WO2016114320A1 - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
WO2016114320A1
WO2016114320A1 PCT/JP2016/050877 JP2016050877W WO2016114320A1 WO 2016114320 A1 WO2016114320 A1 WO 2016114320A1 JP 2016050877 W JP2016050877 W JP 2016050877W WO 2016114320 A1 WO2016114320 A1 WO 2016114320A1
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WIPO (PCT)
Prior art keywords
semiconductor substrate
conductive particles
substrate
holes
hole
Prior art date
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Ceased
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PCT/JP2016/050877
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English (en)
French (fr)
Japanese (ja)
Inventor
誠一郎 篠原
恭志 阿久津
朋之 石松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to KR1020177017942A priority Critical patent/KR102094725B1/ko
Priority to US15/543,113 priority patent/US11901325B2/en
Priority to CN201680004716.6A priority patent/CN107210287B/zh
Publication of WO2016114320A1 publication Critical patent/WO2016114320A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Definitions

  • the present invention relates to a multilayer substrate.
  • multilayer substrates are used in which semiconductor substrates in which electronic components such as ICs are incorporated are stacked.
  • a through electrode having bumps is formed on each semiconductor substrate, and through electrodes of opposing semiconductor substrates are connected by bump reflow (Patent Document 1) or between opposing semiconductor substrates.
  • Patent Document 2 there is a method (Patent Document 2) in which an anisotropic conductive film in which conductive particles are dispersed is sandwiched in an insulating adhesive layer, and through electrodes are connected by heating and pressing.
  • the through electrode 6 generally includes (a) a (b) through hole 4h formed in the semiconductor substrate 3, and (c) a plated film 4a formed by electroless plating.
  • a through hole is formed by patterning to leave the plating film 4a inside the through hole 4h.
  • D Further, a metal 5 is filled in the through hole by providing a mask in a predetermined pattern and performing electrolytic plating. It is formed by.
  • the method of connecting opposite through electrodes using anisotropic conductive films and laminating semiconductor substrates can simplify the manufacturing process of the multilayer substrate to some extent, but the anisotropic conductive films are insulated. Because conductive particles are randomly dispersed in the adhesive layer, the conductive characteristics of the anisotropic conductive film may not be sufficiently sandwiched between the through electrodes of the semiconductor substrate facing each other, resulting in variation in conduction characteristics. There's a problem. On the other hand, since there are many conductive particles that do not contribute to the connection of the through electrodes between the opposing semiconductor substrates, there is a problem in that unnecessary conductive particles are expensive.
  • an object of the present invention is to provide a multilayer substrate having excellent conduction characteristics by laminating a semiconductor substrate using an anisotropic conductive film at a low cost with a simple manufacturing process.
  • the present inventor in manufacturing a multilayer substrate by laminating a semiconductor substrate using an anisotropic conductive film, in the insulating adhesive of the anisotropic conductive film with respect to the through-hole formed in the previous stage of the formation of the through electrode
  • the opposing through holes can be reliably connected with the conductive particles. It has been found that the number of conductive particles that do not contribute can be reduced, the manufacturing process of the multilayer substrate can be significantly simplified, and the manufacturing cost of the multilayer substrate can be reduced, and the present invention has been conceived.
  • the present invention is a multilayer substrate in which a semiconductor substrate having a through hole is laminated, and in the plan view of the multilayer substrate, conductive particles are selectively present at positions where the through holes are opposed to each other,
  • a multilayer substrate having a connection structure in which opposing through holes are connected by conductive particles, and semiconductor substrates on which the through holes are formed are bonded to each other with an insulating adhesive.
  • the multilayer substrate is a multilayer substrate in which a first semiconductor substrate having a through hole and a second semiconductor substrate having a through hole are laminated, The through hole of the first semiconductor substrate and the through hole of the second semiconductor substrate are opposed to each other and connected by conductive particles selectively disposed between them.
