WO2021196377A1 - 一种显示面板及制程方法 - Google Patents

一种显示面板及制程方法 Download PDF

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Publication number
WO2021196377A1
WO2021196377A1 PCT/CN2020/092331 CN2020092331W WO2021196377A1 WO 2021196377 A1 WO2021196377 A1 WO 2021196377A1 CN 2020092331 W CN2020092331 W CN 2020092331W WO 2021196377 A1 WO2021196377 A1 WO 2021196377A1
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WO
WIPO (PCT)
Prior art keywords
layer
sub
encapsulation
light
display panel
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PCT/CN2020/092331
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English (en)
French (fr)
Inventor
王雷
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/963,008 priority Critical patent/US11864427B2/en
Publication of WO2021196377A1 publication Critical patent/WO2021196377A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Definitions

  • This application relates to the field of panel manufacturing technology, and in particular to a display panel and a manufacturing process method.
  • Polarizer can effectively reduce the reflectivity of the panel under strong light, but it loses nearly 58% of the light. This is for OLED (OrganicLight-Emitting Diode, organic electro-laser display), greatly increases its life burden.
  • the thickness of the polarizer is large and the material is brittle, which is not conducive to being applied to a display panel that is dynamically bent.
  • the embodiment of the present application provides a display panel and a manufacturing method. In order to solve the problem that the display panel can be dynamically bent.
  • This application provides a display panel, including:
  • a pixel definition layer having a first surface and a second surface oppositely arranged, and the pixel definition layer is provided with grooves;
  • the light-emitting layer is arranged in the groove
  • the encapsulation layer is arranged on the first surface of the pixel definition layer and extends to cover the light-emitting layer;
  • the color film functional layer is arranged in the encapsulation layer and corresponds to the groove.
  • the encapsulation layer includes a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer.
  • the first sub-encapsulation layer is disposed on the first surface of the pixel definition layer and extends Covering the light-emitting layer
  • the second sub-encapsulation layer covers the first sub-encapsulation layer and the color filter light-emitting layer on the side away from the pixel definition layer
  • the third sub-encapsulation layer is disposed on the second sub-encapsulation layer. The side of the encapsulation layer away from the first encapsulation layer.
  • the color filter function layer is disposed between the first sub-encapsulation layer and the second sub-encapsulation layer, and is located in the groove.
  • the top of the color filter functional layer is arc-shaped, and the top of the color filter functional layer is lower than the plane of the second sub-encapsulation layer.
  • the color filter functional layer is formed on the first sub-encapsulation layer by inkjet printing.
  • it further includes an anode layer, a cathode layer, and a light-shielding layer.
  • the light-shielding layer is located on the first surface of the pixel definition layer and on both sides of the groove, and the cathode layer is located on the light-shielding layer.
  • the first sub-encapsulation layer and the first sub-encapsulation layer, and the light-emitting layer disposed in the groove is located between the first sub-encapsulation layer and the light-emitting layer, and the anode layer is disposed on the light-emitting layer away from the One side of the cathode layer.
  • it further includes a planarization layer, an interlayer insulation layer, a first insulation layer, and a second insulation layer.
  • the planarization layer is provided on the second surface, and the second insulation layer is provided on the planarization layer.
  • the side of the layer is away from the pixel definition layer, and the first insulating layer is disposed on the side of the second insulating layer away from the planarization layer.
  • the thin film transistor further includes a thin film transistor, the thin film transistor includes a first port and a second port, the planarization layer, the interlayer insulating layer, the first insulating layer, and the second insulating layer are provided with a channel, so The first port is connected to the anode layer, and the first port communicates with the second port through the channel.
  • it further includes a buffer layer and an insulating film layer, the buffer layer is disposed on the side of the first insulating layer away from the second insulating layer, and the insulating film layer is disposed on the buffer layer away from the second insulating layer. The first surface of the first insulating layer.
  • the color film functional layer includes a red color resist, a green color resist, a blue color resist, and a black matrix.
  • the pixel unit and the blue sub-pixel unit correspond.
  • the embodiment of the present application also provides a method for manufacturing a display panel, including:
  • the first surface and the second surface are oppositely arranged, and the pixel definition layer is arranged in the groove;
  • a light-emitting layer is arranged in the groove
  • An encapsulation layer and a color film functional layer are arranged on one side of the pixel definition layer, and the encapsulation layer extends to cover the light-emitting layer.
  • the color filter function layer is disposed between the first sub-encapsulation layer and the second sub-encapsulation layer, and is located in the groove.
  • the top of the color filter functional layer is arc-shaped, and the top of the color filter functional layer is lower than the plane of the second sub-encapsulation layer.
  • the color filter functional layer is formed on the first sub-encapsulation layer by inkjet printing.
  • it further includes an anode layer, a cathode layer, and a light-shielding layer.
  • the light-shielding layer is located on the first surface of the pixel definition layer and on both sides of the groove, and the cathode layer is located on the light-shielding layer.
