WO2019201132A1 - 封装结构、显示装置 - Google Patents

封装结构、显示装置 Download PDF

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Publication number
WO2019201132A1
WO2019201132A1 PCT/CN2019/082105 CN2019082105W WO2019201132A1 WO 2019201132 A1 WO2019201132 A1 WO 2019201132A1 CN 2019082105 W CN2019082105 W CN 2019082105W WO 2019201132 A1 WO2019201132 A1 WO 2019201132A1
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WIPO (PCT)
Prior art keywords
layer
inorganic
package structure
inorganic layer
crack
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PCT/CN2019/082105
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English (en)
French (fr)
Inventor
刘庭良
肖云升
董向丹
龙跃
张锴
郭永林
马宏伟
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/633,892 priority Critical patent/US11309520B2/en
Publication of WO2019201132A1 publication Critical patent/WO2019201132A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present application relates to the field of display technologies, and in particular, to a package structure and a display device.
  • OLED Organic Light Emitting Diode
  • an embodiment of the present disclosure provides a package structure, including: a first inorganic layer, a first organic layer, and a second inorganic layer, which are sequentially stacked in a thickness direction of the package structure, wherein the first inorganic layer And at least one of the second inorganic layers is a crack prevention layer.
  • the crack prevention layer is provided with at least one through opening.
  • the crack prevention layer includes: a plurality of inorganic pattern units arranged in order from the inside to the outside, and a gap between the two adjacent inorganic pattern units, wherein the gap is the through opening.
  • the crack prevention layer includes a plurality of inorganic pattern units disposed concentrically with a gap between two adjacent inorganic pattern units.
  • one inorganic pattern unit located at the center is a rectangular block, and the remaining inorganic pattern units are all rectangular annular blocks.
  • the first inorganic layer and the second inorganic layer are both crack-proof layers; adjacent to the two inorganic patterns in the first inorganic layer along a thickness direction of the package structure The gap between the cells is interleaved with the gap between two adjacent inorganic pattern units in the second inorganic layer.
  • the package structure further includes: at least one package group disposed on the second inorganic layer; wherein the package group includes: a second layer disposed in a stack along the thickness direction of the package structure An organic layer and a third inorganic layer; the third inorganic layer is the crack prevention layer.
  • the gap has a width of 50-200 [mu]m.
  • the package structure further includes: a first region surrounding the first region and a second region; and one of the plurality of the inorganic pattern units in the layer of the crack prevention layer
  • An orthographic projection of the inorganic pattern unit within the face of the inorganic pattern unit encompasses an orthographic projection of the first region within the plane.
  • the second inorganic layer is the crack prevention layer; wherein a surface of the first organic layer adjacent to the first inorganic layer covers the first inorganic layer near the first organic layer The surface and the side that is connected to the surface.
  • the second inorganic layer is the crack prevention layer; wherein the second inorganic layer covers at least a side of the first organic layer near a surface of the first organic layer.
  • a projection of a gap between two adjacent inorganic pattern units in a plane of the first inorganic layer is within a range of the first inorganic layer along a thickness direction of the package structure .
  • the package structure further includes: a first region, a second region located at a periphery of the first region; wherein an orthographic projection of the first inorganic layer in a plane of the first inorganic layer a distance from the edge to the edge of the orthographic projection of the first region in the plane is 100-200 ⁇ m; and/or the edge of the second inorganic layer is orthographically projected within the plane of the second inorganic layer
  • the distance of the first region from the edge of the orthographic projection in the plane is 400-600 ⁇ m.
  • an embodiment of the present disclosure further provides a display device, including: a substrate provided with at least one OLED device, and a package structure for packaging the OLED device, the package structure being any of the above Package structure.
  • the substrate further includes: a display area, a non-display area located at a periphery of the display area;
  • the package structure includes: a first area, a second area located at a periphery of the first area;
  • the contour of the orthographic projection of the first zone on the face of the package structure encloses the contour of the orthographic projection of the display zone within the face.
  • FIG. 1 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to the related art
  • FIG. 2 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 3 is a schematic structural view of another package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 4 is a schematic cross-sectional view of another package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 5 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 6 is a schematic cross-sectional view of another package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 7 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to some embodiments of the present disclosure.
  • FIG. 8 is a schematic top plan view of a crack prevention layer in a package structure according to some embodiments of the present disclosure.
  • FIG. 9 is a schematic top plan view of still another crack prevention layer in a package structure according to some embodiments of the present disclosure.
  • FIG. 10 is a schematic top plan view of another crack prevention layer in a package structure according to some embodiments of the present disclosure.
  • FIG. 11 is a cross-sectional structural view of another package structure along a thickness direction thereof according to some embodiments of the present disclosure.
  • FIG. 12 is a schematic cross-sectional view of another package structure along a thickness direction thereof according to some embodiments of the present disclosure.
  • FIG. 13 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 14 is a schematic top plan view of a package structure according to some embodiments of the present disclosure.
  • 15 is a schematic cross-sectional view of another package structure along a thickness direction thereof according to some embodiments of the present disclosure
  • 16 is a schematic top plan view of another package structure according to some embodiments of the present disclosure.
  • FIG. 17 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to some embodiments of the present disclosure.
  • FIG. 18 is a schematic cross-sectional view of a package structure along a thickness direction thereof according to some embodiments of the present disclosure.
  • FIG. 19 is a schematic top plan view of another package structure according to some embodiments of the present disclosure.
  • FIG. 20 is a schematic structural diagram of a display device along a thickness direction thereof according to some embodiments of the present disclosure
  • FIG. 21 is a schematic structural diagram of still another display device along a thickness direction thereof according to some embodiments of the present disclosure.
  • FIG. 22 is a schematic structural view of another display device along a thickness direction thereof according to some embodiments of the present disclosure.
  • the core component of the OLED display is the OLED device, which has the advantages of high color gamut and high contrast as a new display device.
  • the OLED device comprises: an anode, a light-emitting layer and a cathode which are sequentially stacked, and the light-emitting principle is: under the driving of an applied voltage, the positively charged holes excited from the anode and the negatively charged electrons excited from the cathode are The light-emitting layer recombines, thereby releasing energy, so that molecules of the luminescent material in the luminescent layer are excited by the energy, thereby generating light emission.
  • the OLED device further includes: a hole injection layer, a hole transport layer disposed between the anode and the light-emitting layer, and sequentially stacked in a direction from the anode toward the light-emitting layer; and an electron transport layer between the cathode and the light-emitting layer.
  • the hole injection layer, the hole transport layer and the electron transport layer are usually made of a functional material to improve the transmission efficiency of holes and electrons from the anode and the cathode to the light-emitting layer, thereby improving the luminous efficiency of the OLED device. .
  • the above-mentioned luminescent materials, functional materials and electrode materials in the OLED device are very sensitive to atmospheric pollutants, water vapor, and oxygen, and are susceptible to electrochemical corrosion in an environment containing water vapor and oxygen, causing damage to OLED devices. . Therefore, the OLED device must be effectively packaged to isolate the OLED device from moisture, oxygen, etc. in the atmosphere to prevent moisture and oxygen from entering the OLED.
  • the related art provides an encapsulation layer for encapsulating a plurality of OLED devices in a display panel.
  • the encapsulation layer is a laminated structure in which an inorganic film 01, an organic film 02, and an inorganic film 01 are alternately arranged.
  • one or two inorganic films 01 in the above structure are uniform planar structures, and after the OLED device is encapsulated by the encapsulation layer, when the inorganic film 01 is cracked during long-term use, The toughness of the inorganic film 01 is lower than that of the organic film 02, and the generated cracks may extend along the entire inorganic film 01, resulting in failure of the package.
  • the generated crack is transmitted to the display area along the edge of the display panel, so that the OLED device in the display region is permeable to water vapor and oxygen. Electrochemical corrosion occurs when entering, which causes the display product to be prone to random failure, which greatly affects the reliability and yield of the display product.
  • Some embodiments of the present disclosure provide a package structure 100, as shown in FIGS. 2-4, including: a first inorganic layer 10, a first organic layer 30, and a first layer stacked in the thickness direction Z-Z' of the package structure 100.
  • the second inorganic layer 20, at least one of the first inorganic layer 10 and the second inorganic layer 20 is a crack prevention layer 40.
  • the above-mentioned “at least one of the first inorganic layer 10 and the second inorganic layer 20 is the crack prevention layer 40" means that the structure and the defense of at least one of the first inorganic layer 10 and the second inorganic layer 20 are The structure of the split layer 40 is the same.
  • the first inorganic layer 10 is a crack prevention layer 40; or, as shown in FIG. 3, the second inorganic layer 20 is a crack prevention layer 40; or, as shown in FIG. 4, the first inorganic layer 10 is One layer of crack prevention layer 40, and the second inorganic layer 20 is another layer of crack prevention layer 40.
  • At least one of the first inorganic layer 10 and the second inorganic layer 20 described above is an inorganic layer capable of preventing crack propagation.
