JP2017157678A - 成膜装置 - Google Patents
成膜装置 Download PDFInfo
- Publication number
- JP2017157678A JP2017157678A JP2016039270A JP2016039270A JP2017157678A JP 2017157678 A JP2017157678 A JP 2017157678A JP 2016039270 A JP2016039270 A JP 2016039270A JP 2016039270 A JP2016039270 A JP 2016039270A JP 2017157678 A JP2017157678 A JP 2017157678A
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- gas
- partition
- pipes
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008021 deposition Effects 0.000 title abstract 2
- 238000005192 partition Methods 0.000 claims abstract description 98
- 230000002093 peripheral effect Effects 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 21
- 239000013078 crystal Substances 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 161
- 238000010926 purge Methods 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- -1 SiH 2 Cl 2 Chemical compound 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45519—Inert gas curtains
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45576—Coaxial inlets for each gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45587—Mechanical means for changing the gas flow
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/10—Mixing gases with gases
- B01F23/19—Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means
- B01F23/191—Mixing systems, i.e. flow charts or diagrams; Arrangements, e.g. comprising controlling means characterised by the construction of the controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02529—Silicon carbide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
そこで、反応室内で混合されるように、Si原料ガスやC原料ガスをそれぞれ分離した複数の配管から反応室に供給する成膜装置が提案されている。
SiC等の高温プロセスでは配管が設けられるガス供給部も高温になるため、配管にSiCでコートされたカーボンなどの耐熱性が高い材料を用いる必要がある。しかしながら、このような二重管構造とすると、熱膨張による変形を抑えるため、ある程度のあそびを有する分離した構造としなければならない。そのため、内側パイプと外側パイプとの位置精度を維持することが困難である。そして、位置がずれることで、内側パイプと外側パイプとが互いに近接する箇所ができると、その箇所からパージガスが十分供給されず、堆積物の付着が発生するおそれが生じる。そして、各パイプの堆積物がパーティクルとして基板上に落下することで、膜質を悪化させてしまうといった問題がある。
図1は、第1の実施形態による成膜装置1の概略断面図である。図1の成膜装置1は、基板の一例であるSiC基板2上に、成膜処理の一例であるSiC膜のエピタキシャル成長を行うために用いることができる。図1に示すように、成膜装置1は、成膜室の一例であるチャンバ3と、供給部4とを備える。また、成膜装置1は、回転部51と、ガス排出部6とを備える。
次に、供給部4の具体的な構成例について説明する。
第1〜第4ガス仕切板401〜404は、チャンバ3の上壁32から下方に順次所定の間隔で配置されている。そして、第1〜第4ガス仕切板401〜404とチャンバ3の上壁32とのそれぞれの間に独立したガスの流路が設けられる。
第1内側パイプ411は、D1方向(以下、鉛直方向と記す)に延びる略円筒形状を有している。第1内側パイプ411は、第1導入路431と第1導入路431の下方D11の第2導入路432とを仕切る第1ガス仕切板401に配置されている。第1内側パイプ411は、第1導入路431と連通し、第1ガス仕切板401から第4ガス仕切板404の下方に至る。具体的には、第1内側パイプ411の上端には、円環状のフランジ411aが設けられている。また、第1内側パイプ411に対応する第1〜第4ガス仕切板401〜404には、貫通孔401a〜404aが設けられている。第1内側パイプ411は、D12方向(以下、上方と記す)から貫通孔401aの内周縁部にフランジ411aを当接させた状態で、第1ガス仕切板401から貫通孔402a〜404aを通り、第2の導入路432、第2のガス仕切板402、第3の導入路403、第3のガス仕切板403、第4の導入路434を貫通して、第4ガス仕切板404の下方に至っている。
