JP2020061455A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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Abstract
Description
図1は、本発明の実施の形態1に係る半導体装置の構成を示す平面図であり、図2は、当該構成を示す断面図である。
図4は、本発明の実施の形態2に係る半導体装置の構成を示す断面図である。以下、本実施の形態2に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
図5は、本発明の実施の形態3に係る半導体装置の構成を示す平面図であり、図6は、当該構成を示す断面図である。以下、本実施の形態3に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
図7は、本発明の実施の形態4に係る半導体装置の構成を示す平面図である。以下、本実施の形態4に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
図10は、本発明の実施の形態5に係る半導体装置の構成を示す断面図である。以下、本実施の形態5に係る構成要素のうち、上述の構成要素と同じまたは類似する構成要素については同じ参照符号を付し、異なる構成要素について主に説明する。
Claims (9)
- 開口した空間を有する容器体と、
前記容器体内の空間内に配設された半導体チップと、
前記空間内に配設され、前記半導体チップと離間されたシャント抵抗と、
前記空間内に配設され、前記半導体チップと前記シャント抵抗とを接続する回路パターンと、
前記容器体の前記空間を、前記半導体チップ側の第1空間と、前記シャント抵抗側の第2空間とに分離する仕切部材と、
前記第1空間内に配設され、前記半導体チップを封止する第1封止材と、
前記開口のうち前記第1空間に対応する部分を覆う第1蓋部、及び、前記開口のうち前記第2空間に対応する部分を覆う第2蓋部と
を備え、
前記第2蓋部は、前記第2空間と前記容器体外部とを連通する少なくとも1つの穴を形成する、半導体装置。 - 請求項1に記載の半導体装置であって、
前記シャント抵抗及び前記第2空間内の前記回路パターンのうちの少なくとも一部は、防錆膜によって覆われている、半導体装置。 - 請求項1または請求項2に記載の半導体装置であって、
前記少なくとも1つの穴は、平面視における前記第2蓋部の一端側の穴と他端側の穴とを含み、
断面視における前記第2蓋部の上面の形状と前記第2蓋部の下面の形状とが異なる、半導体装置。 - 請求項1または請求項2に記載の半導体装置であって、
前記少なくとも1つの穴は、前記第2蓋部に配設された複数の穴である、半導体装置。 - 請求項4に記載の半導体装置であって、
前記複数の穴はスリットを含む、半導体装置。 - 請求項4に記載の半導体装置であって、
前記第2蓋部は網目状のパターンを有し、
前記複数の穴は前記パターンによって規定される穴を含む、半導体装置。 - 請求項1に記載の半導体装置であって、
前記第2空間内に配設され、前記シャント抵抗を封止する第2封止材をさらに備え、
前記第1封止材の材質と前記第2封止材の材質とが異なる、半導体装置。 - 請求項1から請求項7のうちのいずれか1項に記載の半導体装置であって、
前記少なくとも1つの穴は、前記シャント抵抗の上方以外の位置に形成されている、半導体装置。 - 請求項1から請求項8のうちのいずれか1項に記載の半導体装置であって、
前記仕切部材は、前記容器体または前記第1蓋部と一体化されている、半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018191657A JP7050643B2 (ja) | 2018-10-10 | 2018-10-10 | 半導体装置 |
US16/451,857 US10847437B2 (en) | 2018-10-10 | 2019-06-25 | Semiconductor device |
CN201910925653.3A CN111029314B (zh) | 2018-10-10 | 2019-09-27 | 半导体装置 |
DE102019215259.7A DE102019215259B4 (de) | 2018-10-10 | 2019-10-02 | Halbleitervorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018191657A JP7050643B2 (ja) | 2018-10-10 | 2018-10-10 | 半導体装置 |
Publications (2)
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JP2020061455A true JP2020061455A (ja) | 2020-04-16 |
JP7050643B2 JP7050643B2 (ja) | 2022-04-08 |
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JP2018191657A Active JP7050643B2 (ja) | 2018-10-10 | 2018-10-10 | 半導体装置 |
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US (1) | US10847437B2 (ja) |
JP (1) | JP7050643B2 (ja) |
CN (1) | CN111029314B (ja) |
DE (1) | DE102019215259B4 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111739847B (zh) * | 2020-07-27 | 2020-11-20 | 甬矽电子(宁波)股份有限公司 | 芯片封装结构、其制作方法和电子设备 |
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JPS5139133U (ja) * | 1974-09-17 | 1976-03-24 | ||
JPS52115844U (ja) * | 1976-03-01 | 1977-09-02 | ||
JPS6170971U (ja) * | 1984-10-15 | 1986-05-15 | ||
JPH04162489A (ja) * | 1990-10-24 | 1992-06-05 | Sanyo Electric Co Ltd | 混成集積回路 |