  • the first organic layer 30 located between the two inorganic layers is mainly made of an organic material, and the organic material has a long molecular chain, so that the organic material is internally The space gap is large, which can provide a certain buffering effect for the crack, thereby effectively blocking the crack;
  • the first inorganic layer 10 and the second inorganic layer 20 respectively located on both sides of the first organic layer 30 are mainly Made of an inorganic material, the structure density is higher than that of the organic material, and has a good blocking effect on water vapor and oxygen, and at least one of the first inorganic layer 10 and the second inorganic layer 20 is a crack-proof layer. In the case of 40, it is also possible to prevent the crack from extending.
  • the device to be packaged (for example, an OLED device) can be avoided during use of the display device including the package structure 100 and the OLED device. Or alleviating the problem that the water vapor and the oxygen gas enter the inside of the display device along the crack due to the occurrence of cracks on the package structure 100, thereby causing electrochemical corrosion of the OLED device.
  • the crack prevention layer 40 is provided with at least one through opening 40a.
  • one through opening 40a refers to a portion of the crack preventing layer 40 that penetrates the crack preventing layer 40, and this portion is not connected to the edge of the crack preventing layer 40.
  • the first inorganic layer 10 since the first inorganic layer 10, the first organic layer 30, and the second inorganic layer 20 are sequentially stacked along the thickness direction Z-Z' of the package structure 100, Of the three layers of the first inorganic layer 10, the first organic layer 30, and the second inorganic layer 20, the adjacent two layers are in close contact with each other.
  • the organic material generally has a certain fluidity, as shown in FIGS. 5 and 7, when the first inorganic layer 10 is the crack prevention layer 40, the first organic layer 30 is prepared over the first inorganic layer 10. During the process, a part of the organic material is filled into the through opening 40a to fill the through opening 40a, which is advantageous for improving the flatness of the entire package structure 100.
  • the cross-sectional shape of the through opening 40a is only a trapezoid, and the trapezoid is directed in the direction from the first inorganic layer 10 to the second inorganic layer 20.
  • the structure is a structure in which the upper opening is larger than the lower opening, but some embodiments of the present disclosure are not limited thereto, and any one of the through openings 40a may have a rectangular shape or a trapezoid having an upper opening smaller than the lower opening, as long as the crack prevention layer 40 can be penetrated. Just fine.
  • the crack prevention layer 40 is provided with at least one through opening 40a, the crack stops when it extends to any one of the through openings 40a, thereby preventing the crack from extending to the entire crack prevention layer 40. Further, the crack is further expanded to improve the product yield of the display device including the package structure 100 and the OLED device described above.
  • the number, shape, and distribution manner of the through openings 40a in the crack prevention layer 40 are not limited, and may be flexibly set according to specific application requirements.
  • a large number and/or a wide distribution of through openings 40a may be disposed on the crack prevention layer 40 to satisfy the use of the above display device in a use scenario where there is a possibility of generating a large number and/or cracks from various directions. A requirement to block further cracking of the crack throughout the crack protection layer 40.
  • a small number and/or a centrally distributed through opening 40a may be provided on the crack prevention layer 40 to meet the use requirements of the above display device in a use scenario where it is possible to generate a small number and/or cracks from a single direction. Thereby a further extension of the crack in the entire crack protection layer 40 is blocked.
  • the crack prevention layer 40 may also be modified by a specific structure of the inorganic layer such that at least one of the first inorganic layer 10 and the second inorganic layer 20 has crack prevention. The function.
  • the specific structure of the crack prevention layer 40 may be alternately arranged by a dense portion and a loose portion, so that when cracks are generated on the crack prevention layer 40, since different regions on the crack prevention layer 40 have different densities, Utilizing the structural non-uniformity of the crack-proof layer 40 itself makes it difficult for the crack to continue to extend between different portions of the crack-proof layer 40, thereby blocking further extension of the crack throughout the crack-proof layer 40.
  • the structure of the crack prevention layer 40 will be described in detail below by taking the manner in which the through opening 40a is provided in the crack prevention layer 40 as an example.
  • the crack prevention layer 40 may be provided with at least one through opening 40a, and each of the through openings 40a may have a strip shape, for example.
  • only the number of the through openings 40a is four, and the four through openings 40a are symmetrically arranged as an example, and the specific number and arrangement manner are not limited.
  • any of the crack prevention layers 40 includes: a plurality of inorganic layers arranged in order from the inside to the outside.
  • the pattern unit 41 has a gap between the adjacent two inorganic pattern units 41, and the gap is the above-described through opening 40a, that is, one gap is one through opening 40a.
  • each ring includes but is not limited to the rectangular ring illustrated in FIGS. 9-10, and may also be a ring, an elliptical ring, or a diamond ring. Wait for other rings.
  • one inorganic pattern unit 41 located at the center is a rectangular block, and the remaining inorganic pattern units 41 are all rectangular annular blocks to sequentially surround the central rectangular block from the inside to the outside.
  • the structure of at least one of the first inorganic layer 10 and the second inorganic layer 20 is the same as the structure of the crack prevention layer 40, which means:
  • the first inorganic layer 10 includes a plurality of inorganic pattern units 41 arranged in this order from the inside to the outside, and a gap is formed between the adjacent two inorganic pattern units 41.
  • the second inorganic layer 20 includes a plurality of inorganic pattern units 41 arranged in this order from the inside to the outside, and a gap is provided between the adjacent two inorganic pattern units 41.
  • the first inorganic layer 10 includes: a plurality of inorganic pattern units 41 arranged in this order from the inside to the outside, a gap between two adjacent inorganic pattern units 41; and, a second inorganic
  • the layer 20 also includes a plurality of inorganic pattern units 41 arranged in this order from the inside to the outside, with a gap between the adjacent two inorganic pattern units 41.
  • the organic material generally has a certain fluidity
  • the first inorganic layer 10 is the crack preventing layer 40
  • a part of the first organic layer 30 is prepared over the first inorganic layer 10, and a part thereof.
  • the organic material is filled into the gap between the adjacent two inorganic pattern units 41 to fill the gap, which is advantageous for improving the flatness of the package structure 100 as a whole.
  • the width of the gap between the adjacent two inorganic pattern units 41 is not limited. Since the adjacent two inorganic pattern units 41 are arranged one around the other, the width of the gap between the adjacent two inorganic pattern units 41 may be equal everywhere, that is, a value; or, adjacent The width of the gap between the two inorganic pattern units 41 may also be set such that different regions are different from each other; or, the width of the gap between the adjacent two inorganic pattern units 41 may be set such that different regions are not completely identical.
  • the width of the gap between two adjacent inorganic pattern units 41 may be, for example, 50-200 ⁇ m, which can effectively block the extension of cracks while maintaining a certain structural strength of the crack-proof layer 40 as a whole, which is advantageous for further improvement. Packaging effect.
  • the width of the gap between the adjacent two inorganic pattern units 41 may be taken from any of 70 ⁇ m, 90 ⁇ m, 100 ⁇ m, 120 ⁇ m, 140 ⁇ m, 150 ⁇ m, 160 ⁇ m, and 180 ⁇ m.
  • the inorganic material structure in the related art Due to the high density of the inorganic material structure in the related art, it has a good blocking effect on water vapor and oxygen, but the crack is also more easily transmitted on the inorganic material.
  • the organic material has a long molecular chain and a large spatial gap, which has a good buffering effect on the crack.
  • the organic material due to its large spatial gap, the organic material has a poor blocking effect on water vapor and oxygen.
  • the crack prevention layer 40 illustrated in FIG. 9 is taken as an example.
  • a crack is generated on the crack prevention layer 40 (illustrated by a thick solid line in FIG. 9)
  • two adjacent inorganic patterns are formed.
  • the package structure 100 includes at least one layer of crack prevention layer 40, and the crack prevention layer 40 includes a plurality of inorganic pattern units 41 sequentially surrounded from the inside to the outside, and adjacent There is a gap between the two inorganic pattern units 41 so that the crack cannot extend over the crack prevention layer 40, thereby effectively preventing the extension of the crack.
  • the anti-crack layer 40 is included from the inside to the outside.
  • the plurality of inorganic pattern units 41 which are sequentially wound, are disposed in such a manner as to block cracks from extending from the edges to the center of the package structure 100.
  • some embodiments of the present disclosure pass at least one of the first inorganic layer 10 and the second inorganic layer 20 in the package structure 100.
  • the structure is set to the structure of the crack prevention layer 40, so that at least one of the first inorganic layer 10 and the second inorganic layer 20 can function to prevent crack extension, and the probability of crack extension is lowered compared with the encapsulation layer provided by the related art. Thereby, the packaging effect of the package structure 100 is improved.
  • the package structure 100 since the gap in the crack prevention layer 40 can block the extension and accumulation of the tensile force, the package structure 100 provided by some embodiments of the present disclosure can reduce the package structure 100 by using the design of the crack prevention layer 40 having a gap. The risk of edge breakage, thereby improving the package reliability of the above package structure 100 when applied to a flexible display device; and, the gap in the crack prevention layer 40 is filled with an organic material or corresponds to the first organic layer 30, due to the organic material to the water vapor The oxygen barrier effect is poor.
