WO2017102069A1 - Beschichtungsquelle mit strukturierung - Google Patents

Beschichtungsquelle mit strukturierung Download PDF

Info

Publication number
WO2017102069A1
WO2017102069A1 PCT/EP2016/002059 EP2016002059W WO2017102069A1 WO 2017102069 A1 WO2017102069 A1 WO 2017102069A1 EP 2016002059 W EP2016002059 W EP 2016002059W WO 2017102069 A1 WO2017102069 A1 WO 2017102069A1
Authority
WO
WIPO (PCT)
Prior art keywords
coating material
coating
structuring
source
support element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2016/002059
Other languages
German (de)
English (en)
French (fr)
Inventor
Peter Polcik
Sabine WÖRLE
Ronnie INNERWINKLER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plansee Composite Materials GmbH
Original Assignee
Plansee Composite Materials GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plansee Composite Materials GmbH filed Critical Plansee Composite Materials GmbH
Priority to KR1020187017106A priority Critical patent/KR102657632B1/ko
Priority to EP16819815.8A priority patent/EP3390684B1/de
Priority to JP2018531419A priority patent/JP7023844B2/ja
Priority to US16/061,688 priority patent/US20190003036A1/en
Priority to CN201680074480.3A priority patent/CN108391438B/zh
Publication of WO2017102069A1 publication Critical patent/WO2017102069A1/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0635—Carbides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/067—Borides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material

Definitions

  • Joining step over brazing also deliberately cracks into a brittle
  • the coating material itself may be formed in one or more parts. If the coating material is designed in several parts, the structuring can be incorporated into all or even only some of the parts of the coating material.
  • the shape, or the cross section of these recesses, grooves, notches or slots can also be designed differently.
  • the cross section may have the shape of a semicircle, a rectangle, a square, a triangle, or a trapezoid.
  • the cracks preferably extend in their depth (spatial extent in the direction of the thickness of the coating source) completely through the
  • Coating source By structuring on the surface of the coating material facing away from the support element therefore finds a
  • a coating source according to the invention may comprise a coating material of different brittle materials.
  • the coating material of carbides (eg: TiC, SiC, WC), borides (eg: T1B2, VB2, CrB 2 ), nitrides (eg: TiN, AlN, TiNaIN), silicides (eg: TiSi 2 , CrSi 2 , M0S12), oxides (eg: Al 2 O 3, (Al, Cr) 2O 3), brittle metals (eg: Cr, Si), intermetallic phases (eg: T13AI, T1AI3, AUCr) or mixtures of the abovementioned materials.
  • the coating material of carbides (eg: TiC, SiC, WC), borides (eg: T1B2, VB2, CrB 2 ), nitrides (eg: TiN, AlN, TiNaIN), silicides (eg: TiSi 2 , CrSi 2 , M0S12
  • Ratio X d2 / (d2 + d3) of the thickness of the coating material d2 to Sum cfc + cb of the thickness of the coating material d2 and thickness of the
  • Supporting element d3 of greater than or equal to 0.6. It is even more preferable to have a maximum ratio X of 0.85.
  • a thermal treatment of the coating source can take place, for example via rapid cooling by means of liquid nitrogen.
  • a thermal treatment of the coating source can take place, for example via rapid cooling by means of liquid nitrogen.
  • Coating source to a deflection of the support element instead of cracking in the coating material. It is believed that in such cases the tensile stresses in the coating material are lower than the breaking stress of the coating material. Such deformed (bent) coating sources can not properly in a
  • Coating material d2 and thickness of the support element d3 of greater or equal to 0.6. It is even more preferable to have a maximum ratio X of 0.85.
  • Figure 1 shows a coating source (1) for the physical
  • the coating material (2) is with the
  • the cracks (4) run as far as possible along the structuring (5).

