric touch scanner |
| US10846501B2 (en) | 2017-04-28 | 2020-11-24 | The Board Of Trustees Of The Leland Stanford Junior University | Acoustic biometric touch scanner |
| US10404306B2 (en) * | 2017-05-30 | 2019-09-03 | International Business Machines Corporation | Paint on micro chip touch screens |
| KR20200012973A (ko) * | 2017-06-02 | 2020-02-05 | 넥스트 바이오메트릭스 그룹 에이에스에이 | 라이브니스 검출을 구비한 지문 센서 |
| WO2018227435A1 (zh) * | 2017-06-14 | 2018-12-20 | 华为技术有限公司 | 一种显示模组及移动终端 |
| US20180373913A1 (en) * | 2017-06-26 | 2018-12-27 | Qualcomm Incorporated | Ultrasonic fingerprint sensor for under-display applications |
| TWI614695B (zh) * | 2017-07-03 | 2018-02-11 | 敦泰電子有限公司 | 具指紋辨識之高屏佔比顯示裝置 |
| US10461124B2 (en) | 2017-08-07 | 2019-10-29 | Invensense, Inc. | Ultrasonic sensing device |
| JP2019066319A (ja) * | 2017-09-29 | 2019-04-25 | 株式会社ジャパンディスプレイ | 検出装置及び電子機器 |
| CN107656656B (zh) * | 2017-10-24 | 2021-05-18 | 业成科技(成都)有限公司 | 声波式触控装置及其触控判断方法 |
| KR102524554B1 (ko) * | 2017-12-28 | 2023-04-20 | 엘지디스플레이 주식회사 | 지문 인식이 가능한 표시 장치 |
| KR102540010B1 (ko) * | 2017-12-29 | 2023-06-02 | 엘지디스플레이 주식회사 | 지문 인식이 가능한 표시 장치 |
| KR102395435B1 (ko) * | 2018-01-22 | 2022-05-09 | 엘지이노텍 주식회사 | 지문 인식 장치 및 이를 포함하는 전자 디바이스 |
| EP3746741A4 (en) | 2018-02-02 | 2021-11-10 | Cornell University | ACOUSTIC DETECTION SYSTEMS, DEVICES AND METHODS |
| US11031358B2 (en) * | 2018-03-01 | 2021-06-08 | Marvell Asia Pte, Ltd. | Overhang model for reducing passivation stress and method for producing the same |
| CN108502841A (zh) * | 2018-05-04 | 2018-09-07 | 李扬渊 | 一种能够实现超声波传感的电子设备及其制造方法 |
| CN108423632A (zh) * | 2018-05-04 | 2018-08-21 | 李扬渊 | 一种能够实现超声波传感的电子设备及其制造方法 |
| US20190354238A1 (en) * | 2018-05-21 | 2019-11-21 | UltraSense Systems, Inc. | Ultrasonic touch detection and decision |
| CN108955736B (zh) * | 2018-05-30 | 2020-03-06 | 京东方科技集团股份有限公司 | 一种超声波传感器及其制作方法、显示装置 |
| CN108924277A (zh) * | 2018-05-31 | 2018-11-30 | 业成科技(成都)有限公司 | 面板结构 |
| CN108830214A (zh) * | 2018-06-14 | 2018-11-16 | 业成科技(成都)有限公司 | 指纹辨识装置及其制造方法 |
| KR102471819B1 (ko) | 2018-06-21 | 2022-11-29 | 삼성전자 주식회사 | 압전 소자를 이용하여, 압력 감지 및 초음파 신호를 송수신하는 센서 모듈을 포함하는 전자 장치 |
| WO2020188313A2 (en) * | 2018-07-10 | 2020-09-24 | Next Biometrics Group Asa | Thermally conductive and protective coating for electronic device |
| CN109240550B (zh) * | 2018-08-10 | 2022-04-15 | 业泓科技(成都)有限公司 | 触控显示模组以及应用该触控显示模组的电子装置 |
| CN109144319B (zh) * | 2018-08-22 | 2022-04-08 | 京东方科技集团股份有限公司 | 传感结构、显示设备及传感结构的驱动方法 |
| KR102495667B1 (ko) * | 2018-08-23 | 2023-02-03 | 삼성전자주식회사 | 디스플레이의 아래에 배치된 센서를 포함하는 전자 장치 |
| US11126814B2 (en) * | 2018-10-17 | 2021-09-21 | Qualcomm Incorporated | Ultrasonic fingerprint sensor with flexible substrate |
| KR102708149B1 (ko) * | 2018-11-08 | 2024-09-24 | 엘지이노텍 주식회사 | 터치 센싱 장치 |
| KR102646718B1 (ko) * | 2018-11-16 | 2024-03-14 | 삼성디스플레이 주식회사 | 전자장치 |
| CN111222386B (zh) * | 2018-11-27 | 2023-11-10 | 上海耕岩智能科技有限公司 | 指纹采集方法及装置 |
