TWI806814B - 多層基板 - Google Patents

多層基板 Download PDF

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Publication number
TWI806814B
TWI806814B TW105101042A TW105101042A TWI806814B TW I806814 B TWI806814 B TW I806814B TW 105101042 A TW105101042 A TW 105101042A TW 105101042 A TW105101042 A TW 105101042A TW I806814 B TWI806814 B TW I806814B
Authority
TW
Taiwan
Prior art keywords
holes
semiconductor substrate
conductive particles
substrate
semiconductor
Prior art date
Application number
TW105101042A
Other languages
English (en)
Chinese (zh)
Other versions
TW201639116A (zh
Inventor
篠原誠一郎
阿久津恭志
石松朋之
Original Assignee
日商迪睿合股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW201639116A publication Critical patent/TW201639116A/zh
Application granted granted Critical
Publication of TWI806814B publication Critical patent/TWI806814B/zh

Links

Classifications

    • H10W90/00
    • H10W72/30
    • H10W72/012
    • H10W72/20
    • H10W72/851
    • H10W72/01204
    • H10W72/01212
    • H10W72/013
    • H10W72/01304
    • H10W72/01361
    • H10W72/072
    • H10W72/07223
    • H10W72/07253
    • H10W72/07254
    • H10W72/073
    • H10W72/07323
    • H10W72/07332
    • H10W72/07338
    • H10W72/222
    • H10W72/224
    • H10W72/225
    • H10W72/227
    • H10W72/234
    • H10W72/244
    • H10W72/247
    • H10W72/252
    • H10W72/253
    • H10W72/255
    • H10W72/261
    • H10W72/322
    • H10W72/325
    • H10W72/353
    • H10W72/354
    • H10W74/15
    • H10W90/26
    • H10W90/288
    • H10W90/297
    • H10W90/722
    • H10W90/724
    • H10W90/732
    • H10W90/734
    • H10W99/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW105101042A 2015-01-13 2016-01-13 多層基板 TWI806814B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-004596 2015-01-13
JP2015004596 2015-01-13

Publications (2)

Publication Number Publication Date
TW201639116A TW201639116A (zh) 2016-11-01
TWI806814B true TWI806814B (zh) 2023-07-01

Family

ID=56405861

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105101042A TWI806814B (zh) 2015-01-13 2016-01-13 多層基板
TW109121150A TWI809284B (zh) 2015-01-13 2016-01-13 異向導電膜、連接構造體及連接構造體之製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109121150A TWI809284B (zh) 2015-01-13 2016-01-13 異向導電膜、連接構造體及連接構造體之製造方法

Country Status (6)

Country Link
US (1) US11901325B2 (enExample)
JP (2) JP2016131246A (enExample)
KR (1) KR102094725B1 (enExample)
CN (1) CN107210287B (enExample)
TW (2) TWI806814B (enExample)
WO (1) WO2016114320A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI806814B (zh) * 2015-01-13 2023-07-01 日商迪睿合股份有限公司 多層基板
WO2017149977A1 (ja) * 2016-02-29 2017-09-08 パナソニックIpマネジメント株式会社 非水電解質二次電池
JP7125547B2 (ja) * 2018-12-29 2022-08-24 深南電路股▲ふん▼有限公司 多様に組み立て可能なプリント基板及びその製造方法
US20230106035A1 (en) * 2020-01-31 2023-04-06 Mitsui Chemicals, Inc. Anisotropic conductive sheet, electrical inspection device, and electrical inspection method
TWI742991B (zh) * 2021-01-20 2021-10-11 啟耀光電股份有限公司 基板結構與電子裝置
CN118866723A (zh) * 2024-06-24 2024-10-29 江苏博敏电子有限公司 一种使用异向导电膜进行芯片堆叠互连的工艺

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US5965064A (en) * 1997-10-28 1999-10-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
US20100171209A1 (en) * 2009-01-05 2010-07-08 Hitachi Metals, Ltd. Semiconductor device and method for manufacturing the same
JP2010232492A (ja) * 2009-03-27 2010-10-14 Dainippon Printing Co Ltd 多層プリント配線板組合せ体およびその製造方法
TW201131583A (en) * 2009-12-24 2011-09-16 Cheil Ind Inc Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same