  • the position of the gap in the crack prevention layer 40 is determined before the test, and the position of the water vapor intrusion can be detected simply and effectively through the position of the gap and/or The degree has greatly improved the reliability of process production.
  • the plurality of inorganic pattern units 41 in any of the anti-cracking layers 40 may be formed synchronously by the same process to simplify the preparation process of the crack-preventing layer 40.
  • the above-described crack prevention layer 40 may be formed by an evaporation process or a chemical vapor deposition (CVD) process.
  • the material for forming the crack prevention layer 40 by the evaporation process or the chemical vapor deposition process is an inorganic material.
  • any of the crack preventing layers 40 includes a plurality of inorganic pattern units 41 arranged in order from the inside to the outside, and a gap is provided between the adjacent two inorganic pattern units 41, the adjacent two inorganic pattern units 41 are Do not touch each other (ie, independent of each other).
  • a Fine Metal Mask may be used to form the film formed by an evaporation process or a chemical vapor deposition process.
  • the gaseous inorganic material is deposited on the corresponding substrate through the opening portion of the FMM to form a plurality of spaced apart inorganic pattern units 41 in the crack prevention layer 40.
  • the thicknesses and materials of the first inorganic layer 10, the second inorganic layer 20, and the first organic layer 30 described above are not defined.
  • the thickness of the first organic layer 30 is greater than the thickness of any of the first inorganic layer 10 and the second inorganic layer 20.
  • the material of the first organic layer 30 may be selected from one or a combination of polyvinyl alcohol, urethane acrylate polymer, and polyimide resin.
  • the thickness and material of the first inorganic layer 10 and the second inorganic layer 20 may be identical or different.
  • the thickness of the first inorganic layer 10 and the second inorganic layer 30 may be, for example, 0.1 to 1.5 ⁇ m, and may be 0.5 ⁇ m or 1.0 ⁇ m as an example.
  • the thickness of the first organic layer 30 may be, for example, 5 to 12 ⁇ m, and exemplarily, may be 8 ⁇ m or 10 ⁇ m.
  • the material of any of the first inorganic layer 10 and the second inorganic layer 20 may be, for example, selected from one or a combination of aluminum oxide, zinc oxide, titanium oxide, silicon dioxide, silicon nitride, and zirconium oxide.
  • the crack prevention layer 40 illustrated in FIGS. 9 and 10 may include a plurality of inorganic pattern units 41 disposed concentrically with a gap between adjacent inorganic pattern units 41, and the gap is the above-mentioned through Opening 40a.
  • the above-mentioned “concentric arrangement” means that the centers of the plurality of inorganic pattern units 41 arranged in order from the inside to the outside overlap.
  • the structure of at least one of the first inorganic layer 10 and the second inorganic layer 20 is the same as the structure of the crack prevention layer 40, which means:
  • the first inorganic layer 10 includes a plurality of inorganic pattern units 41 arranged concentrically with a gap between adjacent two inorganic pattern units 41.
  • the second inorganic layer 20 includes a plurality of inorganic pattern units 41 arranged concentrically with a gap between adjacent two inorganic pattern units 41.
  • the first inorganic layer 10 includes: a plurality of inorganic pattern units 41 arranged concentrically, having a gap between two adjacent inorganic pattern units 41; and the second inorganic layer 20 also includes The plurality of inorganic pattern units 41 disposed concentrically have a gap between the adjacent two inorganic pattern units 41.
  • the plurality of inorganic pattern units 41 arranged concentrically may be identical in size, or completely different, or not identical, depending on the specific structural requirements of the package structure described above.
  • the plurality of inorganic patterns 41 may be concentric square blocks and square rings that surround the square blocks from the inside to the outside as shown in FIG. 9 and FIG. 10, or may be concentric circular blocks and sequentially surrounded from the inside to the outside.
  • the circular ring or other shape of the circular block may depend on the shape of the structure to be packaged by the package structure 100.
  • the first inorganic layer 10 and the second inorganic layer 30 are both crack-proof layers 40 along the thickness direction Z-Z′ of the package structure 100, A gap between two adjacent inorganic pattern units 41 in the first inorganic layer 10 (40) is alternately arranged with a gap between two adjacent inorganic pattern units 41 in the second inorganic layer 20 (40).
  • the gap between the adjacent two inorganic pattern units 41 in (40) does not overlap.
  • the area surrounded by the thick solid line a1 is the outline of the first inorganic layer 10
  • the area surrounded by the thin solid line a2 is the outline of the second inorganic layer 20
  • the area surrounded by the dotted line b is The outline of an organic layer 30, the first organic layer 30 is filled with a gap in the first inorganic layer 10.
  • the first organic layer 30 may be formed by an inkjet printing technique, and since the organic material has fluidity, the organic material may be filled into the gap of the first inorganic layer 10 during the inkjet printing process, so that the first formed The organic layer 30 still maintains a relatively flat surface.
  • the distance between the first inorganic layer 20 and the OLED device in the package structure 100 is smaller than the distance between the second inorganic layer 20 and the OLED device, that is, the second The inorganic layer 20 is relatively closer to the external environment.
  • the package structure 100 further includes: at least one package group G disposed on the second inorganic layer 20 , the package group G includes a thickness direction Z-Z along the package structure 100 'The second organic layer 50 and the third inorganic layer 60 are sequentially stacked; the third inorganic layer 60 is the crack prevention layer 40.
  • Fig. 15 corresponds to the A-A' direction in Fig. 9.
  • the specific structure of the third inorganic layer 60 as the crack prevention layer 40 can be referred to the above description.
  • the third inorganic layer 60 includes a plurality of inorganic pattern units 41 sequentially surrounded from the inside to the outside, and two adjacent ones.
  • the gap between the inorganic pattern units 41 (that is, the through opening 40a) will be described as an example.
  • the first inorganic layer 10 and the second inorganic layer 20 are both illustrated as an example of the crack prevention layer 40 .
  • Some embodiments of the present disclosure are not limited thereto, and may be the first inorganic layer 10 or the second inorganic layer.
  • 20 is the crack prevention layer 40.
  • the package structure 100 further includes one package group G disposed on the second inorganic layer 20 (ie, the second organic layer 50 and the third inorganic layer 60 located above is a group) is illustrated.
  • the package structure 100 further includes a plurality of package groups G
  • the plurality of package groups G are sequentially stacked along the thickness direction Z-Z' of the package structure 100, that is, the third inorganic layer 60 is sequentially formed to be sequentially formed.
  • the second organic layer 50 and the third inorganic layer 60 are each formed with a third inorganic layer 50, and a third inorganic layer 60 is formed correspondingly.
  • the package effect of the package structure 100 as a whole can be further improved.
  • the second inorganic layer 20 is a crack prevention layer 40 , that is, includes a plurality of inorganic pattern units arranged in order from the inside to the outside, and has a gap between adjacent two inorganic pattern units (ie, In the case of the through opening 40a), the gap between the adjacent two inorganic pattern units 41 in the third inorganic layer 60 (40) is adjacent to the second inorganic layer 20 in the thickness direction Z-Z' of the package structure 100
  • the gaps between the two inorganic pattern units 41 are alternately arranged to block water vapor and oxygen from directly entering the gaps in the second inorganic layer 20 from the gaps in the third inorganic layer 60 (40), thereby further improving the encapsulation effect.
  • the package structure 100 further includes a plurality of package groups G disposed on the second inorganic layer 20, along the thickness direction Z-Z' of the package structure 100, in the adjacent two package groups G,
  • the gaps between the adjacent two inorganic pattern units 41 in the respective third inorganic layer 60 (40) are staggered, so that it is more difficult for water vapor and oxygen to enter the lower second inorganic layer through the plurality of package groups G disposed in the stack. Thereby further improving the packaging effect.
  • the above various structures are arranged in such a manner as to better block moisture and oxygen from passing through the package structure 100.
  • the package structure 100 includes a first area A1 (illustrated in FIG. 10 and FIG. 16 only with a rectangular area surrounded by a thick broken line at the center) and surrounded by The second area A2 of the first area A1 (in FIG. 10 and FIG. 16 is only a rectangular annular area surrounded by thick broken lines).
  • one inorganic pattern unit 41 located at the center is in the plane of the inorganic pattern unit
  • the contour of the orthographic projection encloses the contour of the orthographic projection of the first zone A1 within the plane.
  • the above-mentioned “face of the inorganic pattern unit” means: the surface of the first organic layer 30 close to the side of the second inorganic layer 20; when the first inorganic layer 10 In the case of the crack preventing layer 40, the above-mentioned “face of the inorganic pattern unit” means the surface of the substrate on which the device to be packaged is placed.
  • the first inorganic layer 10 is the crack prevention layer 40
  • the gap in the crack prevention layer 40 is outside the first area A1, and one inorganic pattern unit 41 in the center covers the entire first area A1;
  • the second inorganic layer 20 is the crack prevention layer 40
  • the gap in the crack prevention layer 40 is outside the first region A1, and one inorganic pattern unit 41 at the center covers the entire first region A1.
