WO2019042015A1 - 一种膜层结构、显示装置及膜层结构的制备方法 - Google Patents

一种膜层结构、显示装置及膜层结构的制备方法 Download PDF

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Publication number
WO2019042015A1
WO2019042015A1 PCT/CN2018/094880 CN2018094880W WO2019042015A1 WO 2019042015 A1 WO2019042015 A1 WO 2019042015A1 CN 2018094880 W CN2018094880 W CN 2018094880W WO 2019042015 A1 WO2019042015 A1 WO 2019042015A1
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Prior art keywords
film layer
organic film
substrate
layer
organic
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PCT/CN2018/094880
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English (en)
French (fr)
Inventor
王玉林
施槐庭
宋丽芳
彭锐
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Priority to US16/336,164 priority Critical patent/US10923677B2/en
Publication of WO2019042015A1 publication Critical patent/WO2019042015A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a film layer structure, a display device, and a method of fabricating a film layer structure.
  • OLED Organic Light Emitting Diode
  • the present disclosure discloses a film layer structure.
  • the film layer structure includes a substrate, a first organic film layer disposed on the substrate, and a first additional film layer disposed on the first organic film layer.
  • the first organic film layer has a sloped edge, and an angle between a tangent of the upper surface of the sloped edge and the substrate is less than a breakable angle, and the easy break angle refers to the first organic
  • the first additional film layer formed on the ramped edge of the layer is cracked or tends to crack.
  • the break angle is 35°.
  • the first organic film layer is a functional layer in a functional structure on the substrate or an encapsulation layer in a package structure for encapsulating the functional structure.
  • the first additional film layer comprises a first inorganic film layer.
  • the first organic film layer is a functional layer in the functional structure.
  • the film layer structure further includes at least one laminate of the second organic film layer and the second inorganic film layer on the first inorganic film layer.
  • the first organic film layer is an encapsulation layer in a package structure.
  • the package structure includes at least one laminate composed of the first organic film layer and the first organic film layer.
  • the first organic film layer comprises a planar layer or a pixel defining layer.
  • a protective film layer disposed opposite to the substrate and an adhesive paste bonding the protective film layer to the substrate, and the first organic film layer is located on the substrate and the protection Between the layers.
  • the substrate is a rigid substrate or a flexible substrate.
  • the present disclosure also discloses a display device including the above-described film layer structure.
  • the present disclosure also discloses a method of preparing a film layer structure.
  • the method includes forming a first organic film layer on a substrate, and forming a first additional film layer on the first organic film layer.
  • the first organic film layer has a sloped edge, and an angle between a tangent of the upper surface of the sloped edge and the substrate is less than a breakable angle, and the easy break angle refers to the first organic
  • the first additional film layer formed on the ramped edge of the layer is cracked or tends to crack.
  • forming the first additional film layer on the first organic film layer comprises:
  • a first inorganic film layer is formed on the first organic film layer.
  • the first organic film layer is a functional layer in a functional structure on the substrate, and after the step of forming a first inorganic film layer on the first organic film layer, the method further includes :
  • At least one laminate of the second organic film layer and the second inorganic film layer is formed on the first inorganic film layer.
  • the first organic film layer is an encapsulation layer in a package structure
  • the step of forming a first organic film layer on the substrate comprises:
  • a first organic film layer is formed on the second inorganic film layer.
  • FIG. 1 shows one of schematic views of a film layer structure in an embodiment of the present disclosure
  • FIG. 2 shows a second schematic view of a film layer structure in an embodiment of the present disclosure
  • FIG. 3 shows a third schematic view of a film layer structure in an embodiment of the present disclosure
  • FIG. 4 is a flow chart showing a method of preparing a film layer structure in an embodiment of the present disclosure.
  • the terms “upper”, “lower”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom” and The derivative should refer to the public text.
  • the terms “overlay”, “on top of”, “positioned on” or “positioned on top of” mean that a first element, such as a first structure, exists in a second element, such as a second structure. Above, wherein an intermediate element such as an interface structure may exist between the first element and the second element.
  • the term “contacting” means connecting a first element such as a first structure and a second element such as a second structure, with or without other elements at the interface of the two elements.
  • the thickness of the organic film layer formed on the substrate is on the order of micrometers, and is limited by the formation process and material of the organic film layer, and the climbing angle of the upper surface of the organic film layer and the substrate is relatively large.
  • FIG. 1 one of the schematic views of the film layer structure in the embodiment of the present disclosure is shown.
  • Embodiments of the present disclosure provide a film layer structure (for example, applied to an electroluminescent display panel).
  • the film layer structure includes a substrate 11, a first organic film layer 12 disposed on the substrate 11, and a first additional film layer 13 disposed on the first organic film layer 12.
  • the first organic film layer 12 has a sloped edge SE, and an angle between a tangent to the upper surface UP of the sloped edge and the substrate 11 is smaller than a breakable angle.
  • the first organic film layer 12 may be an organic film layer having the outer edge of the film layer closest to the edge of the substrate 11 in the film layer structure.
  • the substrate 11 may be a rigid substrate or a flexible substrate.
  • the schematic diagram on the left side is a partial enlarged view of the area A (the position of the dotted circle) in the film structure, and the upper surface UP of the first organic film layer 12 and the climbing angle of the substrate 11 are ⁇ , and F1 is formed.
  • One of the stresses of the first additional film layer 13 on the first organic film layer 12 the direction of the stress F1 is parallel to the substrate 11, F2 is the other stress of the first additional film layer 13, and the direction of the stress F2 is parallel to the corner position
  • the resultant force F also increases as the climbing angle ⁇ increases, and the first additional film layer 13 is more likely to rupture when the resultant force F is larger; therefore, the control should be controlled.
