JP2018046162A - 炭化珪素半導体装置 - Google Patents
炭化珪素半導体装置 Download PDFInfo
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- JP2018046162A JP2018046162A JP2016180033A JP2016180033A JP2018046162A JP 2018046162 A JP2018046162 A JP 2018046162A JP 2016180033 A JP2016180033 A JP 2016180033A JP 2016180033 A JP2016180033 A JP 2016180033A JP 2018046162 A JP2018046162 A JP 2018046162A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 195
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 168
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 168
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 239000012535 impurity Substances 0.000 claims description 38
- 239000002344 surface layer Substances 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 4
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
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- 230000015556 catabolic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
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- 229920005591 polysilicon Polymers 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
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- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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Abstract
Description
実施の形態1にかかる炭化珪素(SiC)半導体装置の構造について、MOSFETを例に説明する。図1は、実施の形態1にかかる炭化珪素半導体装置の構造を示す断面図である。図1には、図2の切断線A−A’における断面構造を示す。図2は、図1の要部の平面レイアウトを示す平面図である。平面レイアウトとは、炭化珪素基板10のおもて面側から見た各部の平面形状および配置構成である。図3は、比較例1の炭化珪素半導体装置の平面レイアウトを示す平面図である。図4は、一般的なMOSFETの再結合発生率を示す特性図である。図4には、横軸に半導体基板とソース電極との境界(深さ=0μm)からのドレイン電極側へ向かう方向の深さを示し、縦軸に半導体基板内での再結合発生率を示す。
次に、上述した実施の形態1にかかる炭化珪素半導体装置について、積層欠陥の発生の有無を検証した。まず、上述した実施の形態1にかかる炭化珪素半導体装置の製造方法にしたがって、上記諸条件で図1,2に示すMOSFETを作製した(以下、実施例1とする)。そして、実施例1の内周セル24aのp+型コンタクト領域6aおよび第1p型ベース領域3aをアノードとし、n-型ドリフト領域2をカソードとする寄生ダイオード(以下、単に寄生ダイオードとする)を順方向に2500[A/cm2]の電流密度で通電した。また、図3の比較例1のMOSFETの内周セル24aの寄生ダイオードを、実施例1と同様の電流密度で順方向に通電した。
次に、実施の形態2にかかる炭化珪素半導体装置の構造について説明する。図5は、実施の形態2にかかる炭化珪素半導体装置の要部の平面レイアウトを示す平面図である。図5の切断線A−A’における断面構造は、図1と同様である。実施の形態2にかかる炭化珪素半導体装置が実施の形態1にかかる炭化珪素半導体装置と異なる点は、最外周セル24bのセル密度を減少させた点である。すなわち、境界領域23には、最外周セル24bが一定間隔で間引いて配置されている。最外周セル24bを間引くとは、最外周セル24bと同じ表面積を有し、かつp+型コンタクト領域6bを配置しない領域(以下、間引き領域とする)24cが最外周セル24b間に1つ以上存在することである。
