WO2015014036A1 - 柔性有机发光二极管显示器及其制备方法 - Google Patents
柔性有机发光二极管显示器及其制备方法 Download PDFInfo
- Publication number
- WO2015014036A1 WO2015014036A1 PCT/CN2013/086466 CN2013086466W WO2015014036A1 WO 2015014036 A1 WO2015014036 A1 WO 2015014036A1 CN 2013086466 W CN2013086466 W CN 2013086466W WO 2015014036 A1 WO2015014036 A1 WO 2015014036A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- organic light
- layer
- flexible substrate
- flexible
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 238000002161 passivation Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000010409 thin film Substances 0.000 claims abstract description 12
- 238000010521 absorption reaction Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 108010010803 Gelatin Proteins 0.000 claims 1
- 229920000159 gelatin Polymers 0.000 claims 1
- 239000008273 gelatin Substances 0.000 claims 1
- 235000019322 gelatine Nutrition 0.000 claims 1
- 235000011852 gelatine desserts Nutrition 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 101
- 238000010586 diagram Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the protruding structure directly contacts the second flexible substrate, or the protruding structure is placed in an adhesive for fixing the second flexible substrate over the stress absorbing layer.
- the second soft layer absorbs and releases the stress, preventing the flexible organic light emitting diode display electrode from being broken due to stress, which affects the display quality.
- a thin film transistor (TFT) and a first passivation layer are separately formed on the first flexible substrate from bottom to top.
- the thin film transistor may be a top gate structure or a bottom gate structure.
- the top gate structure TFT it may include, in order from bottom to top, an active layer, a gate insulating layer, a gate, an interlayer insulating layer, a drain, and a source; for the bottom gate structure TFT, it may be sequentially included from bottom to top. : Gate, Gate Insulation, Active Layer, Drain, Source. (S2) A via hole is formed at a position where the first passivation layer corresponds to the drain of the TFT.
- the flexible organic light emitting diode display further includes a top emission structure flexible organic light emitting diode display, a bottom emission structure flexible organic light emitting diode display, or an inverted organic light emitting diode flexible display.
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/353,200 US9312504B2 (en) | 2013-08-02 | 2013-11-01 | Flexible organic light emitting diode display device and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310334937.8A CN103426904B (zh) | 2013-08-02 | 2013-08-02 | 一种柔性有机发光二极管显示器及其制备方法 |
CN201310334937.8 | 2013-08-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015014036A1 true WO2015014036A1 (zh) | 2015-02-05 |
Family
ID=49651410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2013/086466 WO2015014036A1 (zh) | 2013-08-02 | 2013-11-01 | 柔性有机发光二极管显示器及其制备方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9312504B2 (zh) |
CN (1) | CN103426904B (zh) |
WO (1) | WO2015014036A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11586247B2 (en) * | 2015-03-31 | 2023-02-21 | Samsung Display Co., Ltd. | Flexible display |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102168681B1 (ko) * | 2013-11-11 | 2020-10-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