  • the climbing angle ⁇ of the organic film layer 12 and the substrate 11 is smaller than the easy-break angle, and the resultant force F of the first additional film layer 13 formed on the first organic film layer 12 at the corner position is reduced, so that the first addition can be prevented. Cracking of the film layer 13.
  • the easy break angle refers to an angle at which the first additional film layer formed on the sloped edge of the first organic layer is cracked or tends to be broken.
  • prone to rupture means an increase in the probability of occurrence of rupture as compared with less than the rupturable angle.
  • the climbing angle ⁇ is an angle between the tangent of the upper surface of the first organic film layer 12 at the corner position and the substrate 11.
  • the film layer structure of the embodiments of the present disclosure may include a plurality of organic film layers, and the first organic film layer 12 may be an organic film layer having the outer edge of the film layer closest to the edge of the substrate 11 in the film layer structure.
  • the functional layer in the functional structure on the substrate is either an encapsulation layer in a package structure for encapsulating the functional structure.
  • the functional structure is a structure that implements, for example, a display function.
  • the functional structure may include a pixel defining layer, a cathode, an organic light emitting layer, an anode, a planarization layer, and the like.
  • the first organic film layer comprises a planar layer or a pixel defining layer.
  • the first additional layer may include a first inorganic film layer.
  • the first additional film layer 13 in FIG. 1 may be the first inorganic film layer. Since the first inorganic film layer has extremely low water oxygen permeability, the stress is relatively large, the hardness is high, and the crack is easy, especially in the corner position of the first inorganic film layer climbing. Therefore, it is necessary to control the climbing angle of the first organic film layer and the substrate to be smaller than the easy-breaking angle, so that the first inorganic film layer is less likely to be broken, so that water oxygen can be effectively prevented from entering the inside of the functional structure such as the OLED device from the rupture position.
  • the first additional film layer 13 in FIG. 1 may also be an organic film layer.
  • the cracking of the first additional film layer 13 can also be prevented.
  • the specific value of the easy breakage angle is related to the material, preparation process, and film thickness of the first additional film layer 13 which is subsequently formed.
  • the break angle is about 35°.
  • the climbing angle ⁇ is greater than or equal to about 35°, the first additional film layer 13 is more likely to be broken, and therefore, the climbing angle ⁇ can be set to be less than about 35° to prevent cracking of the first additional film layer 13.
  • the film layer structure further includes a protective film layer 15 disposed opposite to the substrate 11 and an adhesive 14 for bonding the protective film layer 15 and the substrate 11, and the first organic
  • the film layer 12 is located between the substrate 11 and the protective film layer 15.
  • the adhesive glue is a sheet glue or a Dam-Filler (epoxy resin + getter filler) glue.
  • first additional film layer 13 formed on the first organic film layer 12 is also located between the substrate 11 and the protective film layer 15.
  • the first additional film layer 13 formed on the first organic film layer 12 will be described as the first inorganic film layer.
  • FIG. 2 a second schematic diagram of a film layer structure in an embodiment of the present disclosure is shown.
  • the first organic film layer 121 is a functional layer in a functional structure. As shown in FIG. 2, the first organic film layer 121 is disposed on the substrate 11, the first inorganic film layer 131 is covered on the first organic film layer 121, and at least one of the first inorganic film layer 131 is further disposed. A laminate of a second organic film layer 122 and a second inorganic film layer 132. The second organic film layer 122 is an organic film layer in a package structure.
  • the first organic film layer 121 is opposite to the second organic film layer 122, and the outer edge of the film layer is closest to the edge of the substrate 11, which is also understood to be the outer edge of the film layer of the first organic film layer 121.
  • the distance between the edges of the substrate 11 is smaller than the distance between the outer edge of the film layer of the second organic film layer 122 and the edge of the substrate 11.
  • the climbing angle of the first organic film layer 121 and the substrate 11 is set to be smaller than the easy-to-break angle, and the crack of the first inorganic film layer 131 can be prevented.
  • the ability to block water oxygen can be further improved.
  • only the climbing angle of the first organic film layer 121 and the substrate 11 may be set to be smaller than the easy break angle.
  • the climbing angle of the second organic film layer 122 and the substrate 11 can also be set to be smaller than the easy-to-break angle, the cracking of the second inorganic film layer 132 can be prevented, and the ability to block water oxygen can be further improved.
  • the fabrication process of the OLED device is: forming a driving TFT (Thin Film Transistor) on the substrate, and then sequentially forming a flat layer, an anode, a pixel defining layer, a light emitting layer, a cathode, and finally performing Packaging, complete the fabrication of OLED devices.
  • the structure formed before the formation of the light-emitting layer is generally referred to as a back-plate structure, and the structure finally formed by the package is referred to as a package structure.
  • the organic film layer in the back sheet structure includes a flat layer or a pixel defining layer, that is, the first organic film layer 121 may be a flat layer or a pixel defining layer.
  • the pixel defining layer can also be fabricated after the light emitting layer is fabricated.
  • the climbing angle of the pixel defining layer and the substrate may be set to be smaller than the easy-to-break angle.
  • the structure of the driving TFT, the anode, the light-emitting layer, and the cathode is not shown in the drawing.
  • a driving TFT should be disposed between the first organic film layer 121 and the substrate 11, and the first organic film layer 121 and the first organic film layer 121
  • An anode, a pixel defining layer, a light emitting layer, and a cathode are further disposed between the inorganic film layers 131.
