JP2019502024A5 - - Google Patents
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- Publication number
- JP2019502024A5 JP2019502024A5 JP2018531419A JP2018531419A JP2019502024A5 JP 2019502024 A5 JP2019502024 A5 JP 2019502024A5 JP 2018531419 A JP2018531419 A JP 2018531419A JP 2018531419 A JP2018531419 A JP 2018531419A JP 2019502024 A5 JP2019502024 A5 JP 2019502024A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- forming material
- forming
- source
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 27
- 238000000034 method Methods 0.000 claims 10
- 238000000151 deposition Methods 0.000 claims 5
- 230000008021 deposition Effects 0.000 claims 5
- 239000000956 alloy Substances 0.000 claims 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000005520 cutting process Methods 0.000 claims 2
- 229910052750 molybdenum Inorganic materials 0.000 claims 2
- 239000011733 molybdenum Substances 0.000 claims 2
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- 229910016005 MoSiB Inorganic materials 0.000 claims 1
- 238000005422 blasting Methods 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000000227 grinding Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATGM371/2015 | 2015-12-18 | ||
| ATGM371/2015U AT15050U1 (de) | 2015-12-18 | 2015-12-18 | Beschichtungsquelle mit Strukturierung |
| PCT/EP2016/002059 WO2017102069A1 (de) | 2015-12-18 | 2016-12-07 | Beschichtungsquelle mit strukturierung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019502024A JP2019502024A (ja) | 2019-01-24 |
| JP2019502024A5 true JP2019502024A5 (enExample) | 2019-12-12 |
| JP7023844B2 JP7023844B2 (ja) | 2022-02-22 |
Family
ID=57227207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018531419A Active JP7023844B2 (ja) | 2015-12-18 | 2016-12-07 | 構造化物を有する成膜源 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20190003036A1 (enExample) |
| EP (1) | EP3390684B1 (enExample) |
| JP (1) | JP7023844B2 (enExample) |
| KR (1) | KR102657632B1 (enExample) |
| CN (1) | CN108391438B (enExample) |
| AT (1) | AT15050U1 (enExample) |
| TW (1) | TWI711710B (enExample) |
| WO (1) | WO2017102069A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020115914B4 (de) | 2020-06-17 | 2024-03-07 | Sindlhauser Materials Gmbh | Flächiges Sputtertarget |
| CN113930744B (zh) * | 2021-09-29 | 2023-12-15 | 西北核技术研究所 | 一种具有高发射阈值的梯度涂层及其制备方法 |
| KR20250086259A (ko) | 2023-12-06 | 2025-06-13 | 이유진 | 책상의 기능이 내재되어 있는 캐리어 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291964A (ja) * | 1985-06-17 | 1986-12-22 | Anelva Corp | スパツタ用樹脂タ−ゲツト |
| JPS62278261A (ja) * | 1986-05-26 | 1987-12-03 | Seiko Epson Corp | スパツタ用タ−ゲツトの製造方法 |
| JPS63216969A (ja) * | 1987-03-05 | 1988-09-09 | Daido Steel Co Ltd | 加工方法 |
| EP0483375B1 (en) * | 1990-05-15 | 1996-03-13 | Kabushiki Kaisha Toshiba | Sputtering target and production thereof |
| JPH05214518A (ja) * | 1992-02-04 | 1993-08-24 | Hitachi Metals Ltd | スパッタリングターゲットとバッキングプレートの接合体の矯正方法およびスパッタリングターゲット材 |
| JPH05230642A (ja) * | 1992-02-21 | 1993-09-07 | Nissin High Voltage Co Ltd | スパッタ・ターゲット |
| JP3460506B2 (ja) * | 1996-11-01 | 2003-10-27 | 三菱マテリアル株式会社 | 高誘電体膜形成用スパッタリングターゲット |
| DE102004020404B4 (de) * | 2004-04-23 | 2007-06-06 | H. C. Starck Gmbh & Co. Kg | Trägerplatte für Sputtertargets, Verfahren zu ihrer Herstellung und Einheit aus Trägerplatte und Sputtertarget |
| EP1851166A2 (en) * | 2005-01-12 | 2007-11-07 | New York University | System and method for processing nanowires with holographic optical tweezers |
| JP5928237B2 (ja) * | 2012-08-08 | 2016-06-01 | 住友金属鉱山株式会社 | Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法 |
| CN104711525B (zh) * | 2013-12-13 | 2018-01-26 | 吉坤日矿日石金属株式会社 | 溅射靶及其制造方法 |
| CN106471151B (zh) | 2014-06-27 | 2019-06-18 | 攀时复合材料有限公司 | 溅镀靶 |
-
2015
- 2015-12-18 AT ATGM371/2015U patent/AT15050U1/de unknown
-
2016
- 2016-10-24 TW TW105134281A patent/TWI711710B/zh not_active IP Right Cessation
- 2016-12-07 EP EP16819815.8A patent/EP3390684B1/de active Active
- 2016-12-07 CN CN201680074480.3A patent/CN108391438B/zh active Active
- 2016-12-07 WO PCT/EP2016/002059 patent/WO2017102069A1/de not_active Ceased
- 2016-12-07 KR KR1020187017106A patent/KR102657632B1/ko active Active
- 2016-12-07 JP JP2018531419A patent/JP7023844B2/ja active Active
- 2016-12-07 US US16/061,688 patent/US20190003036A1/en not_active Abandoned
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