CN103681694A (zh) | 2013-12-06 | 2014-03-26 | 京东方科技集团股份有限公司 | 一种柔性显示基板及柔性显示器 |
CN103700320A (zh) * | 2013-12-20 | 2014-04-02 | 京东方科技集团股份有限公司 | 柔性显示器及其制造方法 |
CN103700676B (zh) * | 2013-12-31 | 2016-03-30 | 京东方科技集团股份有限公司 | 柔性阵列基板以及具有该柔性阵列基板的柔性显示装置 |
CN103887261B (zh) * | 2014-03-03 | 2016-08-31 | 京东方科技集团股份有限公司 | 一种柔性显示器及其制备方法 |
CN103972266B (zh) * | 2014-04-16 | 2017-06-09 | 京东方科技集团股份有限公司 | 一种有机电致发光显示面板及显示装置 |
CN104319240B (zh) | 2014-10-27 | 2017-06-23 | 京东方科技集团股份有限公司 | 一种柔性基板贴附方法 |
CN104485351A (zh) * | 2014-12-31 | 2015-04-01 | 深圳市华星光电技术有限公司 | 一种柔性有机发光显示器及其制作方法 |
CN105097876B (zh) * | 2015-06-11 | 2018-07-10 | 京东方科技集团股份有限公司 | 有机发光二极管oled显示器件和装置 |
KR102489592B1 (ko) * | 2015-12-31 | 2023-01-18 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 |
CN105609533B (zh) * | 2016-01-05 | 2018-11-30 | 京东方科技集团股份有限公司 | 柔性显示面板及其制作方法和应力变色聚合物的制作方法 |
CN106981498A (zh) * | 2016-01-19 | 2017-07-25 | 上海和辉光电有限公司 | 显示器件结构、显示器件制备方法 |
US10147772B2 (en) | 2016-08-23 | 2018-12-04 | 3M Innovative Properties Company | Foldable OLED device with compatible flexural stiffness of layers |
CN106158918B (zh) * | 2016-09-30 | 2019-06-11 | 昆山工研院新型平板显示技术中心有限公司 | 柔性显示器及其制备方法 |
TWI626738B (zh) | 2017-04-06 | 2018-06-11 | 宏碁股份有限公司 | 顯示裝置及其製造方法 |
CN108735771B (zh) * | 2017-04-17 | 2021-06-04 | 宏碁股份有限公司 | 显示设备及其制造方法 |
US11063095B2 (en) * | 2017-06-01 | 2021-07-13 | Boe Technology Group Co., Ltd. | Array substrate, display panel having the same, and method of fabricating array substrate |
CN108198952A (zh) | 2017-12-29 | 2018-06-22 | 昆山工研院新型平板显示技术中心有限公司 | 柔性显示屏及其制备方法 |
CN109065599B (zh) * | 2018-08-20 | 2021-01-22 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、以及显示装置 |
CN109256413B (zh) * | 2018-10-12 | 2020-09-11 | 云谷(固安)科技有限公司 | 柔性显示面板及装置 |
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CN1685769A (zh) * | 2003-06-13 | 2005-10-19 | 富士电机控股株式会社 | 有机el显示器 |
CN203367284U (zh) * | 2013-08-02 | 2013-12-25 | 京东方科技集团股份有限公司 | 一种柔性有机发光二极管显示器 |
Family Cites Families (3)
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CN102290422A (zh) | 2003-01-15 | 2011-12-21 | 株式会社半导体能源研究所 | 显示装置及其制造方法、剥离方法及发光装置的制造方法 |
JP4479381B2 (ja) * | 2003-09-24 | 2010-06-09 | セイコーエプソン株式会社 | 電気光学装置、電気光学装置の製造方法、及び電子機器 |
KR20140019699A (ko) * | 2012-08-07 | 2014-02-17 | 삼성디스플레이 주식회사 | 플렉시블 유기 발광 표시 장치 및 그 제조방법 |
-
2013
- 2013-08-02 CN CN201310334937.8A patent/CN103426904B/zh active Active
- 2013-11-01 US US14/353,200 patent/US9312504B2/en active Active
- 2013-11-01 WO PCT/CN2013/086466 patent/WO2015014036A1/zh active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1685769A (zh) * | 2003-06-13 | 2005-10-19 | 富士电机控股株式会社 | 有机el显示器 |
CN203367284U (zh) * | 2013-08-02 | 2013-12-25 | 京东方科技集团股份有限公司 | 一种柔性有机发光二极管显示器 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11586247B2 (en) * | 2015-03-31 | 2023-02-21 | Samsung Display Co., Ltd. | Flexible display |
Also Published As
Publication number | Publication date |
---|---|
US9312504B2 (en) | 2016-04-12 |
CN103426904B (zh) | 2015-11-11 |
CN103426904A (zh) | 2013-12-04 |
US20150194618A1 (en) | 2015-07-09 |
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