JPH0964549A (ja) * | 1995-08-30 | 1997-03-07 | Nec Kansai Ltd | 通気孔を有する電子機器筐体 |
JP2003112980A (ja) * | 2001-09-28 | 2003-04-18 | Dowa Mining Co Ltd | 金属−セラミックス接合体 |
JP2003243609A (ja) * | 2002-02-18 | 2003-08-29 | Mitsubishi Electric Corp | 電力半導体装置及びその製造方法 |
JP2007281219A (ja) * | 2006-04-07 | 2007-10-25 | Hitachi Metals Ltd | セラミックス回路基板およびその製造方法 |
US20080204996A1 (en) * | 2007-02-27 | 2008-08-28 | Hon Hai Precision Industry Co., Ltd. | Air Guiding Plate |
Family Cites Families (13)
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JPH07161925A (ja) * | 1993-12-09 | 1995-06-23 | Mitsubishi Electric Corp | パワーモジュール |
JP3674333B2 (ja) * | 1998-09-11 | 2005-07-20 | 株式会社日立製作所 | パワー半導体モジュール並びにそれを用いた電動機駆動システム |
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JP2015130492A (ja) * | 2013-12-05 | 2015-07-16 | ローム株式会社 | 半導体モジュール |
JP6600172B2 (ja) * | 2015-06-08 | 2019-10-30 | ローム株式会社 | パワーモジュール半導体装置およびその製造方法、およびインバータ装置 |
JP6455364B2 (ja) * | 2015-08-28 | 2019-01-23 | 三菱電機株式会社 | 半導体装置、インテリジェントパワーモジュールおよび電力変換装置 |
CN108293305B (zh) * | 2015-12-10 | 2020-06-26 | 日立汽车系统株式会社 | 电子控制装置 |
CN106455446B (zh) * | 2016-10-28 | 2019-02-15 | 曙光信息产业(北京)有限公司 | 发热元件的冷却装置及冷却装置的制造方法 |
WO2019216299A1 (ja) * | 2018-05-08 | 2019-11-14 | 株式会社村田製作所 | 高周波モジュールの製造方法および高周波モジュール |
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- 2018-10-10 JP JP2018191657A patent/JP7050643B2/ja active Active
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2019
- 2019-06-25 US US16/451,857 patent/US10847437B2/en active Active
- 2019-09-27 CN CN201910925653.3A patent/CN111029314B/zh active Active
- 2019-10-02 DE DE102019215259.7A patent/DE102019215259B4/de active Active
Patent Citations (9)
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JPS5139133U (ja) * | 1974-09-17 | 1976-03-24 | ||
JPS52115844U (ja) * | 1976-03-01 | 1977-09-02 | ||
JPS6170971U (ja) * | 1984-10-15 | 1986-05-15 | ||
JPH04162489A (ja) * | 1990-10-24 | 1992-06-05 | Sanyo Electric Co Ltd | 混成集積回路 |
JPH0964549A (ja) * | 1995-08-30 | 1997-03-07 | Nec Kansai Ltd | 通気孔を有する電子機器筐体 |
JP2003112980A (ja) * | 2001-09-28 | 2003-04-18 | Dowa Mining Co Ltd | 金属−セラミックス接合体 |
JP2003243609A (ja) * | 2002-02-18 | 2003-08-29 | Mitsubishi Electric Corp | 電力半導体装置及びその製造方法 |
JP2007281219A (ja) * | 2006-04-07 | 2007-10-25 | Hitachi Metals Ltd | セラミックス回路基板およびその製造方法 |
US20080204996A1 (en) * | 2007-02-27 | 2008-08-28 | Hon Hai Precision Industry Co., Ltd. | Air Guiding Plate |
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Publication number | Publication date |
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JP7050643B2 (ja) | 2022-04-08 |
DE102019215259A1 (de) | 2020-04-16 |
DE102019215259B4 (de) | 2023-02-23 |
US10847437B2 (en) | 2020-11-24 |
CN111029314B (zh) | 2023-09-08 |
CN111029314A (zh) | 2020-04-17 |
US20200118903A1 (en) | 2020-04-16 |
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