WO2020258870A1 - 显示面板及其制备方法 - Google Patents

显示面板及其制备方法 Download PDF

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Publication number
WO2020258870A1
WO2020258870A1 PCT/CN2020/072531 CN2020072531W WO2020258870A1 WO 2020258870 A1 WO2020258870 A1 WO 2020258870A1 CN 2020072531 W CN2020072531 W CN 2020072531W WO 2020258870 A1 WO2020258870 A1 WO 2020258870A1
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Prior art keywords
layer
sub
insulating
light
electrodes
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PCT/CN2020/072531
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English (en)
French (fr)
Inventor
杜凌霄
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昆山工研院新型平板显示技术中心有限公司
昆山国显光电有限公司
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Publication of WO2020258870A1 publication Critical patent/WO2020258870A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This application relates to the field of display technology, in particular to a display panel and a manufacturing method thereof.
  • a display panel generally includes a metal layer, for example, an anode in a top-emitting display panel, a cathode in a bottom-emitting display panel, and so on.
  • a polarizer can be provided on the side of the light-emitting surface of the display panel. The polarizer can reduce the reflection of the metal layer to external ambient light and improve the contrast of the display panel under strong light.
  • the inventor of the present application has discovered in the long-term research process that the improvement of the materials of each layer in the existing polarizer is immature, and the display panel still has the problem of high reflectivity, and further measures need to be taken to reduce the reflectivity of the display panel.
  • the present application provides a display panel and a preparation method thereof, which can utilize a black insulating block to absorb ambient light, thereby reducing the reflectivity of the display panel.
  • a display panel comprising: a substrate; a light-emitting layer disposed on one side of the substrate, including a plurality of pixel defining blocks and located between the pixel defining blocks Between the light-emitting unit; the encapsulation layer is located on the side of the light-emitting layer away from the substrate; the touch layer is located on the side of the encapsulation layer away from the light-emitting layer; wherein, the encapsulation layer and/or the touch
  • the area of the control layer corresponding to the pixel defining block is provided with a black insulating block.
  • the manufacturing method includes: forming a light-emitting layer on a substrate.
  • the light-emitting layer includes a plurality of pixel defining blocks and located on the pixel defining blocks. Forming an encapsulation layer on the side of the luminescent layer away from the substrate; forming a touch layer on the side of the encapsulation layer away from the substrate; wherein the encapsulation layer and/or the A black insulating block is formed in the area corresponding to the pixel defining block in the touch control layer.
  • the display panel provided by the present application includes an encapsulation layer and a touch control layer, and the area corresponding to the pixel defining block in the encapsulation layer and/or the touch control layer is provided with a black insulating block.
  • the black insulating block since the black insulating block is correspondingly arranged at the position of the pixel defining block that does not emit light, the black insulating block will not affect the light-emitting effect of the light-emitting unit; on the other hand, the black insulating block can absorb part of the external ambient light, thereby The external ambient light incident on the metal layer of the display panel (for example, the anode in the top-emitting display panel, the cathode in the bottom-emitting display panel, etc.) is reduced, and the reflected light reflected by the metal layer is further reduced, thereby reducing the reflection of the display panel rate.
  • the metal layer of the display panel for example, the anode in the top-emitting display panel, the cathode in the bottom-emitting display panel, etc.
  • FIG. 1 is a top view of an embodiment of a display panel of this application
  • FIG. 2 is a cross-sectional view of an embodiment of the display panel in FIG. 1 along the line A-A;
  • FIG. 3 is a cross-sectional view of an embodiment of the touch layer along the line B-B in FIG. 1;
  • FIG. 4 is a cross-sectional view of another embodiment of the display panel in FIG. 1 along line A-A;
  • FIG. 5 is a cross-sectional view of another embodiment of the display panel in FIG. 1 along the line A-A;
  • FIG. 6 is a cross-sectional view of another embodiment of the display panel in FIG. 1 along line A-A;
  • FIG. 7 is a cross-sectional view of another embodiment of the display panel in FIG. 1 along the line A-A;
  • FIG. 8 is a cross-sectional view of another embodiment of the display panel in FIG. 1 along line A-A;
  • FIG. 9 is a flowchart of an embodiment of a method for manufacturing a display panel of this application.
  • FIG. 1 is a schematic top view of an embodiment of the display panel of this application
  • FIG. 2 is a schematic cross-sectional view of the display panel in FIG. 1 along the line A-A.
  • the display panel may be an OLED display panel, a Micro-OLED display panel, etc.
  • the display panel includes:
  • the substrate 10 can be a flexible substrate, and its material can be polyimide, polyethylene terephthalate, polyethylene naphthalate, etc.; of course, in other embodiments, the substrate 10 may also be a rigid substrate, and its material may be silicon or the like.
  • the light-emitting layer 12 is disposed on one side of the substrate 10 and includes a plurality of pixel defining blocks 120 and a light-emitting unit 122 located between the pixel defining blocks 120.
  • the material of the pixel defining block 120 may be photoresist, and the photoresist may include at least one of polyimide, polymethylmethacrylate, and organosilane.