  • the first sub-encapsulation layer and the first sub-encapsulation layer, and the light-emitting layer disposed in the groove is located between the first sub-encapsulation layer and the light-emitting layer, and the anode layer is disposed on the light-emitting layer away from the One side of the cathode layer.
  • it further includes a planarization layer, an interlayer insulation layer, a first insulation layer, and a second insulation layer.
  • the planarization layer is provided on the second surface, and the second insulation layer is provided on the planarization layer.
  • the side of the layer is away from the pixel definition layer, and the first insulating layer is disposed on the side of the second insulating layer away from the planarization layer.
  • the thin film transistor further includes a thin film transistor, the thin film transistor includes a first port and a second port, the planarization layer, the interlayer insulating layer, the first insulating layer, and the second insulating layer are provided with a channel, so The first port is connected to the anode layer, and the first port communicates with the second port through the channel.
  • it further includes a buffer layer and an insulating film layer, the buffer layer is disposed on the side of the first insulating layer away from the second insulating layer, and the insulating film layer is disposed on the buffer layer away from the second insulating layer. The first surface of the first insulating layer.
  • the color film functional layer includes a red color resist, a green color resist, a blue color resist, and a black matrix.
  • the pixel unit and the blue sub-pixel unit correspond.
  • the display panel provided by the embodiments of the present application includes a pixel definition layer, a light-emitting layer, an encapsulation layer, and a color filter function layer.
  • the pixel definition layer has a first surface and a second surface that are arranged oppositely, and the pixel definition layer is provided with grooves.
  • the light-emitting layer is provided in the groove
  • the encapsulation layer is provided on the first surface of the pixel definition layer, and extends to cover the light-emitting layer
  • the color filter function layer is provided in the encapsulation layer and is in contact with the recess. Slot correspondence.
  • the color film function layer is used to replace the polarizer, which can reduce the thickness of the display panel and facilitate the bending of the display panel.
  • the color film functional layer is arranged in the encapsulation layer, the color film functional layer and the light-emitting layer can be further brought closer to further reduce the thickness of the display panel, and at the same time, it is beneficial to improve the light-emitting performance of the display panel.
  • FIG. 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of another structure of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the application.
  • the embodiments of the present application provide a display panel and a manufacturing process method.
  • the display panel will be described in detail below.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • the display panel 100 of the embodiment of the present application includes a pixel definition layer 10, a light emitting layer 20, an encapsulation layer 30, and a color filter function layer 40.
  • the pixel definition layer 10 has a first surface 10a and a second surface 10b disposed oppositely, and The definition layer 10 is provided with a groove 11, the light-emitting layer 20 is provided in the groove 11, and the encapsulation layer 30 is provided on the first surface of the pixel definition layer 10 and extends to cover the light-emitting layer 20.
  • the layer 40 is disposed in the encapsulation layer 30 and corresponds to the groove 11.
  • first surface 10 a may be the upper surface of the pixel definition layer 10, and the second surface 10 b may be the lower surface of the pixel definition layer 10.
  • first surface 10 a may also be the lower surface of the pixel definition layer 10, and the second surface 10 b may be the upper surface of the pixel definition layer 10.
  • the default is that the first surface 10a is the upper surface of the pixel definition layer 10, and the second surface 10b is the lower surface of the pixel definition layer 10.
  • the color film functional layer 40 can replace the polarizer.
  • a color filter to replace the polarizer POL
  • POL polarizer
  • the basic structure of the color film includes red (R), green (G), blue (B) color resistance and black matrix (BM). Based on the self-luminous characteristics of the OLED, the color resistance needs to correspond to the red, green and blue sub-pixel units of the OLED respectively to form the color film functional layer 40.
  • FIG. 2 is a schematic diagram of another structure of a display panel provided in an embodiment of the present application.
  • the encapsulation layer 30 includes a first sub-encapsulation layer 31, a second sub-encapsulation layer 32, and a third sub-encapsulation layer 33, and the first sub-encapsulation layer 31 is disposed on the first surface 10a of the pixel definition layer 10.
  • the second sub-encapsulation layer 32 covers the first sub-encapsulation layer 31 and the side of the color filter light-emitting layer 20 away from the pixel definition layer 10, and the third sub-encapsulation layer
  • the layer 33 is disposed on the side of the second sub-encapsulation layer 32 away from the first encapsulation layer 30.
  • the first sub-encapsulation layer 31 may be an organic layer, and the first sub-encapsulation layer 31 is patterned.
  • the second sub-encapsulation layer 32 is formed on the side of the first sub-encapsulation layer 31 away from the pixel definition layer 10 by inkjet printing.
  • the third sub-encapsulation layer 33 may be an inorganic layer, and the third sub-encapsulation layer 33 may also be formed on the side of the second sub-encapsulation layer 32 away from the first encapsulation layer 30 by inkjet printing.
  • the materials that can be used for the first sub-encapsulation layer 31 and the third sub-encapsulation layer 33 are SiNx or SiOx.