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JPH0334064Y2 (enExample) 1985-08-21 1991-07-18
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JP2748713B2 (ja) 1991-03-29 1998-05-13 日立化成工業株式会社 接続部材
JPH05182973A (ja) 1992-01-07 1993-07-23 Fujitsu Ltd 半導体装置の製造方法
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
JPH08330736A (ja) 1995-06-01 1996-12-13 Toray Ind Inc 多層基板およびその製造方法
JP3296306B2 (ja) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 異方導電性接着剤および接着用膜
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
JP2001237365A (ja) 2000-02-23 2001-08-31 Seiko Epson Corp 接続用端子の接合方法、半導体装置の製造方法および半導体装置
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
TW554191B (en) * 2000-12-16 2003-09-21 Au Optronics Corp Laminating structure and its forming method
JPWO2003003798A1 (ja) 2001-06-29 2004-10-21 東レエンジニアリング株式会社 異方導電性接着剤を用いた接合方法
JP2003282819A (ja) 2002-03-27 2003-10-03 Seiko Epson Corp 半導体装置の製造方法
JP4340517B2 (ja) * 2003-10-30 2009-10-07 Okiセミコンダクタ株式会社 半導体装置及びその製造方法
JP4688526B2 (ja) * 2005-03-03 2011-05-25 Okiセミコンダクタ株式会社 半導体装置及びその製造方法
JP2006310082A (ja) 2005-04-28 2006-11-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
WO2007036994A1 (ja) 2005-09-28 2007-04-05 Spansion Llc 半導体装置およびその製造方法並びにフィルムの製造方法
DE102006001600B3 (de) * 2006-01-11 2007-08-02 Infineon Technologies Ag Halbleiterbauelement mit Flipchipkontakten und Verfahren zur Herstellung desselben
KR100777255B1 (ko) * 2006-04-18 2007-11-20 중앙대학교 산학협력단 이방성 도전 필름 및 이를 이용한 전자부품의 실장방법
JP2006339160A (ja) 2006-06-02 2006-12-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
JP5010990B2 (ja) * 2007-06-06 2012-08-29 ソニーケミカル&インフォメーションデバイス株式会社 接続方法
JP5018270B2 (ja) 2007-06-22 2012-09-05 パナソニック株式会社 半導体積層体とそれを用いた半導体装置
CN101849322B (zh) * 2007-09-20 2012-07-04 索尼化学&信息部件株式会社 各向异性导电膜及其制造方法、以及使用该各向异性导电膜的接合体
JP5622137B2 (ja) * 2007-10-29 2014-11-12 デクセリアルズ株式会社 電気的接続体及びその製造方法
JP2010251547A (ja) 2009-04-16 2010-11-04 Elpida Memory Inc 半導体装置及びその製造方法
JP2010272737A (ja) 2009-05-22 2010-12-02 Elpida Memory Inc 半導体装置の製造方法
CN103155050B (zh) * 2010-10-08 2017-05-03 第一毛织株式会社 各向异性导电膜
US8552567B2 (en) * 2011-07-27 2013-10-08 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
KR101941995B1 (ko) * 2012-07-11 2019-01-24 에스케이하이닉스 주식회사 반도체 장치 및 이를 갖는 적층 반도체 패키지
KR102254104B1 (ko) * 2014-09-29 2021-05-20 삼성전자주식회사 반도체 패키지
TWI806814B (zh) * 2015-01-13 2023-07-01 日商迪睿合股份有限公司 多層基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965064A (en) * 1997-10-28 1999-10-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
US20100171209A1 (en) * 2009-01-05 2010-07-08 Hitachi Metals, Ltd. Semiconductor device and method for manufacturing the same
JP2010232492A (ja) * 2009-03-27 2010-10-14 Dainippon Printing Co Ltd 多層プリント配線板組合せ体およびその製造方法
TW201131583A (en) * 2009-12-24 2011-09-16 Cheil Ind Inc Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same

Also Published As

Publication number Publication date
JP2020202410A (ja) 2020-12-17
KR102094725B1 (ko) 2020-03-31
JP7207383B2 (ja) 2023-01-18
US20170358549A1 (en) 2017-12-14
US11901325B2 (en) 2024-02-13
CN107210287A (zh) 2017-09-26
JP2016131246A (ja) 2016-07-21
WO2016114320A1 (ja) 2016-07-21
TW201639116A (zh) 2016-11-01
TWI809284B (zh) 2023-07-21
KR20170091686A (ko) 2017-08-09
TW202038426A (zh) 2020-10-16
CN107210287B (zh) 2020-04-14

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