  • the first organic film layer 121 is a pixel defining layer
  • a driving TFT, a flat layer, and an anode should be disposed between the first organic film layer 121 and the substrate 11, and the first organic film layer 121 and A light emitting layer and a cathode are further disposed between the first inorganic film layers 131.
  • a protective film layer 15 disposed opposite to the substrate 11 is further provided on the laminated structure of the second organic film layer 122 and the second inorganic film layer 132.
  • the protective film layer 15 is attached to the substrate 11 by an adhesive 14 .
  • FIG. 3 a third schematic view of a film layer structure in an embodiment of the present disclosure is shown.
  • the package structure when the first organic film layer 124 is an encapsulation layer in a package structure, the package structure includes at least one of the first organic film layer 124 and the first inorganic film layer 134.
  • the laminate formed.
  • the first inorganic film layer 134 is overlaid on the first organic film layer 124.
  • a second organic film layer 123 and a second inorganic film layer 133 are further disposed between the first organic film layer 124 and the substrate 11, wherein the second organic film layer 123 may be organic in the back plate structure.
  • Membrane layer when the first organic film layer 124 is an encapsulation layer in a package structure, the package structure includes at least one of the first organic film layer 124 and the first inorganic film layer 134.
  • the laminate formed.
  • the first inorganic film layer 134 is overlaid on the first organic film layer 124.
  • a second organic film layer 123 and a second inorganic film layer 133 are further disposed between the first organic film layer 124 and the substrate 11, where
  • the first organic film layer 124 is opposite to the second organic film layer 123 with the outer edge of the film layer closest to the edge of the substrate 11.
  • the climbing angle of the first organic film layer 124 and the substrate 11 is set to be smaller than the easy-to-break angle, and the crack of the first inorganic film layer 134 can be prevented.
  • the organic film layer in the back plate structure comprises a flat layer or a pixel defining layer, that is to say the second organic film layer 123 may be a flat layer or a pixel defining layer.
  • a protective film layer 15 disposed opposite to the substrate 11 is further provided.
  • the protective film layer 15 is attached to the substrate 11 by an adhesive 14 .
  • a first organic film layer having a sloped edge is provided on a substrate, and an angle between a tangent of the upper surface of the sloped edge and the substrate (also referred to as "climbing" The angle ") is smaller than the easy break angle.
  • the slope of the climbing slope of the first additional film layer formed on the first organic film layer is reduced by controlling the climbing angle of the first organic film layer and the substrate to be smaller than the easy-breaking angle (the clamping between the upper surface and the substrate) The angle), thereby reducing the resultant force of the subsequently formed film layer at the corner position due to the stress in the two directions, preventing the subsequently formed film layer from rupturing and improving the life of the functional structure (for example, an OLED device).
  • the embodiment of the present disclosure also provides a display device including the above-described film structure.
  • This film structure can be applied to an electroluminescence display panel.
  • the electroluminescent display panel includes a substrate, a first organic film layer disposed on the substrate, and a first additional film layer disposed on the first organic film layer.
  • the first organic film layer has a sloped edge, and an angle between a tangent to the upper surface of the sloped edge and the substrate is smaller than a breakable angle, and the easy fracture angle refers to a slope shape of the first organic layer
  • the first additional film layer formed on the edge is cracked or tends to crack.
  • the first organic film layer is an organic film layer having an outer edge of the film layer closest to the edge of the substrate in the film layer structure.
  • the break angle is about 35°.
  • the first organic film layer may be an organic film layer in a functional structure or an organic film layer in a package structure.
  • the first additional film layer may include a first inorganic film layer thereon.
  • the first organic film layer is a functional layer in the functional structure
  • the film layer structure further includes: at least one located on the first inorganic film layer by a second organic A laminate of a film layer and a second inorganic film layer.
  • the first organic film layer is an encapsulation layer in a package structure, the package structure including at least one stack of the first organic film layer and the first inorganic film layer Floor.
  • the first organic film layer comprises a flat layer or a pixel defining layer.
  • the substrate may be a rigid substrate or a flexible substrate.
  • the film layer structure further includes a protective film layer disposed opposite to the substrate and an adhesive paste bonding the protective film layer and the substrate, and the first organic film layer is located on the substrate Between the protective film layers.
  • the display device includes a film layer structure by providing a first organic film layer having a sloped edge on the substrate (for example, the first organic film layer is a film outer layer in the film layer structure) The organic film layer closest to the edge of the substrate), and the climbing angle of the first organic film layer and the substrate (ie, the angle between the tangent to the upper surface of the sloped edge and the substrate) ) is less than the easy to break angle.
  • the hill slope angle of the first additional film layer formed on the first organic film layer is reduced by controlling the climbing angle of the first organic film layer and the substrate to be smaller than the easy-break angle (ie, the slope of the first additional film layer) An angle between the tangent of the upper surface of the edge and the substrate), thereby reducing the resultant force of the subsequently formed first additional film layer at the corner position due to stress in two directions, preventing the subsequently formed film from rupturing To improve the life of functional structures (eg, OLED devices).
  • functional structures eg, OLED devices
  • FIG. 4 a flow diagram of a method of making a film layer structure in an embodiment of the present disclosure is shown.
  • Step 401 forming a first organic film layer on the substrate.
  • the first organic film layer is formed on the substrate, and the method of preparing the first organic film layer differs depending on the type of the first organic film layer.
  • Step 402 forming a first additional layer on the first organic film layer.
  • the first organic film layer has a sloped edge, and an angle between a tangent line of the upper surface of the sloped edge and the substrate is less than a breakable angle, and the easy break angle refers to the first organic layer
  • the first additional film layer formed on the sloped edge is cracked or tends to crack.