  • the cross section of the pixel defining block 120 in the direction perpendicular to the substrate 10 may be a rectangle in FIG. 2 or a trapezoid or the like.
  • the light-emitting unit 122 may include a red light-emitting unit R, a blue light-emitting unit B, and a green light-emitting unit G, which may be sequentially formed in the area defined by the pixel defining block 120 through a metal or non-metal mask, and the formed red light-emitting unit
  • the height of R, the blue light emitting unit B and the green light emitting unit G does not exceed the height of the pixel defining block 120.
  • the light-emitting area of the red light-emitting unit R, the blue light-emitting unit B, and the green light-emitting unit G may be different.
  • the light-emitting area of the blue light-emitting unit B is higher than that of the red light-emitting unit.
  • R and the green light emitting unit G are large.
  • the light-emitting layer 12 may also include an anode in a top-emitting display panel or a cathode in a bottom-emitting display panel, and the material of the anode or the cathode may include metal.
  • a thin film transistor layer may also be included between the substrate 10 and the light-emitting layer 12 of the above-mentioned display panel.
  • the encapsulation layer 14 is located on the side of the light-emitting layer 12 away from the substrate 10, and is used to isolate external water and oxygen to reduce the erosion of the light-emitting layer 12 by external water and oxygen; in this embodiment, the encapsulation layer 14 may take the form of film packaging, It may be formed by stacking a first inorganic layer-an organic layer-a second inorganic layer. The method of forming the first inorganic layer and the second inorganic layer may be a chemical vapor deposition method, etc.
  • the material of the first inorganic layer and the second inorganic layer may be a non-metal oxide or a metal oxide, and the non-metal oxide includes silicon nitride , At least one of silicon oxide and silicon oxynitride; the metal oxide includes at least one of aluminum oxide, zirconium oxide, and titanium oxide.
  • the method of forming the organic layer can be inkjet printing, coating, etc.
  • the material of the organic layer can be acrylic (for example, polymethyl methacrylate, etc.) or silicone (for example, polymethyl monophenyl vinyl silicon). Oxyane, etc.), epoxy-based (for example, epoxy resin, etc.) organic materials.
  • the touch layer 16 is located on the side of the encapsulation layer 14 away from the light-emitting layer 12; the touch layer 16 may be a resistive touch type or a capacitive touch type. The specific structure of the touch layer 16 will be described later.
  • the encapsulation layer 14 and/or the touch layer 16 in the above-mentioned display panel is provided with a black insulating block 18 in the area corresponding to the pixel defining block 120.
  • the material of the black insulating block 18 may be a low-temperature organic insulating layer material OC , Resin, etc.
  • the black insulating block 18 since the black insulating block 18 is correspondingly disposed at the position of the pixel defining block 120 that does not emit light, the black insulating block 18 does not affect the light-emitting effect of the light-emitting unit 122; on the other hand, the black insulating block 18 can absorb part of the The external ambient light further reduces the external ambient light incident on the metal layer of the display panel, and further reduces the reflected light reflected by the metal layer, thereby reducing the reflectivity of the display panel.
  • the touch layer 16 includes: a plurality of touch electrodes 160; an insulating layer 162 covering the plurality of touch electrodes 160 and filling between the touch electrodes 160; wherein, the black insulating block 18 is located on the insulating layer 162 in.
  • the design process of the black insulating block 18 is relatively simple and easy to implement.
  • the multiple touch electrodes 160 include multiple transmitting electrodes TX, multiple receiving electrodes RX, and multiple bridging electrodes 1600.
  • the transmitting electrodes TX and the receiving electrodes RX are located in the first
  • the metal layer M1 is arranged crosswise; in this embodiment, a plurality of transmitting electrodes TX may be arranged at intervals and extending in a first direction, and a plurality of receiving electrodes RX may be arranged at intervals and extending in a second direction, and the first direction may It is perpendicular or at an acute angle to the second direction.
  • FIG. 3 FIG.
  • FIG. 3 is a schematic cross-sectional view of the touch layer in FIG. 1 along the line B-B.
  • One of the transmitting electrode TX and the receiving electrode RX is disconnected at the intersection of the two, and is connected across the other of the transmitting electrode TX and the receiving electrode RX through the bridging electrode 1600; that is, both ends of the bridging electrode 1600 can be disconnected from each other.
  • the transmitting electrode TX or the disconnected receiving electrode RX are connected, and the bridging electrode 1600 is arranged in a different layer from the first metal layer M1 where the transmitting electrode TX and the receiving electrode RX are located.
  • the insulating layer 162 includes a first sub-insulating layer 1620 and a second sub-insulating layer 1622, the first sub-insulating layer 1620 covers the first metal layer M1, and the second sub-insulating layer 1622 covers the bridge electrode 1600 And the area between the bridge electrode 1600 and the first metal layer M1.
  • the design of the touch electrode 160 and the insulating layer 162 is relatively simple in structure, mature in technology, and easy to implement.
  • the area corresponding to the pixel defining block 120 in the second sub-insulating layer 1622 is provided with a black insulating block 18; the design method has a relatively simple structure and a mature process.
