JP2018029215A - 積層セラミック電子部品 - Google Patents
積層セラミック電子部品 Download PDFInfo
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- JP2018029215A JP2018029215A JP2017225503A JP2017225503A JP2018029215A JP 2018029215 A JP2018029215 A JP 2018029215A JP 2017225503 A JP2017225503 A JP 2017225503A JP 2017225503 A JP2017225503 A JP 2017225503A JP 2018029215 A JP2018029215 A JP 2018029215A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 157
- 239000011521 glass Substances 0.000 claims description 78
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 35
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 11
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 8
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 8
- 229910002113 barium titanate Inorganic materials 0.000 claims description 8
- 229910052796 boron Inorganic materials 0.000 claims description 8
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims description 5
- 229910052697 platinum Inorganic materials 0.000 claims description 5
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 5
- 239000002003 electrode paste Substances 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 description 19
- 230000007423 decrease Effects 0.000 description 15
- 238000007747 plating Methods 0.000 description 15
- 150000001340 alkali metals Chemical class 0.000 description 13
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000011148 porous material Substances 0.000 description 10
- 230000035515 penetration Effects 0.000 description 9
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 229910001935 vanadium oxide Inorganic materials 0.000 description 8
- 239000012466 permeate Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 4
- 239000003985 ceramic capacitor Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical group [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 3
- 229910000312 vanadium group oxide Inorganic materials 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 2
- 238000000280 densification Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 239000011591 potassium Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910052701 rubidium Inorganic materials 0.000 description 2
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004453 electron probe microanalysis Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
【解決手段】本発明による積層セラミック電子部品は、内部に内部電極30が形成されたセラミック本体10と、セラミック本体10の外部に形成され内部電極30と接続された外部電極21,22と、セラミック本体10の外部面のうち内部電極30と外部電極21,22が接続される接続面からセラミック本体10の内部側へ形成されたバッファー層41,42と、を含み、外部電極21,22の厚さをT、バッファー層41,42の厚さをt、アクティブ領域の厚さをTA、セラミック本体の厚さをTcとしたとき、T≦10μm、TA/TC>0.8、t≦5μmであることができる。
【選択図】図2
Description
20 外部電極
21、22 第1及び第2の外部電極
30 内部電極
31、32 第1及び第2の内部電極
41、42 第1及び第2のバッファー層
51、52 第1及び第2の接続面
t バッファー層の厚さ
T 外部電極の厚さ
TC セラミック本体の厚さ
TA アクティブ領域の厚さ
Claims (20)
- 内部に内部電極が形成されたセラミック本体と、
前記セラミック本体の外部に形成され前記内部電極と接続された外部電極と、
前記セラミック本体の外部面のうち前記内部電極と前記外部電極が接続される接続面から前記セラミック本体の内部側へ形成され、ホウ素の含量が50%以上であるバッファー層と、
を含み、
前記外部電極の厚さをT、前記バッファー層の厚さをt、アクティブ領域の厚さをTA、セラミック本体の厚さをTCとしたとき、T≦10μm、TA/TC>0.8、t≦5μmである、積層セラミック電子部品。 - 前記セラミック本体は直六面体である、請求項1に記載の積層セラミック電子部品。
- 前記内部電極は長方形である、請求項1に記載の積層セラミック電子部品。
- 前記外部電極は前記セラミック本体の端面に形成される、請求項1に記載の積層セラミック電子部品。
- 前記外部電極は前記セラミック本体の上下面及び側面の一部に伸びる、請求項1に記載の積層セラミック電子部品。
- 前記セラミック本体はチタン酸バリウム又はチタン酸ストロンチウムを含む、請求項1に記載の積層セラミック電子部品。
- 前記外部電極はガラスを含む、請求項1に記載の積層セラミック電子部品。
- 前記内部電極は金、銀、銅、ニッケル、パラジウム、白金及びこれらの合金からなる群から選択された一つ以上を含む、請求項1に記載の積層セラミック電子部品。
- 前記外部電極は金、銀、パラジウム、銅、ニッケル及びこれらの合金からなる群から選択された一つ以上を含む、請求項1に記載の積層セラミック電子部品。
- セラミック本体の対向する端面に形成された第1及び第2の外部電極を含む外部電極と、
前記セラミック本体の内部に離隔されて積層配置され、前記第1及び第2の外部電極にそれぞれ接続された第1及び第2の内部電極を含む内部電極と、
前記セラミック本体の端面から前記セラミック本体の内部側へ形成され、ホウ素の含量が50%以上であるバッファー層と、
を含み、
前記外部電極の厚さをT、前記バッファー層の厚さをt、アクティブ領域の厚さをTA、セラミック本体の厚さをTCとしたとき、T≦10μm、TA/TC>0.8、t≦5μmである、積層セラミック電子部品。 - 前記セラミック本体は直六面体である、請求項10に記載の積層セラミック電子部品。
- 前記内部電極は長方形である、請求項10に記載の積層セラミック電子部品。
- 前記外部電極は前記セラミック本体の上下面及び側面の一部に伸びる、請求項10に記載の積層セラミック電子部品。
