KR20200065074A - 발광 디바이스 패키지 - Google Patents

발광 디바이스 패키지 Download PDF

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Publication number
KR20200065074A
KR20200065074A KR1020207014163A KR20207014163A KR20200065074A KR 20200065074 A KR20200065074 A KR 20200065074A KR 1020207014163 A KR1020207014163 A KR 1020207014163A KR 20207014163 A KR20207014163 A KR 20207014163A KR 20200065074 A KR20200065074 A KR 20200065074A
Authority
KR
South Korea
Prior art keywords
coating layer
base
layer
reflective layer
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020207014163A
Other languages
English (en)
Korean (ko)
Inventor
수 리
Original Assignee
루미레즈 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/788,347 external-priority patent/US10672960B2/en
Application filed by 루미레즈 엘엘씨 filed Critical 루미레즈 엘엘씨
Publication of KR20200065074A publication Critical patent/KR20200065074A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H01L33/56—
    • H01L33/486—
    • H01L33/60—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
KR1020207014163A 2017-10-19 2018-10-01 발광 디바이스 패키지 Ceased KR20200065074A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/788,347 US10672960B2 (en) 2017-10-19 2017-10-19 Light emitting device package with a coating layer
US15/788,347 2017-10-19
EP18153901.6 2018-01-29
EP18153901 2018-01-29
PCT/US2018/053694 WO2019079021A1 (en) 2017-10-19 2018-10-01 LIGHT EMITTING DEVICE HOUSING

Publications (1)

Publication Number Publication Date
KR20200065074A true KR20200065074A (ko) 2020-06-08

Family

ID=63862209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207014163A Ceased KR20200065074A (ko) 2017-10-19 2018-10-01 발광 디바이스 패키지

Country Status (6)

Country Link
EP (1) EP3698415A1 (enExample)
JP (1) JP7193532B2 (enExample)
KR (1) KR20200065074A (enExample)
CN (1) CN111837245A (enExample)
TW (1) TWI856951B (enExample)
WO (1) WO2019079021A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4139956A4 (en) * 2020-04-21 2024-07-17 Jade Bird Display (Shanghai) Limited LED CHIP STRUCTURES WITH REFLECTIVE ELEMENTS
AU2021259592A1 (en) * 2020-04-21 2022-12-08 Jade Bird Display (shanghai) Limited Light-emitting diode chip structures with reflective elements
US12237451B2 (en) 2022-01-28 2025-02-25 Creeled, Inc. Arrangements of light-altering coatings in light-emitting diode packages

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003034508A1 (ja) * 2001-10-12 2005-02-03 日亜化学工業株式会社 発光装置及びその製造方法
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP4973011B2 (ja) * 2006-05-31 2012-07-11 豊田合成株式会社 Ｌｅｄ装置
JP5245594B2 (ja) * 2007-07-27 2013-07-24 日亜化学工業株式会社 発光装置及びその製造方法
JP4962270B2 (ja) * 2007-10-31 2012-06-27 日亜化学工業株式会社 発光装置及びこれの製造方法
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
JP5684700B2 (ja) * 2009-03-31 2015-03-18 東芝ライテック株式会社 発光装置および照明装置
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
JP5413137B2 (ja) * 2009-11-09 2014-02-12 日亜化学工業株式会社 発光装置および発光装置の製造方法
DE102010003321A1 (de) * 2010-03-26 2011-09-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2012019062A (ja) * 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP5864089B2 (ja) * 2010-08-25 2016-02-17 日亜化学工業株式会社 発光装置の製造方法
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
WO2012131792A1 (ja) * 2011-03-31 2012-10-04 パナソニック株式会社 半導体発光装置
JP2014525146A (ja) * 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
JP2013033890A (ja) * 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
TWI597865B (zh) * 2012-06-06 2017-09-01 日立化成股份有限公司 Optical semiconductor device
JP2014041955A (ja) * 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
KR101997243B1 (ko) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR102008315B1 (ko) * 2013-01-23 2019-10-21 삼성전자주식회사 발광 소자 패키지
DE102013215650B4 (de) * 2013-08-08 2021-10-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP6523597B2 (ja) * 2013-09-30 2019-06-05 日亜化学工業株式会社 発光装置
KR102188500B1 (ko) * 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치

Also Published As

Publication number Publication date
JP2021500749A (ja) 2021-01-07
WO2019079021A1 (en) 2019-04-25
TWI856951B (zh) 2024-10-01
EP3698415A1 (en) 2020-08-26
CN111837245A (zh) 2020-10-27
JP7193532B2 (ja) 2022-12-20
TW201924094A (zh) 2019-06-16

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