  • the bridging electrode 1600 is made of metal and the black insulating block 18 covers the bridging electrode 1600, this design method can further reduce the reflection of the bridging electrode 1600 to ambient light, thereby further reducing the reflectivity of the display panel.
  • the maximum height of the black insulating block 18 may be less than or equal to the maximum height of the second sub-insulating layer 1622 at other positions.
  • the projection of the black insulating block 18 on the plane of the substrate 10 is located on the plane of the pixel defining block 120 on the plane of the substrate 10 In the projection, the projected area of the black insulating block 18 may be less than or equal to the projected area of the pixel defining block 120 at the corresponding position.
  • the black insulating block 18a may also be located in the region of the first sub-insulating layer 1620a corresponding to the pixel defining block 120a.
  • This design method has a relatively simple structure, mature technology, and easy implementation; And when the black insulating block 18a covers the first metal layer M1a, this design method can reduce the reflection of the first metal layer M1a to the ambient light, thereby further reducing the reflectivity of the display panel.
  • the black insulating block 18b may also be located in the area of the first sub-insulating layer 1620b and the second sub-insulating layer 1622b corresponding to the pixel defining block 120b.
  • This design method has a relatively simple structure, mature process, and easy implementation; and when the black insulating block 18b covers the bridge electrode 1600b and the first metal layer M1b, this method can further reduce the impact of the bridge electrode 1600b and the first metal layer M1b on the external environment. Light reflection.
  • the first metal layer M1 is away from the encapsulation layer 14 relative to the bridge electrode 1600; in other embodiments, as shown in FIG. 6, the bridge electrode 1600c is away from the encapsulation layer 14c relative to the first metal layer M1c.
  • This design method can reduce the metal area of the top layer to further reduce the reflectivity of the display panel.
  • the black insulating block 18c may be located in the first sub-insulating layer 1620c and/or the second sub-insulating layer 1622c.
  • the encapsulation layer 14d includes an organic layer 140d, and the black insulating block 18d is located in the organic layer 140d; this design method has a relatively simple structure, a mature process, and easy implementation.
  • the display panel provided by the present application may further include a polarizer 11e located on the side of the touch layer 16e away from the encapsulation layer 14e, and the polarizer 11e is coated or inkjet printed The method is formed on the touch layer 16e, which can reduce the thickness of the polarizer 11e and improve its optical effect.
  • the polarizer 11e may include a linear polarizing film and a retardation film that are stacked, and the retardation film is close to the touch layer 16e relative to the linear polarizing film; and in order to avoid polarity between the linear polarizing film and the retardation film For interference, a layer of low-temperature organic insulating layer material OC can be provided as an anti-interference layer between the linear polarizing film and the retardation film.
  • FIG. 9 is a schematic flow chart of an embodiment of a method for manufacturing a display panel according to this application.
  • the manufacturing method can be used to form the display panel given in any of the above embodiments.
  • the manufacturing method includes :
  • a light-emitting layer 12 is formed on a substrate 10, and the light-emitting layer 12 includes a plurality of pixel defining blocks 120 and light emitting units 122 located between the pixel defining blocks 120.
  • the above step S101 includes: first forming a plurality of pixel defining blocks 120 on the substrate 10; and then forming light emitting units 122 of different colors in the regions between the plurality of pixel defining blocks 120 by evaporation.
  • the preparation method provided by the present application may further include forming a thin film transistor layer on the substrate 10; the above step S101 specifically includes forming the light emitting layer 12 on the side of the thin film transistor layer away from the substrate 10.
  • the encapsulation layer 14 includes a first inorganic layer, an organic layer, and a second inorganic layer that are stacked.
  • This step S102 includes: forming a first inorganic layer on the side of the light-emitting layer 12 away from the substrate 10; forming an organic layer on the side of the first inorganic layer away from the light-emitting layer 12; forming a second inorganic layer on the side of the organic layer away from the first inorganic layer.
  • the above step S102 specifically includes: forming an organic layer on the side of the light-emitting layer 12 away from the substrate 10, wherein the black insulating block 18 is formed in the area of the organic layer corresponding to the pixel defining block 120.
  • This can be implemented as follows: first, a first mask is used to form a black insulating block 18 in the area corresponding to the pixel defining block 120 on the side of the first inorganic layer away from the substrate 10; The other areas on the side of the substrate 10 form a transparent insulating block, and at this time, the black insulating block 18 and the transparent insulating block form an organic layer.
  • S103 forming a touch layer 16 on the side of the packaging layer 14 away from the substrate 10; wherein, a black insulating block 18 is formed in the packaging layer 14 and/or the area of the touch layer 16 corresponding to the pixel defining block 120.
  • step S103 when the structure of the display panel is as shown in FIG. 2, the above step S103 includes:
  • a patterned second metal layer M2 is formed on the side of the encapsulation layer 14 away from the light-emitting layer 12, and the second metal layer M2 includes a plurality of bridge electrodes 1600;
  • a second sub-insulating layer 1622 is formed on the side of the second metal layer M2 away from the encapsulation layer 14; at this time, if the black insulating block 18 is located in the second sub-insulating layer 1622, a step of forming the second sub-insulating layer 1622 It is: use a first mask to form a black insulating block 18 at a position corresponding to the pixel defining block 120; use a second mask to form a transparent insulating block in other positions, and the black insulating block 18 and the transparent insulating block form a second sub-insulation Layer 1622; Of course, the order of forming the black insulating block 18 and the transparent insulating block can also be exchanged.