  • the color filter function layer 40 is disposed between the first sub-encapsulation layer 31 and the second sub-encapsulation layer 32 and is located in the groove 11.
  • the color film functional layer 40 is disposed between the first sub-encapsulation layer 31 and the second sub-encapsulation layer 32, and the color film functional layer 40 is located in the groove 11, so that the color film functional layer 40 can be further shortened. And the distance between the light-emitting layer 20. Since the distance between the color film functional layer 40 and the light-emitting layer 20 is relatively short, it is advantageous for the light-emitting layer 20 to emit light through the color film functional layer 40, thereby helping to improve the light-emitting performance of the display panel 100.
  • the color filter function layer 40 may also be disposed inside the second sub-encapsulation layer 32, or the color film function layer 40 may be disposed between the second sub-encapsulation layer 32 and the third sub-encapsulation function layer.
  • these two methods can also reduce the distance between the color film functional layer 40 and the light-emitting layer 20, which is beneficial to improving the light-emitting performance of the display panel 100.
  • the color film functional layer 40 does not need to be arranged in the groove 11, the process is simpler during manufacturing and the manufacturing cost is lower.
  • the top of the color filter functional layer 40 is arc-shaped, and the top of the color filter functional layer 40 is lower than the plane of the second sub-encapsulation layer 32.
  • the top of the color film functional layer 40 is arc-shaped, so that the color film functional layer 40 can increase the light output angle.
  • the top of the color filter functional layer 40 is lower than the plane of the second sub-encapsulation layer 32, which can ensure that the color filter functional layer 40 can be at a sufficiently small distance from the light emitting layer 20 to ensure the light emitting effect of the display panel 100.
  • the top of the color filter function layer 40 may also extend to the second sub-encapsulation layer 32 or the third sub-encapsulation layer 33 higher than the plane of the second sub-encapsulation layer 32.
  • the color film functional layer 40 is formed on the first sub-encapsulation layer 31 by inkjet printing.
  • printing the color film functional layer 40 on the first sub-encapsulation layer 31 by inkjet printing can be more convenient.
  • the display panel 100 further includes an anode layer 50, a cathode layer 60, and a light-shielding layer 70.
  • the light-shielding layer 70 is located on the first surface 10a of the pixel definition layer 10 and on both sides of the groove 11.
  • the cathode layer 60 is located between the light shielding layer 70 and the first sub-encapsulation layer 31, and the light-emitting layer 20 disposed in the groove 11 is located between the first sub-encapsulation layer 31 and the light-emitting layer 20,
  • the anode layer 50 is disposed on the side of the light-emitting layer 20 away from the cathode layer 60.
  • the display panel 100 further includes a planarization layer 80, an interlayer insulation layer 90, a first insulation layer 101, and a second insulation layer 102.
  • the planarization layer 80 is disposed on the second surface 10b, and the second insulation layer
  • the layer 102 is disposed on the side of the planarization layer 80 away from the pixel defining layer 10
  • the first insulating layer 101 is disposed on the side of the second insulating layer 102 away from the planarization layer 80.
  • the thin film transistor 103 includes a first port 1031 and a second port 1032.
  • the planarization layer 80, the interlayer insulating layer 90, the first insulating layer 101, and the second insulating layer 102 are provided with Channel 106, the first port 1031 is connected to the anode layer 50, and the first port 1031 communicates with the second port 1032 through the channel 106.
  • the display panel 100 further includes a buffer layer 104 and an insulating film layer 105.
  • the buffer layer 104 is disposed on the side of the first insulating layer 101 away from the second insulating layer 102, and the insulating film layer 105 is disposed on all sides.
  • the buffer layer 104 is far away from the first surface 10 a of the first insulating layer 101.
  • the display panel 100 provided by the embodiment of the present application includes a pixel definition layer 10, a light-emitting layer 20, an encapsulation layer 30, and a color filter function layer 40.
  • the pixel definition layer 10 has a first surface 10a and a second surface 10b disposed oppositely.
  • the pixel defining layer 10 is provided with a groove 11, the light-emitting layer 20 is arranged in the groove 11, and the encapsulation layer 30 is arranged on the bottom surface of the pixel defining layer 10, and extends to cover the light-emitting layer 20, with a color film function
  • the layer 40 is disposed in the encapsulation layer 30 and corresponds to the groove 11.
  • the color film functional layer 40 is arranged in the encapsulation layer 30, and the color film functional layer 40 corresponds to the light-emitting layer 20 in the groove 11, the color film functional layer 40 is used to replace the polarizer, which can reduce the display panel 100
  • the thickness of the display panel 100 is convenient for bending of the display panel 100.
  • the color film functional layer 40 and the light-emitting layer 20 can be further brought closer to further reduce the thickness of the display panel 100.
  • FIG. 3 is a schematic flowchart of a display panel manufacturing method according to an embodiment of the present application.
  • an embodiment of the present application provides a display panel manufacturing method, which includes the steps:
  • a pixel definition layer is provided, the first surface and the second surface are oppositely disposed, and the pixel definition layer is disposed in a groove.
