JP2017017238A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2017017238A
JP2017017238A JP2015134137A JP2015134137A JP2017017238A JP 2017017238 A JP2017017238 A JP 2017017238A JP 2015134137 A JP2015134137 A JP 2015134137A JP 2015134137 A JP2015134137 A JP 2015134137A JP 2017017238 A JP2017017238 A JP 2017017238A
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Japan
Prior art keywords
insulating material
layer
semiconductor device
thin film
metal thin
Prior art date
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Pending
Application number
JP2015134137A
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English (en)
Japanese (ja)
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JP2017017238A5 (enExample
Inventor
仁則 石堂
Kiminori Ishido
仁則 石堂
道昭 玉川
Michiaki Tamagawa
道昭 玉川
俊寛 岩崎
Toshihiro Iwasaki
俊寛 岩崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amkor Technology Japan Inc
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J Devices Corp
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Filing date
Publication date
Application filed by J Devices Corp filed Critical J Devices Corp
Priority to JP2015134137A priority Critical patent/JP2017017238A/ja
Priority to KR1020160082516A priority patent/KR102593380B1/ko
Priority to US15/198,785 priority patent/US10256196B2/en
Priority to TW105120901A priority patent/TWI771273B/zh
Priority to CN202010360169.3A priority patent/CN111524863A/zh
Priority to CN201610515520.5A priority patent/CN106328607B/zh
Publication of JP2017017238A publication Critical patent/JP2017017238A/ja
Publication of JP2017017238A5 publication Critical patent/JP2017017238A5/ja
Priority to KR1020230140340A priority patent/KR102855741B1/ko
Pending legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2015134137A 2015-07-03 2015-07-03 半導体装置及びその製造方法 Pending JP2017017238A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015134137A JP2017017238A (ja) 2015-07-03 2015-07-03 半導体装置及びその製造方法
KR1020160082516A KR102593380B1 (ko) 2015-07-03 2016-06-30 반도체장치 및 그 제조방법
US15/198,785 US10256196B2 (en) 2015-07-03 2016-06-30 Semiconductor device and method for manufacturing same
TW105120901A TWI771273B (zh) 2015-07-03 2016-07-01 半導體裝置及其製造方法
CN202010360169.3A CN111524863A (zh) 2015-07-03 2016-07-01 半导体器件及其制造方法
CN201610515520.5A CN106328607B (zh) 2015-07-03 2016-07-01 半导体器件及其制造方法
KR1020230140340A KR102855741B1 (ko) 2015-07-03 2023-10-19 반도체장치 및 그 제조방법

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JP2015134137A JP2017017238A (ja) 2015-07-03 2015-07-03 半導体装置及びその製造方法

Related Child Applications (1)

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JP2020012999A Division JP2020065088A (ja) 2020-01-29 2020-01-29 半導体装置及びその製造方法

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JP2017017238A true JP2017017238A (ja) 2017-01-19
JP2017017238A5 JP2017017238A5 (enExample) 2018-06-14

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US (1) US10256196B2 (enExample)
JP (1) JP2017017238A (enExample)
KR (2) KR102593380B1 (enExample)
CN (2) CN106328607B (enExample)
TW (1) TWI771273B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018137341A (ja) * 2017-02-22 2018-08-30 株式会社ジェイデバイス 電子デバイス及びその製造方法
JP2019075492A (ja) * 2017-10-18 2019-05-16 日立化成株式会社 半導体装置の製造方法及び半導体装置
WO2019155959A1 (ja) * 2018-02-06 2019-08-15 アオイ電子株式会社 半導体装置の製造方法

Families Citing this family (7)

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