  • a patterned first metal layer M1 is formed on the side of the second sub-insulating layer 1622 away from the encapsulation layer 14.
  • the first metal layer M1 includes a plurality of transmitting electrodes and a plurality of receiving electrodes arranged crosswise, and the transmitting electrodes and the receiving electrodes One of them is disconnected at the intersection of the two; the bridge electrode 1600 is correspondingly arranged at the intersection of the transmitting electrode and the receiving electrode.
  • a via hole can be opened at the corresponding position of the second sub-insulating layer 1622 to make the disconnected transmitting electrode or
  • the receiving electrode is connected to the bridging electrode 1600 at the corresponding position through the second sub-insulating layer 1622.
  • a first sub-insulating layer 1620 is formed on the side of the first metal layer M1 away from the encapsulation layer 14, and the first sub-insulating layer 1620 covers the first metal layer M1; at this time, if the black insulating block 18 is located on the first sub-insulating layer 1620 , Its implementation is similar to step B above.
  • step S103 when the structure of the display panel is as shown in FIG. 6, the above step S103 includes:
  • a patterned first metal layer M1c is formed on the side of the encapsulation layer 14c away from the light-emitting layer 12c.
  • the first metal layer M1c includes a plurality of transmitting electrodes and a plurality of receiving electrodes arranged crosswise, and one of the transmitting electrode and the receiving electrode Break at the intersection of the two.
  • a first sub-insulating layer 1620c is formed on the side of the first metal layer M1c away from the packaging layer 14c, and the first sub-insulating layer 1620c covers the first metal layer M1c; at this time, if the black insulating block 18c is located on the first sub-insulating layer 1620c , Its implementation is similar to step B above.
  • a patterned second metal layer M2c is formed on the side of the first sub-insulating layer 1620c away from the encapsulation layer 14c.
  • the second metal layer M2c includes a plurality of bridge electrodes 1600c, and the bridge electrodes 1600c are arranged at the intersection of the transmitting electrode and the receiving electrode.
  • a via hole can be opened at the corresponding position of the first sub-insulating layer 1620c, so that both ends of the bridging electrode 1600c are disconnected from the transmitting electrode and the receiving electrode through the first sub-insulating layer 1620c.
  • a second sub-insulating layer 1622c is formed on the side of the first sub-insulating layer 1620c away from the packaging layer 14c, and the second sub-insulating layer 1622c covers the second metal layer M2c and between the first metal layer M1c and the second metal layer M2c Area.
  • the black insulating block 18c is located in the second sub-insulating layer 1622c, its implementation is similar to the above-mentioned step B.
  • the preparation method provided in the present application further includes: coating, inkjet printing or other methods on the touch layer
  • a polarizer 11e is formed on the side of 16e away from the encapsulation layer 14e.
  • the specific process may be to form a phase difference film on the side of the touch layer 16e away from the encapsulation layer 14e; then form an anti-interference layer on the side of the phase difference film away from the encapsulation layer 14e.
  • the material of the anti-interference layer may be a low-temperature organic insulating layer material;
  • a linear polarizing film is formed on the side of the anti-interference layer away from the encapsulation layer 14e.
  • the thickness of the polarizer 11e can be further reduced by reducing the thickness of the anti-interference layer, thereby improving the bending performance of the display panel.