次に、上述した実施の形態2にかかる炭化珪素半導体装置について、積層欠陥の発生の有無を検証した。まず、上述した実施の形態2にかかる炭化珪素半導体装置の製造方法にしたがって、上記諸条件で図5に示すMOSFETを作製した(以下、実施例2とする)。そして、実施例2の内周セル24aの寄生ダイオードを順方向に2500[A/cm2]の電流密度で通電した。その結果、実施例2においても、実施例1と同様に、最外周セル24bのp+型コンタクト領域6bの直下の部分で、n+型出発基板1内の基底面転位を起点とする積層欠陥が発生しないことが確認された。
次に、実施の形態3にかかる炭化珪素半導体装置の構造について説明する。図6は、実施の形態3にかかる炭化珪素半導体装置の要部の平面レイアウトを示す平面図である。図6の切断線B−B’における断面構造は、図1の符号4a,4b,5,6a,6b,7,d3,d4をそれぞれ符号64a,64b,65,66a,66b,67,d11,d12に代えたものと同様である。実施の形態3にかかる炭化珪素半導体装置が実施の形態1にかかる炭化珪素半導体装置と異なる点は、内周セル24aの各部を同じ方向(以下、第1方向とする)Xに延びるストライプ状の平面レイアウトに配置し、最外周セル24bのp+型コンタクト領域66bを第1方向Xに延びる直線部を含む平面形状に配置した点である。
次に、上述した実施の形態3にかかる炭化珪素半導体装置について、積層欠陥の発生の有無を検証した。図7は、比較例2の炭化珪素半導体装置の平面レイアウトを示す平面図である。まず、上述した実施の形態3にかかる炭化珪素半導体装置の製造方法にしたがって、上記諸条件で図6に示すMOSFETを作製した(以下、実施例3とする)。そして、実施例3の内周セル24aの寄生ダイオードを順方向に2500[A/cm2]の電流密度で通電した。また、図7の比較例2のMOSFETの内周セル24aの寄生ダイオードを、実施例3と同様の電流密度で順方向に通電した。比較例2のMOSFETが実施例3と異なる点は、最外周セル24bのp+型コンタクト領域66cの幅d13が内周セル24aのp+型コンタクト領域66aの幅d11よりも広い点である。
次に、実施の形態4にかかる炭化珪素半導体装置の構造について説明する。図8は、実施の形態4にかかる炭化珪素半導体装置の要部の平面レイアウトを示す平面図である。図8の切断線B−B’における断面構造は、図1の符号4a,4b,5,6a,6b,7,d3,d4をそれぞれ符号64a,64b,65,66a,66d,67,d11,d14に代えたものと同様である。実施の形態4にかかる炭化珪素半導体装置が実施の形態3にかかる炭化珪素半導体装置と異なる点は、第2方向Yに内周セル24aと対向する部分24dにおいて、最外周セル24bのp+型コンタクト領域66dの表面積の総和(面積密度)を減少させた点である。
次に、上述した実施の形態4にかかる炭化珪素半導体装置について、積層欠陥の発生の有無を検証した。まず、上述した実施の形態4にかかる炭化珪素半導体装置の製造方法にしたがって、上記諸条件で図8に示すMOSFETを作製した(以下、実施例4とする)。そして、実施例4の内周セル24aの寄生ダイオードを順方向に2500[A/cm2]の電流密度で通電した。その結果、実施例4においても、実施例3と同様に、最外周セル24bのp+型コンタクト領域66dの直下の部分で、n+型出発基板1内の基底面転位を起点とする積層欠陥が発生しないことが確認された。
次に、実施の形態5にかかる炭化珪素半導体装置の構造について説明する。図9は、実施の形態5にかかる炭化珪素半導体装置の構造を示す断面図である。実施の形態5にかかる炭化珪素半導体装置の内周セル24aおよび最外周セル24bの平面レイアウトは、図2と同様である。実施の形態5にかかる炭化珪素半導体装置が実施の形態1にかかる炭化珪素半導体装置と異なる点は、内周セル24aのMOSゲート構造を、プレーナゲート構造に代えてトレンチゲート構造とした点である。
次に、実施の形態6にかかる炭化珪素半導体装置の構造について説明する。実施の形態6にかかる炭化珪素半導体装置が実施の形態1にかかる炭化珪素半導体装置と異なる点は、次の2点である。1つ目の相違点は、最外周セル24bのp+型コンタクト領域6bの表面積S2が内周セル24aのp+型コンタクト領域6aの表面積S1と等しい点である。2つ目の相違点は、最外周セル24bのp+型コンタクト領域6bの不純物濃度が内周セル24aのp+型コンタクト領域6aの不純物濃度よりも低い点である。
2 n-型ドリフト領域
3a,3b,4a,4b,64a,64b,71 p型ベース領域
5,65 n+型ソース領域
6a,6b,66a,66b,66d p+型コンタクト領域
7,67 n型JFET領域
8,73 ゲート絶縁膜
9,74 ゲート電極
10 炭化珪素基板
11 層間絶縁膜
12 ソース電極
13 ドレイン電極
21 活性領域
22 エッジ終端領域
23 境界領域
24a 内周セル(単位セル)
24b 最外周セル(単位セル)
24c 最外周セルの間引き領域
24d 最外周セルの、第2方向に内周セルと対向する部分
24e 最外周セルの、第1方向に内周セルと対向する部分