  • the present invention also relates to a method for manufacturing a multilayer substrate in which through-holes formed in a semiconductor substrate are opposed to each other, wherein the conductive particles correspond to the positions in a plan view of the multilayer substrate where the through-holes are opposed to each other.
  • An anisotropic conductive film selectively disposed on the insulating adhesive layer is sandwiched between semiconductor substrates having through holes, and the anisotropic conductive film is heated and pressed to anisotropically conduct these semiconductor substrates.
  • a method for manufacturing a multi-layer substrate that is electrically connected.
  • this multilayer substrate a method of manufacturing a multilayer substrate in which a first semiconductor substrate having a through hole and a second semiconductor substrate having a through hole are joined with the through holes facing each other.
  • An anisotropic conductive film having conductive particles selectively disposed on an insulating adhesive layer corresponding to the arrangement of through holes is sandwiched between a first semiconductor substrate and a second semiconductor substrate, and the anisotropic conductive film
  • a method of manufacturing a multi-layer substrate in which a first semiconductor substrate and a second semiconductor substrate are anisotropically conductively connected by heating and pressing is provided.
  • the present invention provides an anisotropic conductive film used in the above-described method for producing a multilayer substrate, wherein conductive particles are selectively arranged on the insulating adhesive layer in correspondence with the arrangement of through holes connected by the anisotropic conductive film.
  • An anisotropic conductive film is provided.
  • an anisotropic conductive film useful for the above-mentioned method for producing a multilayer substrate, an anisotropic conductive film including an insulating adhesive layer and conductive particles arranged in the insulating adhesive layer, two or more An anisotropic conductive film in which a plurality of conductive particles having different sizes or types is contained in the conductive particle unit is provided.
  • the conduction characteristics are stabilized because the through holes of the semiconductor substrate are reliably connected by the conductive particles.
  • through holes are connected to each other with conductive particles without filling the through holes with metal in the semiconductor substrate, and conductive particles that do not contribute to the connection are reduced between the semiconductor substrates. Therefore, the manufacturing cost of the multilayer substrate is remarkably suppressed. For the same reason, it is effective in reducing the number of instrumentation steps.
  • the multilayer substrate of the present invention can be manufactured in a simple process by using a specific anisotropic conductive film.
  • the multilayer substrate of the present invention can be provided at a much lower price.
  • FIG. 1 is a cross-sectional view of a multilayer substrate 1A according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a multilayer substrate 1B according to an embodiment of the present invention.
  • FIG. 3A is an explanatory diagram of the manufacturing process of the multilayer substrate 1B.
  • FIG. 3B is an explanatory diagram of the manufacturing process of the multilayer substrate 1B.
  • FIG. 3C is an explanatory diagram of the manufacturing process of the multilayer substrate 1B.
  • FIG. 3D is an explanatory diagram of the manufacturing process of the multilayer substrate 1B.
  • FIG. 4A is an explanatory diagram of arrangement of conductive particles with respect to a through hole before anisotropic conductive connection.
  • FIG. 4A is an explanatory diagram of arrangement of conductive particles with respect to a through hole before anisotropic conductive connection.
  • FIG. 4B is an explanatory diagram of the arrangement of the conductive particles with respect to the through hole after the anisotropic conductive connection.
  • FIG. 5A is an explanatory diagram of arrangement of conductive particles with respect to a through hole before anisotropic conductive connection.
  • FIG. 5B is an explanatory diagram of the arrangement of the conductive particles with respect to the through hole after the anisotropic conductive connection.
  • FIG. 6A is an explanatory diagram of the arrangement of the conductive particles with respect to the through hole before the anisotropic conductive connection.
  • FIG. 6B is an explanatory diagram of the arrangement of the conductive particles with respect to the through hole after the anisotropic conductive connection.
  • FIG. 7A is an explanatory diagram of the arrangement of the conductive particles with respect to the through hole before the anisotropic conductive connection.
