JP2018207108A5 - - Google Patents
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- Publication number
- JP2018207108A5 JP2018207108A5 JP2018107498A JP2018107498A JP2018207108A5 JP 2018207108 A5 JP2018207108 A5 JP 2018207108A5 JP 2018107498 A JP2018107498 A JP 2018107498A JP 2018107498 A JP2018107498 A JP 2018107498A JP 2018207108 A5 JP2018207108 A5 JP 2018207108A5
- Authority
- JP
- Japan
- Prior art keywords
- etching solution
- alcohol
- ether
- glycol
- hydroxyl group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000005530 etching Methods 0.000 claims 16
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 11
- 239000002904 solvent Substances 0.000 claims 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims 6
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 claims 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 239000002131 composite material Substances 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims 3
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims 3
- 150000001298 alcohols Chemical class 0.000 claims 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 claims 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 3
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Natural products OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 claims 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 3
- 235000012239 silicon dioxide Nutrition 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 claims 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- -1 alkoxy alcohols Chemical class 0.000 claims 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims 2
- 125000003827 glycol group Chemical group 0.000 claims 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 claims 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 claims 2
- IVDFJHOHABJVEH-UHFFFAOYSA-N pinacol Chemical compound CC(C)(O)C(C)(C)O IVDFJHOHABJVEH-UHFFFAOYSA-N 0.000 claims 2
- 229920005862 polyol Polymers 0.000 claims 2
- 150000003077 polyols Chemical class 0.000 claims 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims 1
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 claims 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims 1
- CSZZMFWKAQEMPB-UHFFFAOYSA-N 1-methoxybutan-2-ol Chemical compound CCC(O)COC CSZZMFWKAQEMPB-UHFFFAOYSA-N 0.000 claims 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims 1
- LJVNVNLFZQFJHU-UHFFFAOYSA-N 2-(2-phenylmethoxyethoxy)ethanol Chemical compound OCCOCCOCC1=CC=CC=C1 LJVNVNLFZQFJHU-UHFFFAOYSA-N 0.000 claims 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 claims 1
- WCASXYBKJHWFMY-NSCUHMNNSA-N 2-Buten-1-ol Chemical compound C\C=C\CO WCASXYBKJHWFMY-NSCUHMNNSA-N 0.000 claims 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims 1
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 claims 1
- FMVOPJLFZGSYOS-UHFFFAOYSA-N 2-[2-(2-ethoxypropoxy)propoxy]propan-1-ol Chemical compound CCOC(C)COC(C)COC(C)CO FMVOPJLFZGSYOS-UHFFFAOYSA-N 0.000 claims 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 claims 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims 1
- DEDUBNVYPMOFDR-UHFFFAOYSA-N 2-ethoxypropan-1-ol Chemical compound CCOC(C)CO DEDUBNVYPMOFDR-UHFFFAOYSA-N 0.000 claims 1
- YTTFFPATQICAQN-UHFFFAOYSA-N 2-methoxypropan-1-ol Chemical compound COC(C)CO YTTFFPATQICAQN-UHFFFAOYSA-N 0.000 claims 1
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 claims 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 claims 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 claims 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 claims 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims 1
- ZSPTYLOMNJNZNG-UHFFFAOYSA-N 3-Buten-1-ol Chemical compound OCCC=C ZSPTYLOMNJNZNG-UHFFFAOYSA-N 0.000 claims 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 claims 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 claims 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 claims 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims 1