  • the first area A1 of the package structure 100 corresponds to the display area of the display device, by making the plurality of inorganic pattern units 41 in the crack prevention layer 40 (for example, concentrically arranged) Among the inorganic pattern units 41), the orthographic projection of an inorganic pattern unit 41 located at the center in the plane of the inorganic pattern unit surrounds the orthographic projection of the first area A1 in the plane, thereby avoiding moisture in the air.
  • Oxygen enters the display area of the display device through the gaps on the first inorganic layer 10 and the second inorganic layer 20, thereby further improving the effect of the package structure 100 blocking moisture and oxygen.
  • the second inorganic layer 20 is a crack prevention layer 40; the first organic layer 30 is adjacent to the surface of the first inorganic layer 10 to cover the first inorganic layer 10 near the first organic layer. The surface of the layer and the side joined to the surface.
  • the surface of the first organic layer 30 close to the first inorganic layer 10 may also be referred to as a lower surface of the first organic layer 30; the first inorganic layer 10 is close to The surface of the first organic layer may also be referred to as the upper surface of the first inorganic layer 10.
  • the second inorganic layer 20 is a crack prevention layer 40; the second inorganic layer 20 is adjacent to a surface of the first organic layer 30 covering at least a side surface of the first organic layer 30.
  • the surface of the second inorganic layer 20 close to the first organic layer 30 may also be referred to as the lower surface of the second inorganic layer 20 in the direction from the first inorganic layer 10 to the first organic layer 30.
  • the first organic layer 30 formed on the surface of the first inorganic layer 10 completely covers the first inorganic layer 10, and the second inorganic layer 20 formed thereafter covers the lower portion.
  • the second inorganic layer 20 is a crack-proof layer, that is, has a gap, the gap in the second inorganic layer 20 does not cover the first organic layer 30, and the other regions cover the first organic layer 30.
  • the package structure 100 when the package structure 100 is applied to the display device, if a crack occurs on the second inorganic layer 20, the crack does not extend to the underlying first inorganic layer 10, and the first inorganic layer 10 is located at the second. Below the inorganic layer 20, therefore, the external force received when the entire display device is bent is extremely small, and the possibility of occurrence of cracks is small. Therefore, when the first inorganic layer 10 is not a crack prevention layer, that is, not in the first inorganic layer 10 The gap is also provided, and the first inorganic layer 10 can also be made to have a better encapsulation effect.
  • a gap between two adjacent inorganic pattern elements 41 The projection in the plane in which the first inorganic layer 10 is located is within the range of the first inorganic layer 10.
  • the first inorganic layer 10 is directly under the gap between the adjacent inorganic pattern units 41, and water vapor and oxygen are blocked by the first inorganic layer 10, failing to pass.
  • the gap between the adjacent two inorganic pattern units 41 in the second inorganic layer 20 directly passes down through the package structure 100, thereby improving the packaging effect.
  • the first inorganic layer 10 since the side of the first inorganic layer 10 is covered by the first organic layer 30, the first inorganic layer 10 is not in contact with the second inorganic layer 20, in order to avoid The water vapor and oxygen pass from the package structure 100 into the first region of the package structure 100 from the interval b1 between the first inorganic layer 10 and the second inorganic layer 20 (shown in bold in FIG. 17).
  • the interval b1 between the first inorganic layer 10 and the second inorganic layer 20 should be made to have a certain distance from the first region.
  • the distance h1 of the edge of the first inorganic layer 10 in the plane of the first inorganic layer 10 to the edge of the first region in the plane of the orthographic projection is 100-200 ⁇ m, for example. It may be any one of 120 ⁇ m, 140 ⁇ m, 160 ⁇ m, and 180 ⁇ m.
  • the orthographic projection in the plane of the first inorganic layer 10 is also a rectangle, and there are four edges of the orthographic projection, where h1 refers to the first The distance between the two edges of the inorganic layer 10 that are adjacent to each other in the plurality of edges of the orthographic projections in the plane and the plurality of edges of the orthographic projection of the first region in the plane.
  • the distance h2 of the edge of the second inorganic layer 20 in the plane of the second inorganic layer 20 to the edge of the first region in the plane of the orthographic projection is 400-600 ⁇ m, for example, 450 ⁇ m, 500 ⁇ m, 550 ⁇ m. Any value.
  • the orthographic projection in the plane of the second inorganic layer 20 is also a rectangle, and there are four edges of the orthographic projection, where h2 refers to the The distance between the two edges of the two inorganic layers 20 that are adjacent to each other in the plurality of edges of the orthographic projections in the plane and the plurality of edges of the orthographic projection of the first region in the plane.
  • the package structure 100 described above may further include a protective layer disposed on the outermost side for avoiding the inorganic layer of the surface being scratched during application of the package structure 100 to the display device.
  • Some embodiments of the present disclosure also provide a display device, as shown in FIG. 20, including a substrate 200 provided with at least one OLED device and the above described package structure 100 for packaging an OLED device.
  • the substrate 200 includes a substrate, and at least one OLED device disposed on a surface of the substrate.
  • the above-mentioned “substrate 200 provided with at least one OLED device” is represented by a single layer body, and the specific structure of the substrate 200 is not actually drawn; similarly, only The above-mentioned package structure 100 is represented by a single layer.
  • the specific structure in the package structure 100 refer to the foregoing description, and details are not described herein again.
  • the display device may specifically be an OLED display device, and may be any product or component having a display function such as a display panel, a device including a display panel, a display, a television, a mobile phone, a tablet computer, or the like.
  • the manner of bonding between the package structure 100 and the substrate 200 provided with the OLED device is not limited.
  • the package structure 100 and the substrate 200 provided with the OLED device may be bonded by optical glue to
  • the package of the OLED device on the substrate 200 is realized; or the package structure 100 described above may be directly formed on the substrate 200 provided with the OLED device, that is, the first inorganic layer 10 in the package structure 100 is directly formed (for example, directly deposited).
  • the substrate 200 is provided with an OLED device to implement packaging of the OLED device.
  • an LTPS (Low Temperature Poly-silicon) backplane circuit structure for driving the OLED device to emit light is further formed on the substrate 200.
  • the substrate includes: a display area S1 and a non-display area S2.
  • the outline of the first area A1 of the package structure 100 on the surface of the package structure 100 surrounds the display area S1.
  • the orthographic projection of the first region of the package structure 100 on the surface of the package structure 100 surrounds the orthographic projection of the display region in the plane may be: the first region is located in the package structure 100
  • the contour of the orthographic projection of the surface is exactly the same as the shape of the contour of the orthographic projection of the display area in the plane, that is, completely coincident; or the contour of the orthographic projection of the first region on the surface of the encapsulation structure 100 covers the display area.
  • the shape of the orthographic projection of the first region on the surface of the package structure 100 and the contour of the orthographic projection of the display region in the plane are not necessarily concentric patterns, as long as the contour of the orthographic projection of the display region in the plane is
  • the first region may be within the range of the orthographic projection of the surface of the package structure 100.
  • the first inorganic layer 10 in the package structure 100 is first.
  • the distance h4 from the edge of the orthographic projection in the plane of the inorganic layer 10 to the edge of the substrate is 800-1000 ⁇ m, for example, any value of 850 ⁇ m, 900 ⁇ m, 950 ⁇ m; the second inorganic layer 20 in the package structure 100 is The distance h3 from the edge of the orthographic projection in the plane of the second inorganic layer 10 to the edge of the substrate is 400-600 ⁇ m, and may be any value of 450 ⁇ m, 500 ⁇ m, or 550 ⁇ m, for example.
  • the interval between the first inorganic layer 10 and the second inorganic layer 20 is made to have a certain distance from the display region, and water vapor and oxygen are prevented from entering the display region of the substrate through the above interval, thereby further improving the packaging effect.