  • first surface may be the upper surface of the pixel definition layer
  • second surface may be the lower surface of the pixel definition layer
  • first surface may also be the lower surface of the pixel definition layer
  • second surface may be the upper surface of the pixel definition layer.
  • the default is that the first surface is the upper surface of the pixel definition layer, and the second surface is the lower surface of the pixel definition layer.
  • a light-emitting layer is provided in the groove.
  • a color film functional layer is arranged between the packaging layers, and the color film functional layer corresponds to the groove.
  • the color film functional layer can replace the polarizer.
  • POL polarizer
  • the basic structure of the color film includes red (R), green (G), blue (B) color resistance and black matrix (BM). Based on the self-luminous characteristics of OLED, the color resistance needs to correspond to the red, green and blue sub-pixel units of the OLED respectively to form a color film functional layer.
  • the encapsulation layer includes a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer.
  • the first sub-encapsulation layer is disposed on the first surface of the pixel definition layer and extends to cover the light emitting
  • the second sub-encapsulation layer covers the first sub-encapsulation layer and the side of the color filter light-emitting layer away from the pixel definition layer
  • the third sub-encapsulation layer is disposed on the second sub-encapsulation layer away from the pixel definition layer. Said one side of the first encapsulation layer.
  • the color filter function layer is disposed between the first sub-encapsulation layer and the second sub-encapsulation layer, and is located in the groove.
  • the color film functional layer is arranged between the first sub-encapsulation layer and the second sub-encapsulation layer, and the color film functional layer is located in the groove, which can further shorten the gap between the color film functional layer and the light-emitting layer. distance. Since the distance between the color film functional layer and the light-emitting layer is relatively short, it is advantageous for the light-emitting layer to emit light through the color film functional layer, thereby helping to improve the light-emitting performance of the display panel.
  • the color filter function layer can also be arranged inside the second sub-encapsulation layer, or the color filter function layer can be arranged between the second sub-encapsulation layer and the third sub-encapsulation function layer.