- 前記セラミック本体はチタン酸バリウム又はチタン酸ストロンチウムを含む、請求項10に記載の積層セラミック電子部品。
- 前記外部電極はガラスを含む、請求項10に記載の積層セラミック電子部品。
- 前記内部電極は金、銀、銅、ニッケル、パラジウム、白金及びこれらの合金からなる群から選択された一つ以上を含む、請求項10に記載の積層セラミック電子部品。
- 前記外部電極は金、銀、パラジウム、銅、ニッケル及びこれらの合金からなる群から選択された一つ以上を含む、請求項10に記載の積層セラミック電子部品。
- 導電性金属及びガラスを含む外部電極用ペーストを製造する段階と、
内部電極が積層された焼結チップに前記外部電極用ペーストで外部電極を形成する段階と、
前記ガラスの軟化点以上で昇温速度を調節してホウ素の含量が50%以上であるバッファー層の厚さを調節する外部電極焼結段階と、
を含む、積層セラミック電子部品の製造方法。 - 前記昇温速度を高めて前記バッファー層の厚さを減少させる、請求項18に記載の積層セラミック電子部品の製造方法。
- 前記昇温速度を低めて前記バッファー層の厚さを増加させる、請求項18に記載の積層セラミック電子部品の製造方法。
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JP2020150168A JP7331321B2 (ja) | 2013-02-20 | 2020-09-07 | 積層セラミック電子部品 |
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KR1020130018275A KR102097332B1 (ko) | 2013-02-20 | 2013-02-20 | 적층 세라믹 전자 부품 |
KR10-2013-0018275 | 2013-02-20 |
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JP2018029215A true JP2018029215A (ja) | 2018-02-22 |
JP6800830B2 JP6800830B2 (ja) | 2020-12-16 |
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JP2017225503A Active JP6800830B2 (ja) | 2013-02-20 | 2017-11-24 | 積層セラミック電子部品 |
JP2020150168A Active JP7331321B2 (ja) | 2013-02-20 | 2020-09-07 | 積層セラミック電子部品 |
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US (1) | US9305705B2 (ja) |
JP (3) | JP6342122B2 (ja) |
KR (1) | KR102097332B1 (ja) |
CN (1) | CN103996537B (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102089692B1 (ko) * | 2013-02-20 | 2020-04-14 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
JP5689143B2 (ja) * | 2013-03-19 | 2015-03-25 | 太陽誘電株式会社 | 低背型積層セラミックコンデンサ |
JP2015153764A (ja) * | 2014-02-10 | 2015-08-24 | 株式会社村田製作所 | 積層セラミックコンデンサ、積層セラミックコンデンサ連及び積層セラミックコンデンサの実装構造体 |
TWI580568B (zh) * | 2014-09-03 | 2017-05-01 | Murata Manufacturing Co | Ceramic electronic parts and manufacturing method thereof |
US9892854B2 (en) * | 2015-03-12 | 2018-02-13 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing the same |
JP6679964B2 (ja) * | 2015-03-12 | 2020-04-15 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP2016181597A (ja) | 2015-03-24 | 2016-10-13 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
JP6632808B2 (ja) | 2015-03-30 | 2020-01-22 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
KR102538902B1 (ko) * | 2016-02-24 | 2023-06-01 | 삼성전기주식회사 | 전자부품 및 그의 제조방법 |
KR101898666B1 (ko) * | 2016-09-02 | 2018-09-13 | 한양대학교 산학협력단 | 뉴런 소자 및 그 구동 방법 |
WO2018044127A1 (ko) | 2016-09-02 | 2018-03-08 | 한양대학교 산학협력단 | 뉴로모픽 소자 및 그 구동 방법 |
JP7047526B2 (ja) * | 2018-03-27 | 2022-04-05 | Tdk株式会社 | 積層セラミック電子部品 |
KR102217289B1 (ko) * | 2018-11-22 | 2021-02-19 | 삼성전기주식회사 | 커패시터 부품 및 그 제조 방법 |
DE102019109308A1 (de) * | 2019-04-09 | 2020-10-15 | Tdk Electronics Ag | Keramisches Bauelement und Verfahren zur Herstellung des keramischen Bauelements |
JP7427460B2 (ja) * | 2019-04-22 | 2024-02-05 | 太陽誘電株式会社 | セラミック電子部品、回路基板、およびセラミック電子部品の製造方法 |
JP2020202220A (ja) * | 2019-06-07 | 2020-12-17 | 株式会社村田製作所 | 積層セラミック電子部品 |
KR102333093B1 (ko) * | 2019-07-08 | 2021-12-01 | 삼성전기주식회사 | 커패시터 부품 |
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KR102089692B1 (ko) * | 2013-02-20 | 2020-04-14 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
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JPH10135063A (ja) * | 1996-11-01 | 1998-05-22 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2012033621A (ja) * | 2010-07-29 | 2012-02-16 | Kyocera Corp | 積層セラミックコンデンサ |
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JP2020198453A (ja) | 2020-12-10 |
JP6342122B2 (ja) | 2018-06-13 |
JP7331321B2 (ja) | 2023-08-23 |
JP6800830B2 (ja) | 2020-12-16 |
CN103996537A (zh) | 2014-08-20 |
KR20140104279A (ko) | 2014-08-28 |
KR102097332B1 (ko) | 2020-04-06 |
JP2014160793A (ja) | 2014-09-04 |
US20140233149A1 (en) | 2014-08-21 |
US9305705B2 (en) | 2016-04-05 |
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