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Abstract

本申请公开了一种显示面板及其制备方法，所述显示面板包括：衬底；发光层，设置于所述衬底一侧，包括多个像素界定块以及位于所述像素界定块之间的发光单元；封装层，位于所述发光层远离所述衬底一侧；触控层，位于所述封装层远离所述发光层一侧；其中，所述封装层和/或所述触控层对应所述像素界定块的区域设置有黑色绝缘块。通过上述方式，本申请能够利用黑色绝缘块吸收外界环境光，进而降低显示面板的反射率。

Description

显示面板及其制备方法 技术领域
本申请涉及显示技术领域，特别是涉及一种显示面板及其制备方法。
背景技术
目前，显示面板中一般包含金属层，例如，顶发光显示面板中的阳极，底发光显示面板中的阴极等。而为了降低金属层表面对外界环境光的反射，可在显示面板的出光面一侧设置偏光片。偏光片可以降低金属层对外界环境光的反射，提高显示面板在强光下的对比度。
本申请的发明人在长期研究过程中发现，现有的偏光片中各层材料改善不成熟，显示面板仍存在反射率高的问题，需要进一步采取措施降低显示面板的反射率。
发明内容
本申请提供一种显示面板及其制备方法，能够利用黑色绝缘块吸收外界环境光，进而降低显示面板的反射率。
本申请采用的一个技术方案是：提供一种显示面板，所述显示面板包括：衬底；发光层，设置于所述衬底一侧，包括多个像素界定块以及位于所述像素界定块之间的发光单元；封装层，位于所述发光层远离所述衬底一侧；触控层，位于所述封装层远离所述发光层一侧；其中，所述封装层和/或所述触控层对应所述像素界定块的区域设置有黑色绝缘块。
本申请采用的另一个技术方案是：提供一种显示面板的制备方法，所述制备方法包括：在衬底上形成发光层，所述发光层包括多个像素界定块以及位于所述像素界定块之间的发光单元；在所述发光层远离所述衬底一侧形成封装层；在所述封装层远离所述衬底一侧形成触控层；其中，所述封装层和/或所述触控层中对应所述像素界定块的区域形成有黑色绝缘块。
本申请的有益效果是：本申请所提供的显示面板中包括封装层和触控层，且封装层和/或触控层中对应像素界定块的区域设置有黑色绝缘块。一方面，由于黑色绝缘块对应设置在本身不发光的像素界定块位置处，因此黑色绝缘块并不会影响发光单元的发光效果；另一方面，该黑色绝缘块可以吸收部分外界环境光，进而使得入射到显示面板的金属层(例如，顶发光显示面板中的阳极，底 发光显示面板中的阴极等)的外界环境光减少，进一步由金属层反射的反射光减少，从而降低显示面板的反射率。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图，其中：
图1为本申请显示面板一实施方式的俯视图；
图2为图1中显示面板沿A-A线一实施方式的剖视图；
图3为图1中触控层沿B-B线一实施方式的剖视图；
图4为图1中显示面板沿A-A线另一实施方式的剖视图；
图5为图1中显示面板沿A-A线另一实施方式的剖视图；
图6为图1中显示面板沿A-A线另一实施方式的剖视图；
图7为图1中显示面板沿A-A线另一实施方式的剖视图；
图8为图1中显示面板沿A-A线另一实施方式的剖视图；
图9为本申请显示面板的制备方法一实施方式的流程图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，均属于本申请保护的范围。
请参阅图1-图2，图1为本申请显示面板一实施方式的俯视示意图，图2为图1中显示面板沿A-A线的剖视示意图。该显示面板可以是OLED显示面板、Micro-OLED显示面板等，该显示面板包括：
衬底10；在本实施例中，衬底10可以是柔性衬底，其材质可以为聚酰亚胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯等；当然，在其他实施例中，衬底10也可以是硬性衬底，其材质可以是硅等。
发光层12，设置于衬底10一侧，包括多个像素界定块120以及位于像素界定块120之间的发光单元122。像素界定块120的材质可以为光刻胶，该光刻胶 中可以包含聚酰亚胺、聚甲基丙烯酸甲酯、有机硅烷中至少一种材质。像素界定块120在垂直于衬底10方向上的截面可以为图2中的矩形，也可以为梯形等。发光单元122可以包括红光发光单元R、蓝光发光单元B和绿光发光单元G，可通过金属或者非金属掩膜版在像素界定块120界定的区域内依次形成，且形成的红光发光单元R、蓝光发光单元B和绿光发光单元G的高度不超过像素界定块120的高度。另外，在本实施例中，红光发光单元R、蓝光发光单元B和绿光发光单元G的发光面积可以不同，例如，出于发光寿命考虑，蓝光发光单元B的发光面积较红光发光单元R和绿光发光单元G大。另外，在本实施例中，发光层12内还可以包括顶发光显示面板中的阳极或底发光显示面板中的阴极，该阳极或阴极的材质可以包括金属。当外界环境光入射到该发光层12内的金属层时，金属层表面会产生反射光。此外，在其他实施例中，上述显示面板的衬底10与发光层12之间还可包括薄膜晶体管层。