| KR102630772B1 (ko) * | 2018-11-30 | 2024-01-30 | 엘지디스플레이 주식회사 | 초음파 센서 및 디스플레이 장치 |
| CN109597081A (zh) * | 2018-11-30 | 2019-04-09 | 李扬渊 | 一种传感器装置 |
| CN111403591B (zh) * | 2018-12-14 | 2023-04-07 | 茂丞(郑州)超声科技有限公司 | 晶圆级超声波芯片组件及其制造方法 |
| US10833292B2 (en) * | 2018-12-20 | 2020-11-10 | Wuhan China Star Optoelectronics Technology Co., Ltd. | Organic light-emitting diode display panel |
| CN111403431B (zh) * | 2019-01-02 | 2023-09-05 | 京东方科技集团股份有限公司 | 柔性体及控制其发生形变的方法 |
| CN109522885B (zh) * | 2019-01-08 | 2024-06-14 | 深圳市台技光电有限公司 | 适用于超声波指纹识别功能的钢化玻璃保护膜及制备方法 |
| KR102629414B1 (ko) * | 2019-01-17 | 2024-01-26 | 삼성전자주식회사 | 드래그 입력에 기반하여 지문을 인식하기 위한 전자 장치 및 방법 |
| US10929636B2 (en) * | 2019-01-18 | 2021-02-23 | Qualcomm Incorporated | Ultrasonic fingerprint sensor with electrically nonconductive acoustic layer |
| CN109817679B (zh) * | 2019-01-31 | 2020-10-16 | 武汉华星光电半导体显示技术有限公司 | Oled显示屏模组 |
| KR102548486B1 (ko) | 2019-02-13 | 2023-06-28 | 삼성전자주식회사 | 디스플레이 및 이를 포함하는 전자 장치 |
| US10891458B2 (en) * | 2019-02-28 | 2021-01-12 | Qualcomm Incorporated | Module architecture for large area ultrasonic fingerprint sensor |
| US11079518B1 (en) * | 2019-02-28 | 2021-08-03 | Facebook Technologies, Llc | Transparent tunable optical elements with structurally-modified electroactive polymer |
| KR20200109437A (ko) | 2019-03-12 | 2020-09-23 | 삼성디스플레이 주식회사 | 전자 패널 및 이를 포함하는 전자 장치 |
| US10943150B2 (en) | 2019-04-12 | 2021-03-09 | Datalogic Ip Tech S.R.L. | Smart trigger |
| CN111709405A (zh) * | 2019-11-12 | 2020-09-25 | 神盾股份有限公司 | 指纹识别装置及其指纹识别方法 |
| CN112906442B (zh) * | 2019-12-04 | 2024-04-30 | 茂丞(郑州)超声科技有限公司 | 晶圆级超声波装置及其制造方法 |
| JP7367932B2 (ja) * | 2020-01-23 | 2023-10-24 | 大日本印刷株式会社 | センサモジュール |
| KR102892296B1 (ko) | 2020-02-04 | 2025-11-26 | 삼성전자주식회사 | 지문 인식 겸용 터치 센서 및 이를 포함하는 디스플레이 장치 |
| US11228846B2 (en) | 2020-02-14 | 2022-01-18 | Apple Inc. | Sensor assembly for electronic device |
| KR20210158459A (ko) * | 2020-06-23 | 2021-12-31 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN111682045B (zh) * | 2020-06-23 | 2022-06-21 | 京东方科技集团股份有限公司 | 超声波指纹识别传感器及其制作方法、显示模组 |
| US11393239B2 (en) * | 2020-07-01 | 2022-07-19 | Qualcomm Incorporated | Multiple-frequency ultrasonic sensor system |
| WO2022011606A1 (zh) * | 2020-07-15 | 2022-01-20 | 深圳市汇顶科技股份有限公司 | 超声换能器与电子设备 |
| KR102848872B1 (ko) * | 2020-07-27 | 2025-08-22 | 삼성디스플레이 주식회사 | 표시 패널 |
| KR102860672B1 (ko) | 2020-07-30 | 2025-09-17 | 삼성디스플레이 주식회사 | 전자장치 |
| CN111914776B (zh) * | 2020-08-07 | 2023-12-22 | 业泓科技(成都)有限公司 | 显示装置 |
| DE102020121855A1 (de) * | 2020-08-20 | 2022-02-24 | Infineon Technologies Ag | Hochfrequenz-Vorrichtungen und zugehörige Herstellungsverfahren |
| US11823968B2 (en) * | 2020-08-27 | 2023-11-21 | Nxp Usa, Inc. | Semiconductor device package having stress isolation and method therefor |
| CN112183396B (zh) | 2020-09-30 | 2024-03-08 | 京东方科技集团股份有限公司 | 显示组件和显示装置 |
| US12205857B2 (en) * | 2020-10-07 | 2025-01-21 | Murata Manufacturing Co., Ltd. | Electronic component with metallic cap |