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Abstract

一种封装结构（100）和显示装置，该封装结构（100）包括：沿所述封装结构（100）的厚度方向依次层叠设置的第一无机层（10）、第一有机层（30）以及第二无机层（20），所述第一无机层（10）和所述第二无机层（20）中至少一层为防裂层（40）。

Description

封装结构、显示装置
本申请要求于2018年04月17日提交中国专利局、申请号为201810345269.1、申请名称为“一种封装盖板、显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种封装结构、显示装置。
背景技术
有机电致发光二极管(Organic Light Emitting Diode，简称OLED)显示器由于具有轻薄、宽视角、功耗低、响应速度快、可实现柔性显示等优势，因此，OLED显示器在显示领域及照明领域得到了广泛应用。
发明内容
一方面、本公开实施例提供一种封装结构，包括：沿所述封装结构的厚度方向依次层叠设置的第一无机层、第一有机层以及第二无机层，其中，所述第一无机层和所述第二无机层中至少一层为防裂层。
在一些实施例中，所述防裂层上设置有至少一个贯通开口。
在一些实施例中，所述防裂层包括：由内向外依次环绕设置的多个无机图案单元，相邻两个所述无机图案单元之间具有间隙，所述间隙为所述贯通开口。
在一些实施例中，所述防裂层包括：同心设置的多个的无机图案单元，相邻两个所述无机图案单元之间具有间隙。
在一些实施例中，在任一层所述防裂层中，位于中心的一个无机图案单元为矩形块，其余所述无机图案单元均为矩形环状块。
在一些实施例中，所述第一无机层和所述第二无机层均为防裂层；沿所述封装结构的厚度方向，所述第一无机层中的相邻两个所述无机图案单元之间的所述间隙与所述第二无机层中的相邻两个所述无机图案单元之间的所述间隙交错设置。
在一些实施例中，所述封装结构还包括：设置在所述第二无机层上的至少一个封装组；其中，所述封装组包括：沿所述封装结构的厚度方向依次层叠设置的第二有机层和第三无机层；所述第三无机层为所述防裂层。
在一些实施例中，所述间隙的宽度为50-200μm。
在一些实施例中，所述封装结构还包括：第一区、包围所述第一区第二区；在任一层所述防裂层中的多个所述无机图案单元中，位于中心的一个所述无机图案单元在该无机图案单元所在面内的正投影的轮廓包围所述第一区的在该面内的正投影轮廓。
在一些实施例中，所述第二无机层为所述防裂层；其中，所述第一有机层靠近所述第一无机层的表面覆盖所述第一无机层靠近所述第一有机层的表面和与该表面连接的侧面。
在一些实施例中，所述第二无机层为所述防裂层；其中，所述第二无机层靠近所述第一有机层的表面至少覆盖所述第一有机层的侧面。
在一些实施例中，沿所述封装结构的厚度方向，相邻两个所述无机图案单元之间的间隙在所述第一无机层所在面内的投影在所述第一无机层的范围内。
在一些实施例中，所述封装结构还包括：第一区、位于所述第一区外围的第二区；其中，所述第一无机层在所述第一无机层所在面内的正投影的边缘到所述第一区在该面内的正投影的边缘的距离为100-200μm；和/或，所述第二无机层在所述第二无机层所在面内的正投影的边缘到所述第一区在该面内的正投影的边缘的距离为400-600μm。
另一方面、本公开实施例还提供一种显示装置，包括：设置有至少一个OLED器件的基板，以及用于封装所述OLED器件的封装结构，所述封装结构为上述任一项所述的封装结构。
在一些实施例中，所述基板还包括：显示区、位于所述显示区外围的非显示区；所述封装结构包括：第一区、位于所述第一区外围的第二区；所述第一区在所述封装结构所在面的正投影的轮廓包围所述显示区在该面内的正投影的轮廓。
附图说明
为了更清楚地说明本公开实施例或相关技术中的技术方案，下面将对本公开实施例或相关技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为相关技术提供的一种封装结构沿其厚度方向的剖面结构示意图；
图2为本公开一些实施例提供的一种封装结构沿其厚度方向的剖面结构示意图；
图3为本公开一些实施例提供的再一种封装结构沿其厚度方向的结构示意图；
图4为本公开一些实施例提供的另一种封装结构沿其厚度方向的剖面结构示意图；
图5为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图6为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图7为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图8为本公开一些实施例提供的封装结构中的一种防裂层的俯视结构示意图；
图9为本公开一些实施例提供的封装结构中的再一种防裂层的俯视结构示意图；
图10为本公开一些实施例提供的封装结构中的另一种防裂层的俯视结构示意图；
图11为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图12为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图13为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图14为本公开一些实施例提供的一种封装结构的俯视结构示意图；
图15为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图16为本公开一些实施例提供的另一种封装结构的俯视结构示意图；
图17为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图18为本公开一些实施例提供的又一种封装结构沿其厚度方向的剖面结构示意图；
图19为本公开一些实施例提供的另一种封装结构的俯视结构示意图；
图20为本公开一些实施例提供的一种显示装置沿其厚度方向的结构示意图；
图21为本公开一些实施例提供的再一种显示装置沿其厚度方向的结构示意图；以及
图22为本公开一些实施例提供的另一种显示装置沿其厚度方向的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
OLED显示器的核心部件是OLED器件，其作为一种新型显示器件，具有高色域、高对比度等优点。OLED器件包括：依次层叠设置的阳极、发光层以及阴极，其发光原理为：在外加电压的驱动下，从阳极激发出的带正电荷的空穴与从阴极激发出的带负电荷的电子在发光层中复合，进而释放出能量，使得发光层中的发光材料的分子受到该能量的激发，进而产生光发射。
OLED器件还包括：位于阳极与发光层之间，且在从阳极指向发光层的方向上依次层叠设置的空穴注入层、空穴传输层；位于阴极与发光层之间的电子传输层。其中，空穴注入层、空穴传输层以及电子传输层通常采用功能材料制成，以提高空穴、电子分别从阳极、阴极向发光层注入过程中的传输效率，进而提高OLED器件的发光效率。
但是，OLED器件内的上述发光材料、功能材料以及电极的材料对大气中的污染物、水汽、以及氧气都非常敏感，在含有水汽、氧气的环境中容易发生电化学腐蚀，对OLED器件造成损害。因此，必须对OLED器件进行有效地封装，将OLED器件与大气中的水汽、氧气等隔离开，以阻止水汽、氧气进入OLED内部。
相关技术提供一种封装层，用于封装显示面板中的多个OLED器件，如图1所示，该封装层采用的是无机膜01、有机膜02、无机膜01交替排列的层叠结构。
然而，上述结构中的一层或两层无机膜01为均匀的面状结构，采用该封装层对OLED器件进行封装后，在长期使用过程中，当无机膜01发生断裂(Crack)时，由于无机膜01的韧性相对有机膜02较低，产生的裂纹会沿着整个无机膜01延伸，导致封装失效。
例如，当裂纹在无机膜01的边缘(即位于非显示区)发生断裂后，产生的裂纹会沿着显示面板的边缘传递到显示区，使得显示区内的OLED器件因水汽、氧气透过裂纹的进入而发生电化学腐蚀，导致显示产品容易出现随机失效(random failure)，极大地影响显示产品的信赖性和良率。
本公开一些实施例提供一种封装结构100，如图2-4所示，包括：沿封装结构100的厚度方向Z-Z’依次层叠设置的第一无机层10、第一有机层30以及第二无机层20，第一无机层10和第二无机层20中至少一层为防裂层40。
可以理解的是，上述的“第一无机层10和第二无机层20中至少一层为防裂层40是指：第一无机层10和第二无机层20中至少一层的结构与防裂层40的结构相同。即：
如图2所示，第一无机层10为防裂层40；或者，如图3所示，第二无机层20为防裂层40；或者，如图4所示，第一无机层10为一层防裂层40，第二无机层20为另一层防裂层40。
也即是说，上述的第一无机层10和第二无机层20中至少一层为能够防止裂纹延伸的无机层。
在本公开一些实施例提供的上述封装结构100中，一方面，位于两层无机层之间的第一有机层30主要由有机材料制成，由于有机材料的分子链较长，使得有机材料内部的空间间隙较大，能够为裂纹提供一定的缓冲作用，从而对裂纹产生有效的阻挡效果；另一方面，分别位于第一有机层30两侧的第一无机层10和第二无机层20主要由无机材料制成，其结构致密度相对于有机材料更高，对水汽、氧气均有较好的阻挡效果，且在第一无机层10和第二无机层20中至少一层为防裂层40的情况下，还能够起到防止裂纹延伸的阻挡效果。