31,33 n-型炭化珪素層
32,34 p型炭化珪素層
41 境界領域とエッジ終端領域との段差
41a 境界領域とエッジ終端領域との段差のステア
42,43 JTE領域
72 トレンチ
L1 最外周セルのp+型コンタクト領域の1辺の長さ
L2 最外周セルのp+型コンタクト領域の配置間隔(ピッチ)
X 基板おもて面に平行な方向(第1方向)
Y 第1方向と直交し、かつ基板おもて面に平行な方向(第2方向)
d1 内周セルの対角線の長さ
d2 最外周セルの対角線の長さ
d3 内周セルのp+型コンタクト領域の対角線の長さ
d4 最外周セルのp+型コンタクト領域の対角線の長さ
d11 内周セルのp+型コンタクト領域の幅
d12 最外周セルのp+型コンタクト領域の幅
d14 最外周セルのp+型コンタクト領域の1辺の長さ
Claims (9)
- 炭化珪素からなる半導体基板と、
前記半導体基板の第1主面の表面層に設けられた第1導電型の第1半導体領域と、
前記半導体基板の第2主面の表面層に選択的に設けられた第2導電型の第2半導体領域と、
前記第1半導体領域と前記第2半導体領域との間に、前記第1半導体領域および前記第2半導体領域に接して設けられた、前記第1半導体領域よりも不純物濃度の低い第1導電型の第3半導体領域と、
前記第2半導体領域の内部に選択的に設けられた第1導電型の第4半導体領域と、
前記第2半導体領域の内部に選択的に設けられた、前記第2半導体領域よりも不純物濃度の高い第1導電型の第5半導体領域と、
前記第2半導体領域の、前記第3半導体領域と前記第4半導体領域との間の領域に接して設けられたゲート絶縁膜と、
前記ゲート絶縁膜を挟んで前記第2半導体領域の反対側に設けられたゲート電極と、
前記第4半導体領域および前記第5半導体領域に接する第1電極と、
前記第1半導体領域に接する第2電極と、
前記第2半導体領域、前記第4半導体領域、前記第5半導体領域、前記ゲート絶縁膜および前記ゲート電極を有する第1セルと、
前記第2半導体領域および前記第5半導体領域を有し、前記第1セルよりも前記半導体基板の外側に配置された第2セルと、
を備え、
前記第2セルの前記第5半導体領域の抵抗値は、前記第1セルの前記第5半導体領域の抵抗値よりも大きいことを特徴とする炭化珪素半導体装置。 - 前記第1セルは、活性領域にマトリクス状のレイアウトに複数配置され、
前記第2セルは、前記活性領域の外周に沿って前記活性領域の周囲を囲むレイアウトに複数配置され、
1つの前記第2セルの前記第5半導体領域の表面積は、1つの前記第1セルの前記第5半導体領域の表面積よりも小さいことを特徴とする請求項1に記載の炭化珪素半導体装置。 - 前記第1セルは、活性領域にマトリクス状のレイアウトに複数配置され、
前記第2セルは、前記活性領域の外周に沿って前記活性領域の周囲を囲むレイアウトに複数配置され、
前記第2セルの個数は、複数の前記第1セルのうち、前記活性領域の外周に沿って配置された前記第1セルの個数よりも少ないことを特徴とする請求項1に記載の炭化珪素半導体装置。 - 複数の前記第2セルの前記第5半導体領域は等間隔に離して配置されていることを特徴とする請求項1〜3のいずれか一つに記載の炭化珪素半導体装置。
- 前記第1セルは、活性領域にマトリクス状のレイアウトに複数配置され、
前記第2セルは、前記活性領域の外周に沿って前記活性領域の周囲を囲むレイアウトに複数配置され、
前記第2セルの前記第5半導体領域の不純物濃度は、前記第1セルの前記第5半導体領域の不純物濃度よりも低いことを特徴とする請求項1に記載の炭化珪素半導体装置。 - 前記第1セルは、活性領域にストライプ状のレイアウトに配置され、
前記第2セルは、前記活性領域の外周に沿って前記活性領域の周囲を矩形状に囲む平面形状を有し、
前記第2セルの前記第5半導体領域の幅は、1つの前記第1セルの前記第5半導体領域の幅よりも小さいことを特徴とする請求項1に記載の炭化珪素半導体装置。 - 前記第1セルは、活性領域にストライプ状のレイアウトに配置され、
前記第2セルは、前記活性領域の外周に沿って前記活性領域の周囲を矩形状に囲む平面形状を有し、
前記第2セルの前記第5半導体領域は、前記活性領域の外周に沿って前記活性領域の周囲を囲むレイアウトに複数配置され、
前記第2セルの複数の前記第5半導体領域のうち、前記第1セルがストライプ状に延びる第1方向に沿って配置された前記第5半導体領域の表面積の総和は、1つの前記第1セルの前記第5半導体領域の表面積よりも小さいことを特徴とする請求項1に記載の炭化珪素半導体装置。 - 前記第1セルは、活性領域にストライプ状のレイアウトに配置され、
前記第2セルは、前記活性領域の外周に沿って前記活性領域の周囲を矩形状に囲む平面形状を有し、
前記第2セルの前記第5半導体領域の不純物濃度は、前記第1セルの前記第5半導体領域の不純物濃度よりも低いことを特徴とする請求項1に記載の炭化珪素半導体装置。 - パワーモジュールに搭載されることを特徴とする請求項1〜8のいずれか一つに記載の炭化珪素半導体装置。
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