  • the first organic film layer may be an organic film layer in which the outer edge of the film layer is closest to the edge of the substrate. And the climbing angle of the first organic film layer and the substrate is smaller than the easy fracture angle.
  • the first organic film layer 121 when the first organic film layer 121 is an organic film layer in a functional structure, the first organic film layer 121 may be formed using an exposure and development process. By adjusting parameters such as exposure intensity, exposure time, developer concentration, development time, and the like, the climbing angle of the first organic film layer 121 and the substrate 11 is made smaller than the easy-to-break angle.
  • the first organic film layer 124 when the first organic film layer 124 is an organic film layer in a package structure, the first organic film layer 124 may be formed by a printing process or a chemical vapor deposition process.
  • the slope of the first organic film layer 124 and the substrate 11 is made smaller than the easy-to-break angle by adjusting the material viscosity of the first organic film layer, the contact angle of the substrate, the deposition rate of the first organic film layer, and the like.
  • a specific step of forming a first organic film layer on the substrate may be: forming a second organic film layer on the substrate; and the second organic film A second inorganic film layer is formed on the layer; and the first organic film layer is formed on the second inorganic film layer.
  • the second organic film layer 123 is formed on the substrate 11 by an exposure and development process. Then, a second inorganic film layer 133 is formed on the second organic film layer 123 by a chemical vapor deposition process or an atomic layer deposition process. Finally, the first organic film layer 124 is formed on the second inorganic film layer 133 by a printing process or a chemical vapor deposition process.
  • the first inorganic film layer may also be formed on the first organic film layer.
  • the first inorganic film layer may be formed using a chemical vapor deposition process or an atomic layer deposition process.
  • the first organic film layer 121 is an organic film layer in a functional structure
  • a chemical vapor deposition process or an atomic layer deposition process may be employed on the first organic film layer 121.
  • the first inorganic film layer 131 is formed.
  • the first organic film layer 121 is an organic film layer in a functional structure, and after the first inorganic film layer is formed on the first organic film layer, the first inorganic film layer is further formed on the first inorganic film layer. At least one laminate composed of a second organic film layer and a second inorganic film layer.
  • a second organic film layer 122 on the first inorganic film layer 131 for example, using a printing process or a chemical vapor deposition process
  • the second organic film layer 122 for example, using a chemical vapor deposition process or an atomic layer deposition process
  • the second inorganic film layer 132 is formed, and a laminated structure of the second organic film layer 122 and the second inorganic film layer 132 can be formed according to the above-described process, and the number of layers of the laminated structure is greater than or equal to one layer.
  • the sheet of the second inorganic film layer 132 in the laminated structure is pasted with a sheet of glue or coated with Dam-Filler glue.
  • the adhesive material 14 to which the protective film layer is attached is formed, and the protective film layer 15 is attached to the adhesive 14 .
  • first organic film layer 124 is an organic film layer in a package structure
  • a first inorganic film is formed on the first organic film layer 124 (for example, by a chemical vapor deposition process or an atomic layer deposition process).
  • Layer 134 when the first organic film layer 124 is an organic film layer in a package structure, a first inorganic film is formed on the first organic film layer 124 (for example, by a chemical vapor deposition process or an atomic layer deposition process).
  • a sheet of glue or a Dam-Filler adhesive is applied to the first inorganic film layer 134 to form an adhesive 14 to which a protective film layer is attached, and a protective film layer 15 is attached to the adhesive 14 .
  • the material of the first inorganic film layer and the second inorganic film layer may be at least one of SiNx (silicon nitride), SiCN (silicon nitride), SiON (silicon oxynitride), and Al 2 O 3 (alumina).
  • SiNx silicon nitride
  • SiCN silicon nitride
  • SiON silicon oxynitride
  • Al 2 O 3 alumina
  • a first organic film layer having a sloped edge is formed on a substrate (for example, the first organic film layer is the outer edge of the film layer in the film layer structure closest to the edge of the substrate Organic film layer), and the angle between the tangent to the upper surface of the sloped edge and the substrate (also referred to as its "climbing angle") is smaller than the easy-to-break angle, which is The first additional film layer formed on the sloped edge of the first organic layer is cracked or tends to crack.