因此，采用本公开一些实施例提供的上述封装结构100对待封装的器件(该结构例如为OLED器件)进行封装后，在包括有上述封装结构100和OLED器件的显示装置的使用过程中，能够避免或缓解由于上述封装结构100上产生裂纹，而导致的水汽、氧气沿裂纹进入显示装置内部，从而 对OLED器件产生电化学腐蚀的问题。
在本公开一些实施例中，如图5-7所示，防裂层40上设置有至少一个贯通开口40a。
这里，一个贯通开口40a是指，在防裂层40上开设的将防裂层40贯通的一个部分，该部分与防裂层40的边缘不连接。
可以理解的是，如图5-7所示，由于第一无机层10、第一有机层30以及第二无机层20是沿封装结构100的厚度方向Z-Z’依次层叠设置的，因此，第一无机层10、第一有机层30以及第二无机层20这三层中，相邻两层之间是紧密接触的。此外，由于有机材料通常具有一定的流动性，因此，如图5和图7所示，当第一无机层10为防裂层40时，在第一无机层10上方制备第一有机层30的过程中，一部分有机材料会填充到贯通开口40a中，从而将贯通开口40a填满，有利于提高上述封装结构100整体的平整性。
在上述图5-7中，沿封装结构100的厚度方向Z-Z’，贯通开口40a截面形状仅以梯形为例，且沿从第一无机层10指向第二无机层20的方向，该梯形的结构为上开口大于下开口的结构，但本公开一些实施例不限于此，任一个贯通开口40a截面形状可以为矩形、或上开口小于下开口的梯形，只要能够实现将防裂层40贯通即可。
当防裂层40上产生裂纹后，由于防裂层40上设置有至少一个贯通开口40a，裂纹延伸到任一个贯通开口40a处时便会停止延伸，进而避免裂纹再延伸到整个防裂层40上，即阻挡裂纹的进一步扩展，从而提高包括有上述封装结构100和OLED器件的显示装置的产品良率。
不对防裂层40中的贯通开口40a的数量、形状以及分布方式不作限定，可根据具体应用要求灵活设置。
示例的，防裂层40上可以设置数量较多和/或分布较广的贯通开口40a，以满足上述显示装置在有可能产生数量较多和/或来自各个方向的裂纹的使用场景下的使用需求，从而阻挡裂纹在整个防裂层40中的进一步延伸。
或者，防裂层40上可以设置数量较少和/或集中分布的贯通开口40a，以满足上述显示装置在有可能产生数量较少和/或来自单一方向的裂纹的使用场景下的使用需求，从而阻挡裂纹在整个防裂层40中的进一步延伸。
当然，在本公开另一些实施例中，上述防裂层40也可以是通过对无机层的具体结构进行改进，从而使得第一无机层10和第二无机层20中至少 一层具有防止裂纹延伸的功能。
示例的，防裂层40的具体结构可以由致密部分和疏松部分交替排列而成，这样一来，当防裂层40上产生裂纹时，由于防裂层40上不同区域具有不同的致密度，利用防裂层40自身结构上的不均匀性，使得裂纹难以在防裂层40中的不同部分之间继续延伸，从而阻挡裂纹在整个防裂层40中的进一步延伸。
下面将以在防裂层40上设置贯通开口40a的方式为例，对防裂层40的结构作详细说明。
在本公开一些实施例中，如图8所示，防裂层40上可以设置有至少一个贯通开口40a，每个贯通开口40a的形状例如可以为条状。
图8中仅以贯通开口40a的数量为4个，且4个贯通开口40a对称设置为例，具体数量及排布方式不作限定。
在本公开另一些实施例中，为进一步提高防裂层40防止裂纹延伸的效果，如图9-10所示，任一层防裂层40均包括：由内向外依次环绕设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙，该间隙为上述的贯通开口40a，即，一个间隙为一个贯通开口40a。
这里，前述的图5-7中的剖视方向，对应于图9中的A-A’方向。
可以理解的是，在任一层防裂层40中的由内向外依次环绕设置的多个无机图案单元41中，位于中心之外的无机图案单元41(如图9示意出的其中1个无机图案单元41或图10示意出的其中3个无机图案单元41)均为环形，每个环形包括但不限于图9-10示意出的矩形环，还可以为圆环、或椭圆环、或菱形环等其他环形。
示例的，在任一层防裂层40中，位于中心的一个无机图案单元41为矩形块，其余无机图案单元41均为矩形环状块，以从内向外依次环绕中心的矩形块。
由前述描述可知，上述第一无机层10和第二无机层20中至少一层的结构与防裂层40的结构相同是指：
如图5和图11所示，第一无机层10包括：由内向外依次环绕设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙。
或者，如图6和图12所示，第二无机层20包括：由内向外依次环绕设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙。
或者，如图7和图13所示，第一无机层10包括：由内向外依次环绕 设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙；并且，第二无机层20也包括：由内向外依次环绕设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙。
这里，前述的图11-13中的剖视方向，对应于图10中的A-A’方向。
如图5和图7所示，由于有机材料通常具有一定的流动性，当第一无机层10为防裂层40时，在第一无机层10上方制备第一有机层30的过程中，一部分有机材料会填充到相邻两个无机图案单元41之间的间隙中，从而将间隙填满，有利于提高上述封装结构100整体的平整性。
不对相邻两个无机图案单元41之间的间隙的宽度进行限定。由于相邻两个无机图案单元41之间是一个环绕另一个的设置方式，因此，相邻两个无机图案单元41之间的间隙的宽度可以是处处相等，即为一个数值；或者，相邻两个无机图案单元41之间的间隙的宽度也可以设置成不同区域互不相同；或者，相邻两个无机图案单元41之间的间隙的宽度也可以设置成不同区域不完全相同。
示例的，相邻两个无机图案单元41之间的间隙的宽度例如可以为50-200μm，该数值范围可以有效阻挡裂纹的延伸，同时保持防裂层40整体一定的结构强度，有利于进一步提高封装效果。
相邻两个无机图案单元41之间的间隙的宽度可以取自70μm、90μm、100μm、120μm、140μm、150μm、160μm、180μm中的任一数值。
由于相关技术中的无机材料结构致密度较高，对水汽、氧气有较好的阻挡效果，但是裂纹在无机材料上也更容易传递。相对的，有机材料分子链较长，空间间隙较大，对裂纹有很好的缓冲阻挡效果，但是，由于其空间间隙较大，有机材料对水汽、氧气的阻挡效果较差。
在本公开一些实施例中，以图9示意出的防裂层40为例，当防裂层40上产生裂纹(在图9中以粗实线示意出)后，由于相邻两个无机图案单元41之间具有间隙，裂纹会在间隙处停止延伸。
也即是说，当一个无机图案单元41上产生裂纹后，裂纹无法穿过间隙继续延伸至相邻的其他无机图案单元41上，从而有效地阻止了防裂层40上裂纹的延伸，避免裂纹在整个封装结构100上的延伸。
因此，在本公开一些实施例提供的上述封装结构100中，封装结构100包括至少一层防裂层40，防裂层40包括由内向外依次环绕的多个无机图案单元41，并且相邻的两个无机图案单元41之间具有间隙，使得裂纹无 法在防裂层40上延伸，从而有效地阻止裂纹的延伸。
在相关技术中，封装层上的裂纹一般在靠近边缘处产生，从而会从边缘延伸至中心，因此，在本公开一些实施例提供的上述封装结构100中，通过防裂层40包括由内向外依次环绕的多个无机图案单元41的设置方式，可以阻挡裂纹从边缘延伸至封装结构100的中心。
这样一来，当将上述封装结构100应用于显示装置时，可以避免裂纹延伸至显示区，从而可以改善显示区的OLED器件因水汽、氧气的进入而发生电化学腐蚀的问题。
由于相关技术中的封装层中的均匀的面状结构的无机层容易产生裂纹，因此本公开一些实施例通过将封装结构100中的第一无机层10和第二无机层20中至少一层的结构设置成防裂层40的结构，使得第一无机层10和第二无机层20中至少一层可以起到阻止裂纹延伸的作用，相比相关技术提供的封装层，降低了裂纹延伸的概率，从而提高了封装结构100的封装效果。
此外，由于防裂层40中的间隙可以阻断拉力的延伸和积累，因此，通过本公开一些实施例提供的上述封装结构100，利用防裂层40具有间隙的设计方式可以减小封装结构100边缘断裂的风险，从而提高上述封装结构100应用于柔性显示装置时的封装信赖性；并且，防裂层40中的间隙被有机材料所填充或对应于第一有机层30，由于有机材料对水汽、氧气的阻挡效果较差，在对产品进行封装性能的测试过程中，通过测试前确定防裂层40中的间隙的位置，能够通过间隙的位置简单有效地检测到水汽侵入的位置和/或程度，极大地提高了工艺生产的可靠性。
示例的，任一层防裂层40中的多个无机图案单元41可以通过同一次工艺同步形成，以简化防裂层40的制备工艺。
例如，可以通过蒸镀(evaporation)工艺或化学气相沉积(chemical vapor deposition，简称CVD)工艺形成上述的防裂层40。
可以理解的是，由于第一无机层10和第二无机层20中至少一层为防裂层40，因此，用于通过蒸镀工艺或化学气相沉积工艺形成防裂层40的材料为无机材料，并且，由于任一层防裂层40包括由内向外依次环绕设置的多个无机图案单元41，且相邻两个无机图案单元41之间具有间隙，使得相邻两个无机图案单元41之间互不接触(即相互独立)。