  • these two methods can also reduce the distance between the color film functional layer and the light-emitting layer, which is beneficial to improve the light-emitting performance of the display panel.
  • the color film functional layer does not need to be arranged in the groove, the process is simpler and the manufacturing cost is lower during manufacturing.
  • the color film functional layer is arranged in the encapsulation layer, and the color film functional layer corresponds to the light-emitting layer in the groove, the color film functional layer is used to replace the polarizer, which can reduce the thickness of the display panel , It is convenient for the display panel to be bent.
  • the color film function layer is arranged in the encapsulation layer, the color film function layer and the light-emitting layer can be further brought closer to further reduce the thickness of the display panel, and at the same time, it is beneficial to improve the display panel.
  • the light performance since the color film functional layer is arranged in the encapsulation layer, and the color film functional layer corresponds to the light-emitting layer in the groove, the color film functional layer is used to replace the polarizer, which can reduce the thickness of the display panel , It is convenient for the display panel to be bent.
  • the color film function layer is arranged in the encapsulation layer, the color film function layer and the light-emitting layer can be further brought closer to further reduce the thickness of the

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Abstract

本申请实施例提供一种显示面板及制造方法，显示面板包括像素定义层、发光层、封装层以及彩膜功能层，像素定义层具有相对设置的第一面和第二面，所述像素定义层设置有凹槽，发光层设在所述凹槽内，封装层设置在所述像素定义层的第一面上，且延伸覆盖所述发光层，彩膜功能层设置在所述封装层内，且与所述凹槽对应。

Description

一种显示面板及制程方法 技术领域
本申请涉及面板制造技术领域，特别涉及一种显示面板及制程方法。
 背景技术
偏光片（POL）能够有效地降低强光下面板的反射率，却损失了接近58%的出光。这对于OLED（OrganicLight-Emitting Diode，有机电激光显示）来说，极大地增加了其寿命负担。另一方面，偏光片厚度较大、材质脆，不利于应用到动态弯折的显示面板上。
因此，提供一种能够实现动态弯折的显示面板，成为本领域技术人员亟待解决的技术问题。
 技术问题
本申请实施例提供一种显示面板及制程方法。以解决显示面板能够动态弯折的问题。
 技术解决方案
本申请提供一种显示面板，包括：
像素定义层，具有相对设置的第一面和第二面，所述像素定义层设置有凹槽；
发光层，设在所述凹槽内；
封装层，设置在所述像素定义层的第一面上，且延伸覆盖所述发光层；
彩膜功能层，设置在所述封装层内，且与所述凹槽对应。
在一些实施例中，所述封装层包括第一子封装层、第二子封装层以及第三子封装层，所述第一子封装层设置在所述像素定义层的第一面，且延伸覆盖所述发光层，所述第二子封装层覆盖在所述第一子封装层和彩膜发光层远离所述像素定义层的一面，所述第三子封装层设置在所述第二子封装层远离所述第一封装层的一面。
在一些实施例中，所述彩膜功能层设置在所述第一子封装层与所述第二子封装层之间，且位于所述凹槽内。
在一些实施例中，所述彩膜功能层的顶部为弧形，所述彩膜功能层的顶部低于所述第二子封装层的平面。
在一些实施例中，所述彩膜功能层通过喷墨打印形成到所述第一子封装层上。
在一些实施例中，还包括阳极层、阴极层以及遮光层，所述遮光层位于所述像素定义层的第一面，且位于所述凹槽的两侧，所述阴极层位于所述遮光层与所述第一子封装层之间，且设置于所述凹槽内的发光层位于所述第一子封装层与发光层之间，所述阳极层设置在所述发光层远离所述阴极层的一面。