| CN112216732B (zh) * | 2020-10-13 | 2024-04-23 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
| CN115273156B (zh) * | 2021-04-29 | 2025-07-08 | 上海思立微电子科技有限公司 | 超声波指纹识别装置以及超声波指纹识别芯片 |
| US12066338B2 (en) * | 2021-05-11 | 2024-08-20 | UltraSense Systems, Inc. | Force-measuring device assembly for a portable electronic apparatus, a portable electronic apparatus, and a method of modifying a span of a sense region in a force-measuring device assembly |
| US11519801B1 (en) * | 2021-06-04 | 2022-12-06 | Synaptics Incorporated | Sensor device for transcapacitive sensing with shielding |
| US11816919B2 (en) | 2021-06-04 | 2023-11-14 | Synaptics Incorporated | Sensor device for transcapacitive sensing with shielding |
| US11798307B2 (en) | 2021-08-30 | 2023-10-24 | Qualcomm Incorporated | Under-display ultrasonic fingerprint sensors for foldable displays |
| CN118140119A (zh) * | 2021-09-14 | 2024-06-04 | 苹果公司 | 传感器组件 |
| CN114758367A (zh) * | 2022-04-29 | 2022-07-15 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
| WO2024010506A1 (en) * | 2022-07-05 | 2024-01-11 | Fingerprint Cards Anacatum Ip Ab | Biometric imaging device and method for manufacturing the biometric imaging device |
| WO2024010507A1 (en) * | 2022-07-05 | 2024-01-11 | Fingerprint Cards Anacatum Ip Ab | Biometric imaging device and method for manufacturing the biometric imaging device |
| EP4562761A1 (en) * | 2022-07-26 | 2025-06-04 | CENTITVC - Centro de Nanotecnologia e Materiais Tecnicos, Funcionais e Inteligentes | Natural stone panel with an integrated touch sensing system and manufacturing method thereof |
| KR20240021413A (ko) | 2022-08-10 | 2024-02-19 | 삼성전자주식회사 | 지문 센서 패키지 및 이를 포함하는 스마트 카드 |
| EP4589552A4 (en) * | 2022-09-13 | 2025-10-22 | Huike Singapore Holding Pte Ltd | ULTRASONIC FINGERPRINT DEVICE AND ELECTRONIC DEVICE |
| CN115393910B (zh) * | 2022-09-13 | 2025-02-14 | 汇科(新加坡)控股私人有限公司 | 超声指纹装置和电子设备 |
| WO2024128767A1 (ko) * | 2022-12-13 | 2024-06-20 | 삼성전자 주식회사 | 초음파 센서 모듈을 포함하는 전자 장치 |
| CN116140175B (zh) * | 2023-03-08 | 2025-06-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | 压电微机械超声波换能器及超声探测系统 |
| US12494080B2 (en) * | 2023-04-04 | 2025-12-09 | Qualcomm Incorporated | Devices configured for near-field ultrasonic imaging |
| WO2025019353A1 (en) * | 2023-07-14 | 2025-01-23 | Cellink Corporation | Forming welded and soldered connections to flexible interconnect circuits |
| TWI888883B (zh) * | 2023-08-02 | 2025-07-01 | 大陸商茂丞(鄭州)超聲科技有限公司 | 超聲波感測元件總成及超聲波感測元件 |
| KR20250074970A (ko) * | 2023-11-21 | 2025-05-28 | 삼성전자주식회사 | 지문 센서 패키지 및 이를 포함하는 기기 |
Family Cites Families (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58186981A (ja) | 1982-04-26 | 1983-11-01 | Toray Ind Inc | 入出力変換素子 |
| US5133037A (en) | 1991-06-07 | 1992-07-21 | Hoechst Celanese Corp | Polymeric optical modulator and waveguiding media |
