JP2008054276A5 - - Google Patents
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- Publication number
- JP2008054276A5 JP2008054276A5 JP2007045044A JP2007045044A JP2008054276A5 JP 2008054276 A5 JP2008054276 A5 JP 2008054276A5 JP 2007045044 A JP2007045044 A JP 2007045044A JP 2007045044 A JP2007045044 A JP 2007045044A JP 2008054276 A5 JP2008054276 A5 JP 2008054276A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- piezoelectric substrate
- base material
- linear expansion
- substrate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims 1
- 229910052580 B4C Inorganic materials 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 238000002425 crystallisation Methods 0.000 claims 1
- 230000008025 crystallization Effects 0.000 claims 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 claims 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 239000006104 solid solution Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- 238000007751 thermal spraying Methods 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007045044A JP4247281B2 (ja) | 2006-07-27 | 2007-02-26 | 圧電基板及びその製造方法 |
| US11/880,168 US7569976B2 (en) | 2006-07-27 | 2007-07-20 | Piezo-electric substrate and manufacturing method of the same |
| EP07014595.8A EP1885062B1 (en) | 2006-07-27 | 2007-07-25 | Piezo-electric substrate and manufacturing method of the same |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006204739 | 2006-07-27 | ||
| JP2007045044A JP4247281B2 (ja) | 2006-07-27 | 2007-02-26 | 圧電基板及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008262369A Division JP4773494B2 (ja) | 2006-07-27 | 2008-10-09 | 圧電素子の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008054276A JP2008054276A (ja) | 2008-03-06 |
| JP2008054276A5 true JP2008054276A5 (enExample) | 2008-08-21 |
| JP4247281B2 JP4247281B2 (ja) | 2009-04-02 |
Family
ID=39237839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007045044A Active JP4247281B2 (ja) | 2006-07-27 | 2007-02-26 | 圧電基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4247281B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009093376A1 (ja) * | 2008-01-24 | 2009-07-30 | Murata Manufacturing Co., Ltd. | 弾性波素子の製造方法 |
| EP2237417B1 (en) | 2008-01-25 | 2013-07-31 | Murata Manufacturing Co. Ltd. | Elastic wave element and method for manufacturing the same |
| JP4636292B2 (ja) | 2008-08-27 | 2011-02-23 | 株式会社村田製作所 | 電子部品及び電子部品の製造方法 |
| JP5304386B2 (ja) * | 2009-03-27 | 2013-10-02 | 株式会社村田製作所 | 弾性表面波素子の製造方法 |
| EP2736169B1 (en) | 2012-08-17 | 2016-09-14 | NGK Insulators, Ltd. | Composite substrate, elastic surface wave device, and method for producing composite substrate |
| JP6076076B2 (ja) * | 2012-12-21 | 2017-02-08 | 日東電工株式会社 | 組織再生促進剤 |
| FR3079661A1 (fr) * | 2018-03-29 | 2019-10-04 | Soitec | Procede de fabrication d'un substrat pour filtre radiofrequence |
| JP7439415B2 (ja) * | 2019-08-28 | 2024-02-28 | 住友金属鉱山株式会社 | 圧電性基板、圧電性基板の製造方法、及び複合基板 |
| JP7577559B2 (ja) * | 2021-02-15 | 2024-11-05 | 太陽誘電株式会社 | 弾性波デバイス、ウエハ、フィルタおよびマルチプレクサ |
-
2007
- 2007-02-26 JP JP2007045044A patent/JP4247281B2/ja active Active
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