因此，在采用蒸镀工艺或化学气相沉积工艺形成防裂层40的过程中，可以使用精细金属掩膜板(Fine Metal Mask，简称FMM)，以使得通过蒸 镀工艺或化学气相沉积工艺形成的气态无机材料透过FMM上的开口部分，沉积到相应的衬底上，以形成上述防裂层40中一个个间隔开的无机图案单元41。
在本公开一些实施例中，不对上述的第一无机层10、第二无机层20和第一有机层30的厚度和材料进行限定。
示例的，第一有机层30的厚度大于第一无机层10和第二无机层20中任一层的厚度。
第一有机层30的材料可以选自聚乙烯醇、聚氨酯丙烯酸酯聚合物、聚酰亚胺树脂中的一种或几种的组合。
示例的，第一无机层10和第二无机层20的厚度和材料可以完全相同，也可以不同。
其中，第一无机层10和第二无机层30的厚度例如可以为0.1-1.5μm，示例的，可以为0.5μm或1.0μm。
第一有机层30的厚度例如可以为5-12μm，示例的，可以为8μm或10μm。
第一无机层10和第二无机层20中任一层的材料例如可以选自氧化铝、氧化锌、氧化钛、二氧化硅、氮化硅和氧化锆中的一种或几种的组合。
在本公开一些实施例中，图9和图10示意出的防裂层40可以包括同心设置的多个无机图案单元41，相邻无机图案单元41之间具有间隙，该间隙即为上述的贯通开口40a。
这里，上述的“同心设置”是指：由内向外依次环绕设置的多个无机图案单元41的中心重合。
由前述描述可知，上述第一无机层10和第二无机层20中至少一层的结构与防裂层40的结构相同是指：
如图5和图11所示，第一无机层10包括：同心设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙。
或者，如图6和图12所示，第二无机层20包括：同心设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙。
或者，如图7和图13所示，第一无机层10包括：同心设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙；并且，第二无机层20也包括：同心设置的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙。
示例的，在任一层防裂层40中，同心设置的多个无机图案单元41的 大小可以完全相同，或完全不相同，或不完全相同，可以根据上述封装结构的具体结构要求而定。
其中，多个无机图案41可以如图9和图10所示地，为同心的方形块和由内向外依次环绕该方形块的方形环，也可以为同心的圆形块和由内向外依次环绕该圆形块的圆形环或其他形状，可依据封装结构100所要封装的结构的形状而定。
在本公开一些实施例中，如图7、图13和图14所示，第一无机层10和第二无机层30均为防裂层40，沿封装结构100的厚度方向Z-Z’，第一无机层10(40)中相邻两个无机图案单元41之间的间隙与第二无机层20(40)中相邻两个无机图案单元41之间的间隙交错设置。
从图7和图13中可以看出，沿封装结构100的厚度方向Z-Z’，第一无机层10(40)中相邻两个无机图案单元41之间的间隙与第二无机层20(40)中相邻两个无机图案单元41之间的间隙没有重叠。
即，从图14中可以看出，第一无机层10(40)中相邻两个无机图案单元41之间的间隙的轮廓与第二无机层20(40)中相邻两个无机图案单元41之间的间隙的轮廓不交叠。
其中，在图14中，粗实线a1围成的区域为第一无机层10的轮廓，细实线a2围成的区域为第二无机层20的轮廓，点画线b围成的区域为第一有机层30的轮廓，第一有机层30填充满第一无机层10中的间隙。
此处，例如可以通过喷墨打印技术形成第一有机层30，由于有机材料具有流动性，在喷墨打印过程中，有机材料会填充到第一无机层10的间隙中，使得形成的第一有机层30的仍保持一个较为平整的表面。
考虑到当采用上述封装结构100对OLED器件进行封装时，封装结构100中的第一无机层20与OLED器件之间的距离，小于第二无机层20与OLED器件之间的距离，即第二无机层20相对地更靠近外界环境。这样一来，当水汽、氧气从第二无机层20中的间隙进入后，不会垂直向下地直接进入第一无机层10中的间隙，从而进入显示装置内部，而是从第二无机层20中的间隙进入后向四周(即360°)分散移动，由于水汽、氧气通过第二无机层20中的间隙侵入量有限，使得水汽、氧气难以进一步进入第一无机层10中的间隙，从而提高封装结构100的封装效果。
在本公开一些实施例中，如图15所示，封装结构100还包括：设置在第二无机层20上的至少一个封装组G，该封装组G包括沿封装结构100 的厚度方向Z-Z’依次层叠设置的第二有机层50和第三无机层60；第三无机层60为防裂层40。
其中，图15中的剖视方向，对应于图9中的A-A’方向。
可以理解的是，第三无机层60作为防裂层40的具体结构，可参考上述说明，以下仅以第三无机层60包括由内向外依次环绕的多个无机图案单元41，相邻两个无机图案单元41之间具有间隙(即贯通开口40a)为例进行说明。
上述图14中仅以第一无机层10和第二无机层20均为防裂层40为例进行示意，本公开一些实施例不限于此，也可以是第一无机层10或第二无机层20为防裂层40，具体结构可参考上述说明，此处不再赘述。
并且，上述图15中仅示意了封装结构100还包括设置在第二无机层20上的一个封装组G(即第二有机层50和位于其上方的第三无机层60为一个组)的情况，当封装结构100还包括多个封装组G时，多个封装组G沿封装结构100的厚度方向Z-Z’依次层叠设置，也即是说，在第三无机层60上继续依次形成第二有机层50和第三无机层60，每形成一个第二有机层50，则对应形成有一个第三无机层60。
这样，通过在第二无机层20之上设置至少一个封装组G，能够进一步提高封装结构100整体的封装效果。
示例的，如图15所示，在第二无机层20为防裂层40，即包括由内向外依次环绕设置的多个无机图案单元，且相邻两个无机图案单元之间具有间隙(即贯通开口40a)的情况下，沿封装结构100的厚度方向Z-Z’，第三无机层60(40)中相邻两个无机图案单元41之间的间隙与第二无机层20中相邻两个无机图案单元41之间的间隙交错设置，以阻挡水汽、氧气从第三无机层60(40)中的间隙直接进入第二无机层20中的间隙处，从而进一步提高封装效果。
示例的，在封装结构100还包括设置在第二无机层20上的多个封装组G的情况下，沿封装结构100的厚度方向Z-Z’，在相邻两个的封装组G中，各自的第三无机层60(40)中相邻两个无机图案单元41之间的间隙交错设置，使得水汽、氧气更难以通过层叠设置的多个封装组G进入下方的第二无机层内，从而进一步提高封装效果。
以上各结构的设置方式，均是为了更好地阻隔水汽、氧气透过封装结构100。
在本公开一些实施例中，如图10和图16所示，封装结构100包括第一区A1(图10和图16中仅以位于中心的以粗虚线围成的矩形区域作示意)和包围第一区A1的第二区A2(图10和图16中仅以粗虚线围成的矩形环形区域作示意)。
如图10所示，防裂层40中的多个无机图案单元41(例如为同心设置的多个无机图案单元41)中，位于中心的一个无机图案单元41在该无机图案单元所在面内的正投影的轮廓包围第一区A1在该面内的正投影的轮廓。
这里，当第二无机层20为防裂层40时，上述的“该无机图案单元所在面”即指：第一有机层30靠近第二无机层20一侧的表面；当第一无机层10为防裂层40时，上述的“该无机图案单元所在面”即指：放置待封装的器件的衬底的表面。
也即是说，当第一无机层10为防裂层40时，防裂层40中的间隙在第一区A1之外，中心的一个无机图案单元41覆盖了整个第一区A1；同样的，当第二无机层20，为防裂层40时，防裂层40中的间隙在第一区A1之外，中心的一个无机图案单元41覆盖了整个第一区A1。
这样一来，当封装结构100应用于显示装置时，封装结构100的第一区A1对应显示装置的显示区，通过使防裂层40中的多个无机图案单元41(例如为同心设置的多个无机图案单元41)中，位于中心的一个无机图案单元41在该无机图案单元所在面内的正投影的轮廓包围第一区A1在该面内的正投影的轮廓，可以避免空气中的水汽、氧气通过第一无机层10和第二无机层20上的间隙进入到显示装置的显示区，从而进一步提高封装结构100阻隔水汽、氧气的效果。
在本公开一些实施例中，如图17-19所示，第二无机层20为防裂层40；第一有机层30靠近第一无机层10的表面覆盖第一无机层10靠近第一有机层的表面和与该表面连接的侧面。
这里，沿从第一无机层10指向第一有机层30的方向，第一有机层30靠近第一无机层10的表面也可称为第一有机层30的下表面；第一无机层10靠近第一有机层的表面也可称为第一无机层10的上表面。
在本公开一些实施例中，如图17-19所示，第二无机层20为防裂层40；第二无机层20靠近第一有机层30的表面至少覆盖第一有机层30的侧面。
这里，沿从第一无机层10指向第一有机层30的方向，第二无机层20靠近第一有机层30的表面也可称为第二无机层20的下表面。
也即是说，形成第一无机层10后，在第一无机层10表面形成的第一有机层30完全覆盖了第一无机层10，之后形成的第二无机层20又覆盖了下方的第一有机层30。
由于第二无机层20为防裂层，即具有间隙，因此，第二无机层20中的间隙没有覆盖第一有机层30，其他区域均覆盖了第一有机层30。
