WO2020143115A1 - 显示面板 - Google Patents

显示面板 Download PDF

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Publication number
WO2020143115A1
WO2020143115A1 PCT/CN2019/078950 CN2019078950W WO2020143115A1 WO 2020143115 A1 WO2020143115 A1 WO 2020143115A1 CN 2019078950 W CN2019078950 W CN 2019078950W WO 2020143115 A1 WO2020143115 A1 WO 2020143115A1
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WO
WIPO (PCT)
Prior art keywords
ring
shaped member
display panel
strip
layer
Prior art date
Application number
PCT/CN2019/078950
Other languages
English (en)
French (fr)
Inventor
王坤
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/340,144 priority Critical patent/US10847752B2/en
Publication of WO2020143115A1 publication Critical patent/WO2020143115A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the invention relates to the field of display technology, in particular to a display panel.
  • the foldable screen has wide application prospects. At present, more and more manufacturers are trying to develop foldable screens.
  • Foldable screens require that the number of foldable times meet commercial standards. Under this requirement, the foldable screens need to achieve a high level of bending resistance.
  • the improvement of the bending resistance of the traditional foldable screen depends in part on the improvement of the bending resistance of its encapsulation layer, which is limited by the structure of the encapsulation layer of the traditional foldable screen.
  • the stress can not be effectively relieved, therefore, the overall bending resistance of the traditional foldable screen is low.
  • An object of the present invention is to provide a display panel, which can effectively improve the bending resistance of the display panel.
  • a display panel includes a display device board including a display area and a peripheral area located on at least one side of the display area; an encapsulation layer, the encapsulation layer including a first organic layer, A first inorganic layer, a second organic layer and a second inorganic layer, the first organic layer is disposed on a portion of the display device board corresponding to the display area, the first organic layer includes at least two ring members ,
  • the ring-shaped member includes four strip-shaped members, the strip-shaped members cover at least a part of the pixel unit of the display device board, the first inorganic layer, the second organic layer, and the second inorganic layer are in this order Laminated, and the first inorganic layer covers the first organic layer;
  • the linear shape corresponding to the strip-shaped member is one of a straight line, a zigzag line, a broken line, and a wavy line;
  • the width of the strip-shaped member is greater than Or equal to the width of the pixel unit; the surface of the
  • At least two of the ring members include a first ring member and a second ring member, and the first ring member surrounds the second ring member.
  • the first inorganic layer is provided on the ring-shaped member and the portion of the display device board not covered by the ring-shaped member.
  • a display panel includes a display device board including a display area and a peripheral area located on at least one side of the display area; an encapsulation layer, the encapsulation layer including a first organic layer, A first inorganic layer, a second organic layer and a second inorganic layer, the first organic layer is disposed on a portion of the display device board corresponding to the display area, the first organic layer includes at least two ring members ,
  • the ring-shaped member includes four strip-shaped members, the strip-shaped members cover at least a part of the pixel unit of the display device board, the first inorganic layer, the second organic layer, and the second inorganic layer are in this order Laminated, and the first inorganic layer covers the first organic layer.
  • the line type corresponding to the bar-shaped member is one of a straight line, a zigzag line, a fold line, and a wavy line.
  • the width of the strip-shaped member is greater than or equal to the width of the pixel unit.
  • At least two of the ring members include a first ring member and a second ring member, and the first ring member surrounds the second ring member.
  • the width of the strip-shaped member in the first ring-shaped member is equal to the width of the strip-shaped member in the second ring-shaped member.
  • the width of the strip-shaped member in the first ring-shaped member is larger or smaller than the width of the strip-shaped member in the second ring-shaped member.
  • the first inorganic layer is provided on the ring-shaped member and the portion of the display device board not covered by the ring-shaped member.
  • the surface of the ring-shaped member away from the display device board is a convex curved surface.
  • the height of the bar-shaped member is in the range of 1 micrometer to 15 micrometers.
  • the width of the strip-like member is in the range of 10 microns to 500 microns.
  • the strip-shaped members are arranged at equal intervals in the same direction.
  • At least a part of the strip-shaped member fills the concave portion corresponding to the pixel unit on the display device board.
  • the thickness of the second organic layer at a position corresponding to the strip-shaped member is greater than or equal to 0 ⁇ m.
  • the ring-shaped member is formed by spraying a first organic material in the display area of the display device board using a spraying device.
  • the first inorganic layer is formed by depositing a first inorganic material on the ring-shaped member and on a portion of the display device board not covered by the ring-shaped member.
  • the second organic layer is formed by applying a second organic material to the first inorganic layer and a portion of the display device board not covered by the first inorganic layer.
  • the second inorganic layer is formed by depositing a second inorganic material on the second organic layer.
  • the first organic layer in the encapsulation layer includes at least two ring-shaped members
  • the ring-shaped member includes four strip-shaped members
  • the strip-shaped members cover at least a part of the pixel unit of the display device board.