  • FIG. 7B is an explanatory diagram of the arrangement of the conductive particles with respect to the through hole after the anisotropic conductive connection.
  • FIG. 8 is an explanatory view of the arrangement of the conductive particles with respect to the through hole before the anisotropic conductive connection.
  • FIG. 9 is a cross-sectional view of a multilayer substrate 1C according to an embodiment of the present invention.
  • FIG. 10 is an arrangement diagram of electrodes and conductive particles on the surface of the semiconductor substrate used for the production of the multilayer substrate of Example 1.
  • FIG. 11 is an arrangement diagram of electrodes and conductive particles on the surface of the semiconductor substrate used for manufacturing the multilayer substrate of Example 4.
  • FIG. 12 is an arrangement diagram of electrodes and conductive particles on the surface of the semiconductor substrate used in the production of the multilayer substrate of Example 5.
  • FIG. 13 is an arrangement diagram of electrodes and conductive particles on the surface of the semiconductor substrate used for manufacturing the multilayer substrate of Example 6.
  • FIG. 14 is a process explanatory diagram of the method for manufacturing the through electrode.
  • FIG. 1 is a cross-sectional view of a multilayer substrate 1A according to an embodiment of the present invention.
  • the multi-layer substrate 1A is formed by stacking three layers of semiconductor substrates 3A, 3B, and 3C on a wiring substrate 2, and each of the semiconductor substrates 3A, 3B, and 3C is a semiconductor wafer on which semiconductor components such as ICs are formed. is there.
  • a through hole 4X is formed in the wiring board 2, and through holes 4A, 4B, and 4C are formed in each of the semiconductor substrates 3A, 3B, and 3C, and a portion where the through hole 4X is exposed on the surface of the wiring board 2, Electrode pads 9 are formed in portions where the through holes 4A, 4B, 4C are exposed on the surface of the semiconductor substrate.
  • semiconductor chips may be used as the semiconductor substrates 3A, 3B, 3C.
  • the number of stacked semiconductor substrates constituting the multilayer substrate is not particularly limited.
  • Through hole 4A of first semiconductor substrate 3A and through hole 4B of second semiconductor substrate 3B are opposed to multilayer substrate 1A, and are electrically connected by conductive particles 11 selectively disposed therebetween.
  • that the conductive particles 11 are selectively disposed between the through holes 4A and 4B is that the conductive particles 11 are present on the opposing surface of the through holes 4A and 4B or in the vicinity thereof even when seen in a plan view. It means that one or more conductive particles 11 are captured in the through holes 4A, 4B. Arrangement so that one to a dozen or more are captured is preferable in terms of both cost and performance.
  • a plurality of conductive particles may overlap in the film thickness direction.
  • size, kind, etc. of the conductive particle may differ.
  • the accuracy of alignment between the semiconductor substrates 3A and 3B and the conductive particles 11 can be relaxed.
  • the opposing surfaces of the first semiconductor substrate 3A and the second semiconductor substrate 3B are bonded to each other with an insulating adhesive 12.
  • the insulating adhesive 12 is formed from an insulating adhesive layer of an anisotropic conductive film described later.
  • the through hole 4B of the second semiconductor substrate 3B connected to the through hole 4A of the first semiconductor substrate 3A is also opposed to the through hole 4C of the third semiconductor substrate 3C on the third semiconductor substrate 3C side.
  • Through holes 4B of the second semiconductor substrate 3B and the through holes 4C of the third semiconductor substrate 3C are electrically connected by the conductive particles 11 selectively disposed therebetween.
  • the opposing surfaces of the second semiconductor substrate 3B and the third semiconductor substrate 3C are also bonded to each other by the insulating adhesive 12. Further, the through holes 4X of the wiring board 2 and the through holes 4A of the first semiconductor substrate 3A are similarly connected by the conductive particles 11.