| TW241352B (en) | 1994-03-30 | 1995-02-21 | Whitaker Corp | Reflective mode ultrasonic touch sensitive switch |
| JPH0854425A (ja) | 1994-04-28 | 1996-02-27 | Hoechst Celanese Corp | 電気光学的センサーデバイス |
| DE19833928B4 (de) | 1998-07-28 | 2005-05-25 | Infineon Technologies Ag | Biometrische Sensoreinrichtung mit in einem Flexleiterband integrierten elektronischen Bauelementen |
| KR20010110247A (ko) | 2001-11-05 | 2001-12-12 | 주식회사 이지메딕스 | 이방 전도성 접착 필름을 이용한 초음파 탐촉자 적층구조 |
| EP1607986B1 (en) | 2003-03-26 | 2011-07-27 | Daikin Industries, Limited | Method for forming ferroelectric thin film |
| US20040263483A1 (en) | 2003-06-24 | 2004-12-30 | Aufderheide Brian E | Sensing device |
| CN100483444C (zh) | 2003-09-24 | 2009-04-29 | 奥森泰克公司 | 具有分布于薄膜上方的传感器电子设备的手指生物测量传感器以及单晶基底和相关方法 |
| US7223243B2 (en) | 2003-11-14 | 2007-05-29 | General Electric Co. | Thin film ultrasonic transmitter/receiver |
| KR100561851B1 (ko) | 2003-11-18 | 2006-03-16 | 삼성전자주식회사 | 지문 인식 센서 및 그 제조 방법 |
| WO2005052533A1 (ja) | 2003-11-27 | 2005-06-09 | Kyocera Corporation | 圧力センサ装置 |
| WO2006055024A2 (en) | 2004-04-05 | 2006-05-26 | Vaxiion Therapeutics, Inc. | Minicells as vaccines |
| WO2006042144A2 (en) * | 2004-10-07 | 2006-04-20 | Ultra-Scan Corporation | Ultrasonic fingerprint scanning utilizing a plane wave |
| EP1886344B1 (en) | 2005-04-28 | 2014-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
| CN1876760A (zh) | 2005-06-08 | 2006-12-13 | 富士胶片株式会社 | 非线性光学材料用组合物、光学部件、非线性光学材料及其制造方法 |
| US20070008952A1 (en) | 2005-07-07 | 2007-01-11 | Vodtel Communications Inc. | Internet telephone network system |
| JP4682927B2 (ja) | 2005-08-03 | 2011-05-11 | セイコーエプソン株式会社 | 静電型超音波トランスデューサ、超音波スピーカ、音声信号再生方法、超音波トランスデューサの電極の製造方法、超音波トランスデューサの製造方法、超指向性音響システム、および表示装置 |
| WO2007134051A2 (en) | 2006-05-08 | 2007-11-22 | The Penn State Research Foundation | High frequency ultrasound transducers |
| US8098915B2 (en) | 2006-05-25 | 2012-01-17 | Ultra-Scan Corporation | Longitudinal pulse wave array |
| US8139827B2 (en) * | 2006-05-25 | 2012-03-20 | Ultra-Scan Corporation | Biometrical object reader having an ultrasonic wave manipulation device |
| WO2008015917A1 (en) | 2006-08-02 | 2008-02-07 | Konica Minolta Medical & Graphic, Inc. | Ultrasonic probe, and ultrasonic probe manufacturing method |
| US8069549B2 (en) | 2007-03-22 | 2011-12-06 | Seiko Epson Corporation | Method for sealing a quartz crystal device |
| JP5052605B2 (ja) * | 2007-05-11 | 2012-10-17 | パナソニック株式会社 | 半導体チップ |
| CN101315823A (zh) | 2007-06-01 | 2008-12-03 | 聚鼎科技股份有限公司 | 过电流保护元件的制作方法 |
| KR100914026B1 (ko) | 2007-06-12 | 2009-08-28 | 한국세라믹기술원 | 압전 박막형 지문 센서 제조방법 |
| KR20100057596A (ko) | 2007-07-03 | 2010-05-31 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 존재 검출을 위한 박막 검출기 |
| US7955641B2 (en) | 2007-08-13 | 2011-06-07 | Ultra-Scan Corporation | Method of making a piezoelectric device |
| KR100934957B1 (ko) | 2008-02-22 | 2010-01-06 | 한국과학기술연구원 | 압전 폴리머 기판을 이용한 하이브리드 전기소자와 그제조방법 |