  • An inorganic layer, a second organic layer, and a second inorganic layer are sequentially stacked on the first organic layer, therefore, when the display panel is bent, the encapsulation layer can stress it among multiple strip-shaped members
  • the encapsulation layer can release its stress from one strip-shaped member to another strip-shaped member along the length of the strip-shaped member, or release its stress from one strip-shaped member to have a gap with it Therefore, the technical solution of the present invention can effectively improve the bending resistance of the display panel.
  • FIG. 1 is a schematic diagram of a first embodiment of a display panel of the present invention.
  • Fig. 2 is a first schematic diagram of the X-X' cross section in Fig. 1.
  • Fig. 3 is a second schematic diagram of the X-X' cross section in Fig. 1.
  • Fig. 4 is a third schematic diagram of the X-X' cross section in Fig. 1.
  • FIG. 5 is a schematic diagram of the width of the bar-shaped member gradually decreasing from outside to inside in the first embodiment of the display panel of the present invention.
  • FIG. 6 is a schematic diagram of a second embodiment of the display panel of the present invention.
  • FIG. 7 is a schematic diagram of a third embodiment of the display panel of the present invention.
  • FIG. 1 is a schematic diagram of a first embodiment of a display panel of the present invention
  • FIG. 2 is a first schematic diagram of the XX′ cross section in FIG. 1
  • FIG. 3 is an X- in FIG. 1
  • FIG. 4 is the third schematic diagram of the XX′ cross section in FIG. 1
  • FIG. 5 is the first embodiment of the display panel of the present invention. Schematic diagram of reduction.
  • the display panel in this embodiment may be, for example, OLED (Organic Light Emitting Diode, organic light-emitting diode display panel), etc.
  • the display panel of this embodiment includes a display device board 101 and an encapsulation layer 102.
  • the display device board 101 includes a display area A and a peripheral area B located on at least one side of the display area A.
  • the display device board 101 includes a flexible substrate 1011, a buffer layer (not shown in the figure), a scan line (not shown in the figure), a data line (not shown in the figure), and a thin film transistor switch (not shown in the figure) ), a flat layer (not shown in the figure), a pixel defining layer 1012, an anode (not shown in the figure), an organic light emitting material layer 1013, a cathode 1014, a cover layer 1015, and the like.
  • the scan line and the data line are both connected to the thin film transistor switch, the thin film transistor switch is also connected to the anode, and the organic light emitting material layer 1013 is disposed between the anode and the cathode 1014 between.
  • a pixel unit composed of the thin film transistor switch, the anode, the organic light emitting material layer 1013, and the cathode 1014 is disposed in the display area A.
  • the first inorganic layer 1022, the second organic layer 1023, and the second inorganic layer 1024 are sequentially stacked, and the first inorganic layer 1022 is provided on the first organic layer 1021 and the display device board 101 is a portion that is not covered by the first organic layer 1021.
  • the material of the cover layer 1015 may be, for example, lithium fluoride (LiF).
  • the pixel unit is located in the display area A, and the color corresponding to the pixel unit is one of red, green, and blue.
  • a pixel defining layer 1012 is provided between the organic light emitting material layers 1013 of two adjacent pixel units.
  • a portion of the display device board 101 located in the peripheral area B is provided with a retaining wall
  • the retaining wall includes a first retaining wall 1017 and a second retaining wall 1016
  • the first retaining wall 1017 and the second retaining wall 1016 are all ring-shaped
  • the first retaining wall 1017 surrounds the second retaining wall 1016.
  • the second retaining wall 1016 surrounds the ring-shaped member.
  • the first retaining wall 1017 includes a first wall 10171 and a second wall 10172, and the second wall 10172 is disposed on the first wall 10171.
  • the material of the first wall 10171 is the same as the material of the flat layer.
  • the first wall 10171 is formed in the same process as the flat layer in the process of forming the flat layer.
  • the material of the second retaining wall 1016 and the material of the second wall 10172 are the same as the material of the pixel defining layer 1012.
  • the second retaining wall 1016 and the second wall 10172 of the first retaining wall 1017 are formed in the same process as the pixel defining layer 1012 during the process of forming the pixel defining layer 1012.
  • the encapsulation layer 102 includes a first organic layer 1021, a first inorganic layer 1022, a second organic layer 1023, and a second inorganic layer 1024.
  • the first organic layer 1021 is disposed on the display device board 101 and the display area On the portion corresponding to A, the first organic layer 1021 includes at least two ring-shaped members, and the ring-shaped member includes four strip-shaped members, the strip-shaped members covering at least a portion of the pixel unit of the display device board 101, so
  • the first inorganic layer 1022, the second organic layer 1023, and the second inorganic layer 1024 are sequentially stacked, and the first inorganic layer 1022 covers the first organic layer 1021.
  • the ring-shaped member (ie, the patterned first organic layer 1021) is formed by spraying a first organic material in the display area A of the display device board 101 using a spraying device.