  • the climbing angle of the first organic film layer and the substrate to be smaller than the easy fracture angle, the slope angle of the subsequent formation of the film layer on the first organic film layer is reduced, thereby reducing the subsequently formed film layer at the corner position. Due to the resultant force generated by the stress in the two directions, the subsequently formed film layer is prevented from being broken, and the life of the OLED device is improved.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本公开文本提供了一种膜层结构、显示装置及膜层结构的制备方法，涉及显示技术领域。本公开文本通过在基板上设置具有斜坡状边缘的第一有机膜层，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度

Description

一种膜层结构、显示装置及膜层结构的制备方法
相关申请的交叉引用
本申请要求于2017年8月28日递交的中国专利申请第201710751104.X的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开文本涉及显示技术领域，特别是涉及一种膜层结构、显示装置及膜层结构的制备方法。
背景技术
OLED(Organic Light Emitting Diode，有机发光二极管)具有主动发光、高亮度、高对比度、超薄、低功耗、可柔性化以及工作温度范围宽等诸多优点，已成为极具竞争力和发展前景的下一代显示技术。
发明内容
本公开文本公开了一种膜层结构。该膜层结构包括基板、设置在所述基板上的第一有机膜层和设置在所述第一有机膜层上的第一附加膜层。其中，所述第一有机膜层具有斜坡状边缘，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。
在一个实施例中，所述易破裂角度为35°。
在一个实施例中，所述第一有机膜层为在所述基板上的功能结构中的功能层或者为用于封装所述功能结构的封装结构中的封装层。
在一个实施例中，所述第一附加膜层包括第一无机膜层。
在一个实施例中，所述第一有机膜层为所述功能结构中的功能层。所述膜层结构还包括：位于所述第一无机膜层上的至少一个由第二有机膜层 和第二无机膜层构成的叠层。
在一个实施例中，所述第一有机膜层为封装结构中的封装层。所述封装结构包括至少一个由所述第一有机膜层和所述第一有机膜层构成的叠层。
在一个实施例中，所述第一有机膜层包括平坦层或像素限定层。
在一个实施例中，还包括与所述基板相对设置的保护膜层和将所述保护膜层与所述基板接合的粘贴胶，且所述第一有机膜层位于所述基板与所述保护膜层之间。
在一个实施例中，所述基板为刚性基板或柔性基板。
本公开文本还公开了一种显示装置，包括上述的膜层结构。
本公开文本还公开了一种膜层结构的制备方法。所述方法包括：在基板上形成第一有机膜层；在所述第一有机膜层上形成第一附加膜层。其中，所述第一有机膜层具有斜坡状边缘，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。
在一个实施例中，在在所述第一有机膜层上形成第一附加膜层包括：
在所述第一有机膜层上形成第一无机膜层。
在一个实施例中，所述第一有机膜层为所述基板上的功能结构中的功能层，在所述第一有机膜层上形成第一无机膜层的步骤之后，所述方法还包括：
在所述第一无机膜层上形成至少一个由第二有机膜层和第二无机膜层的叠层。
在一个实施例中，所述第一有机膜层为封装结构中的封装层，所述在基板上形成第一有机膜层的步骤，包括：
在所述基板上形成第二有机膜层；
在所述第二有机膜层上形成第二无机膜层；
在所述第二无机膜层上形成第一有机膜层。
附图说明
图1示出了本公开文本实施例中的膜层结构的示意图之一；
图2示出了本公开文本实施例中的膜层结构的示意图之二；
图3示出了本公开文本实施例中的膜层结构的示意图之三；
图4示出了本公开文本实施例中的一种膜层结构的制备方法的流程图。
具体实施方式
为使本公开文本的上述目的、特征和优点能够更加明显易懂，下面结合附图和具体实施方式对本公开文本作进一步详细的说明。
当介绍本公开文本的元素及其实施例时，除非上下文中另外明确地指出，否则在本文和所附权利要求中所使用的词语的单数形式包括复数，反之亦然。因而，当提及单数时，通常包括相应术语的复数。用语“包含”、“包括”、“含有”和“具有”旨在包括性的并且表示可以存在除所列要素之外的另外的要素。
出于下文表面描述的目的，如其在附图中被标定方向那样，术语“上”、“下”、“左”、“右”“垂直”、“水平”、“顶”、“底”及其派生词应涉及公开文本。术语“上覆”、“在……顶上”、“定位在……上”或者“定位在……顶上”意味着诸如第一结构的第一要素存在于诸如第二结构的第二要素上，其中，在第一要素和第二要素之间可存在诸如界面结构的中间要素。术语“接触”意味着连接诸如第一结构的第一要素和诸如第二结构的第二要素，而在两个要素的界面处可以有或者没有其它要素。
在OLED器件中，基板上形成的有机膜层的厚度都在微米级别，受有机膜层的形成工艺和材料限制，有机膜层的上表面与基板的爬坡角度都比较大。
当在有机膜层上沉积其他膜层时，由于有机膜层的上表面与基板的爬坡角度都比较大，使得沉积在有机膜层上的膜层在转角位置容易出现破裂，影响OLED器件的寿命。
参照图1，示出了本公开文本实施例中的膜层结构的示意图之一。
