JP2021500749A5 - - Google Patents

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Publication number
JP2021500749A5
JP2021500749A5 JP2020522366A JP2020522366A JP2021500749A5 JP 2021500749 A5 JP2021500749 A5 JP 2021500749A5 JP 2020522366 A JP2020522366 A JP 2020522366A JP 2020522366 A JP2020522366 A JP 2020522366A JP 2021500749 A5 JP2021500749 A5 JP 2021500749A5
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JP
Japan
Prior art keywords
reflective layer
transparent coating
coating layer
light emitting
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020522366A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021500749A (ja
JP7193532B2 (ja
Filing date
Publication date
Priority claimed from US15/788,347 external-priority patent/US10672960B2/en
Application filed filed Critical
Priority claimed from PCT/US2018/053694 external-priority patent/WO2019079021A1/en
Publication of JP2021500749A publication Critical patent/JP2021500749A/ja
Publication of JP2021500749A5 publication Critical patent/JP2021500749A5/ja
Application granted granted Critical
Publication of JP7193532B2 publication Critical patent/JP7193532B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020522366A 2017-10-19 2018-10-01 発光デバイスパッケージ Active JP7193532B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/788,347 US10672960B2 (en) 2017-10-19 2017-10-19 Light emitting device package with a coating layer
US15/788,347 2017-10-19
EP18153901.6 2018-01-29
EP18153901 2018-01-29
PCT/US2018/053694 WO2019079021A1 (en) 2017-10-19 2018-10-01 LIGHT EMITTING DEVICE HOUSING

Publications (3)

Publication Number Publication Date
JP2021500749A JP2021500749A (ja) 2021-01-07
JP2021500749A5 true JP2021500749A5 (enExample) 2021-11-11
JP7193532B2 JP7193532B2 (ja) 2022-12-20

Family

ID=63862209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020522366A Active JP7193532B2 (ja) 2017-10-19 2018-10-01 発光デバイスパッケージ

Country Status (6)

Country Link
EP (1) EP3698415A1 (enExample)
JP (1) JP7193532B2 (enExample)
KR (1) KR20200065074A (enExample)
CN (1) CN111837245A (enExample)
TW (1) TWI856951B (enExample)
WO (1) WO2019079021A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4139956A4 (en) * 2020-04-21 2024-07-17 Jade Bird Display (Shanghai) Limited LED CHIP STRUCTURES WITH REFLECTIVE ELEMENTS
AU2021259592A1 (en) * 2020-04-21 2022-12-08 Jade Bird Display (shanghai) Limited Light-emitting diode chip structures with reflective elements
US12237451B2 (en) 2022-01-28 2025-02-25 Creeled, Inc. Arrangements of light-altering coatings in light-emitting diode packages

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003034508A1 (ja) * 2001-10-12 2005-02-03 日亜化学工業株式会社 発光装置及びその製造方法
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP4973011B2 (ja) * 2006-05-31 2012-07-11 豊田合成株式会社 Ｌｅｄ装置
JP5245594B2 (ja) * 2007-07-27 2013-07-24 日亜化学工業株式会社 発光装置及びその製造方法
JP4962270B2 (ja) * 2007-10-31 2012-06-27 日亜化学工業株式会社 発光装置及びこれの製造方法
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
JP5684700B2 (ja) * 2009-03-31 2015-03-18 東芝ライテック株式会社 発光装置および照明装置
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
JP5413137B2 (ja) * 2009-11-09 2014-02-12 日亜化学工業株式会社 発光装置および発光装置の製造方法
DE102010003321A1 (de) * 2010-03-26 2011-09-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP5864089B2 (ja) * 2010-08-25 2016-02-17 日亜化学工業株式会社 発光装置の製造方法
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
WO2012131792A1 (ja) * 2011-03-31 2012-10-04 パナソニック株式会社 半導体発光装置
JP2014525146A (ja) * 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
JP2013033890A (ja) * 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
TWI597865B (zh) * 2012-06-06 2017-09-01 日立化成股份有限公司 Optical semiconductor device
JP2014041955A (ja) * 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
KR101997243B1 (ko) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR102008315B1 (ko) * 2013-01-23 2019-10-21 삼성전자주식회사 발광 소자 패키지
DE102013215650B4 (de) * 2013-08-08 2021-10-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP6523597B2 (ja) * 2013-09-30 2019-06-05 日亜化学工業株式会社 発光装置
KR102188500B1 (ko) * 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치

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