  • At least a part of the strip-shaped member fills the concave portion corresponding to the pixel unit on the display device board 101.
  • the ring-shaped member having elasticity is used to relieve stress caused by bending of the display panel, and to diffuse the stress along the direction of the line corresponding to the strip-shaped member, thereby improving the display panel
  • the anti-bending performance reduces the risk of failure of the display panel at the bend.
  • the linear shape corresponding to the strip-shaped member is a straight line.
  • the density of the strip-shaped member and the width of the corresponding line shape can be set according to the spraying accuracy and the nozzle size of the spraying device.
  • the strip-shaped members are arranged equidistantly.
  • the strip-shaped member covers at least a part of the pixel unit in the first direction.
  • the bar-shaped member has extended claws extending from the side of the main body portion of the bar-shaped member toward the outside of the main body portion of the bar-shaped member, and the extended claws cling to In at least one of the flat surface, the inclined surface, and the uneven surface of the display device board, the extended contact claw may be linear or arc-shaped.
  • the width of the strip-shaped member is equal to the width of one pixel unit, as shown in FIG. 1, or the width of the strip-shaped member is greater than the width of one pixel unit, as shown in FIG. 4.
  • the width of the strip-like member is equal to the width of the pixel unit (ie, the first organic material sprayed by the spraying device in the display area A of the display device board 101
  • the material only covers the width of a single pixel unit (ie, sub-pixel)
  • the display panel has the highest bending resistance.
  • At least two of the ring-shaped members include a first ring-shaped member and a second ring-shaped member, and the first strip-shaped member is located between the second strip-shaped member and an edge portion of the display device board 101, The first ring-shaped member surrounds the second ring-shaped member.
  • the width of the strip-shaped member in the first ring-shaped member is equal to the width of the strip-shaped member in the second ring-shaped member; or, the width of the strip-shaped member in the first ring-shaped member is larger or smaller than The width of the strip-shaped member in the second ring-shaped member.
  • the width of the strip-shaped members in the two adjacent ring-shaped members is equal; or, the width of the strip-shaped members in the ring-shaped members From the edge of the display area A to the center of the display area A gradually decreases (as shown in FIG. 5) or gradually increases.
  • the first inorganic layer 1022 is provided on the ring-shaped member and a portion of the display device board 101 that is not covered by the ring-shaped member.
  • the first inorganic layer 1022 also covers a portion of the display device board 101 located in the peripheral area B.
  • the first inorganic layer 1022 also covers a retaining wall provided in the peripheral area B and the display The part of the device board 101 that is not covered by the retaining wall.
  • the first inorganic layer 1022 is formed on the ring-shaped member by an atomic layer deposition (ALD) process, a laser pulse deposition (PLD) process, a sputtering process, a plasma enhanced chemical vapor deposition (PECVD) process, etc.
  • the display device board 101 is formed by depositing a first inorganic material on a portion not covered by the ring-shaped member, and the first inorganic material may be, for example, SiNx, SiOxNy, SiOx, SiCxNy, ZnO, AlOx, or the like.
  • the first inorganic layer 1022 covers the first inorganic layer 1022 and the retaining wall located in the peripheral area B, there is a gap between the two ring-shaped members in the first inorganic layer 1022, and the two retaining walls There is also a gap between them, so the contact area between the encapsulation layer 102 and the display device board 101 can be increased, the ability of the display panel to relieve stress during bending can be improved, and thus the bending resistance of the display panel can be improved Fold performance.
  • the surface of the ring-shaped member away from the display device board 101 is a convex curved surface.
  • the height of the bar-shaped member is in the range of 1 micron to 15 microns, for example, the height is 1 micron, 2 microns, 3 microns, 4 microns, 5 microns, 6 microns, 7 microns, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns.
  • the height refers to the length from one end to the other end of the cross-section of the bar-shaped member in a direction perpendicular to the plane corresponding to the display device board 101.
  • the width of the strip-shaped member is in the range of 10 microns to 500 microns, for example, the width is 10 microns, 30 microns, 50 microns, 70 microns, 90 microns, 110 microns, 130 microns, 150 microns, 170 microns, 190 microns, 210 microns, 230 microns, 250 microns, 270 microns, 290 microns, 310 microns, 330 microns, 350 microns, 370 microns, 390 microns, 410 microns, 430 microns, 450 microns, 470 microns, 490 microns, 500 microns .
  • the width refers to the length from one end to the other end of the cross section of the strip-like member in a direction parallel to the plane corresponding to the display device board 101.
  • the thickness of the second organic layer 1023 at the position corresponding to the strip-shaped member is greater than or equal to 0 ⁇ m.
  • the thickness refers to the length from one end to the other end of the cross section of the second organic layer 1023 in a direction perpendicular to the plane corresponding to the display device board 101.
  • the first inorganic layer 1022 and the second inorganic layer 1024 are located at the strip-shaped member Contact at the corresponding position.