  • the multilayer substrate 1A has a connection structure in which the through holes 4X of the wiring substrate 2 and the through holes 4A, 4B, and 4C of the three-layer semiconductor substrate are linearly connected in the stacking direction of the multilayer substrate. According to the connection structure in which the through-holes in each layer are connected in a straight line, the electric transmission path is shortened, so that the transmission speed can be improved.
  • 1 A of multilayer substrates are manufactured by connecting each layer which comprises a multilayer substrate using the anisotropic conductive film of this invention in which conductive particles have specific arrangement
  • the number of such conductive particles 11 is as follows: The total number of conductive particles existing between the first semiconductor substrate and the second semiconductor substrate is preferably 5% or less, more preferably 0.5% or less, and particularly almost all of the conductive particles 11 are captured by the through holes 4A and 4B. To be. The same applies to other semiconductor substrates constituting the multilayer substrate 1A.
  • the wiring substrate 2 constituting the multilayer substrate 1A a glass epoxy substrate such as FR4 can be used.
  • the wiring substrate 2 an IC chip or a silicon wafer for IC formation may be used.
  • the wiring board 2 is appropriately selected according to the use of the multilayer board 1A.
  • solder balls 8 may be provided on the electrode portions of the wiring board 2 as necessary.
  • the semiconductor substrates 3A, 3B, and 3C are not particularly limited as long as they have through holes 4A, 4B, and 4C.
  • a general semiconductor material such as silicon can be used.
  • the specifications of the through holes 4A, 4B, 4C can be set as appropriate.
  • the through holes 4A, 4B, and 4C include the electrode pads 9.
  • the through holes 4A, 4B, and 4C of the semiconductor substrates 3A, 3B, and 3C are linearly connected across at least two layers of the semiconductor substrate in the thickness direction of the multilayer substrate 1A.
  • the through holes 4A, 4B, and 4C are arranged so as to be connected linearly across the front and back of the multilayer substrate 1A.
  • the multilayer substrate 1B shown in FIG. 2 has a connection structure in which the through holes 4X, 4A, 4B, and 4C of each layer are connected in a straight line, and has a heat sink 7 for heat dissipation connected to the through hole 4C in the outermost layer. . Therefore, the multilayer substrate 1B can efficiently dissipate the heat released from the electronic components such as the IC formed on the wiring substrate 2 and the semiconductor substrates 3A, 3B, and 3C by the heat sink 7.
  • ⁇ Multilayer substrate manufacturing method> As a method for manufacturing a multilayer substrate of the present invention, for example, in the case of the multilayer substrate 1B of FIG. 2, first, as shown in FIG. 3A, a wiring substrate 2 having a through hole 4X and a semiconductor substrate 3A having a through hole 4A The anisotropic conductive film 10A of the present invention in which the conductive particles 11 are selectively arranged on the insulating adhesive layer 12 corresponding to the arrangement of the through holes 4X and 4A to be connected is sandwiched between the anisotropic conductive films. By heating and pressing 10A, the wiring substrate 2 and the first semiconductor substrate 3A are anisotropically conductively connected to obtain a two-layer connection structure shown in FIG. 3B.
  • the wiring substrate 2 and the anisotropic conductive film 10A are aligned and overlapped so that the through holes 4X to be connected and the conductive particles 11 are aligned, and the first semiconductor substrate 3A is similarly positioned. These are superposed and superposed and heated and pressed to make anisotropic conductive connections.
  • the conductive particles corresponding to the through holes of the anisotropic conductive film (the conductive particles constituting the particle groups when the particle groups are formed as described later) and the through holes are connected to the CCD. Or the like, and may be performed by superimposing them.
  • the first semiconductor substrate 3A and the anisotropic conductive film 10B are aligned and overlapped, and the second semiconductor substrate 3B is aligned and stacked thereon, and heated and pressed to change the difference.
  • the conductive connection is made to obtain a three-layer connection structure shown in FIG. 3D.
