JP2017524831A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017524831A5 JP2017524831A5 JP2017519788A JP2017519788A JP2017524831A5 JP 2017524831 A5 JP2017524831 A5 JP 2017524831A5 JP 2017519788 A JP2017519788 A JP 2017519788A JP 2017519788 A JP2017519788 A JP 2017519788A JP 2017524831 A5 JP2017524831 A5 JP 2017524831A5
- Authority
- JP
- Japan
- Prior art keywords
- target
- plate
- target plate
- backing plate
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 7
- 238000005219 brazing Methods 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 238000004544 sputter deposition Methods 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 238000005477 sputtering target Methods 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 238000002360 preparation method Methods 0.000 claims 2
- 238000005422 blasting Methods 0.000 claims 1
- 229910010293 ceramic material Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 239000012634 fragment Substances 0.000 claims 1
- 238000000168 high power impulse magnetron sputter deposition Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462017909P | 2014-06-27 | 2014-06-27 | |
| US62/017,909 | 2014-06-27 | ||
| PCT/EP2015/001298 WO2015197196A1 (de) | 2014-06-27 | 2015-06-26 | Sputtering target |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017524831A JP2017524831A (ja) | 2017-08-31 |
| JP2017524831A5 true JP2017524831A5 (enExample) | 2018-11-08 |
| JP6567048B2 JP6567048B2 (ja) | 2019-08-28 |
Family
ID=53717965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017519788A Active JP6567048B2 (ja) | 2014-06-27 | 2015-06-26 | スパッタリングターゲット |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10109468B2 (enExample) |
| EP (1) | EP3161180B1 (enExample) |
| JP (1) | JP6567048B2 (enExample) |
| KR (2) | KR20180135120A (enExample) |
| CN (1) | CN106471151B (enExample) |
| BR (1) | BR112016029142A2 (enExample) |
| MX (1) | MX380827B (enExample) |
| RU (1) | RU2696910C2 (enExample) |
| TW (1) | TWI713457B (enExample) |
| WO (1) | WO2015197196A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT15050U1 (de) * | 2015-12-18 | 2016-11-15 | Plansee Composite Mat Gmbh | Beschichtungsquelle mit Strukturierung |
| CN110670030A (zh) * | 2019-09-29 | 2020-01-10 | 洛阳丰联科绑定技术有限公司 | 一种ito拼接型靶材的粘结方法 |
| CN111118459A (zh) * | 2019-12-30 | 2020-05-08 | 有研亿金新材料有限公司 | 一种高性能铁磁性靶材的制备方法 |
| KR102707659B1 (ko) * | 2021-11-17 | 2024-09-19 | 바짐테크놀로지 주식회사 | 스퍼터링 타겟 접합체 |
| CN114434107A (zh) * | 2022-02-15 | 2022-05-06 | 株洲火炬安泰新材料有限公司 | 一种提高ito靶材焊合率的生产加工方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4209375A (en) * | 1979-08-02 | 1980-06-24 | The United States Of America As Represented By The United States Department Of Energy | Sputter target |
| DE2933835C2 (de) * | 1979-08-21 | 1987-02-19 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Befestigen von in Scheiben- oder Plattenform vorliegenden Targetmaterialien auf Kühlteller für Aufstäubanlagen |
| US4740429A (en) * | 1985-07-22 | 1988-04-26 | Ngk Insulators, Ltd. | Metal-ceramic joined articles |
| JPS62278261A (ja) * | 1986-05-26 | 1987-12-03 | Seiko Epson Corp | スパツタ用タ−ゲツトの製造方法 |
| JPS63216969A (ja) * | 1987-03-05 | 1988-09-09 | Daido Steel Co Ltd | 加工方法 |
| JPS63241167A (ja) | 1987-03-30 | 1988-10-06 | Seiko Epson Corp | スパツタリング用タ−ゲツト |
| RU2091501C1 (ru) * | 1991-04-22 | 1997-09-27 | Акционерное общество открытого типа "Всероссийский алюминиево-магниевый институт" | Способ изготовления мишени для магнетронного распыления из алюминия особой чистоты |
| RU2068459C1 (ru) * | 1991-06-03 | 1996-10-27 | Центральный научно-исследовательский институт технологии судостроения | Способ обработки поверхности изделий из стали и сплавов на основе меди |
| JPH05214518A (ja) * | 1992-02-04 | 1993-08-24 | Hitachi Metals Ltd | スパッタリングターゲットとバッキングプレートの接合体の矯正方法およびスパッタリングターゲット材 |
| US7063773B2 (en) * | 2000-08-17 | 2006-06-20 | Tosoh Smd, Inc. | High purity sputter targets with target end-of-life indication and method of manufacture |
