JP2016131246A - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
JP2016131246A
JP2016131246A JP2016004551A JP2016004551A JP2016131246A JP 2016131246 A JP2016131246 A JP 2016131246A JP 2016004551 A JP2016004551 A JP 2016004551A JP 2016004551 A JP2016004551 A JP 2016004551A JP 2016131246 A JP2016131246 A JP 2016131246A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
conductive particles
substrate
hole
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016004551A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016131246A5 (enExample
Inventor
誠一郎 篠原
Seiichiro Shinohara
誠一郎 篠原
恭志 阿久津
Yasushi Akutsu
恭志 阿久津
朋之 石松
Tomoyuki Ishimatsu
朋之 石松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of JP2016131246A publication Critical patent/JP2016131246A/ja
Publication of JP2016131246A5 publication Critical patent/JP2016131246A5/ja
Pending legal-status Critical Current

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Classifications

    • H10W90/00—
    • H10W72/30—
    • H10W72/012—
    • H10W72/20—
    • H10W72/851—
    • H10W72/01204—
    • H10W72/01212—
    • H10W72/013—
    • H10W72/01304—
    • H10W72/01361—
    • H10W72/072—
    • H10W72/07223—
    • H10W72/07253—
    • H10W72/07254—
    • H10W72/073—
    • H10W72/07323—
    • H10W72/07332—
    • H10W72/07338—
    • H10W72/222—
    • H10W72/224—
    • H10W72/225—
    • H10W72/227—
    • H10W72/234—
    • H10W72/244—
    • H10W72/247—
    • H10W72/252—
    • H10W72/253—
    • H10W72/255—
    • H10W72/261—
    • H10W72/322—
    • H10W72/325—
    • H10W72/353—
    • H10W72/354—
    • H10W74/15—
    • H10W90/26—
    • H10W90/288—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W99/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
JP2016004551A 2015-01-13 2016-01-13 多層基板 Pending JP2016131246A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015004596 2015-01-13
JP2015004596 2015-01-13

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020161100A Division JP7207383B2 (ja) 2015-01-13 2020-09-25 多層基板

Publications (2)

Publication Number Publication Date
JP2016131246A true JP2016131246A (ja) 2016-07-21
JP2016131246A5 JP2016131246A5 (enExample) 2019-02-21

Family

ID=56405861

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016004551A Pending JP2016131246A (ja) 2015-01-13 2016-01-13 多層基板
JP2020161100A Active JP7207383B2 (ja) 2015-01-13 2020-09-25 多層基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020161100A Active JP7207383B2 (ja) 2015-01-13 2020-09-25 多層基板

Country Status (6)

Country Link
US (1) US11901325B2 (enExample)
JP (2) JP2016131246A (enExample)
KR (1) KR102094725B1 (enExample)
CN (1) CN107210287B (enExample)
TW (2) TWI806814B (enExample)
WO (1) WO2016114320A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806814B (zh) * 2015-01-13 2023-07-01 日商迪睿合股份有限公司 多層基板
WO2017149977A1 (ja) * 2016-02-29 2017-09-08 パナソニックＩｐマネジメント株式会社 非水電解質二次電池
JP7125547B2 (ja) * 2018-12-29 2022-08-24 深南電路股▲ふん▼有限公司 多様に組み立て可能なプリント基板及びその製造方法
US20230106035A1 (en) * 2020-01-31 2023-04-06 Mitsui Chemicals, Inc. Anisotropic conductive sheet, electrical inspection device, and electrical inspection method
TWI742991B (zh) * 2021-01-20 2021-10-11 啟耀光電股份有限公司 基板結構與電子裝置
CN118866723A (zh) * 2024-06-24 2024-10-29 江苏博敏电子有限公司 一种使用异向导电膜进行芯片堆叠互连的工艺

Citations (6)

* Cited by examiner, † Cited by third party
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JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JPH11241054A (ja) * 1997-10-28 1999-09-07 Sony Chem Corp 異方導電性接着剤および接着用膜
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2010251547A (ja) * 2009-04-16 2010-11-04 Elpida Memory Inc 半導体装置及びその製造方法