  • the anisotropic conductive film and the third semiconductor substrate 3C are aligned and superimposed on the second semiconductor substrate 3B, and heated and pressed.
  • the heat sink 7 is connected to the third semiconductor substrate 3C with a heat conductive tape or the like, solder balls 8 are formed on the electrode pads 9 of the wiring substrate 2, and the multilayer substrate 1B is obtained by a conventional method.
  • solder balls 8 may be provided in place of the solder balls 8.
  • an alignment mark having a size of several tens of ⁇ m to several hundreds of ⁇ m is formed on the semiconductor substrate as an example. Alignment is performed.
  • the anisotropic conductive film has conductive particles arranged in a monodisperse or lattice shape, the anisotropic conductive film is not provided with an alignment mark.
  • the anisotropic conductive film used in the present invention is such that the conductive particles 11 are selectively arranged on the insulating adhesive layer 12 corresponding to the arrangement of the through holes to be connected. 11 can be substituted for the alignment mark. It is preferable to provide an alignment mark on the anisotropic conductive film including the arrangement of the conductive particles.
  • the conductive particles 11 are selectively disposed on the insulating adhesive layer 12 corresponding to the arrangement of the through holes to be connected.
  • An alignment mark is formed.
  • the alignment mark is preferably formed by arranging conductive particles. Thereby, the alignment mark can be detected clearly, and the addition of a new process for attaching the alignment mark to the anisotropic conductive film becomes unnecessary.
  • the alignment mark may be formed by partially curing the insulating adhesive layer 12 by laser irradiation or the like. This makes it easy to change the position where the alignment mark is attached.
  • a metal mold having a convex portion corresponding to the arrangement of the conductive particles 11 is subjected to a known processing method such as machining, laser processing, or photolithography on a metal plate.
  • the mold is filled with a curable resin and cured to produce a resin mold in which irregularities are reversed, and conductive particles are placed in the recesses of the resin mold, and an insulating adhesive layer forming composition is formed thereon.
  • the product can be filled, cured, and removed from the mold.
  • a member having through holes formed in a predetermined arrangement is provided on the insulating adhesive layer forming composition layer, and from there
  • the conductive particles 11 may be supplied and passed through the through holes.
  • the conductive particles 11 used in the anisotropic conductive film 10 can be appropriately selected from those used in known anisotropic conductive films. Examples thereof include metal particles such as solder, nickel, cobalt, silver, copper, gold, and palladium, and metal-coated resin particles.
  • the metal coating of the metal-coated resin particles can be formed using a known metal film forming method such as an electroless plating method or a sputtering method. The metal coating is not particularly limited as long as it is formed on the surface of the core resin material.
  • the core resin material may be formed only from a resin, or may contain conductive fine particles in order to improve conduction reliability.
  • the conductive particles among the particles described above, it is preferable to use solder particles in terms of conduction reliability and cost. On the other hand, it is preferable to use metal-coated resin particles when a reflow step is not necessary in the subsequent step.
  • the metal-coated resin particles are used as the conductive particles. This is because, when used, it becomes possible to lower the temperature of heating and pressurization, and the range of materials for the insulating adhesive is widened.
  • conductive particles two or more kinds of particles having different sizes and types can be used in combination.
  • the arrangement, particle diameter, and type of the conductive particles 11 are appropriately selected according to the opening diameter of the through holes from the viewpoint of the stability of bonding between the through holes.
  • the particle diameter of the conductive particles 11 is usually set to the opening of the through holes 4A and 4X. It is preferable to make it larger than the aperture.
  • the conductive particles 11 are formed of solder particles, as shown in FIGS. 4A and 4B, the plated film 4a of the through hole is easily wetted by the solder particles melted by heating and pressing at the time of anisotropic conductive connection.
  • the particle diameter of the conductive particles 11 be equal to or larger than the opening diameters of the through holes 4A and 4B. Thereby, the conductive particles 11 are pressed by the through holes 4A and 4B, and the through holes 4A and 4B can be reliably connected by the conductive particles 11.