第1内側パイプ411および第1外側パイプ421と、第2内側パイプ412および第2外側パイプ422は、D2方向(以下、水平方向と記す)に適宜間隔を設けて配置されている。
図2Aは、第1の実施形態による第1内側パイプ411の断面図であり、図2Bは、図2Aの第1内側パイプ411の下面図である。
次に、以上のように構成された第1の実施形態の成膜装置1の動作例として、SiC膜の成膜方法について説明する。
次に、第2の実施形態として、内側パイプ411、412の下端部がテーパ形状を有する実施形態について説明する。なお、第2の実施形態において、既述の実施形態に対応する構成部については同一の符号を用いて重複した説明を省略する。
次に、第3の実施形態として、内側パイプ411、412および外側パイプ421、422の双方の下端部がテーパ形状を有する実施形態について説明する。なお、第3の実施形態において、既述の実施形態に対応する構成部については同一の符号を用いて重複した説明を省略する。
次に、第4の実施形態として、三重管構造のパイプを有する実施形態について説明する。なお、第4の実施形態において、既述の実施形態に対応する構成部については同一の符号を用いて重複した説明を省略する。
2 SiC基板
3 チャンバ
32 上壁
4 供給部
401 第1ガス仕切板
402 第2ガス仕切板
403 第3ガス仕切板
404 第4ガス仕切板
411 第1内側パイプ
411b 第1ガイド部
412 第2内側パイプ
412b 第2ガイド部
421 第1外側パイプ
422 第2外側パイプ
431 第1導入路
432 第2導入路
433 第3導入路
434 第4導入路
Claims (5)
- 基板上に反応を行う反応室と、
前記反応室の上方に配置され、前記基板上に少なくとも第1ガスおよび第2ガスを供給する供給部と、を備え、
前記供給部は、
第1隔壁と、前記第1隔壁の下部に所定間隔で設けられる第2隔壁と、前記第2隔壁の下部に所定間隔で設けられる第3隔壁と、
前記第1ガスが導入される前記第1の隔壁と前記第2隔壁の間に設けられる第1流路と、
前記第2ガスが導入される前記第2隔壁と前記第3隔壁との間に設けられる第2流路と、
前記第2隔壁から前記第3隔壁の下方に至り、前記第1流路と連通する第1配管と、
前記第1配管を囲むように設けられ、前記第3隔壁から前記第3隔壁の下方に至り、前記第2流路と連通する第2配管と、
前記第1配管の外周面または前記第2配管の内周面に設けられ、前記第1配管の外周面および前記第2配管の内周面の一方から他方に向かって突出した凸部と、
を備える成膜装置。 - 前記凸部は、前記第1配管の外周面に設けられ、前記第2配管の内周面に向かって突出した請求項1に記載の成膜装置。
- 前記凸部は、前記第1配管および前記第2配管の下端より上方に設けられた請求項1または2に記載の成膜装置。
- 前記凸部は、前記第1配管の中心軸方向に伸延した形状を有する請求項1〜3のいずれか1項に記載の成膜装置。
- 前記凸部の下端は、テーパを有する請求項4に記載の成膜装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016039270A JP6664993B2 (ja) | 2016-03-01 | 2016-03-01 | 成膜装置 |
PCT/JP2017/007292 WO2017150400A1 (ja) | 2016-03-01 | 2017-02-27 | 成膜装置 |
DE112017001127.2T DE112017001127B4 (de) | 2016-03-01 | 2017-02-27 | Filmausbildevorrichtung |
CN201780012924.5A CN109075038B (zh) | 2016-03-01 | 2017-02-27 | 成膜装置 |
KR1020187028294A KR102211543B1 (ko) | 2016-03-01 | 2017-02-27 | 성막 장치 |
TW106106581A TWI630282B (zh) | 2016-03-01 | 2017-03-01 | 成膜裝置 |
US16/118,734 US10896831B2 (en) | 2016-03-01 | 2018-08-31 | Film forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016039270A JP6664993B2 (ja) | 2016-03-01 | 2016-03-01 | 成膜装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017157678A true JP2017157678A (ja) | 2017-09-07 |
JP2017157678A5 JP2017157678A5 (ja) | 2019-01-24 |
JP6664993B2 JP6664993B2 (ja) | 2020-03-13 |
Family
ID=59742958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016039270A Active JP6664993B2 (ja) | 2016-03-01 | 2016-03-01 | 成膜装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10896831B2 (ja) |
JP (1) | JP6664993B2 (ja) |
KR (1) | KR102211543B1 (ja) |
CN (1) | CN109075038B (ja) |
DE (1) | DE112017001127B4 (ja) |
TW (1) | TWI630282B (ja) |
WO (1) | WO2017150400A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020039809A1 (ja) | 2018-08-24 | 2020-02-27 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