封装层14，位于发光层12远离衬底10一侧，用于隔绝外部水氧，以降低外部水氧对发光层12的侵蚀；在本实施例中，封装层14可以采取薄膜封装的形式，其可由第一无机层-有机层-第二无机层层叠形成。形成第一无机层和第二无机层的方法可以为化学气相沉积方法等，第一无机层和第二无机层的材质可以为非金属氧化物或金属氧化物，非金属氧化物包括氮化硅、氧化硅、氮氧化硅中的至少一种；金属氧化物包括氧化铝、氧化锆、氧化钛中的至少一种。形成有机层的方法可以为喷墨打印、涂布等，有机层的材质可以为丙烯酸系(例如，聚甲基丙烯酸甲酯等)、有机硅系(例如，聚甲基单苯基乙烯基硅氧烷等)、环氧系(例如，环氧树脂等)有机材料等。
触控层16，位于封装层14远离发光层12一侧；触控层16可以为电阻式触控形式，也可以为电容式触控形式，具体触控层16的结构将在后续说明。
在本实施例中，上述显示面板中的封装层14和/或触控层16对应像素界定块120的区域设置有黑色绝缘块18，该黑色绝缘块18的材质可以为低温有机绝缘层材料OC、树脂等。一方面，由于黑色绝缘块18对应设置在本身不发光的像素界定块120位置处，因此黑色绝缘块18并不会影响发光单元122的发光效果；另一方面，该黑色绝缘块18可以吸收部分外界环境光，进而使得入射到显示面板的金属层的外界环境光减少，进一步由金属层反射的反射光减少，从而降低显示面板的反射率。
在一个实施方式中，触控层16包括：多个触控电极160；绝缘层162，覆 盖多个触控电极160，且填充于触控电极160之间；其中，黑色绝缘块18位于绝缘层162中。该黑色绝缘块18的设计方式工艺较为简单，且易于实现。
在一个应用场景中，如图1和图2所示，多个触控电极160包括多个发射电极TX、多个接收电极RX以及多个桥接电极1600，发射电极TX和接收电极RX位于第一金属层M1，且交叉设置；在本实施例中，多个发射电极TX可以间隔排布且沿第一方向延伸，多个接收电极RX可以间隔排布且沿第二方向延伸，第一方向可以和第二方向垂直或者成锐角。为使得同层设置的发射电极TX与接收电极RX之间相互绝缘不受影响，如图3所示，图3为图1中触控层沿B-B线的剖视示意图。发射电极TX和接收电极RX中的一个在两者交叉处断开，且通过桥接电极1600跨过发射电极TX和接收电极RX中的另一个进行连接；即桥接电极1600的两端可以与断开的发射电极TX或断开的接收电极RX连接，且桥接电极1600与发射电极TX和接收电极RX所在的第一金属层M1非同层设置。
请继续参阅图2或图3，绝缘层162包括第一子绝缘层1620和第二子绝缘层1622，第一子绝缘层1620覆盖第一金属层M1，第二子绝缘层1622覆盖桥接电极1600以及桥接电极1600与第一金属层M1之间的区域。
在本实施例中，上述触控电极160和绝缘层162的设计方式结构较为简单，且工艺成熟，易于实现。
进一步，在本实施例中，如图2或图3所示，第二子绝缘层1622中对应像素界定块120的区域设置有黑色绝缘块18；该设计方式结构较为简单，且工艺成熟，易于实现；且当桥接电极1600为金属材质时，且黑色绝缘块18覆盖桥接电极1600时，该设计方式可以进一步降低桥接电极1600对外界环境光的反射，从而进一步降低显示面板的反射率。该黑色绝缘块18的最大高度可以小于等于其他位置处的第二子绝缘层1622的最大高度，该黑色绝缘块18在衬底10所在平面的投影位于像素界定块120在衬底10所在平面的投影内，该黑色绝缘块18的投影面积可以小于等于对应位置处像素界定块120的投影面积。
当然，在其他实施例中，如图4所示，黑色绝缘块18a也可位于第一子绝缘层1620a中对应像素界定块120a的区域，该设计方式结构较为简单，且工艺成熟，易于实现；且当黑色绝缘块18a覆盖第一金属层M1a时，该设计方式可以降低第一金属层M1a对外界环境光反射，从而进一步降低显示面板的反射率。或者，如图5所示，黑色绝缘块18b也可位于第一子绝缘层1620b和第二子绝 缘层1622b中对应像素界定块120b的区域。，该设计方式结构较为简单，且工艺成熟，易于实现；且当黑色绝缘块18b覆盖桥接电极1600b和第一金属层M1b时，该方式可以进一步降低桥接电极1600b和第一金属层M1b对外界环境光反射。
另外，请再次参阅图2，图2中第一金属层M1相对桥接电极1600远离封装层14；在其他实施例中，如图6所示，桥接电极1600c相对第一金属层M1c远离封装层14c设置。该设计方式可以减少顶层金属面积，以进一步降低显示面板的反射率。同样地，在图6的基础上，黑色绝缘块18c可以位于第一子绝缘层1620c和/或第二子绝缘层1622c中。
在另一个实施方式中，如图7所示，封装层14d中包含有机层140d，黑色绝缘块18d位于有机层140d中；该设计方式结构较为简单，且工艺成熟，易于实现。
在又一个实施方式中，如图8所示，本申请所提供的显示面板还可以包括偏光片11e，位于触控层16e远离封装层14e一侧，且偏光片11e采用涂布或喷墨打印的方式在触控层16e上形成，该方式可以降低偏光片11e的厚度，且提升其光学效果。在本实施例中，偏光片11e可以包括层叠设置的线偏光膜和相位差膜，且相位差膜相对线偏光膜靠近触控层16e；而为了避免线偏光膜和相位差膜之间极性干扰，还可在线偏光膜和相位差膜之间设置一层低温有机绝缘层材料OC作为抗干扰层。