在一些实施例中，还包括平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层，所述平坦化层设置在所述第二面，所述第二绝缘层设置在平坦化层远离所述像素定义层的一面，所述第一绝缘层设置在所述第二绝缘层远离所述平坦化层的一面。
在一些实施例中，还包括薄膜晶体管，所述薄膜晶体管包括第一端口和第二端口，所述平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层设置有沟道，所述第一端口与所述阳极层连接，所述第一端口通过所述沟道与所述第二端口连通。
在一些实施例中，还包括缓冲层和绝缘薄膜层，所述缓冲层设置在所述第一绝缘层远离所述第二绝缘层的一面，所述绝缘薄膜层设置在所述缓冲层远离所述第一绝缘层的第一面。
在一些实施例中，所述彩膜功能层包括红色色阻、绿色色阻、蓝色色阻以及黑色矩阵，所述红色色阻、绿色色阻、蓝色色阻分别于红色子像素单元、绿色子像素单元、蓝色子像素单元对应。
本申请实施例还提供一种显示面板制程方法，包括：
提供一像素定义层，所述具有相对设置的第一面和第二面，所述像素定义层设置在凹槽；
在所述凹槽内设置有发光层；
在封装层之间设置彩膜功能层，所述彩膜功能层与所述凹槽对应；
将封装层与彩膜功能层设置在所述像素定义层的一面，所述封装层延伸覆盖所述发光层。
在一些实施例中，所述彩膜功能层设置在所述第一子封装层与所述第二子封装层之间，且位于所述凹槽内。
在一些实施例中，所述彩膜功能层的顶部为弧形，所述彩膜功能层的顶部低于所述第二子封装层的平面。
在一些实施例中，所述彩膜功能层通过喷墨打印形成到所述第一子封装层上。
在一些实施例中，还包括阳极层、阴极层以及遮光层，所述遮光层位于所述像素定义层的第一面，且位于所述凹槽的两侧，所述阴极层位于所述遮光层与所述第一子封装层之间，且设置于所述凹槽内的发光层位于所述第一子封装层与发光层之间，所述阳极层设置在所述发光层远离所述阴极层的一面。
在一些实施例中，还包括平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层，所述平坦化层设置在所述第二面，所述第二绝缘层设置在平坦化层远离所述像素定义层的一面，所述第一绝缘层设置在所述第二绝缘层远离所述平坦化层的一面。
在一些实施例中，还包括薄膜晶体管，所述薄膜晶体管包括第一端口和第二端口，所述平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层设置有沟道，所述第一端口与所述阳极层连接，所述第一端口通过所述沟道与所述第二端口连通。
在一些实施例中，还包括缓冲层和绝缘薄膜层，所述缓冲层设置在所述第一绝缘层远离所述第二绝缘层的一面，所述绝缘薄膜层设置在所述缓冲层远离所述第一绝缘层的第一面。
在一些实施例中，所述彩膜功能层包括红色色阻、绿色色阻、蓝色色阻以及黑色矩阵，所述红色色阻、绿色色阻、蓝色色阻分别于红色子像素单元、绿色子像素单元、蓝色子像素单元对应。
 有益效果
本申请实施例所提供的显示面板包括像素定义层、发光层、封装层以及彩膜功能层，像素定义层具有相对设置的第一面和第二面，所述像素定义层设置有凹槽，发光层设在所述凹槽内，封装层设置在所述像素定义层的第一面上，且延伸覆盖所述发光层，彩膜功能层设置在所述封装层内，且与所述凹槽对应。由于将彩膜功能层设置在封装层内，且彩膜功能层与位于凹槽内的发光层对应，通过彩膜功能层替代偏光片，这样可以降低显示面板的厚度，方便显示面板进行弯折，同时，由于将彩膜功能层设置在封装层内，因此，能够进一步的让彩膜功能层与发光层靠近，进一步降低显示面板厚度的同时，有利于提高显示面板的出光性能。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。
图1为本申请实施例提供的显示面板的结构示意图。
图2为本申请实施例提供一种显示面板的另一种结构示意图。
图3为本申请实施例提供一种显示面板制程方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，在本申请的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
本申请实施例提供一种显示面板及制程方法，以下对显示面板做详细介绍。
请参阅图1，图1为本申请实施例提供的显示面板的结构示意图。其中，本申请实施例显示面板100包括像素定义层10、发光层20、封装层30以及彩膜功能层40，像素定义层10具有相对设置的第一面10a和第二面10b，所述像素定义层10设置有凹槽11，发光层20设在所述凹槽11内，封装层30设置在所述像素定义层10的第一面上，且延伸覆盖所述发光层20，彩膜功能层40设置在所述封装层30内，且与所述凹槽11对应。
需要说明的是，第一面10a可以为像素定义层10的上表面，第二面10b可以为像素定义层10的下表面。当然，第一面10a也可以为像素定义层10的下表面，第二面10b可以为像素定义层10的上表面。本申请实施例中不做特殊说明的情况下，默认为第一面10a为像素定义层10的上表面，第二面10b为像素定义层10的下表面。
其中，彩膜功能层40可以替代偏光片，通过使用彩膜（Color Filter）替代偏光片（POL）被归属为POL-less技术，它不仅能将功能层的厚度从大于100μm降低至小于5 μm。而且能够将出光率从42%提高至60%。彩膜基本结构包括红色(R)、绿色(G)、蓝色(B)色阻以及黑色矩阵(BM)。基于OLED自发光的特点，色阻需要分别与OLED的红、绿和蓝子像素单元对应，形成彩膜功能层40。
请参阅图2，图2为本申请实施例提供一种显示面板的另一种结构示意图。其中，所述封装层30包括第一子封装层31、第二子封装层32以及第三子封装层33，所述第一子封装层31设置在所述像素定义层10的第一面10a，且延伸覆盖所述发光层20，所述第二子封装层32覆盖在所述第一子封装层31和彩膜发光层20远离所述像素定义层10的一面，所述第三子封装层33设置在所述第二子封装层32远离所述第一封装层30的一面。