| AT4240U1 (de) | 2000-11-20 | 2001-04-25 | Plansee Ag | Verfahren zur herstellung einer verdampfungsquelle |
| US20050072668A1 (en) * | 2003-10-06 | 2005-04-07 | Heraeus, Inc. | Sputter target having modified surface texture |
| MY138584A (en) * | 2003-10-06 | 2009-07-31 | Heraeus Inc | Sputter target having modified surface texture |
| JP4562400B2 (ja) * | 2004-01-28 | 2010-10-13 | 京セラ株式会社 | 活性金属を含むロウ材を用いた接合体及びその製造方法 |
| RU2305717C2 (ru) * | 2005-11-14 | 2007-09-10 | Государственное образовательное учреждение высшего профессионального образования "Московский государственный институт стали и сплавов" (технологический университет) | Мишень для получения функциональных покрытий и способ ее изготовления |
| SE533395C2 (sv) * | 2007-06-08 | 2010-09-14 | Sandvik Intellectual Property | Sätt att göra PVD-beläggningar |
| EP2072637B1 (en) * | 2007-12-21 | 2018-08-15 | Sandvik Intellectual Property AB | Coated cutting tool and a method of making a coated cutting tool |
| CN101518851B (zh) | 2009-02-19 | 2011-07-20 | 宁波江丰电子材料有限公司 | 靶材与背板的焊接结构及方法 |
| CN101879640B (zh) * | 2009-05-06 | 2012-07-25 | 光洋应用材料科技股份有限公司 | 陶瓷溅镀靶材组件及其焊合方法 |
| EP2484493B1 (en) * | 2009-09-30 | 2021-01-20 | Sintokogio, Ltd. | Shot peening treatment method for steel product |
| CN101745710A (zh) | 2010-01-07 | 2010-06-23 | 宁波江丰电子材料有限公司 | 靶材组件的焊接方法 |
| JP5437919B2 (ja) | 2010-06-04 | 2014-03-12 | 三井金属鉱業株式会社 | Ｉｔｏスパッタリングターゲットおよびその製造方法 |
| CN102039459B (zh) | 2010-11-18 | 2012-09-19 | 宁波江丰电子材料有限公司 | 一种靶材焊接方法 |
| US20130029178A1 (en) | 2011-07-27 | 2013-01-31 | Shih-Ying Chang | Active solder |
-
2015
- 2015-06-26 CN CN201580034987.1A patent/CN106471151B/zh active Active
- 2015-06-26 BR BR112016029142A patent/BR112016029142A2/pt not_active Application Discontinuation
- 2015-06-26 US US15/319,022 patent/US10109468B2/en active Active
- 2015-06-26 JP JP2017519788A patent/JP6567048B2/ja active Active
- 2015-06-26 WO PCT/EP2015/001298 patent/WO2015197196A1/de not_active Ceased
- 2015-06-26 KR KR1020187036111A patent/KR20180135120A/ko not_active Withdrawn
- 2015-06-26 KR KR1020167035948A patent/KR102111833B1/ko active Active
- 2015-06-26 EP EP15741114.1A patent/EP3161180B1/de active Active
- 2015-06-26 RU RU2016147509A patent/RU2696910C2/ru active
- 2015-06-26 MX MX2016016573A patent/MX380827B/es unknown
- 2015-06-29 TW TW104120685A patent/TWI713457B/zh active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017524831A5 (enExample) | ||
| KR102234455B1 (ko) | Tib2 층 및 그의 사용 | |
| RU2016147509A (ru) | Распыляемая мишень | |
| TWI564413B (zh) | 支承板、靶材總成及濺鍍用靶材 | |
| JP2007529626A (ja) | スパッタターゲットの熱応力緩和方法 | |
| Chuang et al. | Solid liquid interdiffusion bonding of (Pb, Sn) Te thermoelectric modules with Cu electrodes using a thin-film Sn interlayer | |
| CN104480443A (zh) | 一种硬韧纳米复合ZrAlCuN涂层及其制备方法 | |
| JPS63270459A (ja) | スパツタ用タ−ゲツトのボンデイング方法 | |
| CN104927414B (zh) | 一种用于保护镜板的绝缘涂层 | |
| AU2015243024A1 (en) | Bonding dissimilar ceramic components | |
| CN204342868U (zh) | 一种粉末冶金扩散焊接靶材 | |
| CN109202088A (zh) | 一种Ti/Al3Ti层状复合材料的制备方法 | |
| TWI711710B (zh) | 結構化披覆源 | |
| JP2019502024A5 (enExample) | ||
| WO2019086215A1 (en) | Method to create a good bonding between a free standing thermal barrier coating and a green cmc | |
| KR101137912B1 (ko) | 원통형 스퍼터링 타겟 | |
| Hudycz | Titanium metallization coating deposited on AlN ceramics substrate by means of friction surfacing process | |
| CN208430074U (zh) | 热膨胀的解胶膜结构 | |
| CN103498127A (zh) | 一种应用双离子束镀膜技术在W表面制备W-Cr合金层的方法 | |
| JP6273734B2 (ja) | 平板形スパッタリングターゲットとその製造方法 | |
| TW201243077A (en) | Sputtering target | |
| WANG et al. | Investigation on magnetron sputtering Ti film and vacuum brazing of SiCp/Al composites with high volume fraction | |
| Duckham et al. | Room temperature solder bonding of sputtering targets to backing plates | |
| JP2777733B2 (ja) | 丸鋸刃用セラミックス製複合チップ及びその製造方法 | |
| PL216972B1 (pl) | Sposób lutowania węglików spiekanych ze stalą chromowo-niklową na dużych powierzchniach |