| IL189892A (en) | 2008-03-03 | 2012-10-31 | Supco Internat Ltd | Electric or communication socket having a slot for receiving an electrical card and a card therefor |
| KR101493840B1 (ko) | 2008-03-14 | 2015-02-17 | 삼성디스플레이 주식회사 | 액정 표시 장치, 표시 시스템, 및 액정 표시 장치를 이용한물체 형상의 인식 방법 |
| US20090236732A1 (en) * | 2008-03-19 | 2009-09-24 | Powertech Technology Inc. | Thermally-enhanced multi-hole semiconductor package |
| KR101432353B1 (ko) * | 2008-08-01 | 2014-08-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 복합 전극을 갖는 터치 감응 장치 |
| NO20083766L (no) * | 2008-09-01 | 2010-03-02 | Idex Asa | Overflatesensor |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| HK1130618A2 (zh) * | 2008-10-30 | 2010-05-14 | 耀光联有限公司 | 一种金融交易卡 |
| EP2434961B1 (en) | 2009-05-29 | 2015-01-14 | Xlumena, Inc. | Apparatus and method for deploying stent across adjacent tissue layers |
| US20110021515A1 (en) | 2009-07-24 | 2011-01-27 | Takeda Pharmaceutical Company Limited | Dihyrofuropyrmindine compounds |
| CN101691202B (zh) | 2009-08-11 | 2012-01-04 | 西安交通大学 | 一种具有微结构的聚偏氟乙烯压电薄膜的制备方法 |
| EP2482731A1 (en) | 2009-09-29 | 2012-08-08 | University Of Wollongong | Imaging method and system |
| DE102010005403A1 (de) | 2010-01-22 | 2011-07-28 | Epcos Ag, 81669 | Verfahren zur Herstellung eines piezoelektrischen Vielschichtbauelements und piezoelektrisches Vielschichtbauelement |
| US8201739B2 (en) * | 2010-03-08 | 2012-06-19 | Ultra-Scan Corporation | Biometric sensor with delay layer |
| WO2011143279A1 (en) * | 2010-05-11 | 2011-11-17 | Ultra-Scan Corporation | Reflex longitudinal imaging using through sensor insonification |
| US8711128B2 (en) | 2010-11-05 | 2014-04-29 | Synaptics Incorporated | Method and apparatus for sensing an input object relative to a sensing region of an ultrasound sensor device |
| US9259961B2 (en) | 2010-12-10 | 2016-02-16 | Palo Alto Research Center Incorporated | Large-area ultrasound contact imaging |
| US8539837B2 (en) | 2010-12-10 | 2013-09-24 | Palo Alto Research Center Incorporated | Ultrasonic imaging using thin film transistor backplane |
| FR2977319B1 (fr) * | 2011-07-01 | 2014-03-14 | Commissariat Energie Atomique | Dispositif de mesure de pression a sensiblite optimisee |
| US8724832B2 (en) | 2011-08-30 | 2014-05-13 | Qualcomm Mems Technologies, Inc. | Piezoelectric microphone fabricated on glass |
| DE102012200125A1 (de) * | 2012-01-05 | 2013-07-11 | Robert Bosch Gmbh | Sensorstruktur und Drehratensensor |
| MY170979A (en) | 2012-02-02 | 2019-09-23 | Qualcomm Inc | Ultrasonic touch sensor with a display monitor |
| US20140035935A1 (en) | 2012-08-03 | 2014-02-06 | Qualcomm Mems Technologies, Inc. | Passives via bar |
| US8890853B2 (en) | 2013-01-11 | 2014-11-18 | Sharp Laboratories Of America, Inc. | In-pixel ultrasonic touch sensor for display applications |
| JP6098197B2 (ja) * | 2013-02-05 | 2017-03-22 | セイコーエプソン株式会社 | 光学フィルターデバイス、光学モジュール、及び電子機器 |