请一并参阅图1和图9，图9为本申请显示面板的制备方法一实施方式的流程示意图，该制备方法可以用于形成上述任一实施例所给出的显示面板，该制备方法包括：
S101：在衬底10上形成发光层12，发光层12包括多个像素界定块120以及位于像素界定块120之间的发光单元122。
具体地，上述步骤S101包括：在衬底10上先形成多个像素界定块120；然后在多个像素界定块120之间的区域利用蒸镀的方式先后形成颜色不同的发光单元122。
此外，在上述步骤S101之前，本申请所提供的制备方法还可以包括在衬底10上形成薄膜晶体管层；上述步骤S101具体包括在薄膜晶体管层远离衬底10一侧形成发光层12。
S102：在发光层12远离衬底10一侧形成封装层14。
具体地，在本实施例中，封装层14包括层叠设置的第一无机层、有机层和第二无机层。该步骤S102包括：在发光层12远离衬底10一侧形成第一无机层；在第一无机层远离发光层12一侧形成有机层；在有机层远离第一无机层一侧形成第二无机层。
当黑色绝缘块18位于封装层14中时，上述步骤S102具体包括：在发光层12远离衬底10一侧形成有机层，其中，有机层对应像素界定块120的区域形成有黑色绝缘块18。其实现方式可以为：首先利用第一掩膜版在第一无机层远离衬底10一侧对应像素界定块120的区域形成黑色绝缘块18；然后利用第二掩膜版在第一无机层远离衬底10一侧的其他区域形成透明绝缘块，此时黑色绝缘块18和透明绝缘块形成有机层。
S103：在封装层14远离衬底10一侧形成触控层16；其中，封装层14和/或触控层中16对应像素界定块120的区域形成有黑色绝缘块18。
在一个实施方式中，当显示面板的结构如图2中所示时，上述步骤S103包括：
A、在封装层14远离发光层12一侧形成图案化的第二金属层M2，第二金属层M2包括多个桥接电极1600；
B、在第二金属层M2远离封装层14一侧形成第二子绝缘层1622；此时，若黑色绝缘块18位于第二子绝缘层1622中时，则形成第二子绝缘层1622的步骤为：利用第一掩膜版在对应像素界定块120的位置形成黑色绝缘块18；利用第二掩膜版在其他位置形成透明绝缘块，该黑绝缘块18和透明绝缘块形成第二子绝缘层1622；当然，形成黑色绝缘块18和透明绝缘块的顺序也可以调换。
C、在第二子绝缘层1622远离封装层14一侧形成图案化的第一金属层M1，第一金属层M1包括交叉设置的多个发射电极和多个接收电极，且发射电极和接收电极中的一个在两者交叉处断开；桥接电极1600对应设置于发射电极和接收电极的交叉处，此时第二子绝缘层1622对应位置处可以开设过孔，以使得断开的发射电极或接收电极透过第二子绝缘层1622与对应位置处的桥接电极1600连接。
D、在第一金属层M1远离封装层14一侧形成第一子绝缘层1620，第一子绝缘层1620覆盖第一金属层M1；此时，若黑色绝缘块18位于第一子绝缘层1620中，其实现方式类似于上述步骤B。
在另一个实施方式中，当显示面板的结构如图6中所示时，上述步骤S103 包括：
A1：在封装层14c远离发光层12c一侧形成图案化的第一金属层M1c，第一金属层M1c包括交叉设置的多个发射电极和多个接收电极，且发射电极和接收电极中的一个在两者交叉处断开。
B1：在第一金属层M1c远离封装层14c一侧形成第一子绝缘层1620c，第一子绝缘层1620c覆盖第一金属层M1c；此时，若黑色绝缘块18c位于第一子绝缘层1620c中，其实现方式类似于上述步骤B。
C1：在第一子绝缘层1620c远离封装层14c一侧形成图案化的第二金属层M2c，第二金属层M2c包括多个桥接电极1600c，桥接电极1600c对应设置于发射电极和接收电极的交叉处，此时第一子绝缘层1620c对应位置处可以开设过孔，以使得桥接电极1600c两端透过第一子绝缘层1620c与发射电极和接收电极中断开的连接。
D1：在第一子绝缘层1620c远离封装层14c一侧形成第二子绝缘层1622c，且第二子绝缘层1622c覆盖第二金属层M2c以及第一金属层M1c和第二金属层M2c之间的区域。此时，若黑色绝缘块18c位于第二子绝缘层1622c中，其实现方式类似于上述步骤B。
在又一个实施方式中，当显示面板的结构如图8中所示时，在上述步骤S103之后，本申请所提供的制备方法还包括：利用涂布、喷墨打印或者其他方式在触控层16e远离封装层14e一侧形成偏光片11e。具体过程可以为在触控层16e远离封装层14e一侧形成相位差膜；然后在相位差膜远离封装层14e一侧形成抗干扰层，该抗干扰层的材质可以为低温有机绝缘层材料；最后在抗干扰层远离封装层14e一侧形成线偏光膜。在本实施例中，可以通过减薄抗干扰层的厚度进一步将偏光片11e的厚度减薄，从而提升显示面板的弯折性能。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (15)

  1. 一种显示面板，包括：
    衬底；
    发光层，设置于所述衬底一侧，包括多个像素界定块以及位于所述像素界定块之间的发光单元；