JP2020088339A (ja) * | 2018-11-30 | 2020-06-04 | 昭和電工株式会社 | SiCエピタキシャル成長装置 |
CN111261548A (zh) * | 2018-12-03 | 2020-06-09 | 昭和电工株式会社 | SiC化学气相沉积装置和SiC外延晶片的制造方法 |
JP2020141112A (ja) * | 2019-03-01 | 2020-09-03 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11944988B2 (en) * | 2018-05-18 | 2024-04-02 | Applied Materials, Inc. | Multi-zone showerhead |
JP2022525108A (ja) * | 2019-03-11 | 2022-05-11 | アプライド マテリアルズ インコーポレイテッド | 基板処理チャンバ用のリッドアセンブリ装置及び方法 |
EP4067532A4 (en) * | 2019-11-27 | 2023-08-16 | Sino Nitride Semiconductor Co, Ltd | GAN MATERIAL GROWTH LINEAR SPRAY HEAD |
WO2022130926A1 (ja) * | 2020-12-14 | 2022-06-23 | 株式会社ニューフレアテクノロジー | 気相成長装置及び気相成長方法 |
KR102678091B1 (ko) | 2020-12-14 | 2024-06-26 | 가부시키가이샤 뉴플레어 테크놀로지 | 기상 성장 장치 및 기상 성장 방법 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0292896A (ja) * | 1988-09-28 | 1990-04-03 | Toshiba Corp | Si単結晶の製造方法 |
JPH02205316A (ja) * | 1989-02-03 | 1990-08-15 | Sumitomo Metal Ind Ltd | エピタキシャル気相成長装置 |
JPH02308534A (ja) * | 1989-05-24 | 1990-12-21 | Toshiba Corp | 半導体基板の薄膜形成装置 |
JPH0383897A (ja) * | 1989-08-24 | 1991-04-09 | Mitsubishi Electric Corp | 気相成長装置 |
JPH0722323A (ja) * | 1993-06-30 | 1995-01-24 | Nec Corp | 気相成長装置 |
JP2000144432A (ja) * | 1998-11-04 | 2000-05-26 | Ebara Corp | ガス噴射ヘッド |
JP2000252270A (ja) * | 1999-03-01 | 2000-09-14 | Ebara Corp | ガス噴射ヘッド |
JP2004076076A (ja) * | 2002-08-14 | 2004-03-11 | Konica Minolta Holdings Inc | 大気圧プラズマ処理装置及び大気圧プラズマ処理方法 |
JP2004100001A (ja) * | 2002-09-11 | 2004-04-02 | Air Water Inc | 成膜装置 |
JP2007039750A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | 原子層堆積装置 |
JP2010062383A (ja) * | 2008-09-04 | 2010-03-18 | Sharp Corp | 気相成長装置及び気相成長方法 |
WO2010058813A1 (ja) * | 2008-11-21 | 2010-05-27 | 国立大学法人長岡技術科学大学 | 基板処理方法及び基板処理装置 |
JP2014183297A (ja) * | 2013-03-21 | 2014-09-29 | Tokyo Electron Ltd | プラズマ処理装置及びシャワープレート |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2969596B2 (ja) * | 1989-10-06 | 1999-11-02 | アネルバ株式会社 | Cvd装置 |
JP3406959B2 (ja) * | 1992-10-16 | 2003-05-19 | キヤノン株式会社 | マイクロ波プラズマcvd法による堆積膜形成方法 |
JP3360098B2 (ja) * | 1995-04-20 | 2002-12-24 | 東京エレクトロン株式会社 | 処理装置のシャワーヘッド構造 |
DE102005055468A1 (de) | 2005-11-22 | 2007-05-24 | Aixtron Ag | Verfahren zum Abscheiden von Schichten in einem CVD-Reaktor sowie Gaseinlassorgan für einen CVD-Reaktor |
JP4989210B2 (ja) | 2006-12-20 | 2012-08-01 | 住友ゴム工業株式会社 | 自動二輪車用タイヤ |
JP2008226857A (ja) * | 2008-05-16 | 2008-09-25 | Matsushita Electric Ind Co Ltd | プラズマ処理方法及び装置 |
JP2011114081A (ja) * | 2009-11-25 | 2011-06-09 | Sharp Corp | 気相成長装置 |
WO2012008440A1 (ja) * | 2010-07-12 | 2012-01-19 | 株式会社アルバック | 成膜装置 |
JP5542584B2 (ja) * | 2010-08-27 | 2014-07-09 | 株式会社ニューフレアテクノロジー | 成膜装置および成膜方法 |