| US10036734B2 (en) * | 2013-06-03 | 2018-07-31 | Snaptrack, Inc. | Ultrasonic sensor with bonded piezoelectric layer |
| US9262003B2 (en) | 2013-11-04 | 2016-02-16 | Qualcomm Incorporated | Piezoelectric force sensing array |
| US20140359757A1 (en) | 2013-06-03 | 2014-12-04 | Qualcomm Incorporated | User authentication biometrics in mobile devices |
| US20140355387A1 (en) | 2013-06-03 | 2014-12-04 | Qualcomm Incorporated | Ultrasonic receiver with coated piezoelectric layer |
| US9606606B2 (en) * | 2013-06-03 | 2017-03-28 | Qualcomm Incorporated | Multifunctional pixel and display |
| US9323393B2 (en) | 2013-06-03 | 2016-04-26 | Qualcomm Incorporated | Display with peripherally configured ultrasonic biometric sensor |
| US10188350B2 (en) | 2014-01-07 | 2019-01-29 | Samsung Electronics Co., Ltd. | Sensor device and electronic device having the same |
| US9817108B2 (en) * | 2014-01-13 | 2017-11-14 | Qualcomm Incorporated | Ultrasonic imaging with acoustic resonant cavity |
| US9945818B2 (en) | 2014-02-23 | 2018-04-17 | Qualcomm Incorporated | Ultrasonic authenticating button |
| US10042488B2 (en) | 2014-04-04 | 2018-08-07 | Synaptics Incorporated | Through silicon vias for backside connection |
| US9558390B2 (en) | 2014-07-25 | 2017-01-31 | Qualcomm Incorporated | High-resolution electric field sensor in cover glass |
| EP2983108A3 (en) * | 2014-08-05 | 2016-07-13 | LG Innotek Co., Ltd. | Fingerprint sensor and touch device including the same |
| WO2016061406A1 (en) | 2014-10-15 | 2016-04-21 | Qualcomm Incorporated | Superpixel array of piezoelectric ultrasonic transducers for 2-d beamforming |
| US10139479B2 (en) * | 2014-10-15 | 2018-11-27 | Qualcomm Incorporated | Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming |
| US10147870B2 (en) | 2014-11-12 | 2018-12-04 | The Trustees Of Dartmouth College | Porous piezoelectric material with dense surface, and associated methods and devices |
| US20160171276A1 (en) | 2014-12-11 | 2016-06-16 | Elan Microelectronics Corporation | Fingerprint Sensor Having ESD Protection Structure |
| TWI594341B (zh) | 2015-01-19 | 2017-08-01 | 神盾股份有限公司 | 指紋辨識裝置封裝及其製造方法 |
| CN104766830B (zh) * | 2015-04-02 | 2018-07-06 | 南昌欧菲生物识别技术有限公司 | 一种指纹传感器封装结构、封装方法及电子设备 |
| CN205281521U (zh) * | 2015-12-17 | 2016-06-01 | 南昌欧菲生物识别技术有限公司 | 指纹识别模组和终端设备 |
| CN105631402B (zh) * | 2015-12-18 | 2019-02-19 | 业成科技(成都)有限公司 | 指纹识别装置及方法 |
| US9875388B2 (en) * | 2016-02-26 | 2018-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fingerprint sensor device and method |
-
2017
- 2017-02-10 US US15/430,389 patent/US11003884B2/en active Active
- 2017-06-05 CN CN201780037442.5A patent/CN109313702B/zh active Active
- 2017-06-05 JP JP2018564258A patent/JP7050698B2/ja active Active
- 2017-06-05 WO PCT/US2017/035981 patent/WO2017218228A1/en not_active Ceased
- 2017-06-05 CA CA3024317A patent/CA3024317A1/en active Pending
- 2017-06-05 KR KR1020187036310A patent/KR102459255B1/ko active Active