- 125000003158 alcohol group Chemical group 0.000 claims 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 claims 1
- 229940088601 alpha-terpineol Drugs 0.000 claims 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 claims 1
- OWBTYPJTUOEWEK-UHFFFAOYSA-N butane-2,3-diol Chemical compound CC(O)C(C)O OWBTYPJTUOEWEK-UHFFFAOYSA-N 0.000 claims 1
- NUUPJBRGQCEZSI-UHFFFAOYSA-N cyclopentane-1,3-diol Chemical compound OC1CCC(O)C1 NUUPJBRGQCEZSI-UHFFFAOYSA-N 0.000 claims 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 150000002334 glycols Chemical class 0.000 claims 1
- 229940035429 isobutyl alcohol Drugs 0.000 claims 1
- 238000004377 microelectronic Methods 0.000 claims 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims 1
- ZHZCYWWNFQUZOR-UHFFFAOYSA-N pent-4-en-2-ol Chemical compound CC(O)CC=C ZHZCYWWNFQUZOR-UHFFFAOYSA-N 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims 1
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 claims 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 claims 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021071961A JP2021132212A (ja) | 2017-06-05 | 2021-04-21 | 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762515351P | 2017-06-05 | 2017-06-05 | |
| US62/515,351 | 2017-06-05 | ||
| US15/990,000 | 2018-05-25 | ||
| US15/990,000 US11186771B2 (en) | 2017-06-05 | 2018-05-25 | Etching solution for selectively removing silicon nitride during manufacture of a semiconductor device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021071961A Division JP2021132212A (ja) | 2017-06-05 | 2021-04-21 | 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018207108A JP2018207108A (ja) | 2018-12-27 |
| JP2018207108A5 true JP2018207108A5 (enExample) | 2019-02-14 |
| JP7015214B2 JP7015214B2 (ja) | 2022-02-02 |
Family
ID=62528355
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018107498A Active JP7015214B2 (ja) | 2017-06-05 | 2018-06-05 | 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液 |
| JP2021071961A Withdrawn JP2021132212A (ja) | 2017-06-05 | 2021-04-21 | 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021071961A Withdrawn JP2021132212A (ja) | 2017-06-05 | 2021-04-21 | 半導体デバイスの製造中に窒化ケイ素を選択的に除去するためのエッチング溶液 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11186771B2 (enExample) |
| EP (1) | EP3422392B1 (enExample) |
| JP (2) | JP7015214B2 (enExample) |
| KR (1) | KR102141447B1 (enExample) |
| CN (1) | CN109054838A (enExample) |
| IL (1) | IL259799B2 (enExample) |
| SG (1) | SG10201804769SA (enExample) |
| TW (1) | TWI683037B (enExample) |
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| KR20190051656A (ko) * | 2017-11-07 | 2019-05-15 | 삼성전자주식회사 | 식각 조성물, 실리콘 질화막의 식각 방법, 및 반도체 소자의 제조 방법 |
| KR102362365B1 (ko) * | 2018-04-11 | 2022-02-11 | 삼성에스디아이 주식회사 | 실리콘 질화막 에칭 조성물 및 이를 이용한 에칭 방법 |
| US12134784B2 (en) | 2018-11-02 | 2024-11-05 | Public University Corporation Nagoya City University | Method for preparing intestinal tract cell layer derived from pluripotent stem cell |
| CN111363550A (zh) * | 2018-12-26 | 2020-07-03 | 上海新阳半导体材料股份有限公司 | 选择性刻蚀液组合物及其制备方法和应用 |
| US11955341B2 (en) * | 2019-03-11 | 2024-04-09 | Versum Materials Us, Llc | Etching solution and method for selectively removing silicon nitride during manufacture of a semiconductor device |
| EP3959291A4 (en) * | 2019-03-11 | 2023-07-19 | Versum Materials US, LLC | ETCHING SOLUTION AND PROCESS FOR ALUMINUM NITRIDE |
| KR20220002555A (ko) * | 2019-05-01 | 2022-01-06 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 에칭 조성물 |
| KR102803329B1 (ko) * | 2019-08-29 | 2025-05-07 | 에스케이이노베이션 주식회사 | 식각 조성물, 이를 이용한 절연막의 식각방법 및 반도체 소자의 제조방법 |