本公开文本实施例提供了一种膜层结构(例如，应用于电致发光显示面板)。该膜层结构包括：基板11，设置在所述基板11上的第一有机膜层12，设置在第一有机膜层12上的第一附加膜层13。其中，第一有机膜层12具有斜坡状边缘SE，且斜坡状边缘的上表面UP的切线与基板11之间的夹角小于易破裂角度。在实施例中，第一有机膜层12可以为所述膜层结构中膜层外缘最靠近所述基板11边缘的有机膜层。
本公开文本实施例中，所述基板11可以为刚性基板或柔性基板。
如图1所示，左侧的示意图为膜层结构中区域A(虚线圆圈位置)的局部放大图，第一有机膜层12的上表面UP与基板11的爬坡角度为θ，F1为形成在第一有机膜层12上的第一附加膜层13的其中一个应力，应力F1的方向平行于基板11，F2为第一附加膜层13的另一个应力，应力F2的方向平行于转角位置处第一有机膜层12的上表面的切线方向，F为应力F1和应力F2的合力，根据平行四边形法则，F 2＝F1 2+F2 2-2F1F2cosθ。在应力F1和应力F2不变的情况下，随着爬坡角度θ的增大，合力F也增大，当合力F越大时，第一附加膜层13更容易破裂；因此，应该控制第一有机膜层12与基板11的爬坡角度θ小于易破裂角度，减小形成在第一有机膜层12上的第一附加膜层13在转角位置处的合力F，从而可以防止第一附加膜层13的破裂。
其中，当应力F1和应力F2相等时，可以推知F＝2F1sin(θ/2)，随着爬坡角度θ的增大，合力F也增大。
需要说明的是，易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。这里的“倾向于破裂”是指与小于该易破裂角度相比，发生破裂的机率增大。当爬坡角度θ大于或等于易破裂角度时，第一附加膜层13会破裂，或者是破裂的机率会增大。其中，爬坡角度θ为转角位置处第一有机膜层12的上表面的切线与基板11之间的夹角。
此外，本公开文本实施例的膜层结构可以包括多种有机膜层，第一有机膜层12可以为所述膜层结构中膜层外缘最靠近所述基板11边缘的有机 膜层。在实施例中，在所述基板上的功能结构中的功能层或者为用于封装所述功能结构的封装结构中的封装层。功能结构为实现例如显示功能的结构。例如，功能结构可以包括像素定义层、阴极、有机发光层、阳极和平坦化层等。在一种实施方式中，第一有机膜层包括平坦层或像素限定层。
在实施例中，第一附加层可以包括第一无机膜层。此时，图1中的第一附加膜层13可以为第一无机膜层。由于第一无机膜层具有极低的水氧穿透能力，但其应力比较大、硬度高、易破裂，尤其是在第一无机膜层爬坡的转角位置更容易出现破裂。因此，需要控制第一有机膜层与基板的爬坡角度小于易破裂角度，使得第一无机膜层不易发生破裂，从而可以有效阻止水氧从破裂位置进入到诸如OLED器件的功能结构的内部。
当然，图1中的第一附加膜层13还可以为有机膜层，通过控制第一有机膜层12与基板11的爬坡角度，同样也可以防止第一附加膜层13的破裂。
本公开文本实施例中，易破裂角度的具体值跟后续形成的第一附加膜层13的材料、制备工艺、膜层厚度相关。在实施例中，所述易破裂角度为约35°。当爬坡角度θ大于或等于约35°时，第一附加膜层13更容易破裂，因此，可以将爬坡角度θ设置成小于约35°，以防止第一附加膜层13的破裂。
如图1所示，所述膜层结构还包括与所述基板11相对设置的保护膜层15和将所述保护膜层15与所述基板11接合的粘贴胶14，且所述第一有机膜层12位于所述基板11与所述保护膜层15之间。其中，粘贴胶为片胶或者Dam-Filler(环氧树脂+吸气填充剂)胶材。
需要说明的是，在第一有机膜层12上形成的第一附加膜层13，同样位于基板11与保护膜层15之间。
下面将以形成在第一有机膜层12上的第一附加膜层13为第一无机膜层进行说明。
参照图2，示出了本公开文本实施例中的膜层结构的示意图之二。
在本公开文本的一种实施例中，所述第一有机膜层121为功能结构中的功能层。如图2所示，第一有机膜层121位于基板11上，第一无机膜层 131覆盖在第一有机膜层121上，在所述第一无机膜层131上还设置有至少一个由第二有机膜层122和第二无机膜层132构成的叠层。第二有机膜层122为封装结构中的有机膜层。
如图2所示，第一有机膜层121相对于第二有机膜层122，其膜层外缘最靠近基板11的边缘，也可以理解为，第一有机膜层121的膜层外缘与基板11边缘之间的距离小于第二有机膜层122的膜层外缘与基板11边缘之间的距离。将第一有机膜层121与基板11的爬坡角度设置成小于易破裂角度，能够防止第一无机膜层131的破裂。
其中，当第二有机膜层122和第二无机膜层132的叠层结构的层数越多时，可进一步提高阻水氧的能力。在实施例中，可以只将第一有机膜层121与基板11的爬坡角度设置成小于易破裂角度。在实施例中，还可以将第二有机膜层122与基板11的爬坡角度也设置成小于易破裂角度，防止第二无机膜层132的破裂，进一步提高阻水氧的能力。
在一种实施方式中，OLED器件的制作工艺流程为：在基板上制作驱动TFT(Thin Film Transistor，薄膜晶体管)，然后依次制作平坦层、阳极、像素界定层、发光层、阴极，最后再进行封装，完成OLED器件的制作。在制作发光层之前形成的结构一般称为背板结构，最后进行封装形成的结构称为封装结构。
背板结构中的有机膜层包括平坦层或像素限定层，也就是说第一有机膜层121可以为平坦层或像素限定层。当然，在其他一些工艺流程中，也可以在制作发光层之后再制作像素界定层。例如，当像素界定层为所述膜层结构中膜层外缘最靠近基板边缘的有机膜层时，可以将像素界定层与基板的爬坡角度设置成小于易破裂角度。
需要说明的是，为简化图2的示意图，未在图中示出驱动TFT、阳极、发光层、阴极的结构。但应当理解为，在实施例中，当第一有机膜层121为平坦层时，在第一有机膜层121与基板11之间还应设置有驱动TFT，在第一有机膜层121与第一无机膜层131之间还设置有阳极、像素界定层、发光层、阴极。在实施例中，当第一有机膜层121为像素限定层时，在第 一有机膜层121与基板11之间还应设置有驱动TFT、平坦层、阳极，在第一有机膜层121与第一无机膜层131之间还设置有发光层和阴极。