  • the second organic layer 1023 is formed by applying a second organic material to the first inorganic layer 1022 and the portion of the display device board 101 that is not covered by the first inorganic layer 1022.
  • the second organic material and the first organic material are the same or different organic materials.
  • the thickness of the second organic layer 1023 can be adjusted according to actual conditions.
  • the surface of the second organic layer 1023 (away from the surface of the display device board 101) is flat with the top of the first inorganic layer 1022, As shown in FIG. 3, alternatively, the surface of the second organic layer 1023 (the surface away from the display device board 101) is higher than the top of the first inorganic layer 1022 by a predetermined distance, as shown in FIG.
  • the surface of the second organic layer 1023 (the surface away from the display device board 101) is a flat surface.
  • the second organic layer 1023 is disposed on the surface of the first inorganic layer 1022, at least a portion of the second organic layer 1023 fills the gap between the two strip-shaped members, which is beneficial for alleviating the The stress generated at the display unit when the display panel is bent inwards and outwards to enhance the bending resistance of the display panel.
  • the second inorganic layer 1024 is formed on the second organic layer 1023 through an atomic layer deposition (ALD) process, a laser pulse deposition (PLD) process, a sputtering (Sputter) process, a plasma enhanced chemical vapor deposition (PECVD) process, etc. It is formed by depositing a second inorganic material on the top.
  • the second inorganic material may be, for example, SiNx, SiOxNy, SiOx, SiCxNy, ZnO, AlOx, or the like.
  • the first organic layer in the encapsulation layer includes at least two ring-shaped members
  • the ring-shaped member includes four strip-shaped members
  • the strip-shaped members cover at least a part of the pixel unit of the display device board.
  • An inorganic layer, a second organic layer, and a second inorganic layer are sequentially stacked on the first organic layer, therefore, when the display panel is bent, the encapsulation layer can stress it among multiple strip-shaped members
  • the encapsulation layer can release its stress from one strip-shaped member to another strip-shaped member along the length of the strip-shaped member, or release its stress from one strip-shaped member to have a gap with it Therefore, the technical solution of the present invention can effectively improve the bending resistance of the display panel.