| KR102675055B1 (ko) * | 2019-09-18 | 2024-06-12 | 오씨아이 주식회사 | 실리콘 질화막 식각 용액 및 이를 사용한 반도체 소자의 제조 방법 |
| EP4041845A4 (en) | 2019-10-09 | 2023-11-22 | Entegris, Inc. | WET ETCH COMPOSITION AND METHOD |
| CN110846040A (zh) * | 2019-11-08 | 2020-02-28 | 湖北兴福电子材料有限公司 | 一种高容硅量磷酸基蚀刻液及其配制方法 |
| CN110878208A (zh) * | 2019-11-08 | 2020-03-13 | 湖北兴福电子材料有限公司 | 一种提高氮化硅蚀刻均匀性的酸性蚀刻液 |
| KR102974325B1 (ko) * | 2020-07-30 | 2026-06-09 | 엔테그리스, 아이엔씨. | 질화규소 필름을 선택적으로 에칭하기 위한 조성물 및 방법 |
| IL300758B1 (en) * | 2020-08-24 | 2026-06-01 | Basf Se | Composition, use and process for selective burning of silicon-germanium material |
| KR102315919B1 (ko) * | 2021-01-26 | 2021-10-22 | 연세대학교 산학협력단 | 비인산계 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법 |
| KR102325905B1 (ko) * | 2021-03-22 | 2021-11-12 | 연세대학교 산학협력단 | 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법 |
| JP7768825B2 (ja) * | 2021-04-22 | 2025-11-12 | 花王株式会社 | エッチング液 |
| FR3122664B1 (fr) * | 2021-05-05 | 2024-06-28 | Dehon | Composition de defluxage d’assemblages electroniques |
| KR20260004549A (ko) * | 2021-05-26 | 2026-01-08 | 엔테그리스, 아이엔씨. | 질화규소 막을 선택적으로 에칭하기 위한 조성물 및 방법 |
| EP4098729A1 (en) * | 2021-06-01 | 2022-12-07 | Cipelia | Non-flammable, volatile and aqueous cleaning composition |
| US12600909B2 (en) | 2021-06-14 | 2026-04-14 | Rasa Industries, Ltd. | Etching solution composition |
| KR102782691B1 (ko) * | 2021-11-10 | 2025-03-19 | 연세대학교 산학협력단 | 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법 |
| CN115353886B (zh) * | 2022-08-31 | 2023-08-25 | 湖北兴福电子材料股份有限公司 | 一种磷酸基蚀刻液及其配制方法 |
| JP2024055539A (ja) * | 2022-10-07 | 2024-04-18 | 花王株式会社 | エッチング液 |
| CN116218528B (zh) * | 2022-12-08 | 2025-04-22 | 湖北兴福电子材料股份有限公司 | 一种高选择性且低泡的蚀刻液 |
| JP7856788B2 (ja) | 2022-12-08 | 2026-05-11 | ラサ工業株式会社 | エッチング液組成物 |
| WO2025258498A1 (ja) * | 2024-06-10 | 2025-12-18 | ステラケミファ株式会社 | 微細加工処理剤、及び微細加工処理方法 |
| US20260150612A1 (en) * | 2024-11-27 | 2026-05-28 | Applied Materials, Inc | Surface conditioning processes for semiconductor processing chamber parts |
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| JP2012033561A (ja) * | 2010-07-28 | 2012-02-16 | Sanyo Chem Ind Ltd | 窒化ケイ素用エッチング液 |
| JP2012099550A (ja) | 2010-10-29 | 2012-05-24 | Sanyo Chem Ind Ltd | 窒化ケイ素用エッチング液 |
| TW201243030A (en) * | 2011-04-20 | 2012-11-01 | Applied Materials Inc | Selective silicon nitride etch |
| WO2012174518A2 (en) | 2011-06-16 | 2012-12-20 | Advanced Technology Materials, Inc. | Compositions and methods for selectively etching silicon nitride |
| JP5913869B2 (ja) * | 2011-08-31 | 2016-04-27 | 林純薬工業株式会社 | エッチング液組成物およびエッチング方法 |
| JP5490071B2 (ja) | 2011-09-12 | 2014-05-14 | 株式会社東芝 | エッチング方法 |
| KR101782329B1 (ko) | 2011-10-18 | 2017-09-28 | 삼성전자주식회사 | 식각용 조성물 및 이를 이용하는 반도체 기억 소자의 형성 방법 |
| US9868902B2 (en) * | 2014-07-17 | 2018-01-16 | Soulbrain Co., Ltd. | Composition for etching |
| KR20170009240A (ko) | 2015-07-16 | 2017-01-25 | 동우 화인켐 주식회사 | 비불소계 실리콘 질화막 식각 조성물 |
| KR102443370B1 (ko) | 2015-11-20 | 2022-09-15 | 동우 화인켐 주식회사 | 실리콘 질화막 식각액 조성물 |
| US10400167B2 (en) * | 2015-11-25 | 2019-09-03 | Versum Materials Us, Llc | Etching compositions and methods for using same |
-
2018
- 2018-05-25 US US15/990,000 patent/US11186771B2/en active Active
- 2018-06-03 TW TW107119087A patent/TWI683037B/zh active
- 2018-06-04 IL IL259799A patent/IL259799B2/en unknown
- 2018-06-04 EP EP18175806.1A patent/EP3422392B1/en active Active
- 2018-06-04 KR KR1020180064165A patent/KR102141447B1/ko active Active
- 2018-06-05 SG SG10201804769SA patent/SG10201804769SA/en unknown
- 2018-06-05 JP JP2018107498A patent/JP7015214B2/ja active Active
- 2018-06-05 CN CN201810570790.5A patent/CN109054838A/zh active Pending
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2021
- 2021-04-21 JP JP2021071961A patent/JP2021132212A/ja not_active Withdrawn
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