  • the particle group 11 a composed of a plurality of conductive particles 11 may be arranged so as to overlap in the thickness direction of the anisotropic conductive film 10.
  • the electrically-conductive particle 11 can be made to approach to the deeper position of the through holes 4A and 4B.
  • the plurality of conductive particles may be different in size and type.
  • the large-diameter conductive particles 11p are opposed to the through holes 4A and 4B, and the small-diameter conductive particles 11q are used as electrode pads around the large-diameter conductive particles 11p. Place it at the location where it will be captured. In this case, it is preferable that the large-diameter conductive particles 11p are more easily deformed than the small-diameter conductive particles 11q.
  • the large-diameter conductive particles 11p are sandwiched between the through holes 4A and 4B as in the connection structure shown in FIG.
  • the conductive particles 11q can fill the gaps between the through holes 4A, 4B and the large-diameter conductive particles 11p, thereby improving the conductivity between the through holes 4A, 4B and the conductive particles.
  • the particle group 11a by making the conductive particles contact each other, the through holes 4A and 4B and the conductive particles are easily brought into contact with each other.
  • the anisotropic conductive film 10p having the large-diameter conductive particles 11p is temporarily bonded to one semiconductor substrate 3A to have the small-diameter conductive particles 11q.
  • the anisotropic conductive film 10q may be temporarily bonded to the other semiconductor substrate 3B, and then the semiconductor substrates 3A and 3B may be heated and pressurized.
  • the conductive particles may be exposed from the insulating adhesive layer 12, and in particular, the large-diameter conductive particles 11p sandwiched between the through holes 4A and 4B are as follows. It is preferable to expose. By exposing the conductive particles from the insulating adhesive layer, the alignment between the conductive particles and the through holes is facilitated, and since the insulating adhesive layer 12 is not interposed between the conductive particles and the through holes, the conductive particles and Conductivity with the through hole is improved.
  • the exposed surface of the conductive particles of the anisotropic conductive film may be protected by covering with a separator film or the like, and the conductive particles may be exposed when the anisotropic conductive film is used.
  • an insulating resin layer used in a known anisotropic conductive film can be appropriately employed.
  • a photo radical polymerization type resin layer containing an acrylate compound and a photo radical polymerization initiator a heat radical polymerization type resin layer containing an acrylate compound and a heat radical polymerization initiator, a heat containing an epoxy compound and a heat cationic polymerization initiator
  • a cationic polymerization type resin layer, a thermal anion polymerization type resin layer containing an epoxy compound and a thermal anion polymerization initiator, or the like can be used.
  • these resin layers can be polymerized as necessary.
  • the insulating adhesive layer 12 may be formed from a plurality of resin layers.
  • the insulating adhesive layer 12 may have flexibility and adhesiveness to withstand cutting. preferable.
  • an insulating filler such as silica fine particles, alumina, or aluminum hydroxide may be added to the insulating adhesive layer 12.
  • the blending amount of the insulating filler is preferably 3 to 40 parts by mass with respect to 100 parts by mass of the resin forming the insulating adhesive layer.
  • an insulating spacer having a particle diameter that can be filled into the through hole may be added to the insulating adhesive layer 12 as necessary. Thereby, it becomes easy to ensure the uniformity of indentation at the time of anisotropic conductive connection.
  • a part of the resin of the insulating adhesive layer near the conductive particles may be polymerized in advance. This facilitates alignment between the through hole and the conductive particles, and can reduce the risk of occurrence of a short circuit.
  • ⁇ Deformation mode> In the anisotropic conductive film 10 described above, there are almost no conductive particles other than a predetermined position. On the other hand, there may be conductive particles that are not captured by the opposing through holes 4A and 4B even if they exist at predetermined positions. Therefore, after this anisotropic conductive film 10 is used for connecting the semiconductor substrates 3A and 3B, the number of conductive particles 11 not captured by the through holes 4A and 4B between the opposing semiconductor substrates 3A and 3B is as follows. The total number of the conductive particles 11 existing between the semiconductor substrates 3A and 3B facing each other is preferably 5% or less.
