TWI806814B - 多層基板 - Google Patents
多層基板 Download PDFInfo
- Publication number
- TWI806814B TWI806814B TW105101042A TW105101042A TWI806814B TW I806814 B TWI806814 B TW I806814B TW 105101042 A TW105101042 A TW 105101042A TW 105101042 A TW105101042 A TW 105101042A TW I806814 B TWI806814 B TW I806814B
- Authority
- TW
- Taiwan
- Prior art keywords
- holes
- semiconductor substrate
- conductive particles
- substrate
- semiconductor
- Prior art date
Links
Classifications
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- H10W90/00—
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- H10W72/30—
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- H10W72/012—
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- H10W72/20—
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- H10W72/851—
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- H10W72/01204—
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- H10W72/01212—
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- H10W72/013—
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- H10W72/01304—
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- H10W72/01361—
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- H10W72/072—
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- H10W72/07223—
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- H10W72/07253—
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- H10W72/07254—
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- H10W72/073—
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- H10W72/07323—
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- H10W72/07332—
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- H10W72/07338—
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- H10W72/222—
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- H10W72/227—
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- H10W72/234—
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- H10W72/244—
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- H10W72/354—
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- H10W74/15—
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- H10W90/26—
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- H10W90/288—
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- H10W90/722—
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- H10W90/724—
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- H10W90/732—
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- H10W90/734—
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- H10W99/00—
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesive Tapes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2015-004596 | 2015-01-13 | ||
| JP2015004596 | 2015-01-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201639116A TW201639116A (zh) | 2016-11-01 |
| TWI806814B true TWI806814B (zh) | 2023-07-01 |
Family
ID=56405861
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105101042A TWI806814B (zh) | 2015-01-13 | 2016-01-13 | 多層基板 |
| TW109121150A TWI809284B (zh) | 2015-01-13 | 2016-01-13 | 異向導電膜、連接構造體及連接構造體之製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109121150A TWI809284B (zh) | 2015-01-13 | 2016-01-13 | 異向導電膜、連接構造體及連接構造體之製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11901325B2 (enExample) |
| JP (2) | JP2016131246A (enExample) |
| KR (1) | KR102094725B1 (enExample) |
| CN (1) | CN107210287B (enExample) |
| TW (2) | TWI806814B (enExample) |
| WO (1) | WO2016114320A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI806814B (zh) * | 2015-01-13 | 2023-07-01 | 日商迪睿合股份有限公司 | 多層基板 |
| WO2017149977A1 (ja) * | 2016-02-29 | 2017-09-08 | パナソニックIpマネジメント株式会社 | 非水電解質二次電池 |
| JP7125547B2 (ja) * | 2018-12-29 | 2022-08-24 | 深南電路股▲ふん▼有限公司 | 多様に組み立て可能なプリント基板及びその製造方法 |
| US20230106035A1 (en) * | 2020-01-31 | 2023-04-06 | Mitsui Chemicals, Inc. | Anisotropic conductive sheet, electrical inspection device, and electrical inspection method |
| TWI742991B (zh) * | 2021-01-20 | 2021-10-11 | 啟耀光電股份有限公司 | 基板結構與電子裝置 |
| CN118866723A (zh) * | 2024-06-24 | 2024-10-29 | 江苏博敏电子有限公司 | 一种使用异向导电膜进行芯片堆叠互连的工艺 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
| JP2005277112A (ja) * | 2004-03-25 | 2005-10-06 | Sony Chem Corp | 多層配線基板及びその製造方法 |
| US20100171209A1 (en) * | 2009-01-05 | 2010-07-08 | Hitachi Metals, Ltd. | Semiconductor device and method for manufacturing the same |
| JP2010232492A (ja) * | 2009-03-27 | 2010-10-14 | Dainippon Printing Co Ltd | 多層プリント配線板組合せ体およびその製造方法 |
