JP7193532B2 - 発光デバイスパッケージ - Google Patents

発光デバイスパッケージ Download PDF

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Publication number
JP7193532B2
JP7193532B2 JP2020522366A JP2020522366A JP7193532B2 JP 7193532 B2 JP7193532 B2 JP 7193532B2 JP 2020522366 A JP2020522366 A JP 2020522366A JP 2020522366 A JP2020522366 A JP 2020522366A JP 7193532 B2 JP7193532 B2 JP 7193532B2
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JP
Japan
Prior art keywords
coating layer
reflective layer
transparent coating
layer
led
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JP2020522366A
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English (en)
Japanese (ja)
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JP2021500749A (ja
JP2021500749A5 (enExample
Inventor
リー，シュー
Original Assignee
ルミレッズ リミテッド ライアビリティ カンパニー
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Priority claimed from US15/788,347 external-priority patent/US10672960B2/en
Application filed by ルミレッズ リミテッド ライアビリティ カンパニー filed Critical ルミレッズ リミテッド ライアビリティ カンパニー
Publication of JP2021500749A publication Critical patent/JP2021500749A/ja
Publication of JP2021500749A5 publication Critical patent/JP2021500749A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Led Device Packages (AREA)
JP2020522366A 2017-10-19 2018-10-01 発光デバイスパッケージ Active JP7193532B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/788,347 US10672960B2 (en) 2017-10-19 2017-10-19 Light emitting device package with a coating layer
US15/788,347 2017-10-19
EP18153901.6 2018-01-29
EP18153901 2018-01-29
PCT/US2018/053694 WO2019079021A1 (en) 2017-10-19 2018-10-01 LIGHT EMITTING DEVICE HOUSING

Publications (3)

Publication Number Publication Date
JP2021500749A JP2021500749A (ja) 2021-01-07
JP2021500749A5 JP2021500749A5 (enExample) 2021-11-11
JP7193532B2 true JP7193532B2 (ja) 2022-12-20

Family

ID=63862209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020522366A Active JP7193532B2 (ja) 2017-10-19 2018-10-01 発光デバイスパッケージ

Country Status (6)

Country Link
EP (1) EP3698415A1 (enExample)
JP (1) JP7193532B2 (enExample)
KR (1) KR20200065074A (enExample)
CN (1) CN111837245A (enExample)
TW (1) TWI856951B (enExample)
WO (1) WO2019079021A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4139956A4 (en) * 2020-04-21 2024-07-17 Jade Bird Display (Shanghai) Limited LED CHIP STRUCTURES WITH REFLECTIVE ELEMENTS
AU2021259592A1 (en) * 2020-04-21 2022-12-08 Jade Bird Display (shanghai) Limited Light-emitting diode chip structures with reflective elements
US12237451B2 (en) 2022-01-28 2025-02-25 Creeled, Inc. Arrangements of light-altering coatings in light-emitting diode packages

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109915A (ja) 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP2007324256A (ja) 2006-05-31 2007-12-13 Toyoda Gosei Co Ltd Ｌｅｄ装置
JP2009055006A (ja) 2007-07-27 2009-03-12 Nichia Corp 発光装置及びその製造方法
JP2009111245A (ja) 2007-10-31 2009-05-21 Nichia Corp 発光装置及びこれの製造方法
JP2011100905A (ja) 2009-11-09 2011-05-19 Nichia Corp 発光装置および発光装置の製造方法
JP2012019062A (ja) 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP2012069539A (ja) 2010-08-25 2012-04-05 Nichia Chem Ind Ltd 発光装置の製造方法
JP2013033890A (ja) 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
JP2014041955A (ja) 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
US20140203728A1 (en) 2013-01-23 2014-07-24 Samsung Electronics Co., Ltd. Light emitting device package
US20160027977A1 (en) 2014-07-28 2016-01-28 Samsung Electronics Co. Ltd. Light emitting diode package and lighting device using the same
US20160190410A1 (en) 2013-08-08 2016-06-30 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003034508A1 (ja) * 2001-10-12 2005-02-03 日亜化学工業株式会社 発光装置及びその製造方法
KR20100079970A (ko) * 2008-12-31 2010-07-08 서울반도체 주식회사 광원 패키지
JP5684700B2 (ja) * 2009-03-31 2015-03-18 東芝ライテック株式会社 発光装置および照明装置
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
DE102010003321A1 (de) * 2010-03-26 2011-09-29 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9461023B2 (en) * 2011-10-28 2016-10-04 Bridgelux, Inc. Jetting a highly reflective layer onto an LED assembly
WO2012131792A1 (ja) * 2011-03-31 2012-10-04 パナソニック株式会社 半導体発光装置
JP2014525146A (ja) * 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
TWI597865B (zh) * 2012-06-06 2017-09-01 日立化成股份有限公司 Optical semiconductor device
KR101997243B1 (ko) * 2012-09-13 2019-07-08 엘지이노텍 주식회사 발광 소자 및 조명 시스템
JP6523597B2 (ja) * 2013-09-30 2019-06-05 日亜化学工業株式会社 発光装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109915A (ja) 2005-10-14 2007-04-26 Stanley Electric Co Ltd 発光ダイオード
JP2007324256A (ja) 2006-05-31 2007-12-13 Toyoda Gosei Co Ltd Ｌｅｄ装置
JP2009055006A (ja) 2007-07-27 2009-03-12 Nichia Corp 発光装置及びその製造方法
JP2009111245A (ja) 2007-10-31 2009-05-21 Nichia Corp 発光装置及びこれの製造方法
JP2011100905A (ja) 2009-11-09 2011-05-19 Nichia Corp 発光装置および発光装置の製造方法
JP2012019062A (ja) 2010-07-08 2012-01-26 Shin Etsu Chem Co Ltd 発光半導体装置、実装基板及びそれらの製造方法
JP2012069539A (ja) 2010-08-25 2012-04-05 Nichia Chem Ind Ltd 発光装置の製造方法
JP2013033890A (ja) 2011-08-03 2013-02-14 Toyoda Gosei Co Ltd 発光装置
JP2014041955A (ja) 2012-08-23 2014-03-06 Konica Minolta Inc Ｌｅｄ装置、及びその製造方法
US20140203728A1 (en) 2013-01-23 2014-07-24 Samsung Electronics Co., Ltd. Light emitting device package
US20160190410A1 (en) 2013-08-08 2016-06-30 Osram Opto Semiconductors Gmbh Optoelectronic component and method for the production thereof
US20160027977A1 (en) 2014-07-28 2016-01-28 Samsung Electronics Co. Ltd. Light emitting diode package and lighting device using the same

Also Published As

Publication number Publication date
JP2021500749A (ja) 2021-01-07
KR20200065074A (ko) 2020-06-08
WO2019079021A1 (en) 2019-04-25
TWI856951B (zh) 2024-10-01
EP3698415A1 (en) 2020-08-26
CN111837245A (zh) 2020-10-27
TW201924094A (zh) 2019-06-16

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