CN107210287B - 多层基板 - Google Patents

多层基板 Download PDF

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Publication number
CN107210287B
CN107210287B CN201680004716.6A CN201680004716A CN107210287B CN 107210287 B CN107210287 B CN 107210287B CN 201680004716 A CN201680004716 A CN 201680004716A CN 107210287 B CN107210287 B CN 107210287B
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conductive particles
holes
semiconductor substrate
anisotropic conductive
conductive film
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Chinese (zh)
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CN107210287A (zh
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筱原诚一郎
阿久津恭志
石松朋之
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Dexerials Corp
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Dexerials Corp
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    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/01212—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps at a different location than on the final device, e.g. forming as prepeg
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    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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  • Non-Insulated Conductors (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Combinations Of Printed Boards (AREA)
CN201680004716.6A 2015-01-13 2016-01-13 多层基板 Active CN107210287B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015004596 2015-01-13
JP2015-004596 2015-01-13
PCT/JP2016/050877 WO2016114320A1 (ja) 2015-01-13 2016-01-13 多層基板

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CN107210287A CN107210287A (zh) 2017-09-26
CN107210287B true CN107210287B (zh) 2020-04-14

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Country Link
US (1) US11901325B2 (enExample)
JP (2) JP2016131246A (enExample)
KR (1) KR102094725B1 (enExample)
CN (1) CN107210287B (enExample)
TW (2) TWI806814B (enExample)
WO (1) WO2016114320A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107210287B (zh) * 2015-01-13 2020-04-14 迪睿合株式会社 多层基板
JPWO2017149977A1 (ja) * 2016-02-29 2018-12-20 パナソニックＩｐマネジメント株式会社 非水電解質二次電池
WO2020133421A1 (zh) * 2018-12-29 2020-07-02 深南电路股份有限公司 多样化装配印刷线路板及制造方法
US20230106035A1 (en) * 2020-01-31 2023-04-06 Mitsui Chemicals, Inc. Anisotropic conductive sheet, electrical inspection device, and electrical inspection method
TWI742991B (zh) * 2021-01-20 2021-10-11 啟耀光電股份有限公司 基板結構與電子裝置
CN118866723A (zh) * 2024-06-24 2024-10-29 江苏博敏电子有限公司 一种使用异向导电膜进行芯片堆叠互连的工艺

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965064A (en) * 1997-10-28 1999-10-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2010232492A (ja) * 2009-03-27 2010-10-14 Dainippon Printing Co Ltd 多層プリント配線板組合せ体およびその製造方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0334064Y2 (enExample) 1985-08-21 1991-07-18
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JP2748713B2 (ja) 1991-03-29 1998-05-13 日立化成工業株式会社 接続部材
JPH05182973A (ja) 1992-01-07 1993-07-23 Fujitsu Ltd 半導体装置の製造方法
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
JPH08330736A (ja) 1995-06-01 1996-12-13 Toray Ind Inc 多層基板およびその製造方法
JP3296306B2 (ja) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 異方導電性接着剤および接着用膜
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
JP2001237365A (ja) 2000-02-23 2001-08-31 Seiko Epson Corp 接続用端子の接合方法、半導体装置の製造方法および半導体装置
TW554191B (en) 2000-12-16 2003-09-21 Au Optronics Corp Laminating structure and its forming method
JPWO2003003798A1 (ja) 2001-06-29 2004-10-21 東レエンジニアリング株式会社 異方導電性接着剤を用いた接合方法
JP2003282819A (ja) * 2002-03-27 2003-10-03 Seiko Epson Corp 半導体装置の製造方法
JP4340517B2 (ja) * 2003-10-30 2009-10-07 Ｏｋｉセミコンダクタ株式会社 半導体装置及びその製造方法
JP2006310082A (ja) 2005-04-28 2006-11-09 Tokai Rubber Ind Ltd 異方性導電膜およびその製造方法
WO2007036994A1 (ja) 2005-09-28 2007-04-05 Spansion Llc 半導体装置およびその製造方法並びにフィルムの製造方法
DE102006001600B3 (de) * 2006-01-11 2007-08-02 Infineon Technologies Ag Halbleiterbauelement mit Flipchipkontakten und Verfahren zur Herstellung desselben
KR100777255B1 (ko) * 2006-04-18 2007-11-20 중앙대학교 산학협력단 이방성 도전 필름 및 이를 이용한 전자부품의 실장방법
JP2006339160A (ja) 2006-06-02 2006-12-14 Hitachi Chem Co Ltd 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
JP5010990B2 (ja) * 2007-06-06 2012-08-29 ソニーケミカル＆インフォメーションデバイス株式会社 接続方法
JP5018270B2 (ja) * 2007-06-22 2012-09-05 パナソニック株式会社 半導体積層体とそれを用いた半導体装置
KR101193757B1 (ko) * 2007-09-20 2012-10-23 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 이방성 도전막 및 그 제조 방법, 및 그 이방성 도전막을 이용한 접합체
JP5622137B2 (ja) * 2007-10-29 2014-11-12 デクセリアルズ株式会社 電気的接続体及びその製造方法
JP5212118B2 (ja) * 2009-01-05 2013-06-19 日立金属株式会社 半導体装置およびその製造方法
JP2010251547A (ja) 2009-04-16 2010-11-04 Elpida Memory Inc 半導体装置及びその製造方法
JP2010272737A (ja) 2009-05-22 2010-12-02 Elpida Memory Inc 半導体装置の製造方法
KR101219139B1 (ko) 2009-12-24 2013-01-07 제일모직주식회사 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체
KR20120036721A (ko) * 2010-10-08 2012-04-18 제일모직주식회사 이방성 도전 필름
US8552567B2 (en) * 2011-07-27 2013-10-08 Micron Technology, Inc. Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
KR101941995B1 (ko) * 2012-07-11 2019-01-24 에스케이하이닉스 주식회사 반도체 장치 및 이를 갖는 적층 반도체 패키지
KR102254104B1 (ko) * 2014-09-29 2021-05-20 삼성전자주식회사 반도체 패키지
CN107210287B (zh) * 2015-01-13 2020-04-14 迪睿合株式会社 多层基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5965064A (en) * 1997-10-28 1999-10-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2002110897A (ja) * 2000-09-28 2002-04-12 Toshiba Corp 半導体装置およびその製造方法
JP2005277112A (ja) * 2004-03-25 2005-10-06 Sony Chem Corp 多層配線基板及びその製造方法
JP2006245311A (ja) * 2005-03-03 2006-09-14 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2010232492A (ja) * 2009-03-27 2010-10-14 Dainippon Printing Co Ltd 多層プリント配線板組合せ体およびその製造方法

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