需要说明的是，第一子封装层31可以是有机层，且第一子封装层31进行图案化。第二子封装层32通过喷墨打印的方式形成在所述第一子封装层31远离所述像素定义层10的一面。第三子封装层33可以是无机层，第三子封装层33也可以通过喷墨打印的方式形成到所述第二子封装层32远离所述第一封装层30的一面。具体的，第一子封装层31和第三子封装层33可以采用的材料为SiNx或SiOx等。
其中，所述彩膜功能层40设置在所述第一子封装层31与所述第二子封装层32之间，且位于所述凹槽11内。
其中，将彩膜功能层40设置在所述第一子封装层31与第二子封装层32之间，且彩膜功能层40位于凹槽11内，这样能够进一步的缩短彩膜功能层40和发光层20之间的距离。由于彩膜功能层40与发光层20之间的距离较近，因此，有利于发光层20通过所述彩膜功能层40出光，从而有利于提高显示面板100的出光性能。
当然，也可以将彩膜功能层40设置在所述第二子封装层32内侧，或者将彩膜功能层40设置在所述第二子封装层32与第三子封装功能层之间。这两种方式，相较于现有技术，同样也能够降低彩膜功能层40和发光层20之间的距离，有利于提高显示面板100的出光性能。同时，由于不需要将彩膜功能层40设置到凹槽11内，在制造时工艺更加简单，制造成本更低。
其中，所述彩膜功能层40的顶部为弧形，所述彩膜功能层40的顶部低于所述第二子封装层32的平面。
需要说明的是，彩膜功能层40的顶部为弧形，这样彩膜功能层40能够增加出光角度。彩膜功能层40的顶部低于第二子封装层32的平面，这样能够确保彩膜功能层40能够与发光层20足够小的距离，保证显示面板100的出光效果。当然，在一些实施例中，彩膜功能层40的顶部也可以高于第二子封装层32的平面延伸至第二子封装层32或者第三子封装层33。
其中，所述彩膜功能层40通过喷墨打印形成到所述第一子封装层31上。
需要说明的是，通过喷墨打印将彩膜功能层40打印到第一子封装层31上，这种方式能够更加方便。
其中，显示面板100还包括阳极层50、阴极层60以及遮光层70，所述遮光层70位于所述像素定义层10的第一面10a，且位于所述凹槽11的两侧，所述阴极层60位于所述遮光层70与所述第一子封装层31之间，且设置于所述凹槽11内的发光层20位于所述第一子封装层31与发光层20之间，所述阳极层50设置在所述发光层20远离所述阴极层60的一面。
其中，显示面板100还包括平坦化层80、层间绝缘层90、第一绝缘层101以及第二绝缘层102，所述平坦化层80设置在所述第二面10b，所述第二绝缘层102设置在平坦化层80远离所述像素定义层10的一面，所述第一绝缘层101设置在所述第二绝缘层102远离所述平坦化层80的一面。
其中，还包括薄膜晶体管103，所述薄膜晶体管103包括第一端口1031和第二端口1032，所述平坦化层80、层间绝缘层90、第一绝缘层101以及第二绝缘层102设置有沟道106，所述第一端口1031与所述阳极层50连接，所述第一端口1031通过所述沟道106与所述第二端口1032连通。
其中，显示面板100还包括缓冲层104和绝缘薄膜层105，所述缓冲层104设置在所述第一绝缘层101远离所述第二绝缘层102的一面，所述绝缘薄膜层105设置在所述缓冲层104远离所述第一绝缘层101的第一面10a。
本申请实施例所提供的显示面板100包括像素定义层10、发光层20、封装层30以及彩膜功能层40，像素定义层10具有相对设置的第一面10a和第二面10b，所述像素定义层10设置有凹槽11，发光层20设在所述凹槽11内，封装层30设置在所述像素定义层10的底一面上，且延伸覆盖所述发光层20，彩膜功能层40设置在所述封装层30内，且与所述凹槽11对应。由于将彩膜功能层40设置在封装层30内，且彩膜功能层40与位于凹槽11内的发光层20对应，通过彩膜功能层40替代所述偏光片，这样可以降低显示面板100的厚度，方便显示面板100进行弯折，同时，由于将彩膜功能层40设置在封装层30内，因此，能够进一步的让彩膜功能层40与发光层20靠近，进一步降低显示面板100厚度的同时，有利于提高显示面板100的出光性能。
请参阅图3，图3为本申请实施例提供一种显示面板制程方法的流程示意图。其中，本申请实施例提供一种显示面板制程方法，包括步骤：
201、提供一像素定义层，所述具有相对设置的第一面和第二面，所述像素定义层设置在凹槽。
需要说明的是，第一面可以为像素定义层的上表面，第二面可以为像素定义层的下表面。当然，第一面也可以为像素定义层的下表面，第二面可以为像素定义层的上表面。本申请实施例中不做特殊说明的情况下，默认为第一面为像素定义层的上表面，第二面为像素定义层的下表面。
202、在所述凹槽内设置有发光层。
203、在封装层之间设置彩膜功能层，所述彩膜功能层与所述凹槽对应。
需要说明的是，彩膜功能层可以替代偏光片，通过使用彩膜（Color Filter）替代偏光片（POL）被归属为POL-less技术，它不仅能将功能层的厚度从~100μm降低至＜5 μm。而且能够将出光率从42%提高至60%。彩膜基本结构包括红色(R)、绿色(G)、蓝色(B)色阻以及黑色矩阵(BM)。基于OLED自发光的特点，色阻需要分别与OLED的红、绿和蓝子像素单元对应，形成彩膜功能层。
204、将封装层与彩膜功能层设置在所述像素定义层的第一面，所述封装层延伸覆盖所述发光层。
其中，所述封装层包括第一子封装层、第二子封装层以及第三子封装层，所述第一子封装层设置在所述像素定义层的第一面，且延伸覆盖所述发光层，所述第二子封装层覆盖在所述第一子封装层和彩膜发光层远离所述像素定义层的一面，所述第三子封装层设置在所述第二子封装层远离所述第一封装层的一面。
具体的，所述彩膜功能层设置在所述第一子封装层与所述第二子封装层之间，且位于所述凹槽内。
其中，将彩膜功能层设置在所述第一子封装层与第二子封装层之间，且彩膜功能层位于凹槽内，这样能够进一步的缩短彩膜功能层和发光层之间的距离。由于彩膜功能层与发光层之间的距离较近，因此，有利于发光层通过所述彩膜功能层出光，从而有利于提高显示面板的出光性能。
当然，也可以将彩膜功能层设置在所述第二子封装层内侧，或者将彩膜功能层设置在所述第二子封装层与第三子封装功能层之间。这两种方式，相较于现有技术，同样也能够降低彩膜功能层和发光层之间的距离，有利于提高显示面板的出光性能。同时由于不需要将彩膜功能层设置到凹槽内，在制造时，工艺更加简单，制造成本更低。
