CN111837245A - 发光器件封装 - Google Patents

发光器件封装 Download PDF

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Publication number
CN111837245A
CN111837245A CN201880082405.0A CN201880082405A CN111837245A CN 111837245 A CN111837245 A CN 111837245A CN 201880082405 A CN201880082405 A CN 201880082405A CN 111837245 A CN111837245 A CN 111837245A
Authority
CN
China
Prior art keywords
coating layer
layer
reflective layer
reflective
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201880082405.0A
Other languages
English (en)
Chinese (zh)
Inventor
李舒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bright Sharp LLC
Lumileds LLC
Original Assignee
Bright Sharp LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/788,347 external-priority patent/US10672960B2/en
Application filed by Bright Sharp LLC filed Critical Bright Sharp LLC
Publication of CN111837245A publication Critical patent/CN111837245A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
CN201880082405.0A 2017-10-19 2018-10-01 发光器件封装 Pending CN111837245A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/788347 2017-10-19
US15/788,347 US10672960B2 (en) 2017-10-19 2017-10-19 Light emitting device package with a coating layer
EP18153901.6 2018-01-29
EP18153901 2018-01-29
PCT/US2018/053694 WO2019079021A1 (en) 2017-10-19 2018-10-01 LIGHT EMITTING DEVICE HOUSING

Publications (1)

Publication Number Publication Date
CN111837245A true CN111837245A (zh) 2020-10-27

Family

ID=63862209

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880082405.0A Pending CN111837245A (zh) 2017-10-19 2018-10-01 发光器件封装

Country Status (6)

Country Link
EP (1) EP3698415A1 (enExample)
JP (1) JP7193532B2 (enExample)
KR (1) KR20200065074A (enExample)
CN (1) CN111837245A (enExample)
TW (1) TWI856951B (enExample)
WO (1) WO2019079021A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230003505A (ko) * 2020-04-21 2023-01-06 제이드 버드 디스플레이(상하이) 리미티드 반사성 요소들을 갖는 발광 다이오드 칩 구조들
JP2023525648A (ja) * 2020-04-21 2023-06-19 ジェイド バード ディスプレイ（シャンハイ） リミテッド 反射要素を有する発光ダイオードチップ構造
US12237451B2 (en) 2022-01-28 2025-02-25 Creeled, Inc. Arrangements of light-altering coatings in light-emitting diode packages

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1476640A (zh) * 2001-10-12 2004-02-18 ���ǻ�ѧ��ҵ��ʽ���� 发光装置及其制造方法
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP2009111245A (ja) * 2007-10-31 2009-05-21 Nichia Corp 発光装置及びこれの製造方法
US7736920B1 (en) * 2009-06-26 2010-06-15 Paragon Semiconductor Lighting Technology Co., Ltd. Led package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
US20120007119A1 (en) * 2010-07-08 2012-01-12 Shin-Etsu Chemical Co., Ltd. Light-emitting semiconductor device, mounted substrate, and fabrication method thereof
CN102369607A (zh) * 2009-03-31 2012-03-07 东芝照明技术株式会社 发光装置及照明装置
US20130033870A1 (en) * 2011-08-03 2013-02-07 Toyoda Gosei Co., Ltd. Light emitting device
CN103403892A (zh) * 2011-03-31 2013-11-20 松下电器产业株式会社 半导体发光装置
JP2014041955A (ja) * 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
CN103782402A (zh) * 2011-07-21 2014-05-07 克利公司 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法
CN104364922A (zh) * 2012-06-06 2015-02-18 日立化成株式会社 光半导体装置
US20160027977A1 (en) * 2014-07-28 2016-01-28 Samsung Electronics Co. Ltd. Light emitting diode package and lighting device using the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4973011B2 (ja) 2006-05-31 2012-07-11 豊田合成株式会社 Ｌｅｄ装置
JP5245594B2 (ja) 2007-07-27 2013-07-24 日亜化学工業株式会社 発光装置及びその製造方法
JP5413137B2 (ja) 2009-11-09 2014-02-12 日亜化学工業株式会社 発光装置および発光装置の製造方法
DE102010003321A1 (de) * 2010-03-26 2011-09-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP5864089B2 (ja) 2010-08-25 2016-02-17 日亜化学工業株式会社 発光装置の製造方法
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
KR101997243B1 (ko) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 발광 소자 및 조명 시스템
KR102008315B1 (ko) 2013-01-23 2019-10-21 삼성전자주식회사 발광 소자 패키지
DE102013215650B4 (de) 2013-08-08 2021-10-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP6523597B2 (ja) * 2013-09-30 2019-06-05 日亜化学工業株式会社 発光装置

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1476640A (zh) * 2001-10-12 2004-02-18 ���ǻ�ѧ��ҵ��ʽ���� 发光装置及其制造方法
JP2007109915A (ja) * 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP2009111245A (ja) * 2007-10-31 2009-05-21 Nichia Corp 発光装置及びこれの製造方法
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
CN102369607A (zh) * 2009-03-31 2012-03-07 东芝照明技术株式会社 发光装置及照明装置
US7736920B1 (en) * 2009-06-26 2010-06-15 Paragon Semiconductor Lighting Technology Co., Ltd. Led package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same
US20120007119A1 (en) * 2010-07-08 2012-01-12 Shin-Etsu Chemical Co., Ltd. Light-emitting semiconductor device, mounted substrate, and fabrication method thereof
CN103403892A (zh) * 2011-03-31 2013-11-20 松下电器产业株式会社 半导体发光装置
CN103782402A (zh) * 2011-07-21 2014-05-07 克利公司 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法
US20130033870A1 (en) * 2011-08-03 2013-02-07 Toyoda Gosei Co., Ltd. Light emitting device
CN104364922A (zh) * 2012-06-06 2015-02-18 日立化成株式会社 光半导体装置
JP2014041955A (ja) * 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
US20160027977A1 (en) * 2014-07-28 2016-01-28 Samsung Electronics Co. Ltd. Light emitting diode package and lighting device using the same

Also Published As

Publication number Publication date
JP7193532B2 (ja) 2022-12-20
KR20200065074A (ko) 2020-06-08
JP2021500749A (ja) 2021-01-07
TWI856951B (zh) 2024-10-01
EP3698415A1 (en) 2020-08-26
TW201924094A (zh) 2019-06-16
WO2019079021A1 (en) 2019-04-25

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