  • the multilayer substrate 1C shown in FIG. 9 includes an anisotropic conductive film that connects the through hole 4X of the wiring substrate 2 and the through hole 4A of the first semiconductor substrate 3A in the multilayer substrate 1A shown in FIG.
  • the conductive particles 11 are insulated corresponding to the portions where the through holes of the wiring substrate 2 or each of the semiconductor substrates 3A, 3B, 3C face each other. Those selectively disposed on the adhesive layer 12 are used. As a result, the conductive particles 11 and 11x are present at portions where the through holes 4X, 4A, 4B, and 4C are opposed to each other in a plan view of the multilayer substrate 1C. In other words, the conductive particles that are selectively disposed only with respect to the through holes do not necessarily exist between the opposing through holes.
  • the conductive particles 11 are selectively disposed at positions where the through holes 4A and 4B formed in the semiconductor substrate 3A are opposed to each other, and the through holes of the semiconductor substrate 3A.
  • the conductive particles 11x between the semiconductor substrate 3A and the semiconductor substrate 3B that do not contribute to these connections contribute to the connection between the through hole 4X of the wiring substrate 2 and the through hole 4A of the first semiconductor substrate 3A.
  • the conductive particles are not disposed or substantially not present at positions where the through holes do not face each other.
  • the conductive particles can be arranged as a particle group in which a plurality of conductive particles are close to each other.
  • positioned on one surface May be used to manufacture multilayer substrates.
  • the number of conductive particles constituting each particle group 11a is 3 or more, preferably 10 or more, more preferably 12 or more.
  • the interval between the particle groups 11a is set to be equal to or larger than the conductive particle diameter in order to avoid the occurrence of a short circuit, and is appropriately determined according to the through-hole interval of the semiconductor substrate.
  • the anisotropic conductive films in which the particle groups 11a are arranged on one surface at appropriate intervals are commonly used. By using it, the manufacturing cost of the multilayer substrate can be greatly reduced.
  • the arrangement, particle diameter, and type of the plurality of conductive particles constituting the particle group are appropriately determined from the viewpoint of the stability of bonding between the through holes as described above.
  • a plurality of conductive particles having different sizes or types may be included in one particle group, and the plurality of conductive particles overlap each other in the film thickness direction of the anisotropic conductive film.
  • the plurality of conductive particles may be arranged in the surface direction of the anisotropic conductive film in one particle group, and at least a part of the conductive particles contained in the particle group is exposed from the insulating adhesive layer. It may be.
  • the conductive particles are selectively present at positions where the through holes are opposed in a plan view of the multilayer substrate. And the through-hole which opposes is connected by the electrically-conductive particle arrange
  • the opposing through holes may be connected by the conductive particles 11 that are selectively disposed only between the opposing through holes, and the semiconductor substrate 3A on which the opposing through holes are formed. Conductive particles 11x that do not contribute to the connection of the opposing through holes may be included between 3B and 3C.
  • the multilayer substrate of the present invention can be used for various applications such as high-density semiconductor packages and various semiconductors that require high-density mounting. Further, the multilayer substrate may be cut into a predetermined size and used.
  • Examples 1 to 6 Comparative Example 1
  • Semiconductor substrate The semiconductor substrate 3 constituting the multilayer substrate is a rectangle having an outer shape of 7 mm ⁇ and a thickness of 100 ⁇ m. As shown in FIG. 7, the through-holes 4 having chromium electrode pads are arranged in a peripheral ( ⁇ 30 ⁇ m, 85 ⁇ m pitch). 280 pins). On the semiconductor substrate, a 200 ⁇ m square mark is formed as an alignment mark.
