JP2007208041A5 - - Google Patents

Download PDF

Info

Publication number
JP2007208041A5
JP2007208041A5 JP2006025649A JP2006025649A JP2007208041A5 JP 2007208041 A5 JP2007208041 A5 JP 2007208041A5 JP 2006025649 A JP2006025649 A JP 2006025649A JP 2006025649 A JP2006025649 A JP 2006025649A JP 2007208041 A5 JP2007208041 A5 JP 2007208041A5
Authority
JP
Japan
Prior art keywords
optical functional
semiconductor device
functional element
cover
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006025649A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007208041A (ja
JP4996101B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006025649A priority Critical patent/JP4996101B2/ja
Priority claimed from JP2006025649A external-priority patent/JP4996101B2/ja
Priority to US11/700,761 priority patent/US7825423B2/en
Priority to EP07002224A priority patent/EP1816687A2/en
Priority to TW096103824A priority patent/TW200805707A/zh
Publication of JP2007208041A publication Critical patent/JP2007208041A/ja
Publication of JP2007208041A5 publication Critical patent/JP2007208041A5/ja
Application granted granted Critical
Publication of JP4996101B2 publication Critical patent/JP4996101B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006025649A 2006-02-02 2006-02-02 半導体装置及び半導体装置の製造方法 Expired - Fee Related JP4996101B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006025649A JP4996101B2 (ja) 2006-02-02 2006-02-02 半導体装置及び半導体装置の製造方法
US11/700,761 US7825423B2 (en) 2006-02-02 2007-02-01 Semiconductor device and method of manufacturing semiconductor device
EP07002224A EP1816687A2 (en) 2006-02-02 2007-02-01 Semiconductor device and method of manufacturing semiconductor device
TW096103824A TW200805707A (en) 2006-02-02 2007-02-02 Semiconductor device and method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006025649A JP4996101B2 (ja) 2006-02-02 2006-02-02 半導体装置及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2007208041A JP2007208041A (ja) 2007-08-16
JP2007208041A5 true JP2007208041A5 (enExample) 2008-12-25
JP4996101B2 JP4996101B2 (ja) 2012-08-08

Family

ID=38038555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006025649A Expired - Fee Related JP4996101B2 (ja) 2006-02-02 2006-02-02 半導体装置及び半導体装置の製造方法

Country Status (4)