  • FIG. 6 is a schematic diagram of a second embodiment of the display panel of the present invention. This embodiment is similar to or similar to the first embodiment described above, except for:
  • the line type corresponding to the strip-shaped member is a zigzag line or a zigzag line.
  • the strip-shaped member covers at least a portion of the pixel unit in the second direction and the third direction, wherein the second direction and The third direction has an included angle greater than 0 degrees.
  • the line type corresponding to the strip-shaped member is set as a zigzag line or a zigzag line to make the strip-shaped member cover more pixel areas.
  • FIG. 7 is a schematic diagram of a third embodiment of the display panel of the present invention. This embodiment is similar to or similar to the first embodiment or the second embodiment described above, except that:
  • the linear shape corresponding to the strip-shaped member is a wavy line.
  • the strip-shaped member covers at least a part of the pixel unit in the fourth direction and the fifth direction, wherein the fourth direction and the The fifth direction has an included angle greater than 0 degrees.
  • the line shape corresponding to the strip-shaped member is set as a wavy line so that the strip-shaped member covers more pixel areas.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板，包括显示器件板（101）和封装层（102）；显示器件板（101）包括显示区（A）以及外围区（B）；封装层（102）包括第一有机层（1021）、第一无机层（1022）、第二有机层（1023）和第二无机层（1024），第一有机层（1021）包括至少两环状构件，环状构件包括四条状构件，条状构件覆盖显示器件板（101）的像素单元的至少一部分，第一无机层（1022）、第二有机层（1023）和第二无机层（1024）依次层叠。

Description

显示面板 技术领域
本发明涉及显示技术领域，特别涉及一种显示面板。
 背景技术
可折叠屏幕具有广泛的应用前景。目前，越来越多的厂商尝试开发可折叠屏幕。
可折叠屏幕要求可弯折次数达到商用的标准，在这种要求下，可折叠屏幕的抗弯折性能需要达到较高的水平。
传统的可折叠屏幕的抗弯折性能的提高部分依赖于其封装层的抗弯折性能的提高，受限于传统的可折叠屏幕的封装层的构造，传统的可弯折屏幕在弯折时的应力无法得到有效的缓解，因此，传统的可折叠屏幕的整体的抗弯折性能较低。
故，有必要提出一种新的技术方案，以解决上述技术问题。
 技术问题
本发明的目的在于提供一种显示面板，其能有效提高显示面板的抗弯折性能。
 技术解决方案
为解决上述问题，本发明的技术方案如下：
一种显示面板，所述显示面板包括：显示器件板，所述显示器件板包括显示区以及位于所述显示区的至少一侧的外围区；封装层，所述封装层包括第一有机层、第一无机层、第二有机层和第二无机层，所述第一有机层设置于所述显示器件板与所述显示区对应的部分上，所述第一有机层包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板的像素单元的至少一部分，所述第一无机层、所述第二有机层和所述第二无机层依次层叠，并且所述第一无机层覆盖所述第一有机层；所述条状构件所对应的线型为直线、锯齿线、折线、波浪线中的一种；所述条状构件的宽度大于或等于所述像素单元的宽度；所述环状构件远离所述显示器件板的表面为外凸曲面。
在上述显示面板中，至少两所述环状构件包括第一环状构件和第二环状构件，所述第一环状构件包围所述第二环状构件。
在上述显示面板中，所述第一无机层设置于所述环状构件上以及所述显示器件板未被所述环状构件覆盖的部分上。
一种显示面板，所述显示面板包括：显示器件板，所述显示器件板包括显示区以及位于所述显示区的至少一侧的外围区；封装层，所述封装层包括第一有机层、第一无机层、第二有机层和第二无机层，所述第一有机层设置于所述显示器件板与所述显示区对应的部分上，所述第一有机层包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板的像素单元的至少一部分，所述第一无机层、所述第二有机层和所述第二无机层依次层叠，并且所述第一无机层覆盖所述第一有机层。