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PCT/EP2016/002059 2015-12-18 2016-12-07 Beschichtungsquelle mit strukturierung Ceased WO2017102069A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020187017106A KR102657632B1 (ko) 2015-12-18 2016-12-07 구조부를 갖는 코팅 소스
EP16819815.8A EP3390684B1 (de) 2015-12-18 2016-12-07 Beschichtungsquelle mit strukturierung
JP2018531419A JP7023844B2 (ja) 2015-12-18 2016-12-07 構造化物を有する成膜源
US16/061,688 US20190003036A1 (en) 2015-12-18 2016-12-07 Structured coating source
CN201680074480.3A CN108391438B (zh) 2015-12-18 2016-12-07 结构化涂层源

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ATGM371/2015 2015-12-18
ATGM371/2015U AT15050U1 (de) 2015-12-18 2015-12-18 Beschichtungsquelle mit Strukturierung

Publications (1)

Publication Number Publication Date
WO2017102069A1 true WO2017102069A1 (de) 2017-06-22

Family

ID=57227207

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/002059 Ceased WO2017102069A1 (de) 2015-12-18 2016-12-07 Beschichtungsquelle mit strukturierung

Country Status (8)

Country Link
US (1) US20190003036A1 (enExample)
EP (1) EP3390684B1 (enExample)
JP (1) JP7023844B2 (enExample)
KR (1) KR102657632B1 (enExample)
CN (1) CN108391438B (enExample)
AT (1) AT15050U1 (enExample)
TW (1) TWI711710B (enExample)
WO (1) WO2017102069A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020115914B4 (de) 2020-06-17 2024-03-07 Sindlhauser Materials Gmbh Flächiges Sputtertarget

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113930744B (zh) * 2021-09-29 2023-12-15 西北核技术研究所 一种具有高发射阈值的梯度涂层及其制备方法
KR20250086259A (ko) 2023-12-06 2025-06-13 이유진 책상의 기능이 내재되어 있는 캐리어

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62278261A (ja) 1986-05-26 1987-12-03 Seiko Epson Corp スパツタ用タ−ゲツトの製造方法
JPH05230642A (ja) * 1992-02-21 1993-09-07 Nissin High Voltage Co Ltd スパッタ・ターゲット
WO2015197196A1 (de) * 2014-06-27 2015-12-30 Plansee Composite Materials Gmbh Sputtering target

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61291964A (ja) * 1985-06-17 1986-12-22 Anelva Corp スパツタ用樹脂タ−ゲツト
JPS63216969A (ja) * 1987-03-05 1988-09-09 Daido Steel Co Ltd 加工方法
EP0483375B1 (en) * 1990-05-15 1996-03-13 Kabushiki Kaisha Toshiba Sputtering target and production thereof
JPH05214518A (ja) * 1992-02-04 1993-08-24 Hitachi Metals Ltd スパッタリングターゲットとバッキングプレートの接合体の矯正方法およびスパッタリングターゲット材
JP3460506B2 (ja) * 1996-11-01 2003-10-27 三菱マテリアル株式会社 高誘電体膜形成用スパッタリングターゲット
DE102004020404B4 (de) * 2004-04-23 2007-06-06 H. C. Starck Gmbh & Co. Kg Trägerplatte für Sputtertargets, Verfahren zu ihrer Herstellung und Einheit aus Trägerplatte und Sputtertarget
EP1851166A2 (en) * 2005-01-12 2007-11-07 New York University System and method for processing nanowires with holographic optical tweezers
JP5928237B2 (ja) * 2012-08-08 2016-06-01 住友金属鉱山株式会社 Ｃｕ−Ｇａ合金スパッタリングターゲット及びその製造方法
CN104711525B (zh) * 2013-12-13 2018-01-26 吉坤日矿日石金属株式会社 溅射靶及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62278261A (ja) 1986-05-26 1987-12-03 Seiko Epson Corp スパツタ用タ−ゲツトの製造方法
JPH05230642A (ja) * 1992-02-21 1993-09-07 Nissin High Voltage Co Ltd スパッタ・ターゲット
WO2015197196A1 (de) * 2014-06-27 2015-12-30 Plansee Composite Materials Gmbh Sputtering target

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020115914B4 (de) 2020-06-17 2024-03-07 Sindlhauser Materials Gmbh Flächiges Sputtertarget

Also Published As

Publication number Publication date
US20190003036A1 (en) 2019-01-03
EP3390684B1 (de) 2020-03-18
AT15050U1 (de) 2016-11-15
JP7023844B2 (ja) 2022-02-22
TWI711710B (zh) 2020-12-01
KR102657632B1 (ko) 2024-04-15
TW201736625A (zh) 2017-10-16
CN108391438A (zh) 2018-08-10
KR20180094910A (ko) 2018-08-24
JP2019502024A (ja) 2019-01-24
CN108391438B (zh) 2020-04-14
EP3390684A1 (de) 2018-10-24

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