    封装层，位于所述发光层远离所述衬底一侧；
    触控层，位于所述封装层远离所述发光层一侧；
    其中，所述封装层和/或所述触控层对应所述像素界定块的区域设置有黑色绝缘块。
  2. 根据权利要求1所述的显示面板，其中，所述触控层包括：
    多个触控电极；
    绝缘层，覆盖多个所述触控电极，且填充于所述触控电极之间；
    其中，所述黑色绝缘块位于所述绝缘层中。
  3. 根据权利要求2所述的显示面板，其中，
    多个所述触控电极包括多个发射电极、多个接收电极以及多个桥接电极，所述发射电极和所述接收电极位于第一金属层，且交叉设置，所述发射电极和所述接收电极中的一个在两者交叉处断开，且通过所述桥接电极跨过所述发射电极和所述接收电极中的另一个进行连接；
    所述绝缘层包括第一子绝缘层和第二子绝缘层，所述第一子绝缘层覆盖所述第一金属层，所述第二子绝缘层覆盖所述桥接电极以及所述桥接电极与第一金属层之间的区域。
  4. 根据权利要求3所述的显示面板，其中，
    所述第一子绝缘层中对应所述像素界定块的区域设置有所述黑色绝缘块。
  5. 根据权利要求3所述的显示面板，其中，
    所述第二子绝缘层中对应所述像素界定块的区域设置有所述黑色绝缘块。
  6. 根据权利要求3所述的显示面板，其中，
    所述第一子绝缘层和所述第二子绝缘层中对应所述像素界定块的区域设置有所述黑色绝缘块。
  7. 根据权利要求3所述的显示面板，其中，
    所述桥接电极相对所述第一金属层远离所述封装层设置。
  8. 根据权利要求1所述的显示面板，其中，
    所述封装层中包含有机层，所述黑色绝缘块位于所述有机层中。
  9. 根据权利要求1所述的显示面板，其中，所述显示面板还包括：
    偏光片，位于所述触控层远离所述封装层一侧，且所述偏光片采用涂布或喷墨打印的方式在所述触控层上形成。
  10. 一种显示面板的制备方法，包括：
    在衬底上形成发光层，所述发光层包括多个像素界定块以及位于所述像素界定块之间的发光单元；
    在所述发光层远离所述衬底一侧形成封装层；
    在所述封装层远离所述衬底一侧形成触控层；
    其中，所述封装层和/或所述触控层中对应所述像素界定块的区域形成有黑色绝缘块。
  11. 根据权利要求10所述的制备方法，其中，所述在所述封装层远离所述衬底一侧形成触控层包括：
    在所述封装层远离所述发光层一侧形成图案化的第一金属层，所述第一金属层包括交叉设置的多个发射电极和多个接收电极，且所述发射电极和所述接收电极中的一个在两者交叉处断开；
    在所述第一金属层远离所述封装层一侧形成第一子绝缘层，所述第一子绝缘层覆盖所述第一金属层；
    在所述第一子绝缘层远离所述封装层一侧形成图案化的第二金属层，所述第二金属层包括多个桥接电极，所述桥接电极对应设置于所述发射电极和所述接收电极的交叉处，且其两端透过所述第一子绝缘层与所述发射电极和所述接收电极中断开的连接；
    在所述第一子绝缘层远离所述封装层一侧形成第二子绝缘层，且所述第二子绝缘层覆盖所述第二金属层以及所述第一金属层和所述第二金属层之间的区域；
    其中，所述第一子绝缘层和/或所述第二子绝缘层中对应所述像素界定块的区域形成有所述黑色绝缘块。
  12. 根据权利要求10所述的制备方法，其中，所述在所述封装层远离所述衬底一侧形成触控层包括：
    在所述封装层远离所述发光层一侧形成图案化的第二金属层，所述第二金属层包括多个桥接电极；
    在所述第二金属层远离所述封装层一侧形成第二子绝缘层；
    在所述第二子绝缘层远离所述封装层一侧形成图案化的第一金属层，所述第一金属层包括交叉设置的多个发射电极和多个接收电极，且所述发射电极和所述接收电极中的一个在两者交叉处断开；所述桥接电极对应设置于所述发射电极和所述接收电极的交叉处，且其两端透过所述第二子绝缘层与所述发射电极和所述接收电极中断开的连接；
    在所述第一金属层远离所述封装层一侧形成第一子绝缘层，所述第一子绝缘层覆盖所述第一金属层；
    其中，所述第一子绝缘层和/或所述第二子绝缘层中对应所述像素界定块的区域形成有所述黑色绝缘块。
  13. 根据权利要求10所述的制备方法，其中，所述在所述发光层远离所述衬底一侧形成封装层包括：
    在所述发光层远离所述衬底一侧形成有机层，其中，所述有机层对应所述像素界定块的区域形成有黑色绝缘块。
  14. 根据权利要求13所述的制备方法，其中，所述在所述发光层远离所述衬底一侧形成有机层，其中，所述有机层对应所述像素界定块的区域形成有黑色绝缘块，包括：
    利用第一掩膜版在所述发光层远离所述衬底一侧且对应所述像素界定块的区域形成所述黑色绝缘块；
    利用第二掩膜版在所述发光层远离所述衬底一侧的其他区域形成透明绝缘块，所述黑色绝缘块和所述透明绝缘块形成所述有机层。
  15. 根据权利要求10所述的制备方法，其中，所述制备方法还包括：
    在所述触控层远离所述封装层一侧形成偏光片。
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