在上述显示面板中，所述条状构件所对应的线型为直线、锯齿线、折线、波浪线中的一种。
在上述显示面板中，所述条状构件的宽度大于或等于所述像素单元的宽度。
在上述显示面板中，至少两所述环状构件包括第一环状构件和第二环状构件，所述第一环状构件包围所述第二环状构件。
在上述显示面板中，所述第一环状构件中的条状构件的宽度等于所述第二环状构件中的条状构件的宽度。
在上述显示面板中，所述第一环状构件中的条状构件的宽度大于或小于所述第二环状构件中的条状构件的宽度。
在上述显示面板中，所述第一无机层设置于所述环状构件上以及所述显示器件板未被所述环状构件覆盖的部分上。
在上述显示面板中，所述环状构件远离所述显示器件板的表面为外凸曲面。
在上述显示面板中，所述条状构件的高度处于1微米至15微米的范围内。
在上述显示面板中，所述条状构件的宽度处于10微米至500微米的范围内。
在上述显示面板中，在同一方向上，所述条状构件等距设置。
在上述显示面板中，所述条状构件的至少一部分填充所述显示器件板上与所述像素单元对应的凹陷部。
在上述显示面板中，所述第二有机层在与所述条状构件对应的位置处的厚度大于或等于0微米。
在上述显示面板中，所述环状构件是通过利用喷涂装置在所述显示器件板的所述显示区内喷涂第一有机材料来形成的。
在上述显示面板中，所述第一无机层是通过在所述环状构件上以及所述显示器件板未被所述环状构件覆盖的部分上沉积第一无机材料来形成的。
在上述显示面板中，所述第二有机层是通过向所述第一无机层以及所述显示器件板上未被所述第一无机层覆盖的部分涂覆第二有机材料来形成的。
在上述显示面板中，所述第二无机层是通过在所述第二有机层上沉积第二无机材料来形成的。
 有益效果
在本发明中，由于封装层中的第一有机层包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板的像素单元的至少一部分，第一无机层、第二有机层和第二无机层依次层叠于所述第一有机层上，因此，在所述显示面板弯折时，所述封装层能够将其应力在多条条状构件之间予以缓解，例如，所述封装层能够将其应力沿条状构件的长度方向从一条条状构件缓释至另一条条状构件，或者将其应力从一条条状构件缓释至与其具有间隙的另一条条状构件，因此，本发明的技术方案能有效提高显示面板的抗弯折性能。
 附图说明
图1为本发明的显示面板的第一实施例的示意图。
图2为图1中的X-X’截面的第一种示意图。
图3为图1中的X-X’截面的第二种示意图。
图4为图1中的X-X’截面的第三种示意图。
图5为本发明的显示面板的第一实施例中条状构件的宽度自外向内逐渐减小的示意图。
图6为本发明的显示面板的第二实施例的示意图。
图7为本发明的显示面板的第三实施例的示意图。
 本发明的实施方式
本说明书所使用的词语“实施例”意指实例、示例或例证。此外，本说明书和所附权利要求中所使用的冠词“一”一般地可以被解释为“一个或多个”，除非另外指定或从上下文可以清楚确定单数形式。
参考图1至图5，图1为本发明的显示面板的第一实施例的示意图，图2为图1中的X-X’截面的第一种示意图，图3为图1中的X-X’截面的第二种示意图，图4为图1中的X-X’截面的第三种示意图，图5为本发明的显示面板的第一实施例中条状构件的宽度自外向内逐渐减小的示意图。
本实施例的显示面板可例如为OLED（Organic Light Emitting Diode，有机发光二极管显示面板）等。
本实施例的显示面板包括显示器件板101和封装层102。
所述显示器件板101包括显示区A以及位于所述显示区A的至少一侧的外围区B。所述显示器件板101包括柔性基板1011、缓冲层（图中未示出）、扫描线（图中未示出）、数据线（图中未示出）、薄膜晶体管开关（图中未示出）、平坦层（图中未示出）、像素界定层1012、阳极（图中未示出）、有机发光材料层1013、阴极1014、覆盖层1015等。其中，所述扫描线和所述数据线均与所述薄膜晶体管开关连接，所述薄膜晶体管开关还与所述阳极连接，所述有机发光材料层1013设置于所述阳极与所述阴极1014之间。由所述薄膜晶体管开关、所述阳极、所述有机发光材料层1013、所述阴极1014组成的像素单元设置于所述显示区A内。所述第一无机层1022、所述第二有机层1023和所述第二无机层1024依次层叠，并且，所述第一无机层1022设置于所述第一有机层1021以及所述显示器件板101未被所述第一有机层1021覆盖的部分。
所述覆盖层1015的材料可例如为氟化锂（LiF）。
所述像素单元位于所述显示区A，所述像素单元所对应的颜色为红色、绿色、蓝色中的一种。相邻两所述像素单元的所述有机发光材料层1013之间设置有像素界定层1012。
所述显示器件板101位于所述外围区B的部分设置有挡墙，所述挡墙包括第一挡墙1017和第二挡墙1016，所述第一挡墙1017和所述第二挡墙1016均为环状，所述第一挡墙1017包围所述第二挡墙1016。所述第二挡墙1016包围所述环状构件。所述第一挡墙1017包括第一墙体10171和第二墙体10172，所述第二墙体10172设置于所述第一墙体10171上。所述第一墙体10171的材料与所述平坦层的材料相同，所述第一墙体10171是在形成所述平坦层的过程中与所述平坦层采用同一工序形成的。
所述第二挡墙1016的材料和所述第二墙体10172的材料均与所述像素界定层1012的材料相同。所述第二挡墙1016和所述第一挡墙1017的所述第二墙体10172是在形成所述像素界定层1012的过程与所述像素界定层1012采用同一工序形成的。
所述封装层102包括第一有机层1021、第一无机层1022、第二有机层1023和第二无机层1024，所述第一有机层1021设置于所述显示器件板101与所述显示区A对应的部分上，所述第一有机层1021包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板101的像素单元的至少一部分，所述第一无机层1022、所述第二有机层1023和所述第二无机层1024依次层叠，并且所述第一无机层1022覆盖所述第一有机层1021。