JP2013122066A (ja) | 2011-12-09 | 2013-06-20 | Cornes Technologies Ltd | マイクロ波プラズマ処理装置 |
JP2013121885A (ja) | 2011-12-09 | 2013-06-20 | Cornes Technologies Ltd | マイクロ波プラズマ処理装置 |
JP2013122067A (ja) | 2011-12-09 | 2013-06-20 | Cornes Technologies Ltd | マイクロ波プラズマ処理装置 |
JP6065762B2 (ja) | 2013-06-21 | 2017-01-25 | 株式会社デンソー | 炭化珪素半導体成膜装置およびそれを用いた成膜方法 |
JP2016050164A (ja) | 2014-09-02 | 2016-04-11 | 昭和電工株式会社 | SiC化学気相成長装置 |
-
2016
- 2016-03-01 JP JP2016039270A patent/JP6664993B2/ja active Active
-
2017
- 2017-02-27 WO PCT/JP2017/007292 patent/WO2017150400A1/ja active Application Filing
- 2017-02-27 CN CN201780012924.5A patent/CN109075038B/zh active Active
- 2017-02-27 KR KR1020187028294A patent/KR102211543B1/ko active IP Right Grant
- 2017-02-27 DE DE112017001127.2T patent/DE112017001127B4/de active Active
- 2017-03-01 TW TW106106581A patent/TWI630282B/zh active
-
2018
- 2018-08-31 US US16/118,734 patent/US10896831B2/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0292896A (ja) * | 1988-09-28 | 1990-04-03 | Toshiba Corp | Si単結晶の製造方法 |
JPH02205316A (ja) * | 1989-02-03 | 1990-08-15 | Sumitomo Metal Ind Ltd | エピタキシャル気相成長装置 |
JPH02308534A (ja) * | 1989-05-24 | 1990-12-21 | Toshiba Corp | 半導体基板の薄膜形成装置 |
JPH0383897A (ja) * | 1989-08-24 | 1991-04-09 | Mitsubishi Electric Corp | 気相成長装置 |
JPH0722323A (ja) * | 1993-06-30 | 1995-01-24 | Nec Corp | 気相成長装置 |
JP2000144432A (ja) * | 1998-11-04 | 2000-05-26 | Ebara Corp | ガス噴射ヘッド |
JP2000252270A (ja) * | 1999-03-01 | 2000-09-14 | Ebara Corp | ガス噴射ヘッド |
JP2004076076A (ja) * | 2002-08-14 | 2004-03-11 | Konica Minolta Holdings Inc | 大気圧プラズマ処理装置及び大気圧プラズマ処理方法 |
JP2004100001A (ja) * | 2002-09-11 | 2004-04-02 | Air Water Inc | 成膜装置 |
JP2007039750A (ja) * | 2005-08-03 | 2007-02-15 | Furukawa Co Ltd | 原子層堆積装置 |
JP2010062383A (ja) * | 2008-09-04 | 2010-03-18 | Sharp Corp | 気相成長装置及び気相成長方法 |
WO2010058813A1 (ja) * | 2008-11-21 | 2010-05-27 | 国立大学法人長岡技術科学大学 | 基板処理方法及び基板処理装置 |
JP2014183297A (ja) * | 2013-03-21 | 2014-09-29 | Tokyo Electron Ltd | プラズマ処理装置及びシャワープレート |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020039809A1 (ja) | 2018-08-24 | 2020-02-27 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
JP2020031200A (ja) * | 2018-08-24 | 2020-02-27 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
JP7365761B2 (ja) | 2018-08-24 | 2023-10-20 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
JP7175169B2 (ja) | 2018-11-30 | 2022-11-18 | 昭和電工株式会社 | SiCエピタキシャル成長装置 |
CN111261502A (zh) * | 2018-11-30 | 2020-06-09 | 昭和电工株式会社 | SiC外延生长装置 |
CN111261502B (zh) * | 2018-11-30 | 2023-09-15 | 株式会社力森诺科 | SiC外延生长装置 |
JP2020088339A (ja) * | 2018-11-30 | 2020-06-04 | 昭和電工株式会社 | SiCエピタキシャル成長装置 |
CN111261548A (zh) * | 2018-12-03 | 2020-06-09 | 昭和电工株式会社 | SiC化学气相沉积装置和SiC外延晶片的制造方法 |