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Publication number Priority date Publication date Assignee Title
JPH0334064Y2 (enExample) 1985-08-21 1991-07-18
JP2748713B2 (ja) 1991-03-29 1998-05-13 日立化成工業株式会社 接続部材
JPH05182973A (ja) 1992-01-07 1993-07-23 Fujitsu Ltd 半導体装置の製造方法
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
JPH08330736A (ja) 1995-06-01 1996-12-13 Toray Ind Inc 多層基板およびその製造方法
KR100539060B1 (ko) * 1997-10-28 2007-04-25 소니 케미카루 가부시키가이샤 이방도전성접착제및접착용막
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
JP2001237365A (ja) 2000-02-23 2001-08-31 Seiko Epson Corp 接続用端子の接合方法、半導体装置の製造方法および半導体装置
TW554191B (en) * 2000-12-16 2003-09-21 Au Optronics Corp Laminating structure and its forming method
JPWO2003003798A1 (ja) 2001-06-29 2004-10-21 東レエンジニアリング株式会社 異方導電性接着剤を用いた接合方法
JP2003282819A (ja) 2002-03-27 2003-10-03 Seiko Epson Corp 半導体装置の製造方法
JP4340517B2 (ja) * 2003-10-30 2009-10-07 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP2006310082A (ja) 2005-04-28 2006-11-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
WO2007036994A1 (ja) 2005-09-28 2007-04-05 Spansion Llc 半導体装置およびその製造方法並びにフィルムの製造方法
DE102006001600B3 (de) * 2006-01-11 2007-08-02 Infineon Technologies Ag Halbleiterbauelement mit Flipchipkontakten und Verfahren zur Herstellung desselben
KR100777255B1 (ko) * 2006-04-18 2007-11-20 중앙대학교 산학협력단 이방성 도전 필름 및 이를 이용한 전자부품의 실장방법
JP2006339160A (ja) 2006-06-02 2006-12-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
JP5010990B2 (ja) * 2007-06-06 2012-08-29 ソニーケミカル＆インフォメーションデバイス株式会社 接続方法
JP5018270B2 (ja) 2007-06-22 2012-09-05 パナソニック株式会社 半導体積層体とそれを用いた半導体装置
CN101849322B (zh) * 2007-09-20 2012-07-04 索尼化学&信息部件株式会社 各向异性导电膜及其制造方法、以及使用该各向异性导电膜的接合体
JP5622137B2 (ja) * 2007-10-29 2014-11-12 デクセリアルズ株式会社 電気的接続体及びその製造方法
JP5212118B2 (ja) * 2009-01-05 2013-06-19 日立金属株式会社 半導体装置およびその製造方法
JP2010232492A (ja) * 2009-03-27 2010-10-14 Dainippon Printing Co Ltd 多層プリント配線板組合せ体およびその製造方法
JP2010272737A (ja) 2009-05-22 2010-12-02 Elpida Memory Inc 半導体装置の製造方法
KR101219139B1 (ko) * 2009-12-24 2013-01-07 제일모직주식회사 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체
CN103155050B (zh) * 2010-10-08 2017-05-03 第一毛织株式会社 各向异性导电膜
US8552567B2 (en) * 2011-07-27 2013-10-08 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
KR101941995B1 (ko) * 2012-07-11 2019-01-24 에스케이하이닉스 주식회사 반도체 장치 및 이를 갖는 적층 반도체 패키지
KR102254104B1 (ko) * 2014-09-29 2021-05-20 삼성전자주식회사 반도체 패키지
TWI806814B (zh) * 2015-01-13 2023-07-01 日商迪睿合股份有限公司 多層基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JPH11241054A (ja) * 1997-10-28 1999-09-07 Sony Chem Corp 異方導電性接着剤および接着用膜
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2010251547A (ja) * 2009-04-16 2010-11-04 Elpida Memory Inc 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2020202410A (ja) 2020-12-17
KR102094725B1 (ko) 2020-03-31
JP7207383B2 (ja) 2023-01-18
US20170358549A1 (en) 2017-12-14
US11901325B2 (en) 2024-02-13
CN107210287A (zh) 2017-09-26
WO2016114320A1 (ja) 2016-07-21
TW201639116A (zh) 2016-11-01
TWI809284B (zh) 2023-07-21
KR20170091686A (ko) 2017-08-09
TW202038426A (zh) 2020-10-16
CN107210287B (zh) 2020-04-14
TWI806814B (zh) 2023-07-01

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