JP2017017238A5 - - Google Patents

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Publication number
JP2017017238A5
JP2017017238A5 JP2015134137A JP2015134137A JP2017017238A5 JP 2017017238 A5 JP2017017238 A5 JP 2017017238A5 JP 2015134137 A JP2015134137 A JP 2015134137A JP 2015134137 A JP2015134137 A JP 2015134137A JP 2017017238 A5 JP2017017238 A5 JP 2017017238A5
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JP
Japan
Prior art keywords
insulating material
layer
semiconductor device
thin film
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015134137A
Other languages
English (en)
Japanese (ja)
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JP2017017238A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015134137A priority Critical patent/JP2017017238A/ja
Priority claimed from JP2015134137A external-priority patent/JP2017017238A/ja
Priority to KR1020160082516A priority patent/KR102593380B1/ko
Priority to US15/198,785 priority patent/US10256196B2/en
Priority to TW105120901A priority patent/TWI771273B/zh
Priority to CN202010360169.3A priority patent/CN111524863A/zh
Priority to CN201610515520.5A priority patent/CN106328607B/zh
Publication of JP2017017238A publication Critical patent/JP2017017238A/ja
Publication of JP2017017238A5 publication Critical patent/JP2017017238A5/ja
Priority to KR1020230140340A priority patent/KR102855741B1/ko
Pending legal-status Critical Current

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JP2015134137A 2015-07-03 2015-07-03 半導体装置及びその製造方法 Pending JP2017017238A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015134137A JP2017017238A (ja) 2015-07-03 2015-07-03 半導体装置及びその製造方法
KR1020160082516A KR102593380B1 (ko) 2015-07-03 2016-06-30 반도체장치 및 그 제조방법
US15/198,785 US10256196B2 (en) 2015-07-03 2016-06-30 Semiconductor device and method for manufacturing same
TW105120901A TWI771273B (zh) 2015-07-03 2016-07-01 半導體裝置及其製造方法
CN202010360169.3A CN111524863A (zh) 2015-07-03 2016-07-01 半导体器件及其制造方法
CN201610515520.5A CN106328607B (zh) 2015-07-03 2016-07-01 半导体器件及其制造方法
KR1020230140340A KR102855741B1 (ko) 2015-07-03 2023-10-19 반도체장치 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015134137A JP2017017238A (ja) 2015-07-03 2015-07-03 半導体装置及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020012999A Division JP2020065088A (ja) 2020-01-29 2020-01-29 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2017017238A JP2017017238A (ja) 2017-01-19
JP2017017238A5 true JP2017017238A5 (enExample) 2018-06-14

Family

ID=57683221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015134137A Pending JP2017017238A (ja) 2015-07-03 2015-07-03 半導体装置及びその製造方法

Country Status (5)

Country Link
US (1) US10256196B2 (enExample)
JP (1) JP2017017238A (enExample)
KR (2) KR102593380B1 (enExample)
CN (2) CN106328607B (enExample)
TW (1) TWI771273B (enExample)

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EP3373714B1 (en) * 2017-03-08 2023-08-23 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Hybrid component carrier and method for manufacturing the same
JP6988360B2 (ja) * 2017-10-18 2022-01-05 昭和電工マテリアルズ株式会社 半導体装置の製造方法及び半導体装置
JP6816046B2 (ja) * 2018-02-06 2021-01-20 アオイ電子株式会社 半導体装置の製造方法
US11183474B2 (en) 2019-11-04 2021-11-23 Advanced Semiconductor Engineering, Inc. Electronic device package and method for manufacturing the same
US12046523B2 (en) * 2019-11-12 2024-07-23 Advanced Semiconductor Engineering, Inc. Semiconductor device packages and methods of manufacturing the same
CN113921473B (zh) * 2020-07-10 2024-11-08 江苏长电科技股份有限公司 封装结构和封装结构制造方法
KR20220029987A (ko) * 2020-09-02 2022-03-10 에스케이하이닉스 주식회사 3차원 구조의 반도체 장치
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