| TW201131583A (en) * | 2009-12-24 | 2011-09-16 | Cheil Ind Inc | Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0334064Y2 (enExample) | 1985-08-21 | 1991-07-18 | ||
| JPH0362411A (ja) * | 1989-07-31 | 1991-03-18 | Canon Inc | 異方性導電フィルムの製造方法 |
| JP2748713B2 (ja) | 1991-03-29 | 1998-05-13 | 日立化成工業株式会社 | 接続部材 |
| JPH05182973A (ja) | 1992-01-07 | 1993-07-23 | Fujitsu Ltd | 半導体装置の製造方法 |
| TW301843B (en) * | 1994-11-15 | 1997-04-01 | Ibm | Electrically conductive paste and composite and their use as an electrically conductive connector |
| JPH08330736A (ja) | 1995-06-01 | 1996-12-13 | Toray Ind Inc | 多層基板およびその製造方法 |
| JP3296306B2 (ja) * | 1997-10-28 | 2002-06-24 | ソニーケミカル株式会社 | 異方導電性接着剤および接着用膜 |
| JP2001077301A (ja) * | 1999-08-24 | 2001-03-23 | Amkor Technology Korea Inc | 半導体パッケージ及びその製造方法 |
| JP2001237365A (ja) | 2000-02-23 | 2001-08-31 | Seiko Epson Corp | 接続用端子の接合方法、半導体装置の製造方法および半導体装置 |
| JP2002110897A (ja) * | 2000-09-28 | 2002-04-12 | Toshiba Corp | 半導体装置およびその製造方法 |
| TW554191B (en) * | 2000-12-16 | 2003-09-21 | Au Optronics Corp | Laminating structure and its forming method |
| JPWO2003003798A1 (ja) | 2001-06-29 | 2004-10-21 | 東レエンジニアリング株式会社 | 異方導電性接着剤を用いた接合方法 |
| JP2003282819A (ja) | 2002-03-27 | 2003-10-03 | Seiko Epson Corp | 半導体装置の製造方法 |
| JP4340517B2 (ja) * | 2003-10-30 | 2009-10-07 | Okiセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
| JP4688526B2 (ja) * | 2005-03-03 | 2011-05-25 | Okiセミコンダクタ株式会社 | 半導体装置及びその製造方法 |
| JP2006310082A (ja) | 2005-04-28 | 2006-11-09 | Tokai Rubber Ind Ltd | 異方性導電膜およびその製造方法 |
| WO2007036994A1 (ja) | 2005-09-28 | 2007-04-05 | Spansion Llc | 半導体装置およびその製造方法並びにフィルムの製造方法 |
| DE102006001600B3 (de) * | 2006-01-11 | 2007-08-02 | Infineon Technologies Ag | Halbleiterbauelement mit Flipchipkontakten und Verfahren zur Herstellung desselben |
| KR100777255B1 (ko) * | 2006-04-18 | 2007-11-20 | 중앙대학교 산학협력단 | 이방성 도전 필름 및 이를 이용한 전자부품의 실장방법 |
| JP2006339160A (ja) | 2006-06-02 | 2006-12-14 | Hitachi Chem Co Ltd | 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法 |
| JP5010990B2 (ja) * | 2007-06-06 | 2012-08-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 接続方法 |
| JP5018270B2 (ja) | 2007-06-22 | 2012-09-05 | パナソニック株式会社 | 半導体積層体とそれを用いた半導体装置 |
| CN101849322B (zh) * | 2007-09-20 | 2012-07-04 | 索尼化学&信息部件株式会社 | 各向异性导电膜及其制造方法、以及使用该各向异性导电膜的接合体 |
| JP5622137B2 (ja) * | 2007-10-29 | 2014-11-12 | デクセリアルズ株式会社 | 電気的接続体及びその製造方法 |
| JP2010251547A (ja) | 2009-04-16 | 2010-11-04 | Elpida Memory Inc | 半導体装置及びその製造方法 |
| JP2010272737A (ja) | 2009-05-22 | 2010-12-02 | Elpida Memory Inc | 半導体装置の製造方法 |
| CN103155050B (zh) * | 2010-10-08 | 2017-05-03 | 第一毛织株式会社 | 各向异性导电膜 |
| US8552567B2 (en) * | 2011-07-27 | 2013-10-08 | Micron Technology, Inc. | Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication |
| KR101941995B1 (ko) * | 2012-07-11 | 2019-01-24 | 에스케이하이닉스 주식회사 | 반도체 장치 및 이를 갖는 적층 반도체 패키지 |
| KR102254104B1 (ko) * | 2014-09-29 | 2021-05-20 | 삼성전자주식회사 | 반도체 패키지 |
| TWI806814B (zh) * | 2015-01-13 | 2023-07-01 | 日商迪睿合股份有限公司 | 多層基板 |
-
2016
- 2016-01-13 TW TW105101042A patent/TWI806814B/zh active
- 2016-01-13 WO PCT/JP2016/050877 patent/WO2016114320A1/ja not_active Ceased
- 2016-01-13 CN CN201680004716.6A patent/CN107210287B/zh active Active
- 2016-01-13 TW TW109121150A patent/TWI809284B/zh active
- 2016-01-13 US US15/543,113 patent/US11901325B2/en active Active
- 2016-01-13 JP JP2016004551A patent/JP2016131246A/ja active Pending
- 2016-01-13 KR KR1020177017942A patent/KR102094725B1/ko active Active
-
2020
- 2020-09-25 JP JP2020161100A patent/JP7207383B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
| JP2005277112A (ja) * | 2004-03-25 | 2005-10-06 | Sony Chem Corp | 多層配線基板及びその製造方法 |
| US20100171209A1 (en) * | 2009-01-05 | 2010-07-08 | Hitachi Metals, Ltd. | Semiconductor device and method for manufacturing the same |
| JP2010232492A (ja) * | 2009-03-27 | 2010-10-14 | Dainippon Printing Co Ltd | 多層プリント配線板組合せ体およびその製造方法 |
| TW201131583A (en) * | 2009-12-24 | 2011-09-16 | Cheil Ind Inc | Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020202410A (ja) | 2020-12-17 |
| KR102094725B1 (ko) | 2020-03-31 |
| JP7207383B2 (ja) | 2023-01-18 |
| US20170358549A1 (en) | 2017-12-14 |
| US11901325B2 (en) | 2024-02-13 |
| CN107210287A (zh) | 2017-09-26 |
| JP2016131246A (ja) | 2016-07-21 |
| WO2016114320A1 (ja) | 2016-07-21 |
| TW201639116A (zh) | 2016-11-01 |
| TWI809284B (zh) | 2023-07-21 |
| KR20170091686A (ko) | 2017-08-09 |
| TW202038426A (zh) | 2020-10-16 |
| CN107210287B (zh) | 2020-04-14 |
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