在实施例中，在第二有机膜层122和第二无机膜层132的叠层结构上，还设置有与所述基板11相对设置的保护膜层15。该保护膜层15通过粘贴胶14贴附在所述基板11上。
参照图3，示出了本公开文本实施例中的膜层结构的示意图之三。
在本公开文本的另一种实施例中，当所述第一有机膜层124为封装结构中的封装层时，该封装结构包括至少一个由第一有机膜层124和第一无机膜层134构成的叠层。第一无机膜层134覆盖在第一有机膜层124上。所述第一有机膜层124与所述基板11之间还设置有第二有机膜层123和第二无机膜层133，其中，所述第二有机膜层123可以为背板结构中的有机膜层。
如图3所示，第一有机膜层124相对于第二有机膜层123，其膜层外缘最靠近基板11的边缘。将第一有机膜层124与基板11的爬坡角度设置成小于易破裂角度，能够防止第一无机膜层134的破裂。
其中，所述背板结构中的有机膜层包括平坦层或像素限定层，也就是说第二有机膜层123可以为平坦层或像素限定层。
此外，在第一有机膜层124和所述第一无机膜层134的叠层结构上，还设置有与所述基板11相对设置的保护膜层15。该保护膜层15通过粘贴胶14贴附在所述基板11上。
本公开文本实施例中，通过在基板上设置有具有斜坡状边缘的第一有机膜层，且所述斜坡状边缘的上表面的切线与基板之间的夹角(也被称为“爬坡角度”)小于易破裂角度。通过控制第一有机膜层与基板的爬坡角度小于易破裂角度，减小后续形成在第一有机膜层上的第一附加膜层的爬坡倾斜角度(其上表面与基板之间的夹角)，从而减小后续形成的膜层在转角位置上由于两个方向的应力产生的合力，防止后续形成的膜层破裂，提高功能结构(例如，OLED器件)的寿命。
本公开文本实施例还提供了一种显示装置，该显示装置包括上述的膜 层结构。该膜层结构可以应用于电致发光显示面板。所述电致发光显示面板包括：基板，设置在所述基板上的第一有机膜层，设置在第一有机膜层上的第一附加膜层。第一有机膜层具有斜坡状边缘，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。在实施例中，所述第一有机膜层为所述膜层结构中膜层外缘最靠近所述基板边缘的有机膜层。
在实施例中，所述易破裂角度为约35°。所述第一有机膜层可以为功能结构中的有机膜层或封装结构中的有机膜层。所述第一附加膜层上可以包括第一无机膜层。
在本公开文本的实施例中，所述第一有机膜层为所述功能结构中的功能层，所述膜层结构还包括：位于所述第一无机膜层上的至少一个由第二有机膜层和第二无机膜层构成的叠层。
在本公开文本的实施例中，所述第一有机膜层为封装结构中的封装层，所述封装结构包括至少一个由所述第一有机膜层和所述第一无机膜层构成的叠层。
在实施例中，所述第一有机膜层包括平坦层或像素限定层。所述基板可以为刚性基板或柔性基板。
在实施例中，该膜层结构还包括与所述基板相对设置的保护膜层和将所述保护膜层与所述基板接合的粘贴胶，且所述第一有机膜层位于所述基板与所述保护膜层之间。
本公开文本实施例中，该显示装置包括膜层结构，通过在基板上设置具有斜坡状边缘的第一有机膜层，(例如，第一有机膜层为所述膜层结构中膜层外缘最靠近所述基板边缘的有机膜层)，且所述第一有机膜层与所述基板的爬坡角度(即，所述斜坡状边缘的上表面的切线与所述基板之间的夹角)小于易破裂角度。通过控制第一有机膜层与基板的爬坡角度小于易破裂角度，减小后续形成在第一有机膜层上的第一附加膜层的爬坡倾斜角度(即，第一附加膜层的斜坡状边缘的上表面的切线与所述基板之间的 夹角)，从而减小后续形成的第一附加膜层在转角位置上由于两个方向的应力产生的合力，防止后续形成的膜层破裂，提高功能结构(例如，OLED器件)的寿命。
参照图4，示出了本公开文本实施例中的一种膜层结构的制备方法的流程图。
步骤401，在基板上形成第一有机膜层。
本公开文本实施例中，在基板上形成第一有机膜层，由于第一有机膜层的类型不同，其制备的方法也有所不同。
步骤402，在第一有机膜层上形成第一附加层。其中，第一有机膜层具有斜坡状边缘，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。
例如，考虑到封装效果，所述第一有机膜层可以为所述膜层结构中膜层外缘最靠近所述基板边缘的有机膜层。且所述第一有机膜层与所述基板的爬坡角度小于易破裂角度。
参照图2，当所述第一有机膜层121为功能结构中的有机膜层时，可以采用曝光和显影工艺形成第一有机膜层121。通过调节曝光强度、曝光时间、显影液的浓度、显影时间等参数，使得第一有机膜层121与基板11的爬坡角度小于易破裂角度。
参照图3，当所述第一有机膜层124为封装结构中的有机膜层时，可以采用打印工艺或化学气相沉积工艺形成第一有机膜层124。通过调整第一有机膜层的材料黏度、基板的接触角、第一有机膜层的沉积速率等，使得第一有机膜层124与基板11的爬坡角度小于易破裂角度。针对第一有机膜层124为封装结构中的有机膜层，在基板上形成第一有机膜层的具体步骤可以为：在所述基板上形成第二有机膜层；在所述第二有机膜层上形成第二无机膜层；在所述第二无机膜层上形成所述第一有机膜层。
在实施例中，首先，在基板11上采用曝光和显影工艺形成第二有机膜层123。然后，在第二有机膜层123上采用化学气相沉积工艺或原子层沉 积工艺形成第二无机膜层133。最后，在第二无机膜层133上采用打印工艺或化学气相沉积工艺形成第一有机膜层124。
本公开文本实施例中，在基板上形成第一有机膜层之后，还可以在在所述第一有机膜层上形成第一无机膜层。第一无机膜层可以采用化学气相沉积工艺或原子层沉积工艺形成。
参照图2，在本发明的实施例中，当所述第一有机膜层121为功能结构中的有机膜层时，在第一有机膜层121上可以采用化学气相沉积工艺或原子层沉积工艺形成第一无机膜层131。
在本发明的实施例中，针对第一有机膜层121为功能结构中的有机膜层，在第一有机膜层上形成第一无机膜层后，还在所述第一无机膜层上形成至少一个由第二有机膜层和第二无机膜层构成的叠层。