所述环状构件中的四所述条状构件首尾相连为环状。
所述环状构件（即，图案化的所述第一有机层1021）是通过利用喷涂装置在所述显示器件板101的所述显示区A内喷涂第一有机材料来形成的。
所述条状构件的至少一部分填充所述显示器件板101上与所述像素单元对应的凹陷部。
具有弹性的所述环状构件用于缓释所述显示面板因弯折而产生的应力，并使得所述应力沿着所述条状构件所对应的线条的方向扩散，从而提高所述显示面板的抗弯折性能，降低所述显示面板弯折处失效的风险。
在实践中，当所述环状构件覆盖越多的像素单元时，所述第一有机层1021缓解所述显示面板在弯折过程中产生的应力的能力越强，所述显示面板的抗弯折性能越高。
在本实施例中，所述条状构件所对应的线型为直线。
所述条状构件的密度及其所对应的线型的宽度可根据喷涂装置的喷涂精度和喷嘴大小设置。
在同一方向上，所述条状构件等距设置。
在所述条状构件所对应的线型为直线的情况下，所述条状构件在第一方向上覆盖所述像素单元的至少一部分。
作为一种改进，所述条状构件具有延伸触爪，所述延伸触爪从所述条状构件的主体部分的侧面往所述条状构件的主体部分外延伸，所述延伸触爪紧贴于所述显示器件板的平坦面、斜面、凹凸面中的至少一者，所述延伸触爪可为直线形、弧线形。
所述条状构件的宽度等于1个所述像素单元的宽度，如图1所示，或者，所述条状构件的宽度大于1个所述像素单元的宽度，如图4所示。
在实践中，经验证可知：当所述条状构件的宽度等于所述像素单元的宽度时（即，所述喷涂装置在所述显示器件板101的所述显示区A内喷涂的第一有机材料仅覆盖单个像素单元（即，子像素）的宽度）时，所述显示面板的抗弯折性能最高。
至少两所述环状构件包括第一环状构件和第二环状构件，所述第一条状构件位于所述第二条状构件与所述显示器件板101的边缘部之间，所述第一环状构件包围所述第二环状构件。
所述第一环状构件中的条状构件的宽度等于所述第二环状构件中的条状构件的宽度；或者，所述第一环状构件中的条状构件的宽度大于或小于所述第二环状构件中的条状构件的宽度。
即，自所述显示区A的边缘至所述显示区A的中心，相邻两所述环状构件中的条状构件的宽度相等；或者，所述环状构件中的条状构件的宽度自所述显示区A的边缘至所述显示区A的中心逐渐减小（如图5所示）或逐渐增大。
所述第一无机层1022设置于所述环状构件上以及所述显示器件板101未被所述环状构件覆盖的部分上。所述第一无机层1022还覆盖所述显示器件板101位于所述外围区B的部分，具体地，所述第一无机层1022还覆盖设置于所述外围区B的挡墙以及所述显示器件板101未被所述挡墙覆盖的部分。
所述第一无机层1022是通过原子层沉积（ALD）工艺、激光脉冲沉积（PLD）工艺、溅射（Sputter）工艺、等离子增强化学气相沉积（PECVD）工艺等在所述环状构件上以及所述显示器件板101未被所述环状构件覆盖的部分上沉积第一无机材料来形成的，所述第一无机材料可例如为SiNx、SiOxNy、SiOx、SiCxNy、ZnO、AlOx等。
由于所述第一无机层1022覆盖所述第一无机层1022以及位于所述外围区B的所述挡墙，所述第一无机层1022中的两环状构件之间具有间隙，两挡墙之间也具有间隙，因此可以增大所述封装层102与所述显示器件板101的接触面积，提高所述显示面板在弯折过程中缓解应力的能力，从而提高所述显示面板的抗弯折性能。
所述环状构件远离所述显示器件板101的表面为外凸曲面。
所述条状构件的高度处于1微米至15微米的范围内，例如，所述高度为1微米、2微米、3微米、4微米、5微米、6微米、7微米、8微米、9微米、10微米、11微米、12微米、13微米、14微米、15微米。所述高度是指在垂直于所述显示器件板101所对应的平面的方向上，所述条状构件的横截面的一端至另一端的长度。
所述条状构件的宽度处于10微米至500微米的范围内，例如，所述宽度为10微米、30微米、50微米、70微米、90微米、110微米、130微米、150微米、170微米、190微米、210微米、230微米、250微米、270微米、290微米、310微米、330微米、350微米、370微米、390微米、410微米、430微米、450微米、470微米、490微米、500微米。所述宽度是指在平行于所述显示器件板101所对应的平面的方向上，所述条状构件的横截面的一端至另一端的长度。
所述第二有机层1023在所述条状构件所对应的位置处的厚度大于或等于0微米。所述厚度是指在垂直于所述显示器件板101所对应的平面的方向上，所述第二有机层1023的横截面的一端至另一端的长度。
在所述第二有机层1023在所述条状构件所对应的位置处的厚度等于0微米的情况下，所述第一无机层1022和所述第二无机层1024在所述条状构件所对应的位置处相接触。
所述第二有机层1023是通过向所述第一无机层1022以及所述显示器件板101上未被所述第一无机层1022覆盖的部分涂覆第二有机材料来形成的。所述第二有机材料与所述第一有机材料为相同或不同的有机材料。
所述第二有机层1023的厚度可根据实际情况进行调节，例如，所述第二有机层1023的表面（远离所述显示器件板101的表面）与所述第一无机层1022的顶端持平，如图3所示，或者，所述第二有机层1023的表面（远离所述显示器件板101的表面）高出所述第一无机层1022的顶端预定距离，如图2所示。所述第二有机层1023的表面（远离所述显示器件板101的表面）为平坦的表面。
由于所述第二有机层1023设置于所述第一无机层1022的表面，因此，所述第二有机层1023的至少一部分填充两所述条状构件之间的间隙，这有利于缓解所述显示面板内弯和外弯时，在所述显示单元处产生的应力，以增强所述显示面板的抗弯折性能。