Country Link
US (1) US7825423B2 (enExample)
EP (1) EP1816687A2 (enExample)
JP (1) JP4996101B2 (enExample)
TW (1) TW200805707A (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100883075B1 (ko) * 2007-03-02 2009-02-10 엘지전자 주식회사 전계발광소자
DE102008005344A1 (de) 2007-09-21 2009-04-02 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Bauelement
EP2048717A1 (en) * 2007-10-10 2009-04-15 Unity Opto Technology Co., Ltd. Structure of light-emitting diode
JP5089336B2 (ja) 2007-10-29 2012-12-05 新光電気工業株式会社 パッケージ用シリコン基板
JP4912275B2 (ja) 2007-11-06 2012-04-11 新光電気工業株式会社 半導体パッケージ
JP2010074117A (ja) * 2007-12-07 2010-04-02 Panasonic Electric Works Co Ltd 発光装置
KR100998009B1 (ko) * 2008-03-12 2010-12-03 삼성엘이디 주식회사 발광 다이오드 패키지 및 그 제조 방법
US8890186B2 (en) * 2008-03-28 2014-11-18 Panasonic Corporation Molded resin product, semiconductor light-emitting source, lighting device, and method for manufacturing molded resin product
DE102008025491A1 (de) * 2008-05-28 2009-12-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Leiterplatte
US8058669B2 (en) * 2008-08-28 2011-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Light-emitting diode integration scheme
JP2010135488A (ja) * 2008-12-03 2010-06-17 Toshiba Corp 発光装置及びその製造方法
DE102009005547A1 (de) * 2009-01-20 2010-07-29 R. Stahl Schaltgeräte GmbH Gekapselte Leuchtdiodenanordnung
KR101064026B1 (ko) * 2009-02-17 2011-09-08 엘지이노텍 주식회사 발광 디바이스 패키지 및 그 제조방법
JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ledランプの製造方法
US20100301728A1 (en) * 2009-06-02 2010-12-02 Bridgelux, Inc. Light source having a refractive element
JP5634519B2 (ja) * 2010-07-22 2014-12-03 京セラ株式会社 発光装置
KR101714042B1 (ko) * 2010-08-05 2017-03-08 엘지이노텍 주식회사 발광 소자 패키지
WO2012124473A1 (ja) * 2011-03-15 2012-09-20 京セラ株式会社 発光装置
JP5769482B2 (ja) * 2011-04-18 2015-08-26 セイコーインスツル株式会社 ガラス封止型パッケージの製造方法、及び光学デバイス
JP2013004901A (ja) * 2011-06-21 2013-01-07 Nippon Kasei Chem Co Ltd Ledデバイス
TW201310126A (zh) * 2011-08-18 2013-03-01 鴻海精密工業股份有限公司 發光裝置
CN103050583A (zh) * 2011-10-14 2013-04-17 展晶科技(深圳)有限公司 发光二极管的封装方法
KR101887942B1 (ko) * 2012-05-07 2018-08-14 삼성전자주식회사 발광소자
JP6139071B2 (ja) 2012-07-30 2017-05-31 日亜化学工業株式会社 発光装置とその製造方法
DE102013104240B4 (de) 2013-04-26 2015-10-22 R. Stahl Schaltgeräte GmbH Explosionsgeschützte Anordnung elektrischer und/oder elektronischer Bauelemente
JP6490932B2 (ja) * 2013-09-16 2019-03-27 エルジー イノテック カンパニー リミテッド 発光素子パッケージ
DE102013111374A1 (de) * 2013-10-15 2015-04-16 R. Stahl Schaltgeräte GmbH Explosionsgeschützte Anordnung für elektrische und/oder elektronische Bauelemente
CN104124324B (zh) * 2014-08-06 2017-03-01 华中科技大学 一种led封装玻璃及其制备方法和应用
US10347814B2 (en) 2016-04-01 2019-07-09 Infineon Technologies Ag MEMS heater or emitter structure for fast heating and cooling cycles
US10681777B2 (en) 2016-04-01 2020-06-09 Infineon Technologies Ag Light emitter devices, optical filter structures and methods for forming light emitter devices and optical filter structures
US10559723B2 (en) * 2017-08-25 2020-02-11 Rohm Co., Ltd. Optical device
CN111556716B (zh) * 2018-01-29 2024-04-30 菲利普莫里斯生产公司 用于气溶胶生成系统的照明单元
US11758948B2 (en) 2018-01-29 2023-09-19 Altria Client Services Llc Lighting unit for aerosol-generating systems
US11178392B2 (en) * 2018-09-12 2021-11-16 Apple Inc. Integrated optical emitters and applications thereof
KR102872847B1 (ko) * 2018-12-27 2025-10-20 덴카 주식회사 형광체 기판, 발광 기판 및 조명 장치
EP3888204B1 (en) 2019-02-04 2022-12-14 Apple Inc. Vertical emitters with integral microlenses
US12218478B2 (en) 2020-05-10 2025-02-04 Apple Inc. Folded optical conjugate lens
JP7239840B2 (ja) * 2020-08-31 2023-03-15 日亜化学工業株式会社 発光装置の製造方法
US11994694B2 (en) 2021-01-17 2024-05-28 Apple Inc. Microlens array with tailored sag profile
US20240372315A1 (en) * 2021-09-14 2024-11-07 Sony Group Corporation Semiconductor light emitting device
CN114864796A (zh) * 2022-07-05 2022-08-05 至芯半导体(杭州)有限公司 一种紫外器件封装结构及制作方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4846288A (enExample) * 1971-10-13 1973-07-02
JPH0328467Y2 (enExample) * 1985-12-28 1991-06-19
JPH06350132A (ja) * 1993-06-08 1994-12-22 Victor Co Of Japan Ltd 半導体発光素子アレイ
US6784463B2 (en) * 1997-06-03 2004-08-31 Lumileds Lighting U.S., Llc III-Phospide and III-Arsenide flip chip light-emitting devices
JP2003110146A (ja) * 2001-07-26 2003-04-11 Matsushita Electric Works Ltd 発光装置
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
US7224000B2 (en) * 2002-08-30 2007-05-29 Lumination, Llc Light emitting diode component
JP4280050B2 (ja) * 2002-10-07 2009-06-17 シチズン電子株式会社 白色発光装置
CN1754266A (zh) * 2002-12-25 2006-03-29 独立行政法人科学技术振兴机构 发光元件装置、光接收元件装置、光学装置、氟化物结晶、氟化物结晶的制造方法及坩埚
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
EP1484802B1 (en) * 2003-06-06 2018-06-13 Stanley Electric Co., Ltd. Optical semiconductor device
JP4138586B2 (ja) * 2003-06-13 2008-08-27 スタンレー電気株式会社 光源用ledランプおよびこれを用いた車両用前照灯
US7560820B2 (en) * 2004-04-15 2009-07-14 Saes Getters S.P.A. Integrated getter for vacuum or inert gas packaged LEDs
ATE524839T1 (de) * 2004-06-30 2011-09-15 Cree Inc Verfahren zum kapseln eines lichtemittierenden bauelements und gekapselte lichtemittierende bauelemente im chip-massstab
DE102005042778A1 (de) * 2004-09-09 2006-04-13 Toyoda Gosei Co., Ltd., Nishikasugai Optische Festkörpervorrichtung
US7365371B2 (en) * 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
US7798678B2 (en) * 2005-12-30 2010-09-21 3M Innovative Properties Company LED with compound encapsulant lens
US7521728B2 (en) * 2006-01-20 2009-04-21 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same

Similar Documents

Publication Publication Date Title
JP2007208041A5 (enExample)
JP2013089645A5 (enExample)
JP2005209852A5 (enExample)
JP2007116138A5 (enExample)
JP2005123477A5 (enExample)
JP2011515815A (ja) 発光ダイオード装置
MY140301A (en) Light-emitting element storing packages and a method of manufacturing the same
JP2009540614A5 (enExample)
TWI456721B (zh) 導線架及其製造方法及受光發光裝置
JP2005537651A5 (enExample)
US20140347854A1 (en) Lamp unit and vehicle lamp apparatus including the same
CN105229806A (zh) 发光模块
JP2010192629A5 (enExample)
JP2010537411A5 (enExample)
JP2005093681A5 (enExample)
CN108565329A (zh) 发光元件封装体以及包括该发光元件封装体的背光单元
JP2013093386A5 (enExample)
CN103843466B (zh) 具有反射表面区域的半导体发光装置
JP2009038304A5 (enExample)
TW200737551A (en) Semiconductor device and method for manufacturing the same
WO2009051093A1 (ja) 半導体発光モジュール
JP2012186159A5 (enExample)
JP2015035438A5 (enExample)
JP2007027585A5 (enExample)
JP2007012727A5 (enExample)