在第一无机膜层131上(例如，采用打印工艺或化学气相沉积工艺)形成第二有机膜层122，在第二有机膜层122上(例如，采用化学气相沉积工艺或原子层沉积工艺)形成第二无机膜层132，可按照上述的工艺方法形成第二有机膜层122和第二无机膜层132的叠层结构，其叠层结构的层数大于或等于1层。
在实施例中，在形成第二有机膜层122和第二无机膜层132的叠层结构后，在叠层结构中的第二无机膜层132上贴附片胶或涂布Dam-Filler胶材形成贴附保护膜层的粘贴胶14，在粘贴胶14上贴附保护膜层15。
参照图3，当所述第一有机膜层124为封装结构中的有机膜层时，在第一有机膜层124上(例如，采用化学气相沉积工艺或原子层沉积工艺)形成第一无机膜层134。
在实施例中，在第一无机膜层134上贴附片胶或涂布Dam-Filler胶材形成贴附保护膜层的粘贴胶14，在粘贴胶14上贴附保护膜层15。
其中，第一无机膜层和第二无机膜层的材料可以采用SiNx(氮化硅)、SiCN(碳氮化硅)、SiON(氮氧化硅)、Al 2O 3(氧化铝)中的至少一种。
本公开文本实施例中，通过在基板上形成具有斜坡状边缘的第一有机膜层，(例如，所述第一有机膜层为所述膜层结构中膜层外缘最靠近所述 基板边缘的有机膜层)，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角(又被称为其“爬坡角度”)小于易破裂角度，该易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。通过控制第一有机膜层与基板的爬坡角度小于易破裂角度，减小后续形成在第一有机膜层上的膜层的爬坡倾斜角度，从而减小后续形成的膜层在转角位置上由于两个方向的应力产生的合力，防止后续形成的膜层破裂，提高OLED器件的寿命。
对于前述的方法实施例，为了简单描述，故将其都表述为一系列的动作组合，但是本领域技术人员应该知悉，本公开文本并不受所描述的动作顺序的限制，因为依据本公开文本，某些步骤可以采用其他顺序或者同时进行。其次，本领域技术人员也应该知悉，说明书中所描述的实施例均属于优选实施例，所涉及的动作和模块并不一定是本公开文本所必须的。
本说明书中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、商品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、商品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、商品或者设备中还存在另外的相同要素。
以上对本公开文本所提供的一种膜层结构、显示装置及膜层结构的制备方法，进行了详细介绍，本文中应用了具体个例对本公开文本的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本公开文本的方法及其核心思想；同时，对于本领域的一般技术人员，依据本公开文本 的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本公开文本的限制。

Claims (14)

  1. 一种膜层结构，包括：
    设置在所述基板上的第一有机膜层；以及
    设置在所述第一有机膜层上的第一附加膜层，
    其中，所述第一有机膜层具有斜坡状边缘，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。
  2. 根据权利要求1所述的膜层结构，其中，所述易破裂角度为35°。
  3. 根据权利要求1所述的膜层结构，所述第一有机膜层为在所述基板上的功能结构中的功能层或者为用于封装所述功能结构的封装结构中的封装层。
  4. 根据权利要求3所述的膜层结构，其中，所述第一附加膜层包括第一无机膜层。
  5. 根据权利要求4所述的膜层结构，所述第一有机膜层为所述功能结构中的功能层，所述膜层结构还包括：位于所述第一无机膜层上的至少一个由第二有机膜层和第二无机膜层构成的叠层。
  6. 根据权利要求4所述的膜层结构，所述第一有机膜层为所述封装结构中的封装层，所述封装结构包括至少一个由所述第一有机膜层和所述第一无机膜层构成的叠层。
  7. 根据权利要求5所述的膜层结构，其中，所述第一有机膜层包括平坦层或像素限定层。
  8. 根据权利要求1所述的膜层结构，还包括与所述基板相对设置的保护膜层和将所述保护膜层与所述基板接合的粘贴胶，且所述第一有机膜层位于所述基板与所述保护膜层之间。
  9. 根据权利要求1所述的膜层结构，其中，所述基板为刚性基板或柔性基板。
  10. 一种显示装置，其中，包括如权利要求1～9任一项所述的膜层结 构。
  11. 一种膜层结构的制备方法，其中，包括：
    在基板上形成第一有机膜层；以及
    在所述第一有机膜层上形成第一附加膜层，
    其中，所述第一有机膜层具有斜坡状边缘，且所述斜坡状边缘的上表面的切线与所述基板之间的夹角小于易破裂角度，所述易破裂角度是指在第一有机层的斜坡状边缘上形成的第一附加膜层发生破裂或倾向于发生破裂的角度。
  12. 根据权利要求11所述的制备方法，其中，在所述第一有机膜层上形成第一附加膜层包括：
    在所述第一有机膜层上形成第一无机膜层。
  13. 根据权利要求12所述的方法，其中，所述第一有机膜层为所述基板上的功能结构中的功能层，在所述第一有机膜层上形成第一无机膜层的步骤之后，所述方法还包括：
    在所述第一无机膜层上形成至少一个由第二有机膜层和第二无机膜层构成的叠层。
  14. 根据权利要求12所述的方法，其中，所述第一有机膜层为封装结构中的封装层层，所述在基板上形成第一有机膜层的步骤，包括：
    在所述基板上形成第二有机膜层；
    在所述第二有机膜层上形成第二无机膜层；
    在所述第二无机膜层上形成第一有机膜层。
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