- 2017-06-05 TW TW106118555A patent/TWI752962B/zh active
- 2017-06-05 AR ARP170101537A patent/AR108765A1/es unknown
- 2017-06-05 EP EP17730024.1A patent/EP3472751A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3472751A1 (en) | 2019-04-24 |
| US11003884B2 (en) | 2021-05-11 |
| BR112018075541A2 (pt) | 2019-03-19 |
| TW201802723A (zh) | 2018-01-16 |
| CN109313702B (zh) | 2022-07-15 |
| BR112018075541A8 (pt) | 2023-04-11 |
| TWI752962B (zh) | 2022-01-21 |
| JP2019528583A (ja) | 2019-10-10 |
| US20170364726A1 (en) | 2017-12-21 |
| CA3024317A1 (en) | 2017-12-21 |
| CN109313702A (zh) | 2019-02-05 |
| JP7050698B2 (ja) | 2022-04-08 |
| KR20190019074A (ko) | 2019-02-26 |
| WO2017218228A1 (en) | 2017-12-21 |
| KR102459255B1 (ko) | 2022-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AR108765A1 (es) | Dispositivo de sensor de huellas digitales y métodos del mismo | |
| GB2606666B (en) | Acoustic wave device with multi-layer piezoelectric substrate | |
| WO2016040333A3 (en) | Integrated piezoelectric microelectromechanical ultrasound transducer (pmut) on integrated circuit (ic) for fingerprint sensing | |
| PL3547921T3 (pl) | Urządzenia do obrazowania zawierające przetworniki piezoelektryczne | |
| JP2014197522A5 (ja) | 発光装置 | |
| MX2021012334A (es) | Sistema y metodo para autenticar una conexion entre un dispositivo de usuario y un vehiculo. | |
| JP2014197211A5 (enExample) | ||
| PL3829332T3 (pl) | Wyrób wytwarzający aerozol zawierający podłoże wytwarzające aerozol | |
| MX373567B (es) | Combado de sensor de imagen usando tensión. | |
| SG10201909786QA (en) | Sound transducer assembly with a mems sound transducer | |
| MX345827B (es) | Dispositivo semiconductor y método para fabricarlo. | |
| CL2016002881A1 (es) | Revestimiento permeable al sonido para cartón yeso acústico | |
| MY173532A (en) | Semiconductor device and manufacturing method for the semiconductor device | |
| IL298567B1 (en) | Anchorage-independent cells and use thereof | |
| EP3154083A3 (en) | Fan-out package structure having embedded package substrate | |
| SG10201803447TA (en) | Semiconductor Device | |
| MX365022B (es) | Uniones para la metalizacion de celdas solares. | |
| TW201614815A (en) | Semiconductor device | |
| TW201614776A (en) | Method of making embedded memory device with silicon-on-insulator substrate | |
| MX2017000584A (es) | Conjunto de sensores. | |
| WO2018041658A3 (en) | Imaging device with ultrasound transducer array | |
| WO2015134868A3 (en) | An ergonomic musical instrument plectrum | |
| EP2883623A3 (en) | Ultrasonic transducer device, ultrasonic measurement apparatus, and ultrasonic imaging apparatus | |
| MX2019010481A (es) | Estructura de contacto de schottky para dispositivos de semiconductores y metodo para formar tal estructura de contacto de schottky. | |
| EP3669457A4 (en) | SURFACE ACOUSTIC WAVE DEVICE |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FB | Suspension of granting procedure |