JP2020092113A (ja) * | 2018-12-03 | 2020-06-11 | 昭和電工株式会社 | SiC化学気相成長装置及びSiCエピタキシャルウェハの製造方法 |
JP7242990B2 (ja) | 2018-12-03 | 2023-03-22 | 株式会社レゾナック | SiC化学気相成長装置及びSiCエピタキシャルウェハの製造方法 |
CN111261548B (zh) * | 2018-12-03 | 2024-02-06 | 株式会社力森诺科 | SiC化学气相沉积装置和SiC外延晶片的制造方法 |
JP2020141112A (ja) * | 2019-03-01 | 2020-09-03 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
WO2020179272A1 (ja) * | 2019-03-01 | 2020-09-10 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
JP7152970B2 (ja) | 2019-03-01 | 2022-10-13 | 株式会社ニューフレアテクノロジー | 気相成長装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2017150400A1 (ja) | 2017-09-08 |
JP6664993B2 (ja) | 2020-03-13 |
TWI630282B (zh) | 2018-07-21 |
KR20180128919A (ko) | 2018-12-04 |
DE112017001127T5 (de) | 2018-11-15 |
CN109075038A (zh) | 2018-12-21 |
US10896831B2 (en) | 2021-01-19 |
DE112017001127B4 (de) | 2024-06-06 |
CN109075038B (zh) | 2023-08-15 |
KR102211543B1 (ko) | 2021-02-02 |
US20180374721A1 (en) | 2018-12-27 |
TW201739952A (zh) | 2017-11-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2017150400A1 (ja) | 成膜装置 | |
US20210032754A1 (en) | Showerhead assembly and components thereof | |
US20070266932A1 (en) | Vapor phase growth apparatus and method for vapor phase growth | |
US9427762B2 (en) | Gas injector and cover plate assembly for semiconductor equipment | |
JP6376700B2 (ja) | SiC化学気相成長装置 | |
JP6362266B2 (ja) | SiCエピタキシャルウェハの製造方法及びSiCエピタキシャル成長装置 | |
US20170283985A1 (en) | Vapor phase growth apparatus and vapor phase growth method | |
JP2010059520A (ja) | 気相成長装置及び気相成長方法 | |
US20230044440A1 (en) | Film forming apparatus and plate | |
JP2016050164A (ja) | SiC化学気相成長装置 | |
WO2012132575A1 (ja) | シャワープレート、気相成長装置及び気相成長方法 | |
JP4601701B2 (ja) | 気相成長装置及びガス供給方法 | |
US11692266B2 (en) | SiC chemical vapor deposition apparatus | |
JP2010238831A (ja) | 気相成長装置及び気相成長方法 | |
JP2011114081A (ja) | 気相成長装置 | |
JP4758385B2 (ja) | 気相成長装置及び気相成長方法 | |
JP2020088339A (ja) | SiCエピタキシャル成長装置 | |
JP2013105831A (ja) | 気相成長装置 | |
JP2012084581A (ja) | 気相成長装置 | |
KR100956207B1 (ko) | 화학 기상 증착 장치 | |
JP2013171972A (ja) | 気相成長装置および気相成長方法 | |
KR101297344B1 (ko) | 화학기상증착장치 및 화학기상증착장치의 가스공급유닛 | |
JP2010219116A (ja) | 気相成長装置、ガス供給部材および半導体製造方法 | |
JP2024007511A (ja) | クロスフローを有する複数の基板を処理するための半導体処理装置 | |
JP2007238967A (ja) | 気相成長装置、気相成長方法、基板加熱装置、および基板加熱方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181203 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181203 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200107 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200124 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200219 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6664993 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |