JP2020510952A - エレクトロルミネッセンスディスプレイパネル及びその製造方法、表示装置 - Google Patents
エレクトロルミネッセンスディスプレイパネル及びその製造方法、表示装置 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
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- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 7
- 229910001882 dioxygen Inorganic materials 0.000 description 7
- 230000001788 irregular Effects 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
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- 239000003086 colorant Substances 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- KDOQMLIRFUVJNT-UHFFFAOYSA-N 4-n-naphthalen-2-yl-1-n,1-n-bis[4-(n-naphthalen-2-ylanilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound C1=CC=CC=C1N(C=1C=C2C=CC=CC2=CC=1)C1=CC=C(N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C=CC=CC3=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C3C=CC=CC3=CC=2)C=C1 KDOQMLIRFUVJNT-UHFFFAOYSA-N 0.000 description 1
- -1 5-phenyl-2-thienyl Chemical group 0.000 description 1
- 229910013184 LiBO Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 229910001515 alkali metal fluoride Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 1
- 229910000024 caesium carbonate Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- HZRMTWQRDMYLNW-UHFFFAOYSA-N lithium metaborate Chemical compound [Li+].[O-]B=O HZRMTWQRDMYLNW-UHFFFAOYSA-N 0.000 description 1
- SKEDXQSRJSUMRP-UHFFFAOYSA-N lithium;quinolin-8-ol Chemical compound [Li].C1=CN=C2C(O)=CC=CC2=C1 SKEDXQSRJSUMRP-UHFFFAOYSA-N 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000327 poly(triphenylamine) polymer Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
(1)本開示の実施例の図面は本開示の実施例に関する構造だけに係り、その他の構造について通常設計を参照すればよい。
Claims (14)
- エレクトロルミネッセンスディスプレイパネルであって、
ベース基板と、
前記ベース基板に設置された画素構造と、
前記画素構造に設置された封止層とを備え、
前記画素構造はアレイ状に配列され、アレイとして配列された複数のサブ画素を含み、前記画素構造アレイは交差する第1方向と第2方向を有し、前記サブ画素のエッジが、前記第1方向に沿う直線から徐々に離れていく第1部分を含み、前記第1部分の延伸方向が前記第2方向と重ならない、エレクトロルミネッセンスディスプレイパネル。 - 前記第1部分は略曲線である請求項1に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記サブ画素の形状は、円形、楕円形及び前記第1方向に蛇行している四角形のうちの少なくとも1種を含む請求項2に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記サブ画素のエッジの形状は、角数が4個より多い多角形を含む請求項1に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記第1方向に、隣接する前記サブ画素は前記第2方向に沿う直線に対して対称的に設置され、前記第2方向に、隣接する前記サブ画素は前記第1方向に沿う直線に対して対称的に設置される請求項1〜4のいずれか1項に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記封止薄膜は、積層して設置された無機絶縁層と有機絶縁層を少なくとも含む請求項1〜5のいずれか1項に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記無機絶縁層は、前記有機絶縁層と前記画素構造との間に設置された第1無機絶縁層、及び前記有機絶縁層に設置された第2無機絶縁層を含む請求項6に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記有機絶縁層の材料はアクリル樹脂又はポリメチルメタクリレート樹脂のうちの少なくとも1種を含む請求項6に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記画素構造は、積層して設置された第1電極、有機材料機能層及び第2電極を含む請求項1〜8のいずれか1項に記載のエレクトロルミネッセンスディスプレイパネル。
- 隣接する前記画素構造の間に設置された画素区画層をさらに備え、前記サブ画素は前記画素区画層により限定された開口領域に対応し、前記画素区画層の厚さが1μm〜1.5μmである請求項1〜9のいずれか1項に記載のエレクトロルミネッセンスディスプレイパネル。
- 前記エレクトロルミネッセンスディスプレイパネルはフレキシブルディスプレイパネルである請求項1〜10のいずれか1項に記載のエレクトロルミネッセンスディスプレイパネル。
- 請求項1〜11のいずれか1項に記載のエレクトロルミネッセンスディスプレイパネルを備える表示装置。
- ベース基板に有機エレクトロルミネッセンスダイオード画素構造を形成するステップと、
前記画素構造に前記画素構造を被覆する封止薄膜を形成するステップとを含み、
前記画素構造はアレイ状に配列され、アレイとして配列された複数のサブ画素を含み、前記画素構造アレイは交差する第1方向と第2方向を有し、前記サブ画素が前記第1方向に沿う直線から徐々に離れていく第1部分を含み、前記第1部分の延伸方向が前記第2方向と重ならない、エレクトロルミネッセンスディスプレイパネルの製造方法。 - 前記封止薄膜は、積層して設置された無機絶縁層と有機絶縁層を少なくとも含み、前記封止薄膜の形成は、コーティング、インクジェットプリント又は印刷の方式で前記有機絶縁層を形成するステップを少なくとも含む請求項13に記載の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN201710121144.6 | 2017-03-02 | ||
CN201710121144.6A CN108538882B (zh) | 2017-03-02 | 2017-03-02 | 显示面板及显示装置 |
PCT/CN2017/110196 WO2018157620A1 (zh) | 2017-03-02 | 2017-11-09 | 电致发光显示面板及其制备方法、显示装置 |
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JP2020510952A true JP2020510952A (ja) | 2020-04-09 |
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US (1) | US11283044B2 (ja) |
EP (1) | EP3591704A4 (ja) |
JP (1) | JP2020510952A (ja) |
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KR20190108212A (ko) * | 2018-03-13 | 2019-09-24 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 표시 장치의 제조 방법 |
CN109377881A (zh) * | 2018-11-27 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | 一种折叠显示屏 |
CN110323261B (zh) * | 2019-07-04 | 2022-09-13 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
CN110389685A (zh) * | 2019-07-23 | 2019-10-29 | 京东方科技集团股份有限公司 | 触控显示面板及其制作方法、和显示装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003270422A (ja) * | 2002-03-14 | 2003-09-25 | Seiko Epson Corp | 液滴吐出による材料の配置方法、表示装置、表示装置の製造方法、及び、電子機器 |
JP2008226746A (ja) * | 2007-03-15 | 2008-09-25 | Sony Corp | 表示装置および電子機器 |
JP2013043382A (ja) * | 2011-08-24 | 2013-03-04 | Fujifilm Corp | バリア性積層体およびガスバリアフィルム |
US20130057521A1 (en) * | 2011-09-05 | 2013-03-07 | Gun-Shik Kim | Organic light emitting diode display |
US20140097418A1 (en) * | 2012-10-04 | 2014-04-10 | Samsung Display Co., Ltd. | Organic light emitting diode display and method for manufacturing the same |
JP2014103111A (ja) * | 2012-11-19 | 2014-06-05 | Samsung Display Co Ltd | 有機発光表示装置、及び有機発光表示装置の製造方法 |
JP2015023023A (ja) * | 2013-07-22 | 2015-02-02 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 有機発光表示装置及びその製造方法 |
JP2015069857A (ja) * | 2013-09-30 | 2015-04-13 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6008582A (en) * | 1997-01-27 | 1999-12-28 | Dai Nippon Printing Co., Ltd. | Plasma display device with auxiliary partition walls, corrugated, tiered and pigmented walls |
KR101015851B1 (ko) | 2009-02-09 | 2011-02-23 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 |
CN102132630B (zh) * | 2009-11-11 | 2014-11-12 | 松下电器产业株式会社 | 有机el元件及其制造方法 |
CN103187533B (zh) * | 2011-12-30 | 2016-09-28 | 固安翌光科技有限公司 | 一种有机电致发光器件及其制备方法 |
US9698347B2 (en) * | 2012-08-02 | 2017-07-04 | Joled Inc. | Organic EL display panel and method for manufacturing same |
KR102020805B1 (ko) * | 2012-12-28 | 2019-09-11 | 엘지디스플레이 주식회사 | 투명 유기 발광 표시 장치 및 투명 유기 발광 표시 장치 제조 방법 |
JP6358494B2 (ja) * | 2013-02-27 | 2018-07-18 | Tianma Japan株式会社 | 立体画像表示装置 |
KR102037850B1 (ko) * | 2013-02-27 | 2019-10-29 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN103811533B (zh) * | 2014-01-29 | 2017-02-15 | 京东方科技集团股份有限公司 | 有机电致发光显示面板及显示装置 |
KR102489836B1 (ko) * | 2015-06-30 | 2023-01-18 | 엘지디스플레이 주식회사 | 유기전계발광표시장치 |
JP2018112859A (ja) * | 2017-01-11 | 2018-07-19 | 株式会社ジャパンディスプレイ | 表示装置 |
-
2017
- 2017-03-02 CN CN201710121144.6A patent/CN108538882B/zh active Active
- 2017-11-09 WO PCT/CN2017/110196 patent/WO2018157620A1/zh unknown
- 2017-11-09 JP JP2018533942A patent/JP2020510952A/ja active Pending
- 2017-11-09 US US16/066,186 patent/US11283044B2/en active Active
- 2017-11-09 EP EP17882279.7A patent/EP3591704A4/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003270422A (ja) * | 2002-03-14 | 2003-09-25 | Seiko Epson Corp | 液滴吐出による材料の配置方法、表示装置、表示装置の製造方法、及び、電子機器 |
JP2008226746A (ja) * | 2007-03-15 | 2008-09-25 | Sony Corp | 表示装置および電子機器 |
JP2013043382A (ja) * | 2011-08-24 | 2013-03-04 | Fujifilm Corp | バリア性積層体およびガスバリアフィルム |
US20130057521A1 (en) * | 2011-09-05 | 2013-03-07 | Gun-Shik Kim | Organic light emitting diode display |
US20140097418A1 (en) * | 2012-10-04 | 2014-04-10 | Samsung Display Co., Ltd. | Organic light emitting diode display and method for manufacturing the same |
JP2014103111A (ja) * | 2012-11-19 | 2014-06-05 | Samsung Display Co Ltd | 有機発光表示装置、及び有機発光表示装置の製造方法 |
JP2015023023A (ja) * | 2013-07-22 | 2015-02-02 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 有機発光表示装置及びその製造方法 |
JP2015069857A (ja) * | 2013-09-30 | 2015-04-13 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
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CN108538882A (zh) | 2018-09-14 |
US11283044B2 (en) | 2022-03-22 |
WO2018157620A1 (zh) | 2018-09-07 |
US20190312225A1 (en) | 2019-10-10 |
EP3591704A1 (en) | 2020-01-08 |
EP3591704A4 (en) | 2020-12-02 |
CN108538882B (zh) | 2020-05-19 |
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