本申请采用这种方法，由于将彩膜功能层设置在封装层内，且彩膜功能层与位于凹槽内的发光层对应，通过彩膜功能层替代偏光片，这样可以降低显示面板的厚度，方便显示面板进行弯折，同时，由于将彩膜功能层设置在封装层内，因此，能够进一步的让彩膜功能层与发光层靠近，进一步降低显示面板厚度的同时，有利于提高显示面板的出光性能。
以上对本申请实施例提供的显示面板及制程方法进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其中，包括：
    像素定义层，具有相对设置的第一面和第二面，所述像素定义层设置有凹槽；
    发光层，设在所述凹槽内；
    封装层，设置在所述像素定义层的第一面上，且延伸覆盖所述发光层；
    彩膜功能层，设置在所述封装层内，且与所述凹槽对应。
  2. 根据权利要求1所述的显示面板，其中，所述封装层包括第一子封装层、第二子封装层以及第三子封装层，所述第一子封装层设置在所述像素定义层的第一面，且延伸覆盖所述发光层，所述第二子封装层覆盖在所述第一子封装层和彩膜发光层远离所述像素定义层的一面，所述第三子封装层设置在所述第二子封装层远离所述第一封装层的一面。
  3. 根据权利要求2所述的显示面板，其中，所述彩膜功能层设置在所述第一子封装层与所述第二子封装层之间，且位于所述凹槽内。
  4. 根据权利要求3所述的显示面板，其中，所述彩膜功能层的顶部为弧形，所述彩膜功能层的顶部低于所述第二子封装层的平面。
  5. 根据权利要求3所述的显示面板，其中，所述彩膜功能层通过喷墨打印形成到所述第一子封装层上。
  6. 根据权利要求3所述的显示面板，其中，还包括阳极层、阴极层以及遮光层，所述遮光层位于所述像素定义层的第一面，且位于所述凹槽的两侧，所述阴极层位于所述遮光层与所述第一子封装层之间，且设置于所述凹槽内的发光层位于所述第一子封装层与发光层之间，所述阳极层设置在所述发光层远离所述阴极层的一面。
  7. 根据权利要求6所述的显示面板，其中，还包括平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层，所述平坦化层设置在所述第二面，所述第二绝缘层设置在平坦化层远离所述像素定义层的一面，所述第一绝缘层设置在所述第二绝缘层远离所述平坦化层的一面。
  8. 根据权利要求7所述的显示面板，其中，还包括薄膜晶体管，所述薄膜晶体管包括第一端口和第二端口，所述平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层设置有沟道，所述第一端口与所述阳极层连接，所述第一端口通过所述沟道与所述第二端口连通。
  9. 根据权利要求7所述的显示面板，其中，还包括缓冲层和绝缘薄膜层，所述缓冲层设置在所述第一绝缘层远离所述第二绝缘层的一面，所述绝缘薄膜层设置在所述缓冲层远离所述第一绝缘层的第一面。
  10. 根据权利要求7所述的显示面板，其中，所述彩膜功能层包括红色色阻、绿色色阻、蓝色色阻以及黑色矩阵，所述红色色阻、绿色色阻、蓝色色阻分别于红色子像素单元、绿色子像素单元、蓝色子像素单元对应。
  11. 一种显示面板制程方法，其中，包括：
    提供一像素定义层，所述具有相对设置的第一面和第二面，所述像素定义层设置在凹槽；
    在所述凹槽内设置有发光层；
    在封装层之间设置彩膜功能层，所述彩膜功能层与所述凹槽对应；
    将封装层与彩膜功能层设置在所述像素定义层的第一面，所述封装层延伸覆盖所述发光层。
  12. 根据权利要求11所述的显示面板制程方法，其中，所述封装层包括第一子封装层、第二子封装层以及第三子封装层，所述第一子封装层设置在所述像素定义层的第一面，且延伸覆盖所述发光层，所述第二子封装层覆盖在所述第一子封装层和彩膜发光层远离所述像素定义层的一面，所述第三子封装层设置在所述第二子封装层远离所述第一封装层的一面。
  13. 根据权利要求12所述的显示面板制程方法，其中，所述彩膜功能层设置在所述第一子封装层与所述第二子封装层之间，且位于所述凹槽内。
  14. 根据权利要求13所述的显示面板制程方法，其中，所述彩膜功能层的顶部为弧形，所述彩膜功能层的顶部低于所述第二子封装层的平面。
  15. 根据权利要求13所述的显示面板制程方法，其中，所述彩膜功能层通过喷墨打印形成到所述第一子封装层上。
  16. 根据权利要求13所述的显示面板制程方法，其中，还包括阳极层、阴极层以及遮光层，所述遮光层位于所述像素定义层的第一面，且位于所述凹槽的两侧，所述阴极层位于所述遮光层与所述第一子封装层之间，且设置于所述凹槽内的发光层位于所述第一子封装层与发光层之间，所述阳极层设置在所述发光层远离所述阴极层的一面。
  17. 根据权利要求16所述的显示面板制程方法，其中，还包括平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层，所述平坦化层设置在所述第二面，所述第二绝缘层设置在平坦化层远离所述像素定义层的一面，所述第一绝缘层设置在所述第二绝缘层远离所述平坦化层的一面。
  18. 根据权利要求17所述的显示面板制程方法，其中，还包括薄膜晶体管，所述薄膜晶体管包括第一端口和第二端口，所述平坦化层、层间绝缘层、第一绝缘层以及第二绝缘层设置有沟道，所述第一端口与所述阳极层连接，所述第一端口通过所述沟道与所述第二端口连通。
  19. 根据权利要求17所述的显示面板制程方法，其中，还包括缓冲层和绝缘薄膜层，所述缓冲层设置在所述第一绝缘层远离所述第二绝缘层的一面，所述绝缘薄膜层设置在所述缓冲层远离所述第一绝缘层的第一面。
  20. 根据权利要求17所述的显示面板制程方法，其中，所述彩膜功能层包括红色色阻、绿色色阻、蓝色色阻以及黑色矩阵，所述红色色阻、绿色色阻、蓝色色阻分别于红色子像素单元、绿色子像素单元、蓝色子像素单元对应。
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