TWI856951B - 發光元件及其製造之方法 - Google Patents

發光元件及其製造之方法 Download PDF

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Publication number
TWI856951B
TWI856951B TW107136897A TW107136897A TWI856951B TW I856951 B TWI856951 B TW I856951B TW 107136897 A TW107136897 A TW 107136897A TW 107136897 A TW107136897 A TW 107136897A TW I856951 B TWI856951 B TW I856951B
Authority
TW
Taiwan
Prior art keywords
reflective layer
light
led
reflective
layer
Prior art date
Application number
TW107136897A
Other languages
English (en)
Chinese (zh)
Other versions
TW201924094A (zh
Inventor
李舒
Original Assignee
美商亮銳公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/788,347 external-priority patent/US10672960B2/en
Application filed by 美商亮銳公司 filed Critical 美商亮銳公司
Publication of TW201924094A publication Critical patent/TW201924094A/zh
Application granted granted Critical
Publication of TWI856951B publication Critical patent/TWI856951B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
TW107136897A 2017-10-19 2018-10-19 發光元件及其製造之方法 TWI856951B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/788,347 US10672960B2 (en) 2017-10-19 2017-10-19 Light emitting device package with a coating layer
US15/788,347 2017-10-19
EP18153901.6 2018-01-29
EP18153901 2018-01-29
??18153901.6 2018-01-29

Publications (2)

Publication Number Publication Date
TW201924094A TW201924094A (zh) 2019-06-16
TWI856951B true TWI856951B (zh) 2024-10-01

Family

ID=63862209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107136897A TWI856951B (zh) 2017-10-19 2018-10-19 發光元件及其製造之方法

Country Status (6)

Country Link
EP (1) EP3698415A1 (enExample)
JP (1) JP7193532B2 (enExample)
KR (1) KR20200065074A (enExample)
CN (1) CN111837245A (enExample)
TW (1) TWI856951B (enExample)
WO (1) WO2019079021A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4139956A4 (en) * 2020-04-21 2024-07-17 Jade Bird Display (Shanghai) Limited LED CHIP STRUCTURES WITH REFLECTIVE ELEMENTS
AU2021259592A1 (en) * 2020-04-21 2022-12-08 Jade Bird Display (shanghai) Limited Light-emitting diode chip structures with reflective elements
US12237451B2 (en) 2022-01-28 2025-02-25 Creeled, Inc. Arrangements of light-altering coatings in light-emitting diode packages

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111245A (ja) * 2007-10-31 2009-05-21 Nichia Corp 発光装置及びこれの製造方法
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP2014041955A (ja) * 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法

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Publication number Priority date Publication date Assignee Title
JPWO2003034508A1 (ja) * 2001-10-12 2005-02-03 日亜化学工業株式会社 発光装置及びその製造方法
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP4973011B2 (ja) * 2006-05-31 2012-07-11 豊田合成株式会社 Ｌｅｄ装置
JP5245594B2 (ja) * 2007-07-27 2013-07-24 日亜化学工業株式会社 発光装置及びその製造方法
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
JP5684700B2 (ja) * 2009-03-31 2015-03-18 東芝ライテック株式会社 発光装置および照明装置
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
JP5413137B2 (ja) * 2009-11-09 2014-02-12 日亜化学工業株式会社 発光装置および発光装置の製造方法
DE102010003321A1 (de) * 2010-03-26 2011-09-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP5864089B2 (ja) * 2010-08-25 2016-02-17 日亜化学工業株式会社 発光装置の製造方法
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
WO2012131792A1 (ja) * 2011-03-31 2012-10-04 パナソニック株式会社 半導体発光装置
JP2014525146A (ja) * 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
JP2013033890A (ja) * 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
TWI597865B (zh) * 2012-06-06 2017-09-01 日立化成股份有限公司 Optical semiconductor device
KR101997243B1 (ko) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR102008315B1 (ko) * 2013-01-23 2019-10-21 삼성전자주식회사 발광 소자 패키지
DE102013215650B4 (de) * 2013-08-08 2021-10-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP6523597B2 (ja) * 2013-09-30 2019-06-05 日亜化学工業株式会社 発光装置
KR102188500B1 (ko) * 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009111245A (ja) * 2007-10-31 2009-05-21 Nichia Corp 発光装置及びこれの製造方法
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP2014041955A (ja) * 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法

Also Published As

Publication number Publication date
JP2021500749A (ja) 2021-01-07
KR20200065074A (ko) 2020-06-08
WO2019079021A1 (en) 2019-04-25
EP3698415A1 (en) 2020-08-26
CN111837245A (zh) 2020-10-27
JP7193532B2 (ja) 2022-12-20
TW201924094A (zh) 2019-06-16

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