所述第二无机层1024是通过原子层沉积（ALD）工艺、激光脉冲沉积（PLD）工艺、溅射（Sputter）工艺、等离子增强化学气相沉积（PECVD）工艺等在所述第二有机层1023上沉积第二无机材料来形成的，所述第二无机材料可例如为SiNx、SiOxNy、SiOx、SiCxNy、ZnO、AlOx等。
在本发明中，由于封装层中的第一有机层包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板的像素单元的至少一部分，第一无机层、第二有机层和第二无机层依次层叠于所述第一有机层上，因此，在所述显示面板弯折时，所述封装层能够将其应力在多条条状构件之间予以缓解，例如，所述封装层能够将其应力沿条状构件的长度方向从一条条状构件缓释至另一条条状构件，或者将其应力从一条条状构件缓释至与其具有间隙的另一条条状构件，因此，本发明的技术方案能有效提高显示面板的抗弯折性能。
参考图6，图6为本发明的显示面板的第二实施例的示意图。本实施例与上述第一实施例相近或相似，不同之处在于：
在本实施例中，所述条状构件所对应的线型为锯齿线或折线。
在所述条状构件所对应的线型为锯齿线或折线的情况下，所述条状构件在第二方向和第三方向上覆盖所述像素单元的至少一部分，其中，所述第二方向和所述第三方向具有大于0度的夹角。
将所述条状构件所对应的线型设置为锯齿线或折线是为了使得所述条状构件覆盖更多的像素区域。
参考图7，图7为本发明的显示面板的第三实施例的示意图。本实施例与上述第一实施例或第二实施例相近或相似，不同之处在于：
在本实施例中，所述条状构件所对应的线型为波浪线。
在所述条状构件所对应的线型为波浪线的情况下，所述条状构件在第四方向和第五方向上覆盖所述像素单元的至少一部分，其中，所述第四方向和所述第五方向具有大于0度的夹角。
将所述条状构件所对应的线型设置为波浪线是为了使得所述条状构件覆盖更多的像素区域。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (20)

  1. 一种显示面板，其中，所述显示面板包括：
    显示器件板，所述显示器件板包括显示区以及位于所述显示区的至少一侧的外围区；
    封装层，所述封装层包括第一有机层、第一无机层、第二有机层和第二无机层，所述第一有机层设置于所述显示器件板与所述显示区对应的部分上，所述第一有机层包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板的像素单元的至少一部分，所述第一无机层、所述第二有机层和所述第二无机层依次层叠，并且所述第一无机层覆盖所述第一有机层；
    所述条状构件所对应的线型为直线、锯齿线、折线、波浪线中的一种；
    所述条状构件的宽度大于或等于所述像素单元的宽度；
    所述环状构件远离所述显示器件板的表面为外凸曲面。
  2. 根据权利要求1所述的显示面板，其中，至少两所述环状构件包括第一环状构件和第二环状构件，所述第一环状构件包围所述第二环状构件。
  3. 根据权利要求1所述的显示面板，其中，所述第一无机层设置于所述环状构件上以及所述显示器件板未被所述环状构件覆盖的部分上。
  4. 一种显示面板，其中，所述显示面板包括：
    显示器件板，所述显示器件板包括显示区以及位于所述显示区的至少一侧的外围区；
    封装层，所述封装层包括第一有机层、第一无机层、第二有机层和第二无机层，所述第一有机层设置于所述显示器件板与所述显示区对应的部分上，所述第一有机层包括至少两环状构件，所述环状构件包括四条状构件，所述条状构件覆盖所述显示器件板的像素单元的至少一部分，所述第一无机层、所述第二有机层和所述第二无机层依次层叠，并且所述第一无机层覆盖所述第一有机层。
  5. 根据权利要求4所述的显示面板，其中，所述条状构件所对应的线型为直线、锯齿线、折线、波浪线中的一种。
  6. 根据权利要求4所述的显示面板，其中，所述条状构件的宽度大于或等于所述像素单元的宽度。
  7. 根据权利要求4所述的显示面板，其中，至少两所述环状构件包括第一环状构件和第二环状构件，所述第一环状构件包围所述第二环状构件。
  8. 根据权利要求7所述的显示面板，其中，所述第一环状构件中的条状构件的宽度等于所述第二环状构件中的条状构件的宽度。
  9. 根据权利要求7所述的显示面板，其中，所述第一环状构件中的条状构件的宽度大于或小于所述第二环状构件中的条状构件的宽度。
  10. 根据权利要求4所述的显示面板，其中，所述第一无机层设置于所述环状构件上以及所述显示器件板未被所述环状构件覆盖的部分上。
  11. 根据权利要求4所述的显示面板，其中，所述环状构件远离所述显示器件板的表面为外凸曲面。
  12. 根据权利要求4所述的显示面板，其中，所述条状构件的高度处于1微米至15微米的范围内。
  13. 根据权利要求4所述的显示面板，其中，所述条状构件的宽度处于10微米至500微米的范围内。
  14. 根据权利要求4所述的显示面板，其中，在同一方向上，所述条状构件等距设置。
  15. 根据权利要求4所述的显示面板，其中，所述条状构件的至少一部分填充所述显示器件板上与所述像素单元对应的凹陷部。
  16. 根据权利要求4所述的显示面板，其中，所述第二有机层在与所述条状构件对应的位置处的厚度大于或等于0微米。
  17. 根据权利要求4所述的显示面板，其中，所述环状构件是通过利用喷涂装置在所述显示器件板的所述显示区内喷涂第一有机材料来形成的。
  18. 根据权利要求4所述的显示面板，其中，所述第一无机层是通过在所述环状构件上以及所述显示器件板未被所述环状构件覆盖的部分上沉积第一无机材料来形成的。
  19. 根据权利要求4所述的显示面板，其中，所述第二有机层是通过向所述第一无机层以及所述显示器件板上未被所述第一无机层覆盖的部分涂覆第二有机材料来形成的。
  20. 根据权利要求4所述的显示面板，其中，所述第二无机层是通过在所述第二有机层上沉积第二无机材料来形成的。
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