从图17-19中可以看出，由于第一有机层30靠近第一无机层10的表面覆盖第一无机层10靠近第一有机层的表面和与该表面连接的侧面，因此，后续形成的第二无机层20不接触下方的第一无机层10。
这样一来，当上述封装结构100应用于显示装置中后，若第二无机层20上产生裂纹，裂纹不会延伸到下方的第一无机层10上，而第一无机层10由于位于第二无机层20的下方，因此，在显示装置整体产生弯折时受到的外力非常小，出现裂纹的可能性较小，因此，当第一无机层10不是防裂层，即不在第一无机层10上设置间隙，也可以使得第一无机层10起到更好的封装作用。
在本公开一些实施例中，如图17-19所示，沿封装结构100的厚度方向Z-Z’，在上述的第二无机层20中，相邻两个无机图案单元41之间的间隙在第一无机层10所在面内的投影在第一无机层10的范围内。
也即是说，在上述的第二无机层20中，相邻无机图案单元41之间的间隙的正下方对应着第一无机层10，水汽、氧气会被第一无机层10挡住，无法通过第二无机层20中的相邻两个无机图案单元41之间的间隙直接向下穿过封装结构100，从而提升封装效果。
本领域技术人员应该明白，在本公开一些实施例中，由于第一无机层10的侧面是被第一有机层30所覆盖的，第一无机层10与第二无机层20没有接触，为了避免水汽、氧气从第一无机层10与第二无机层20之间的间隔处b1(在图17中以加粗部分示意出)穿过封装结构100进入封装结构100的第一区，在的过程中，应使得第一无机层10与第二无机层20之间的间隔b1与第一区之间具有一定距离。
示例的，如图18所示，第一无机层10在第一无机层10所在面内的正投影的边缘到第一区在该面内的正投影的边缘的距离h1为100-200μm，例如，可以为120μm、140μm、160μm、180μm中的任一数值。
这里，由于第一区的区域形状通常为矩形，因此，其在第一无机层10所在面内的正投影也为矩形，其正投影的边缘会有四个，此处的h1即指第一无机层10在该面内的正投影的多个边缘中与第一区在该面内的正投影的多个边缘中，相互靠近的两个边缘之间的距离。
第二无机层20在第二无机层20所在面内的正投影的边缘到第一区在该面内的正投影的边缘的距离h2为400-600μm，例如，可以为450μm、500μm、550μm中的任一数值。
同样的，由于第一区的区域形状通常为矩形，因此，其在第二无机层20所在面内的正投影也为矩形，其正投影的边缘会有四个，此处的h2即指第二无机层20在该面内的正投影的多个边缘中与第一区在该面内的正投影的多个边缘中，相互靠近的两个边缘之间的距离。
在本公开一些实施例中，上述的封装结构100还可以包括设置在最外侧的保护层，用于避免在封装结构100应用于显示装置的过程中，表面的无机层被刮花。
本公开一些实施例还提供一种显示装置，如图20所示，包括设置有至少一个OLED器件的基板200以及用于封装OLED器件的上述封装结构100。
这里，该基板200包括衬底，以及设置在衬底表面的至少一个OLED器件。
可以理解的是，为方便说明起见，于图20中，仅以单一层体表示上述的“设置有至少一个OLED器件的基板200”，并未实际绘出基板200的具体结构；同样的，仅以单一层体表示上述的封装结构100，封装结构100中的具体结构请参见前述说明，此处不再赘述。
该显示装置具体可以是OLED显示装置，可以为显示面板、包括显示面板的装置、显示器、电视、手机、平板电脑等任何具有显示功能的产品或者部件。
不对封装结构100和设置有OLED器件的基板200之间的贴合方式进行限定，例如，封装结构100形成后，可以通过光学胶对封装结构100和设置有OLED器件的基板200进行贴合，以实现对基板200上OLED器件的封装；或者，也可以在设置有OLED器件的基板200上直接形成上述的封装结构100，即封装结构100中的第一无机层10直接形成(例如直接沉积)在设置有OLED器件的基板200上，以实现对OLED器件的封装。
示例性的，基板200上还形成有用于驱动OLED器件发光的LTPS(Low Temperature Poly-silicon，低温多晶硅技术)背板电路结构。
本公开一些实施例提供的显示装置的有益效果具有与上述封装结构相同的有益效果相同，此处不再赘述。
示例的，如图21-22所示，上述基板包括：显示区S1和非显示区S2，封装结构100的第一区A1在该封装结构100所在面的正投影的轮廓包围显示区S1在该面内的正投影的轮廓。
也即是说，显示区内没有封装结构100中的防裂层中的间隙，即防裂层40中的间隙位于显示区以外，这样可以进一步的提高封装效果。
其中，上述的“封装结构100的第一区在该封装结构100所在面的正投影的轮廓包围显示区在该面内的正投影的轮廓”，可以是：第一区在该封装结构100所在面的正投影的轮廓与显示区在该面内的正投影的轮廓的形状完全相同，即完全重合；也可以是第一区在该封装结构100所在面的正投影的轮廓覆盖显示区在该面内的正投影的轮廓。
当然，第一区在该封装结构100所在面的正投影的轮廓与显示区在该面内的正投影的轮廓的形状不一定是同心图形，只要显示区在该面内的正投影的轮廓在第一区在该封装结构100所在面的正投影的范围内即可。
如图22所示，以第一区在该封装结构100所在面的正投影的轮廓大于显示区在该面内的正投影的轮廓为例，封装结构100中的第一无机层10在第一无机层10所在面内的正投影的边缘到基板的边缘的距离h4为800-1000μm，例如，可以为850μm、900μm、950μm中的任一数值；封装结构100中的第二无机层20在第二无机层10所在面内的正投影的边缘到基板的边缘的距离h3为400-600μm，例如，可以为450μm、500μm、550μm中的任一数值。
这样一来，使得第一无机层10与第二无机层20之间的间隔与显示区之间具有一定距离，避免水汽、氧气通过上述的间隔进入基板的显示区内，从而进一步提高封装效果。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (15)

  1. 一种封装结构，包括：沿所述封装结构的厚度方向依次层叠设置的第一无机层、第一有机层以及第二无机层，其中，所述第一无机层和所述第二无机层中至少一层为防裂层。
  2. 根据权利要求1所述的封装结构，其中，所述防裂层上设置有至少一个贯通开口。
  3. 根据权利要求2所述的封装结构，其中，所述防裂层包括：由内向外依次环绕设置的多个无机图案单元，相邻两个所述无机图案单元之间具有间隙，所述间隙为所述贯通开口。
  4. 根据权利要求1所述的封装结构，其中，所述防裂层包括：同心设置的多个的无机图案单元，相邻两个所述无机图案单元之间具有间隙。
  5. 根据权利要求3或4所述的封装结构，其中，在任一层所述防裂层中，位于中心的一个无机图案单元为矩形块，其余所述无机图案单元均为矩形环状块。
  6. 根据权利要求3或4所述的封装结构，其中，所述第一无机层和所述第二无机层均为防裂层；
    沿所述封装结构的厚度方向，所述第一无机层中的相邻两个所述无机图案单元之间的所述间隙与所述第二无机层中的相邻两个所述无机图案单元之间的所述间隙交错设置。
  7. 根据权利要求3或4所述的封装结构，还包括：设置在所述第二无机层上的至少一个封装组；其中，
    所述封装组包括：沿所述封装结构的厚度方向依次层叠设置的第二有机层和第三无机层；
    所述第三无机层为所述防裂层。
  8. 根据权利要求3或4所述的封装结构，其中，所述间隙的宽度为50-200μm。
  9. 根据权利要求3-8任一项所述的封装结构，还包括：第一区、包围所述第一区第二区；
    在任一层所述防裂层中的多个所述无机图案单元中，位于中心的一个所述无机图案单元在该无机图案单元所在面内的正投影的轮廓包围所述第一区的在该面内的正投影轮廓。
  10. 根据权利要求3或4所述的封装结构，其中，所述第二无机层为 所述防裂层；其中，
    所述第一有机层靠近所述第一无机层的表面覆盖所述第一无机层靠近所述第一有机层的表面和与该表面连接的侧面。
  11. 根据权利要求3或4所述的封装结构，其中，所述第二无机层为所述防裂层；其中，
    所述第二无机层靠近所述第一有机层的表面至少覆盖所述第一有机层的侧面。
  12. 根据权利要求10或11所述的封装结构，其中，沿所述封装结构的厚度方向，相邻两个所述无机图案单元之间的间隙在所述第一无机层所在面内的投影在所述第一无机层的范围内。
  13. 根据权利要求10或11所述的封装结构，还包括：第一区、位于所述第一区外围的第二区；其中，
    所述第一无机层在所述第一无机层所在面内的正投影的边缘到所述第一区在该面内的正投影的边缘的距离为100-200μm；
    和/或，
    所述第二无机层在所述第二无机层所在面内的正投影的边缘到所述第一区在该面内的正投影的边缘的距离为400-600μm。
  14. 一种显示装置，包括：
    设置有至少一个OLED器件的基板，以及
    用于封装所述OLED器件的封装结构，所述封装结构为权利要求1-13任一项所述的封装结构。
  15. 根据权利要求14所述的显示装置，其中，所述基板还包括：显示区、位于所述显示区外围的非显示区；
    所述封装结构包括：第一区、位于所述第一区外围的第二区；
    所述第一区在所述封装结构所在面的正投影的轮廓包围所述显示区在该面内的正投影的轮廓。
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