  • Example 1 In this case, in Examples 1, 2, and 3, one conductive particle 11 is disposed per one end electrode of the through hole 4 as shown in FIG. 10, and in Example 4, insulation is performed as shown in FIG.
  • the adhesive layer 12 is divided into two layers, and the conductive particles 11 are arranged on each adhesive layer 12 so that two conductive particles are arranged in the film thickness direction per one place of the end electrode of the through hole 4
  • Example 5 two conductive particles 11 are arranged side by side in the film surface direction as shown in FIG. 12 per one end electrode of the through hole 4, and in Example 6, 1 of the end electrode of the through hole 4 is arranged.
  • Nine conductive particles per place were arranged side by side in the film surface direction as shown in FIG.
  • the alignment mark was formed of conductive particles. In this case, the outline of the arrangement of the conductive particles was made to substantially coincide with the outline of the alignment mark of the semiconductor substrate 3.
  • a nickel plate having a thickness of 2 mm is prepared, and the protrusions (diameter 30 to 45 ⁇ m, height 25 ⁇ m to 40 ⁇ m.
  • the diameter 45 ⁇ m and height 40 ⁇ m) are arranged on the conductive particles described above.
  • a transfer master was produced by patterning so that Also, 50 parts by mass of phenoxy resin (YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.), 30 parts by mass of a microencapsulated imidazole compound latent curing agent (Novacure HX3941HP, Asahi Kasei E-Materials Co., Ltd.), and fumed silica ( A binder mixed with 20 parts by mass of Aerosil RY200 and Nippon Aerosil Co., Ltd. was applied on a PET (polyethylene terephthalate) film so that the dry thickness was 50 ⁇ m, and this binder was superimposed on the above-mentioned transfer master, After drying at 80 ° C. for 5 minutes, a transfer mold having recesses was prepared by irradiating with 1000 mJ light with a high-pressure mercury lamp.
  • phenoxy resin YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.
  • phenoxy resin YP-50, Nippon Steel & Sumikin Chemical Co., Ltd.
  • epoxy resin jER828, Mitsubishi Chemical Corporation
  • cationic curing agent SI-60L, Sanshin Chemical Industry Co., Ltd.
  • the transfer mold having the above-mentioned concave portions was filled with conductive particles, and the above-mentioned insulating resin adhesive layer was covered thereon, and ultraviolet rays were irradiated to cure the curable resin contained in the insulating resin. Then, the insulating resin was peeled from the mold and pushed in such a way that the ends of the conductive particles were aligned with the interface, whereby the anisotropic conductive films of Examples 1 to 3 were manufactured.
  • the thickness of the pressure-sensitive adhesive layer was changed to 25 ⁇ m, the same was peeled off from the mold, and the peeled pieces were laminated at 60 ° C.
  • the insulating adhesive layer had two layers of anisotropic conductive film Manufactured.
  • the thickness of the pressure-sensitive adhesive layer was changed to 15 ⁇ m, and the insulating resin layer (thickness 15 ⁇ m) prepared in the same manner as the pressure-sensitive adhesive layer was peeled off from the mold in the same manner.
  • An anisotropic conductive film was manufactured by laminating on the conductive particle side of the layer.
  • the anisotropic conductive film of Comparative Example 1 in which the conductive particles are randomly dispersed is obtained by stirring the conductive particles and the insulating resin with a rotation / revolution mixer (Sinky Co., Ltd.). Obtained and produced by forming a coating film of the dispersion at 30 ⁇ m.
  • the multilayer substrate of Comparative Example 1 had many through holes that caused poor filling, whereas the multilayer substrates of Examples 1 to 6 all had good filling, and the through holes were connected by conductive particles. I was able to confirm that it was possible. In particular, in Example 6, the allowable width of the positional deviation between the arrangement of the through holes and the conductive particles was large.

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  • Non-Insulated Conductors (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Laminated Bodies (AREA)
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